Liquid cooling plate and circuit board assembly

Abstract

The utility model provides a liquid cooling plate and a circuit board assembly, and relates to the field of heat exchange. A liquid cooling plate includes: a substrate; a cold liquid channel is formed between every two adjacent fins, recesses are formed in at least part of the cold liquid channels, and the width of the recesses is larger than the size of the cold liquid channels; the base plate and the shell cover the plurality of fins; the spoiler is arranged in the concave hole; wherein the arrangement density of the recesses formed in one cold liquid channel is increased along the flowing direction of the cold liquid in the liquid cooling plate. Through the structure of the liquid cooling plate, the heat dissipation efficiency of the electronic equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of heat exchange technology, and in particular to a liquid cooling plate and a circuit board assembly. Background Art

[0002] With the development of high-performance computing, the density of electronic equipment deployed in data centers and other environments (such as switching nodes, computing nodes, and storage nodes in cabinet equipment) has gradually increased. High-density electronic equipment will generate a large amount of heat, and the heat dissipation pressure of each electronic equipment is also increasing. Therefore, the heat dissipation method has gradually changed from air cooling to more efficient liquid cooling.

[0003] In the implementation of liquid cooling, the liquid cooling plate is in contact with the heat generating device, and the circulating cold liquid flows through the liquid cooling plate, thereby taking away the heat generated by the heat generating device. A cavity is formed in the liquid cooling plate, and high-density fins are arranged in the cavity. A cold liquid channel is formed between adjacent fins, and the cold liquid channel is used for the circulation of cold liquid. Since the cold liquid flows through the cold liquid channel at a uniform speed and absorbs the heat dissipated from the fins, the temperature of the cold liquid gradually rises during this process, resulting in a decrease in the heat dissipation effect of the cold liquid on the downstream of the liquid cooling plate, and uneven heat dissipation in various areas of the heat generating device. When the electronic equipment is running for a long time, there is a problem of heat accumulation or even damage in some areas, which reduces the reliability of the electronic equipment. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a liquid cooling plate and a circuit board assembly.

[0005] According to a first aspect of an embodiment of this specification, a liquid cooling plate cold liquid channel is provided, comprising:

[0006] substrate;

[0007] A plurality of fins, wherein cooling channels are formed between adjacent fins, and recesses are formed in at least some of the cooling channels, wherein the width of the recesses is greater than the size of the cooling channels;

[0008] A housing, wherein the substrate and the housing cover the plurality of fins;

[0009] A spoiler, disposed in the recess;

[0010] The arrangement density of the recesses formed in a cooling liquid channel increases along the flow direction of the cooling liquid in the liquid cooling plate.

[0011] Optionally, the recesses are arranged at intervals between the formed cooling liquid channels.

[0012] Optionally, a cooling liquid channel without a recess is disposed between adjacent cooling liquid channels with recesses.

[0013] Optionally, recesses are formed on adjacent cooling liquid channels, wherein the recesses formed on adjacent cooling liquid channels are staggered.

[0014] Optionally, a guide portion is provided at the connection between the recess and the cold liquid channel.

[0015] Optionally, the thickness of the spoiler decreases along the flow direction of the cooling liquid in the liquid cooling plate.

[0016] Optionally, a size of a projection area of ​​a spoiler disposed in a recess on one of the cold liquid channels on the substrate increases along a flow direction of the cold liquid in the cold liquid channel.

[0017] Optionally, the thickness of the fin is 0.15 mm to 0.5 mm, and the width of the cooling liquid channel is 0.2 mm to 1 mm.

[0018] According to a second aspect of an embodiment of this specification, a circuit board assembly cooling channel is provided, comprising:

[0019] heat dissipation object; and,

[0020] The liquid cooling plate as described in any one of the above items, wherein the liquid cooling plate is attached to the heat dissipation object.

[0021] Optionally, the number of the heat dissipation objects is at least two;

[0022] At least two of the heat dissipation objects are arranged in sequence along the flow direction of the cooling liquid in the liquid cooling plate.

[0023] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0024] In the embodiments of the present specification, recesses are arranged in the cold liquid channel of the liquid cooling plate along the flow direction of the cold liquid, and the arrangement density of the recesses on the downstream side of the flow direction is higher than the arrangement density on the upstream side, so that the flow rate of the cold liquid on the downstream side of the flow direction is reduced, and the heat dissipation effect of the cold liquid on the downstream area is increased, thereby avoiding uneven heat dissipation in liquid cooling and improving the reliability of electronic equipment.

