Multilayer circuit board lamination alignment device

Abstract

The utility model relates to the technical field of multilayer circuit board production, in particular to a multilayer circuit board lamination alignment device. The utility model provides the lamination alignment device for the multilayer circuit board, which can align the lamination clamp and prevent the lamination effect of the multilayer circuit board from being influenced by the position deviation of the lamination clamp moving into the lamination chamber. A multilayer circuit board lamination alignment device comprises a connecting frame, a conveying assembly and the like, and the conveying assembly is arranged on the upper portion of the connecting frame. According to the utility model, the first air cylinder is started to push the alignment plates to be close to each other to align the lamination clamp front and back, then the second air cylinder is started to enable the connecting plate to limit the left side of the lamination clamp, and then the motor is started to drive the screw rod to rotate and enable the moving plate to move leftwards to align the lamination clamp left and right, so that the lamination clamp can be aligned; and the lamination effect of the multilayer circuit board is prevented from being influenced by position deviation of the lamination clamp moving into the lamination chamber.

Description

Technical Field

[0001] The utility model relates to the technical field of multi-layer circuit board production, in particular to a multi-layer circuit board lamination alignment device. Background Art

[0002] Multilayer circuit board lamination is a key step in manufacturing multilayer circuit boards (PCB boards), which involves stacking multiple inner layers of copper foil, prepreg, prepreg, insulation materials, etc. together to form a solid multilayer board body.

[0003] The existing multi-layer circuit board lamination is to place the multi-layer circuit board material on a lamination mold and then send the lamination mold into a lamination chamber for lamination. However, since the position of the lamination mold may shift when it is transferred to the lamination chamber, the lamination effect of the multi-layer circuit board is affected, which is inconvenient.

[0004] Therefore, a multi-layer circuit board lamination alignment device has been developed, which can align the lamination fixture to prevent the position deviation of the lamination fixture when it moves to the lamination chamber and affects the lamination effect of the multi-layer circuit board. Utility Model Content

[0005] In order to overcome the disadvantage of the existing multi-layer circuit board lamination that the position of the lamination mold may be offset when it is transferred to the lamination chamber, resulting in affecting the lamination effect of the multi-layer circuit board, which is relatively inconvenient, the utility model provides a multi-layer circuit board lamination alignment device that can align the lamination fixture to avoid the position deviation of the lamination fixture when it is moved to the lamination chamber, which affects the lamination effect of the multi-layer circuit board.

[0006] The technical solution is: a multi-layer circuit board lamination alignment device, including a connecting frame, a transportation component, a lamination chamber, a connecting bracket, a first cylinder, an alignment plate, a second cylinder, a connecting plate, a motor, a screw and a movable plate. The upper part of the connecting frame is provided with a transportation component, the upper side of the left part of the connecting frame is connected to the lamination chamber, the connecting bracket is connected between the front and rear sides of the right part of the connecting frame, the front and rear sides of the connecting bracket are both connected to the first cylinder, the telescopic ends of the first cylinder are both connected to the alignment plates, the middle part of the connecting bracket is connected to the second cylinder, the telescopic end of the second cylinder is connected to the connecting plate, the left part of the connecting plate is connected to the motor, the motor output shaft is connected to the screw, the screw is rotatably connected to the connecting plate, the movable plate is threadedly connected to the screw, and the front of the movable plate is slidably connected to the connecting plate.

[0007] As an improvement of the above solution, the transport assembly includes a conveyor belt and a motor. The conveyor belt is provided on the connecting frame. The motor is connected to the front right side of the connecting frame. The motor output shaft is connected to the conveyor belt.

[0008] As an improvement to the above solution, soft pads are provided on the sides of the alignment plates that are close to each other.

[0009] As an improvement of the above scheme, it also includes a rotating column and a guide striking column. The rotating column is connected to the right side of the screw rod, and the guiding striking column is slidably connected to the rotating column.

[0010] As an improvement of the above solution, the lower side of the guide striking column is a circular structure.

[0011] As an improvement of the above solution, a spring is also included, and a spring is connected between the guide striking column and the rotating column.

[0012] The beneficial effects are as follows: 1. The utility model starts the first cylinder to push the alignment plates closer to each other to align the laminating fixture front to back, and then starts the second cylinder to limit the connecting plate to the left side of the laminating fixture, and then starts the motor to drive the screw rod to rotate, so that the movable plate moves to the left, and the laminating fixture is aligned left to right. The laminating fixture can be aligned to avoid position deviation when the laminating fixture is moved to the laminating chamber and affect the laminating effect of the multi-layer circuit board.

[0013] 2. The utility model drives the rotating column to rotate a short distance while the screw rod rotates, so that the guide striking column strikes the moving plate, which can cause the laminating fixture to vibrate slightly to reduce bubbles and wrinkles between the circuit board materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 2 It is a structural schematic diagram of the utility model.

[0016] Figure 3 It is a three-dimensional structural schematic diagram of the utility model.

[0017] Figure 4 It is a partial three-dimensional structural schematic diagram of the utility model.

