High-frequency multilayer circuit board capable of rapidly dissipating heat

Abstract

The utility model discloses a high-frequency multilayer circuit board capable of fast heat dissipation, which belongs to the field of circuit boards and comprises a base and a circuit board body, the top of the base is provided with a clamping groove, the circuit board body is arranged in the clamping groove, the bottom of the clamping groove is provided with a heat dissipation groove, and the heat dissipation groove is arranged in the clamping groove. A plurality of heat dissipation rods are arranged in the heat dissipation groove and attached to the bottom of the circuit board body, the bottoms of the heat dissipation rods are fixedly connected with a heat conduction plate, the two ends of the heat conduction plate extend into the base, and the two ends of the bottom of the heat dissipation plate are fixedly connected with heat transfer rods; the temperature generated on the upper surface of the circuit board body is dissipated through the heat dissipation plate, and the temperature generated on the lower surface of the circuit board body is transmitted to the heat conduction plate through the heat dissipation rod, then is transmitted to the heat transfer rod through the heat conduction plate, is transmitted to the heat dissipation plate through the heat transfer rod, and then is uniformly blown and dissipated through the heat dissipation fan. The problem that heat dissipation is difficult due to small bottom space of the circuit board body is avoided, and heat dissipation comprehensiveness and heat dissipation efficiency of the circuit board body are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-frequency multi-layer circuit board with rapid heat dissipation. Background Art

[0002] Multilayer circuit boards are manufactured by stacking two or more layers of circuitry on top of each other, with reliable, pre-defined interconnections. Because drilling and plating are performed before all layers are laminated together, this technology defies conventional manufacturing processes from the outset. The inner two layers consist of traditional double-sided boards, while the outer layers are constructed from separate single-sided boards. Before lamination, the inner substrate undergoes drilling, through-hole plating, pattern transfer, development, and etching. Double-sided boards have a dielectric layer in the middle, with traces on both sides. Multilayer boards have multiple trace layers, with a dielectric layer between each two layers, which can be very thin. Multilayer boards have at least three conductive layers: two on the outer surface, and the remaining layer integrated within the insulating board. Electrical connections between these layers are typically made through plated through-holes (PTHs) in the board's cross-section.

[0003] When existing multi-layer circuit boards are installed and used, a heat dissipation structure is usually installed on the upper side of the circuit board to dissipate heat, but the lower side of the circuit board is not well dissipated, resulting in poor heat dissipation effect. At the same time, the space under the installation side of the circuit board is small, making it more difficult to discharge heat, further reducing the heat dissipation effect. Utility Model Content

[0004] In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide a high-frequency multi-layer circuit board with rapid heat dissipation, so as to solve the problem that in the prior art, a heat dissipation structure is usually installed on the upper side of the circuit board for heat dissipation, but the lower side of the circuit board is not well cooled, resulting in poor heat dissipation effect. At the same time, the space on the lower side of the installation of the circuit board is small, and the heat is more difficult to discharge, which further reduces the heat dissipation effect.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A high-frequency multi-layer circuit board with rapid heat dissipation includes a base and a circuit board body. A card slot is provided on the top of the base, the circuit board body is arranged inside the card slot, a heat dissipation groove is provided at the bottom of the card slot, multiple groups of heat dissipation rods are provided inside the heat dissipation groove and are in contact with the bottom of the circuit board body, the bottom of the heat dissipation rods are connected to a heat conducting plate, both ends of the heat conducting plate extend into the interior of the base, a heat dissipation plate is provided on the top of the base and is in contact with the top of the circuit board body, heat transfer rods are fixedly connected to both ends of the bottom of the heat dissipation plate, and the bottom of the heat transfer rods is in contact with the side wall of the heat conducting plate.

[0007] As a further solution of the present invention: a cooling fan is fixedly connected to the top of the heat dissipation plate.

[0008] As a further solution of the present invention: a plurality of groups of heat dissipation fins are fixedly connected to the top of the heat dissipation plate.

[0009] As a further solution of the present invention: a plurality of placement slots connected to the heat dissipation slots are provided at the bottom of the card slot, and the heat dissipation rods are clipped into the placement slots.

[0010] As a further solution of the present invention: a plurality of heat dissipation holes are provided at the bottom of the heat dissipation groove.

[0011] As a further solution of the present invention: slots are provided on both sides of the top of the base, both ends of the heat conducting plate are connected to the slots, and the heat conducting rods are inserted into the slots.

[0012] As a further solution of the present invention: limiting blocks are fixedly connected to both sides of the top of the base, and the limiting blocks cooperate with the heat dissipation plate.

[0013] As a further solution of the present invention: the circuit board body and the heat dissipation plate are fixedly connected to the base by multiple groups of bolts.

