Automatic driving domain controller and automatic driving vehicle
By integrating the encapsulation shell, PCB board and electrical module, and designing heat dissipation structure and waterproofing measures, the problem of insufficient thermal management and waterproofing performance of the autonomous driving domain controller in extreme environments is solved, achieving more efficient space utilization and stable operation.
Patent Information
- Application Number
- CN202421753290.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-24
AI Technical Summary
How to provide more effective thermal management and waterproofing performance for autonomous driving domain controllers in limited space to ensure their stable operation in extreme environments.
Through the integrated packaging shell, PCB board and electrical module, the heat dissipation structure and heat dissipation fins are designed, combining the interference coordination between the waterproof boss and the groove, and the waterproof slot design of the external interface of the PCB board.
It has achieved high integration of autonomous driving domain controllers and improved space utilization, significantly improved its heat dissipation and waterproof performance, ensuring stable operation in extreme environments.
Smart Images
Figure CN222827511U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of intelligent control technology, and in particular to an autonomous driving domain controller and an autonomous driving vehicle. Background Art
[0002] In recent years, due to the rapid development of autonomous driving technology, the core component of the autonomous driving domain controller is evolving in a more compact, efficient and robust direction. As the forefront of data processing in modern transportation tools such as autonomous driving cars and yachts, the autonomous driving domain controller needs to continuously parse and integrate massive amounts of information from all-round sensors. Although the trend of high integration has brought significant performance improvements, it has also put forward more stringent requirements on thermal management, material application, and packaging technology. Therefore, how to use more suitable packaging technology and packaging materials in a limited space, and at the same time better manage the thermal performance of the autonomous driving domain controller to ensure that the controller can still maintain stable operation in extreme environments has become a key issue that needs to be solved urgently. Utility Model Content
[0003] The present disclosure provides an autonomous driving domain controller and an autonomous driving vehicle.
[0004] According to a first aspect of the present disclosure, an autonomous driving domain controller is provided. The autonomous driving domain controller comprises: a packaging shell, a PCB board, and an electrical module; wherein:
[0005] The package shell is provided with a plurality of external interface holes and a device placement position is provided inside;
[0006] The electrical module is located at the device placement position of the package shell;
[0007] The PCB board is suspended above the electrical module;
[0008] Both the PCB board and the electrical module are provided with external interfaces, which are connected to external devices through the external interface holes.
[0009] Furthermore, the packaging shell includes:
[0010] An upper packaging shell and a lower packaging shell;
[0011] The upper packaging shell and the lower packaging shell are connected by fasteners;
[0012] The outer surface of the upper packaging shell is provided with a fastening structure; the fastening structure is used to connect the controller bracket;
[0013] The shell joint of the upper packaging shell is provided with a waterproof groove, and the shell joint of the lower packaging shell is provided with a waterproof boss. The upper packaging shell and the lower packaging shell utilize the interference fit between the waterproof boss and the waterproof groove at the joint to achieve a sealing effect;
[0014] The outer surface of the lower packaging shell is provided with a heat dissipation structure and heat dissipation fins, and the heat dissipation fins are evenly distributed around the heat dissipation structure.
[0015] Furthermore, the heat dissipation structure includes: a fan groove, a fan, a fan protection net and a thermal bridge.
[0016] Furthermore, the package shell is provided with a plurality of external interface holes, and a device placement position is provided inside, including:
[0017] The side surface of the lower packaging shell is provided with a plurality of external interface holes of the electrical modules;
[0018] The inner surface of the lower packaging shell is provided with a plurality of device placement positions of the electrical modules;
[0019] An external interface hole of the PCB board is arranged between the upper packaging shell and the lower packaging shell.
[0020] Furthermore, an external interface hole of a PCB board is provided between the upper packaging shell and the lower packaging shell, including:
[0021] The first part of the external interface hole of the PCB board is located at the upper packaging shell body, and the second part is located at the lower packaging shell body;
[0022] The first part and the second part of the external interface hole of the PCB board are both provided with waterproof bosses.
[0023] Furthermore, the electrical module is located at the device placement position of the package shell, including:
[0024] The inner surface of the lower packaging shell is provided with a device placement position, and the electrical module is placed in the device placement position of the lower packaging shell in a modular form.
[0025] Furthermore, the PCB board is suspended above the electrical module, including:
[0026] The PCB board includes a PCB board and an external interface of the board;
[0027] The PCB board and the external interface of the board are firmly connected by welding or bonding;
[0028] Waterproof card slots are arranged around the external interface of the board; the external interface of the board is clamped in the external interface hole of the PCB board through the waterproof card slot;
[0029] When the board external interface card is placed in the external interface hole, the PCB board is stably suspended above the electrical module.