[0018] The reference numbers in the figure are: 1. connecting frame, 2. transport assembly, 3. laminating chamber, 4. connecting bracket, 5. first cylinder, 6. alignment plate, 7. second cylinder, 8. connecting plate, 9. motor, 10. screw rod, 11. moving plate, 12. rotating column, 13. guide striking column, 14. spring. DETAILED DESCRIPTION

[0019] The above scheme is further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate the present application and are not limited to the scope of the present application. The implementation conditions adopted in the examples can be further adjusted according to the conditions of the specific manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0020] A multi-layer circuit board lamination alignment device, such as Figure 1-Figure 4As shown, it includes a connecting frame 1, a transport component 2, a laminating chamber 3, a connecting bracket 4, a first cylinder 5, an alignment plate 6, a second cylinder 7, a connecting plate 8, a motor 9, a screw 10, a moving plate 11, a rotating column 12, a guide striking column 13 and a spring 14. The upper part of the connecting frame 1 is provided with a transport component 2, and the transport component 2 includes a conveyor belt and a motor. The connecting frame 1 is provided with a conveyor belt. The front side of the right part of the connecting frame 1 is connected to a motor, and the motor output shaft is connected to the conveyor belt. The upper side of the left part of the connecting frame 1 is connected to the laminating chamber 3. The connecting bracket 4 is connected between the front and rear sides of the right part of the connecting frame 1. The front and rear sides of the connecting bracket 4 are both connected to the first cylinder 5, and the telescopic ends of the first cylinder 5 are both connected to the alignment. Plate 6 and the side where the alignment plate 6 are close to each other are both provided with soft pads to avoid damage to the clamp. The middle part of the connecting bracket 4 is connected to the second cylinder 7, and the telescopic end of the second cylinder 7 is connected to a connecting plate 8. The left part of the connecting plate 8 is connected to a motor 9, and a screw rod 10 is connected to the output shaft of the motor 9. The screw rod 10 is rotatably connected to the connecting plate 8. A moving plate 11 is threadedly connected to the screw rod 10, and the front part of the moving plate 11 is slidably connected to the connecting plate 8. A rotating column 12 is connected to the right side of the screw rod 10, and a guide striking column 13 is slidably connected to the rotating column 12. The lower side of the guide striking column 13 is a circular structure, which is convenient for knocking the clamp, and a spring 14 is connected between the guide striking column 13 and the rotating column 12.

[0021] When using the utility model, first place the connecting frame 1 in the multi-layer circuit board lamination area, then place the circuit board material on the lamination fixture, and after placement, place the lamination fixture on the conveyor belt of the transport component 2, start the motor, and let the conveyor belt transport the lamination fixture. When the lamination fixture moves to the connecting bracket 4, turn off the motor, start the first cylinder 5, push the alignment plates 6 to approach each other to align the lamination fixture front and back, and then start the second cylinder 7 to push the connecting plate 8 downward to pre-press the circuit board material, and at the same time make the connecting plate 8 limit the left side of the lamination fixture, and then start the motor 9 to drive the screw rod 10 to rotate. The movable plate 11 moves to the left to align the laminating fixture left and right. While the screw rod 10 rotates, it drives the rotating column 12 to rotate a short distance, so that the guide striking column 13 strikes the movable plate 11. The spring 14 is used to reset the guide striking column 13, so that the laminating fixture vibrates slightly to reduce bubbles and wrinkles between the circuit board materials. After the laminating fixture is aligned, the conveyor belt continues to convey the laminating fixture to the laminating chamber 3 to laminate the circuit board materials, thereby playing a role in aligning the laminating fixture and avoiding the position deviation of the laminating fixture when it moves to the laminating chamber 3, which affects the lamination effect of the multi-layer circuit board.

[0022] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-layer circuit board lamination alignment device, characterized in that it includes The invention comprises a connecting frame (1), a transport component (2), a laminating chamber (3), a connecting bracket (4), a first cylinder (5), an alignment plate (6), a second cylinder (7), a connecting plate (8), a motor (9), a screw rod (10) and a moving plate (11). The upper part of the connecting frame (1) is provided with a transport component (2). The upper left side of the connecting frame (1) is connected to the laminating chamber (3). The right side of the connecting frame (1) is connected to a connecting bracket (4) between the front and rear sides. The front and rear sides of the connecting bracket (4) are both connected to the first cylinder. (5), the telescopic ends of the first cylinder (5) are connected to a positioning plate (6), the middle part of the connecting bracket (4) is connected to a second cylinder (7), the telescopic end of the second cylinder (7) is connected to a connecting plate (8), the left part of the connecting plate (8) is connected to a motor (9), the output shaft of the motor (9) is connected to a screw rod (10), the screw rod (10) is rotatably connected to the connecting plate (8), the screw rod (10) is threadedly connected to a moving plate (11), and the front part of the moving plate (11) is slidably connected to the connecting plate (8).

2. A multi-layer circuit board lamination alignment device as claimed in claim 1, characterized in that: The transport component (2) comprises a conveyor belt and a motor. The conveyor belt is arranged on the connecting frame (1). The motor is connected to the front right side of the connecting frame (1), and the output shaft of the motor is connected to the conveyor belt.

3. A multi-layer circuit board lamination alignment device as claimed in claim 1, characterized in that: Soft pads are arranged on the sides of the alignment plates (6) that are close to each other.

4. A multi-layer circuit board lamination alignment device as claimed in claim 1, characterized in that: It also comprises a rotating column (12) and a guiding striking column (13); the right side of the screw rod (10) is connected with the rotating column (12); and the rotating column (12) is slidably connected with the guiding striking column (13).

5. A multi-layer circuit board lamination alignment device as claimed in claim 4, characterized in that: The lower side of the guide striking column (13) is a circular structure.

6. A multi-layer circuit board lamination alignment device as claimed in claim 4, characterized in that: It also includes a spring (14), and the spring (14) is connected between the guide striking column (13) and the rotating column (12).

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