[0014] As a further solution of the present invention: a plurality of groups of legs are fixedly connected to the bottom of the base.

[0015] Beneficial effects of the utility model:

[0016] In the utility model, the temperature generated by the upper surface of the circuit board body is dissipated through the heat dissipation plate, while the temperature generated by the lower surface of the circuit board body is transferred to the heat conducting plate through the heat dissipation rod, and then transferred to the heat transfer rod through the heat conducting plate, and then transferred to the heat dissipation plate through the heat transfer rod, and then uniformly dissipated by the heat dissipation fan, thereby avoiding the difficulty in heat dissipation due to the small space at the bottom of the circuit board body, and improving the comprehensiveness and heat dissipation efficiency of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall cross-sectional structure of the utility model Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the utility model Figure 2 ;

[0020] Figure 3 This is a schematic diagram of the cross-sectional structure of the base of the utility model;

[0021] Figure 4This is a schematic diagram of the structure of the base of the utility model from a top view;

[0022] Figure 5 It is a schematic structural diagram of the heat dissipation plate of the present utility model.

[0023] In the figure: 1. Base; 101. Card slot; 102. Heat dissipation slot; 103. Placement slot; 104. Heat dissipation hole; 105. Slot; 106. Limit block; 2. Circuit board body; 3. Heat dissipation rod; 301. Heat conduction plate; 4. Heat dissipation plate; 401. Heat transfer rod; 402. Heat dissipation fins; 5. Cooling fan; 6. Bolt; 7. Support leg. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] like Figure 1-Figure 5 As shown, a high-frequency multi-layer circuit board with rapid heat dissipation includes a base 1 and a circuit board body 2. A card slot 101 is provided at the top of the base 1, and the circuit board body 2 is arranged inside the card slot 101. A heat dissipation slot 102 is provided at the bottom of the card slot 101. Multiple groups of heat dissipation rods 3 are provided inside the heat dissipation slot 102 and are in contact with the bottom of the circuit board body 2. The bottom of the heat dissipation rods 3 are connected to a heat conducting plate 301. Both ends of the heat conducting plate 301 extend into the interior of the base 1 for fixed installation, and the bottom of the heat dissipation rods 3 are in contact with the top of the heat conducting plate 301 for placement. A heat dissipation plate 4 is provided on the top of the base 1 and is in contact with the top of the circuit board body 2. Heat transfer rods 401 are fixedly connected to both ends of the bottom of the heat dissipation plate 4. The bottom of the heat transfer rods 401 is in contact with the side wall of the heat conducting plate 301 for heat transfer.

[0026] In the present application, a plurality of through slots are provided on the side walls of the card slot 101 and penetrate the outer wall of the base 1 for electrically connecting the external wiring harness to the circuit board body 2 .

[0027] like Figure 1 and Figure 2 As shown, in order to improve the heat dissipation efficiency of the circuit board body 2, a heat dissipation fan 5 is fixedly connected to the top of the heat dissipation plate 4 mentioned above. The heat dissipation fan 5 is started to discharge the hot air emitted by the heat dissipation plate 4, thereby improving the heat dissipation effect of the circuit board body 2.

[0028] like Figure 1 and Figure 2As shown, in order to improve the heat dissipation effect of the circuit board body 2, multiple groups of heat dissipation fins 402 are fixedly connected to the top of the above-mentioned heat dissipation plate 4. The multiple groups of heat dissipation fins 402 dissipate the heat conducted from the circuit board body 2 by the heat dissipation plate 4, thereby improving the heat dissipation effect.

[0029] like Figure 1 and Figure 4 As shown, the bottom of the card slot 101 is provided with multiple groups of placement slots 103 connected to the heat dissipation slots 102, and the heat dissipation rods 3 are clipped into the placement slots 103. Through the provision of multiple groups of heat dissipation slots 102, it is convenient to place different numbers of heat dissipation rods 3 for installation and heat dissipation. It is suitable for installation and use of circuit board bodies 2 of the same model but different circuits, thereby improving the convenience of use.

[0030] like Figure 1 and Figure 3 As shown, in order to improve the heat dissipation effect, a plurality of heat dissipation holes 104 are provided at the bottom of the heat dissipation slot 102. The heat dissipation holes 104 facilitate the discharge of heat from the position below the circuit board body 2 inside the heat dissipation slot 102.

[0031] like Figure 1 、 Figure 3 and Figure 4 As shown, slots 105 are provided on both sides of the top of the base 1, both ends of the heat conducting plate 301 are connected to the slots 105, and the heat transfer rods 401 are inserted into the slots 105. When installing the heat sink 4, the heat transfer rods 401 on both sides of the heat sink 4 are inserted into the slots 105 and then attached to the heat conducting plate 301, thereby improving the convenience of connection and facilitating the heat conducting plate 301 to transfer heat to the heat sink 4 through the heat transfer rods 401 for heat dissipation.