[0030] Furthermore, the distance between the heat dissipation fins is 3-10 mm.
[0031] Furthermore, the package housing shell is made by aluminum milling technology.
[0032] According to a second aspect of the present disclosure, an autonomous driving vehicle is provided, which includes: a carrier, a controller bracket, and the autonomous driving domain controller as described above.
[0033] In the present disclosure, through the integrated design of the packaging shell, PCB board and electrical module, the high integration of the autonomous driving domain controller is achieved, and the space utilization rate is improved; at the same time, through the comprehensive design of the heat dissipation structure and the heat dissipation fins, the heat dissipation performance of the domain controller is improved, ensuring the stable operation of the controller in extreme environments; the interference fit between the waterproof boss and the waterproof groove, as well as the waterproof card slot design of the external interface of the PCB board, improve the waterproof performance of the domain controller, so that it can operate reliably in complex and changeable environments.
[0034] It should be understood that the contents described in the utility model summary are not intended to limit the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, among which:
[0036] Figure 1-Figure 2 An exploded diagram of an autonomous driving domain controller provided by an embodiment of the present disclosure is shown;
[0037] Figure 3-Figure 5 Three views of the autonomous driving domain controller provided by an embodiment of the present disclosure are shown;
[0038] Figure 6 A top view of an autonomous driving domain controller provided by an embodiment of the present disclosure is shown;
[0039] Figure 7 An external interface hole diagram of a PCB board of an autonomous driving domain controller provided by an embodiment of the present disclosure is shown;
[0040] Figure 8 A cross-sectional view along the Z-axis of the autonomous driving domain controller provided by an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0042] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0043] In response to the problems mentioned in the background technology, the present disclosure provides an autonomous driving domain controller and an autonomous driving vehicle.
[0044] Specifically, the autonomous driving domain controller includes: a package shell 1, a PCB board 2, and an electrical module 3; wherein the package shell 1 is provided with a plurality of external interface holes, and a device placement position is provided inside; the electrical module 3 is located at the device placement position of the package shell 1; the PCB board 2 is suspended above the electrical module 3; the PCB board 2 and the electrical module 3 are both provided with external interfaces, and are connected to external devices through the external interface holes. The autonomous driving vehicle includes: a carrier, a controller bracket, and the autonomous driving domain controller as described above.
[0045] In this way, the autonomous driving domain controller can be highly integrated, space utilization can be improved, and the overall performance of the domain controller can be enhanced, so that it can operate reliably in complex and changing environments.
[0046] The above content is described in more detail below with reference to a specific embodiment and the accompanying drawings.
[0047] Figure 1-Figure 2 An exploded diagram of an autonomous driving domain controller provided by an embodiment of the present disclosure is shown; Figure 1 As shown, the autonomous driving domain controller includes: a packaging shell 1, a PCB board 2, and an electrical module 3; wherein:
[0048] The shell of the packaging shell 1 is provided with multiple external interface holes and a device placement position is provided inside; the electrical module 3 is located at the device placement position of the packaging shell 1; the PCB board 2 is suspended above the electrical module 3; the PCB board 2 and the electrical module 3 are both provided with external interfaces, which are connected to external devices through the external interface holes.
[0049] Furthermore, if Figure 1As shown, the packaging shell 1 includes: an upper packaging shell 11 and a lower packaging shell 12; the upper packaging shell 11 and the lower packaging shell 12 are connected by fasteners; the fasteners can be threaded fasteners, snap fasteners or other fasteners that can achieve similar functions.
[0050] like Figure 1 As shown, a fastening structure 111 is provided on the outer surface of the upper packaging shell 11; the fastening structure 111 is used to connect the controller bracket; the fastening structure 111 includes a fastening plate and fastening screws and bolts; screw holes and bolt holes are provided on the fastening plate; so that the fastening plate can be fixed to the fastening position of the upper packaging shell 11 by screws, and the autonomous driving domain controller can be fixed to the controller bracket of the vehicle by bolts.
[0051] Among them, the screw hole is a round hole, and the bolt hole is an elliptical hole.
[0052] Furthermore, the bolt hole is designed as an elliptical hole mainly for the following considerations:
[0053] 1. Disperse stress: Compared with round holes, elliptical holes have larger eccentricity and size, which helps to distribute stress more evenly at the edge of the hole when the bolt is subjected to force, thereby reducing the risk of stress concentration. Stress concentration is one of the main factors that lead to deformation, cracks and even fracture of bolt holes.