[0025] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0027] Figure 1 is a schematic structural diagram of a cross section of a liquid cooling plate involved in the present application;

[0028] Figure 2 is a side sectional view of a liquid cooling plate involved in the present application;

[0029] Figure 3 is a top view of a fin and a cooling liquid channel in a liquid cooling plate involved in an embodiment of the present application;

[0030] Figure 4 is a top view of fins and cooling liquid channels in another liquid cooling plate involved in an embodiment of the present application;

[0031] Figure 5 is a top view of fins and cooling liquid channels in another liquid cooling plate involved in an embodiment of the present application;

[0032] Figure 6 is a partial structural schematic diagram of a liquid cooling plate involved in an embodiment of the present application, wherein: Figure 6 The recess in (A) includes a guide portion with rounded corners, Figure 6 (B) The recess comprises a beveled guide portion;

[0033] Figure 7 is a partial structural schematic diagram of a liquid cooling plate involved in an embodiment of the present application, wherein the spoiler is set to be a triangle;

[0034] Figure 8 is a top view of fins and cooling liquid channels in another liquid cooling plate involved in an embodiment of the present application;

[0035] Fig. 9 It is a structural schematic diagram of a circuit board assembly involved in this application. DETAILED DESCRIPTION

[0036] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0037] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0038] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0039] The present application provides a liquid cooling plate 100, such as Figure 1 , 2 As shown, including:

[0040] substrate1;

[0041] A plurality of fins 2, wherein a cooling liquid channel 3 is formed between adjacent fins 2, and a recess 4 is formed in at least part of the cooling liquid channel 3, wherein the width of the recess 4 is greater than the size of the cooling liquid channel 3;

[0042] A shell 5, wherein the substrate 1 and the shell 5 cover the plurality of fins 2;

[0043] A spoiler 6 is disposed in the recess 4;

[0044] The arrangement density of the recesses 4 formed in one cooling liquid channel 3 increases along the flow direction of the cooling liquid in the liquid cooling plate 100 .

[0045] For a liquid cooling plate 100, a substrate 1 and a shell 5 are provided, and the shell 5 is fixedly connected to the substrate 1 to form a cavity 7, and a cold liquid inlet 70 and a cold liquid outlet 71 are provided on both sides of the shell 5. In the cavity 7, a plurality of fins 2 are formed between the substrate 1 and the shell 5, and a cold liquid channel 3 through which the cold liquid flows is formed between adjacent fins 2. The size of the fin 2 can be set according to actual needs, and the heat exchange area of ​​the cold liquid can be increased by the fin 2. Preferably, the thickness of the fin 2 is 0.15 mm to 0.5 mm, and the width of the cold liquid channel 3 is 0.2 mm to 1 mm. The higher the density of the fin 2, the more it can increase the heat exchange area of ​​the cold liquid, wherein the thickness of the fin 2 refers to the size in the arrangement direction of the fin 2, and the width of the cold liquid channel 3 refers to the size between adjacent fins 2. More preferably, the thickness of the fin 2 can be set to between 0.25 mm and 0.35 mm, and the width of the cold liquid channel 3 can be set to between 0.5 mm and 0.8 mm.

[0046] A spoiler 6 is provided in the recess 4. The shape of the spoiler 6 can be similar to that of the recess 4, but slightly smaller than the recess 4 in size. For example, the spoiler 6 can be set to a rectangle, a trapezoid, a triangle or a shape similar to the above shapes. By changing the shape of the spoiler 6, the flow rate of the cooling liquid in the recess 4 can be adjusted, thereby controlling the overall flow rate of the cooling liquid in the liquid cooling plate 100.

[0047] It should be noted that the setting density refers to the number of settings of the recesses 4 within a fixed size range, and the setting number can be 0, that is, no recesses 4 are set within a fixed size range. Then, an increase in the setting density can be considered as an increase in the number of settings of the recesses 4 within the next fixed size range. For example, the number of settings of the recesses 4 within the next fixed size range is 1, 2 or more, which can be set according to actual needs without any limitation.