[0032] like Figure 2 and Figure 4 As shown, the limit blocks 106 are fixedly connected to both sides of the top of the base 1, and the limit blocks 106 cooperate with the heat sink 4. The circuit board body 2 and the heat sink 4 are fixedly connected to the base 1 through multiple sets of bolts 6. The circuit board body 2 is placed inside the card slot 101, and then the heat sink 4 is placed on the top of the base 1 and attached to the top of the circuit board body 2. The heat sink 4 is limited by the limit blocks 106 to align the heat sink 4 with the circuit board body 2, so that the bolts 6 pass through the heat sink 4 and the circuit board body 2 and are screwed into the base 1, and the heat sink 4 and the circuit board body 2 are fixedly installed.

[0033] like Figure 1 and Figure 2 As shown, a plurality of groups of legs 7 are fixedly connected to the bottom of the base 1. The base 1 is placed by setting the legs 7, which makes it convenient to reserve heat dissipation space at the bottom of the heat dissipation hole 104.

[0034] The working principle of the present invention is as follows: when the user is installing, first place the circuit board body 2 inside the card slot 101 on the base 1 and fit it against the top of the heat dissipation rod 3 inside the heat dissipation slot 102. The size of the card slot 101 is the same as the size of the circuit board body 2, and circuit board bodies 2 of different sizes are adapted to bases 1 of different shapes. Then place the heat dissipation plate 4 on the circuit board body 2. At the same time, when the heat dissipation plate 4 is placed on the circuit board body 2, the heat transfer rods 401 on both sides of the heat dissipation plate 4 are inserted into the base 1 and fit against both sides of the heat conducting plate 301. Then fix the heat dissipation plate 4 and the circuit board body 2 to complete the installation of the circuit board body 2 and the heat dissipation plate 4.

[0035] Heat dissipation: The temperature generated on the upper surface of the circuit board body 2 when it is working is dissipated through the heat sink 4, while the temperature generated on the lower surface of the circuit board body 2 when it is working is transferred to the heat conducting plate 301 through the heat dissipation rod 3, and then transferred to the heat transfer rod 401 through the heat conducting plate 301, and then transferred to the heat dissipation plate 4 through the heat transfer rod 401, and then uniformly cooled by the heat dissipation fan 5. This avoids the difficulty of heat dissipation due to the small space at the bottom of the circuit board body 2, and improves the comprehensiveness and efficiency of the heat dissipation of the circuit board body 2.

[0036] The above describes an embodiment of the present invention in detail. However, the above content is only a preferred embodiment of the present invention and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent application of the present invention.

Claims

1. A high-frequency multi-layer circuit board with rapid heat dissipation, comprising a base (1) and a circuit board body (2), characterized in that: The top of the base (1) is provided with a slot (101), the circuit board body (2) is arranged inside the slot (101), the bottom of the slot (101) is provided with a heat dissipation slot (102), a plurality of heat dissipation rods (3) are arranged inside the heat dissipation slot (102) and are in contact with the bottom of the circuit board body (2), the bottom of the heat dissipation rods (3) are connected with a heat conducting plate (301), both ends of the heat conducting plate (301) extend into the base (1), a heat dissipation plate (4) is arranged on the top of the base (1) and is in contact with the top of the circuit board body (2), both ends of the bottom of the heat dissipation plate (4) are fixedly connected with heat transfer rods (401), and the bottom of the heat transfer rods (401) is in contact with the side wall of the heat conducting plate (301).

2. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: A heat dissipation fan (5) is fixedly connected to the top of the heat dissipation plate (4).

3. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: A plurality of groups of heat dissipation fins (402) are fixedly connected to the top of the heat dissipation plate (4).

4. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: The bottom of the card slot (101) is provided with a plurality of placement slots (103) that are in communication with the heat dissipation slot (102), and the heat dissipation rod (3) is clipped into the placement slots (103).

5. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: A plurality of heat dissipation holes (104) are provided at the bottom of the heat dissipation slot (102).

6. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: Slots (105) are provided on both sides of the top of the base (1), both ends of the heat conducting plate (301) are connected to the slots (105), and the heat transfer rod (401) is inserted into the slots (105).

7. A high-frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: Limiting blocks (106) are fixedly connected to both sides of the top of the base (1), and the limiting blocks (106) cooperate with the heat dissipation plate (4).

8. A high frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: The circuit board body (2) and the heat sink (4) are fixedly connected to the base (1) via a plurality of sets of bolts (6).

9. A high frequency multi-layer circuit board with rapid heat dissipation according to claim 1, characterized in that: A plurality of groups of legs (7) are fixedly connected to the bottom of the base (1).

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