[0054] 2. Improve the bearing capacity; by dispersing stress, the elliptical hole can improve the bearing capacity of the bolt hole, enabling it to withstand greater external forces without damage.
[0055] 3. Reduce deformation: Under the action of alternating loads, the bolt hole may be subjected to repeated stretching and compression. The shape of the elliptical hole can better adapt to this change and reduce the deformation and cracks of the hole edge caused by stress concentration.
[0056] According to the embodiments of the present disclosure, through the integrated design of the packaging shell, PCB board and electrical module, the autonomous driving domain controller is highly compact and integrated, the space utilization is improved, and the effective connection between the components is ensured.
[0057] Furthermore, a waterproof groove is provided at the shell joint of the upper packaging shell 11, and a waterproof boss is provided at the shell joint of the lower packaging shell 12. The upper packaging shell 11 and the lower packaging shell 12 achieve a sealing effect by utilizing the interference fit between the waterproof boss and the waterproof groove at the joint.
[0058] It is understandable that waterproof glue can be added on this basis to further enhance the sealing effect.
[0059] like Figure 2 As shown, a heat dissipation structure 121 and heat dissipation fins 122 are disposed on the outer surface of the lower packaging shell 12 , and the heat dissipation fins are evenly distributed around the heat dissipation structure.
[0060] According to the embodiments of the present disclosure, the interference fit between the waterproof boss and the waterproof groove at the joint of the upper packaging shell and the lower packaging shell achieves a good sealing effect and enhances the waterproof performance of the domain controller; the heat dissipation structure and the heat dissipation fin design effectively improve the thermal management capability and ensure the stable operation of the controller in extreme environments.
[0061] Furthermore, if Figure 2 As shown, the heat dissipation structure 121 includes: a fan groove, a fan, a fan protection net and a thermal bridge; wherein the thermal bridge can better conduct the heat generated by the electrical module 3 during operation to the heat dissipation fins and the fan, so that the heat can be effectively dissipated to achieve accelerated cooling.
[0062] According to the embodiments of the present disclosure, by providing a fan and a thermal bridge, the heat dissipation effect is further enhanced, heat accumulation is reduced, and the service life of the controller and internal electrical components is extended.
[0063] Furthermore, if Figure 1-Figure 2 As shown, the package shell 1 is provided with a plurality of external interface holes, and a device placement position is provided inside, including:
[0064] The side surface of the lower packaging shell 12 is provided with multiple external interface holes of the electrical module 3; the inner surface of the lower packaging shell 12 is provided with multiple device placement positions of the electrical module 3; the external interface holes of the PCB board 2 are provided between the upper packaging shell 11 and the lower packaging shell 12.
[0065] According to the embodiments of the present disclosure, the flexibility and scalability of the domain controller are improved by setting a reasonable layout of interface holes and internal device placement.
[0066] Furthermore, if Figure 1-Figure 2 As shown, an external interface hole of the PCB board 2 is provided between the upper packaging shell 11 and the lower packaging shell 12, including:
[0067] The first part of the external interface hole of the PCB board 2 is located in the upper packaging shell 11 shell, and the second part is located in the lower packaging shell 12 shell; the first part and the second part of the external interface hole of the PCB board 2 are both provided with waterproof bosses.
[0068] According to the embodiments of the present disclosure, the external interface holes of the PCB board are distributed between the upper and lower shells, which is convenient for wiring and connection; and the design of the waterproof boss improves the safety and waterproof performance of the interface.
[0069] It should be noted that a waterproof sheet is provided on the external interface of the electrical module 3 , and the external interfaces are all located on the outer surface of the upper packaging shell, so the external interface holes of the electrical module 3 are not specially designed with a waterproof platform.
[0070] Furthermore, if Figure 2 As shown, the electrical module 3 is located at the device placement position of the packaging shell 1, including:
[0071] The inner surface of the lower packaging shell 12 is provided with a device placement position, and the electrical module 3 is placed in the device placement position of the lower packaging shell 12 in a modular form.
[0072] According to the embodiments of the present disclosure, the modular design facilitates the replacement and upgrading of the electrical module 3, reduces the maintenance cost, and improves the maintainability and scalability of the domain controller.
[0073] Furthermore, if Figure 1-Figure 2 As shown, the PCB board 2 is suspended above the electrical module 3, and includes:
[0074] The PCB board 2 includes a PCB board 21 and a board external interface 22; the PCB board 21 and the board external interface 22 are firmly connected by welding or bonding; a waterproof card slot is arranged around the board external interface 22; the board external interface 22 is inserted into the external interface hole of the PCB board 2 through the waterproof card slot; when the board external interface 22 is inserted into the external interface hole, the PCB board 2 is stably suspended above the electrical module 3.
[0075] According to the embodiments of the present disclosure, the suspension design reduces the direct contact between the PCB board and the electrical module, reduces heat conduction, and at the same time the provision of the waterproof card slot ensures the stable suspension of the PCB board, thereby improving the stability and waterproofness of the overall structure.
[0076] Furthermore, if Figure 2 As shown, the distance between the heat dissipation fins 122 is 3-10 mm.
[0077] According to the embodiments of the present disclosure, a reasonable heat dissipation fin spacing design not only ensures sufficient heat dissipation area, but also avoids poor air circulation caused by overcrowding, optimizes the heat dissipation effect, and improves thermal management efficiency.
[0078] Furthermore, the shell of the packaging shell 1 is made by aluminum milling technology.
[0079] It should be noted that the aluminum milling process is the milling process of aluminum alloy materials. The excess material on the workpiece is removed by a rotating milling cutter to obtain the required shape and size. Different milling methods and tools can be selected according to the shape, size and requirements of the workpiece; this process can be used to manufacture various aluminum alloy parts and products.
[0080] According to the embodiments of the present disclosure, the packaging shell made by the aluminum milling process has the characteristics of light weight, high strength and good heat dissipation, which effectively reduces the overall weight of the domain controller and improves the structural strength and thermal management performance.
[0081] Figure 3-5 Three views of the autonomous driving domain controller provided by the embodiment of the present disclosure are shown
[0082] Figure 6 A bottom view of the autonomous driving domain controller provided by an embodiment of the present disclosure is shown.
[0083] like Figure 3-Figure 5 As shown, the housing 1 of the autonomous driving domain controller package is provided with a plurality of external interface holes, and the PCB board 2 and the electrical module 3 are connected to external devices through the external interface holes.
[0084] like Figure 6 As shown, the first part of the external interface hole of the autonomous driving domain controller PCB board 2 is located in the upper packaging shell 11 shell, and the second part is located in the lower packaging shell 12 shell.
[0085] In this embodiment, the housing of the automatic driving domain controller package 1 is also provided with an indicator light, such as Figure 6 As shown, the indicator light can be disposed on the shell of the lower packaging shell 12 .
[0086] Figure 7 The external interface hole diagram of the PCB board of the autonomous driving domain controller provided by the embodiment of the present disclosure is shown; Figure 7 As shown, when the waterproof groove of the upper packaging shell extends to the external interface hole of the PCB board 2, only the inner groove wall is retained, and the size of the inner groove wall is consistent with the size of the external interface waterproof slot of the PCB board 2; when the waterproof boss of the lower packaging shell extends to the external interface hole of the PCB board 2, it is consistent with the size of the external interface waterproof slot of the PCB board 2.
[0087] Waterproof slots of corresponding sizes are arranged around the external interface of the PCB board 2 , which can be waterproof and also play the role of fixing the external interface so that the PCB board 2 can be stably suspended above the electrical module 3 .
[0088] Figure 8 FIG. 4 shows a cross-sectional view of the autonomous driving domain controller along the Z axis provided by an embodiment of the present disclosure. Figure 8 As shown, the PCB board 2 is stably suspended above the electrical module 3; the electrical module 3 is placed in the device placement position in a modular form.
[0089] The present disclosure also provides an autonomous driving vehicle, which includes: a carrier, a controller bracket, and the autonomous driving domain controller as described above.
[0090] According to the embodiments of the present disclosure, by integrating the autonomous driving domain controller as described above, the autonomous driving vehicle is significantly improved in terms of data processing capability, thermal management capability, waterproof performance, etc., thereby enhancing the stability and safety of the vehicle.
[0091] According to the embodiments of the present disclosure, the following technical effects are achieved:
[0092] 1. The modular design concept is adopted to organically combine the packaging shell, PCB board and electrical module, which improves the space utilization of the autonomous driving domain controller and ensures the close connection and efficient collaboration between the components.
[0093] 2. By setting up the heat dissipation structure and heat dissipation fins, the heat dissipation performance of the domain controller is comprehensively improved, the operating temperature of the internal components is effectively reduced, and the service life of the autonomous driving domain controller is extended; at the same time, the interference fit between the waterproof boss and the waterproof groove, as well as the waterproof card slot design of the external interface of the PCB board, provide the domain controller with better waterproof performance, ensuring its reliable operation in complex and changing environments.
[0094] 3. The modular design makes it easy to replace and upgrade the electrical modules, reduces maintenance costs, and improves the maintainability and scalability of the domain controller.
[0095] 4. The packaging shell made by aluminum milling technology improves the structural strength, heat dissipation performance and lightweight level of the domain controller.
[0096] 5. When the autonomous driving domain controller is applied to autonomous driving vehicles, it significantly enhances the vehicle's data processing capabilities, thermal management capabilities, and waterproof performance, and improves the vehicle's stability and safety.
[0097] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. An autonomous driving domain controller, characterized in that: The autonomous driving domain controller comprises: A packaging shell (1), a PCB board (2), and an electrical module (3); wherein: The package shell (1) is provided with a plurality of external interface holes and a device placement position is provided inside; The electrical module (3) is located at a device placement position of the packaging shell (1); The PCB board (2) is suspended above the electrical module (3); The PCB board (2) and the electrical module (3) are both provided with external interfaces, and are connected to external devices through the external interface holes.
2. The autonomous driving domain controller according to claim 1, characterized in that: The packaging shell (1) comprises: An upper packaging shell (11) and a lower packaging shell (12); The upper packaging shell (11) and the lower packaging shell (12) are connected via fasteners; The outer surface of the upper packaging shell (11) is provided with a fastening structure (111); the fastening structure (111) is used to connect to a controller rack; The shell joint of the upper packaging shell (11) is provided with a waterproof groove, and the shell joint of the lower packaging shell (12) is provided with a waterproof boss, and the upper packaging shell (11) and the lower packaging shell (12) achieve a sealing effect by utilizing an interference fit between the waterproof boss and the waterproof groove at the joint; The outer surface of the lower packaging shell (12) is provided with a heat dissipation structure (121) and heat dissipation fins (122), and the heat dissipation fins are evenly distributed around the heat dissipation structure.
3. The autonomous driving domain controller according to claim 2, characterized in that: The heat dissipation structure (121) comprises: a fan groove, a fan, a fan protection net and a thermal bridge.
4. The autonomous driving domain controller according to claim 2, characterized in that: The package shell (1) is provided with a plurality of external interface holes and a device placement position is provided inside, including: The side surface of the shell of the lower packaging shell (12) is provided with a plurality of external interface holes of the electrical module (3); The inner surface of the shell of the lower packaging shell (12) is provided with a plurality of component placement positions of the electrical module (3); An external interface hole of the PCB board (2) is provided between the upper packaging shell (11) and the lower packaging shell (12).
5. The autonomous driving domain controller according to claim 3, characterized in that: An external interface hole of the PCB board (2) is provided between the upper packaging shell (11) and the lower packaging shell (12), comprising: The first part of the external interface hole of the PCB board (2) is located in the upper packaging shell (11) housing, and the second part is located in the lower packaging shell (12) housing; The first part and the second part of the external interface hole of the PCB board (2) are both provided with waterproof bosses.
6. The autonomous driving domain controller according to claim 2, characterized in that: The electrical module (3) is located at the device placement position of the packaging shell (1), and comprises: The inner surface of the lower packaging shell (12) is provided with a device placement position, and the electrical module (3) is placed in the device placement position of the lower packaging shell (12) in a modular form.
7. The autonomous driving domain controller according to claim 1, characterized in that: The PCB board (2) is suspended above the electrical module (3), and comprises: The PCB board (2) comprises a PCB board (21) and a board external interface (22); The PCB board (21) and the board external interface (22) are firmly connected by welding or bonding; Waterproof slots are arranged around the board external interface (22); the board external interface (22) is inserted into the external interface hole of the PCB board (2) through the waterproof slots; When the board external interface (22) is inserted into the external interface hole, the PCB board (2) is stably suspended above the electrical module (3).
8. The autonomous driving domain controller according to claim 2, characterized in that: The distance between the heat dissipation fins (122) is 3-10 mm.
9. The autonomous driving domain controller according to claim 1, characterized in that: The shell of the packaging shell (1) is made by using an aluminum milling process.
10. An autonomous driving vehicle, characterized in that: The vehicle includes a carrier, a controller bracket and an autonomous driving domain controller according to any one of claims 1-9.