[0048] After the cold liquid pipeline is connected to the liquid cooling plate 100 and the liquid cooling plate 100 is attached to the heat dissipation object, the cold liquid flows into and fills the cavity 7 , and the cold liquid takes out the heat of the heat dissipation object through the cold liquid channel 3 . On the upstream side of the liquid cooling plate 100 (the side close to the inlet 70), since the temperature of the cold liquid is relatively low, the heat on the fins 2 can be taken away more quickly. On the downstream side of the liquid cooling plate 100 (the side close to the outlet 71), since the cold liquid has absorbed the heat on the upstream fins 2, the temperature of the cold liquid increases and the ability to absorb heat decreases. However, by providing a high-density recess 4 and a spoiler 6 therein, the flow rate of the cold liquid on the downstream side can be relatively reduced, so that the cold liquid can stay on the downstream side for a relatively long time, so as to increase the time for absorbing heat relative to the fins 2, approach or reach a heat absorption amount similar to that on the upstream side, thereby balancing the heat absorption of various parts in the liquid cooling plate 100, achieving heat absorption balance of the liquid cooling plate 100, avoiding the situation where the heat dissipation efficiency on the downstream side of the liquid cooling plate 100 is insufficient, and then avoiding the problem of heat accumulation and even damage to the heat dissipation object caused by insufficient heat dissipation efficiency in some areas, thereby improving the reliability of electronic equipment.

[0049] Optional, such as Figure 3 , 4 As shown, the recesses 4 are arranged at intervals between the formed cooling liquid channels 3 .

[0050] In the liquid cooling plate 100 , the recesses 4 may be provided on part of the cooling liquid channels 3 or on all of the cooling liquid channels 3 according to actual needs.

[0051] Since the size of the fins 2 and the cold liquid channel 3 is relatively small, setting the recesses 4 with a high density may increase the difficulty of preparing the liquid cooling plate 100, and the high-density arrangement of the recesses 4 may cause a significant drop in the flow rate of the cold liquid or cause blockage of the cold liquid channel 3 when used for a long time. In order to avoid the above problems, the cold liquid channel 3 can be divided into a cold liquid channel 3A including the recesses 4 and the spoiler 6 and a cold liquid channel 3B not including the recesses 4 and the spoiler 6, wherein the cold liquid channel 3A and the cold liquid channel 3B are arranged at intervals, wherein the interval arrangement may be one by one or several intervals as required, without limitation. The direction indicated by the arrow is the direction of the cold liquid in

[0052] In this way, the cold liquid channel 3A can achieve more balanced heat dissipation for the downstream side, and the cold liquid channel 3B can achieve rapid flow of cold liquid therein, maintaining the flow rate in the liquid cooling plate 100 , thereby improving the flexibility of the heat dissipation requirements of the liquid cooling plate 100 .

[0053] Preferably, Figure 4 As shown, a cooling liquid channel 3B without a recess 4 is arranged between adjacent cooling liquid channels 3A with recesses 4 .

[0054] Through Figure 4 The arrangement shown can achieve a better balance of heat dissipation and flow rate in the liquid cooling plate 100 .

[0055] Optional, such as Figure 5 As shown, recesses 4 are formed on adjacent cooling liquid channels 3 , wherein the recesses 4 formed on adjacent cooling liquid channels 3 are staggered.

[0056] For different heat dissipation objects, for example, when the heat dissipation demand on one side of a heat dissipation object is similar to that on the other side, it is necessary to maintain the heat dissipation balance of each area of ​​the heat dissipation object. At this time, a higher density of recesses 4 and spoilers 6 therein can be provided in the liquid cooling plate 100, so that the cold liquid on the downstream side of the liquid cooling plate 100 can absorb more heat emitted by the fins 2, thereby further improving the heat dissipation balance of the liquid cooling plate 100.

[0057] Optional, such as Figure 6 As shown, a guide portion 30 is provided at the connection between the recess 4 and the cooling liquid channel 3 .

[0058] In the liquid cooling plate 100, due to the arrangement of the recess 4 and the spoiler 6, the size of some areas is reduced, especially the junction of the cold liquid channel 3 and the recess 4. In order to reduce the obstruction of the cold liquid flow caused by the arrangement of the recess 4 and the spoiler 6, a guide portion 30 can be provided at the connection between the recess 4 and the cold liquid channel 3. The guide portion 30 can be set as a rounded corner or as a transition zone from small to large size, wherein: Figure 6(A) is a guide portion 30A provided with a rounded corner, Figure 6 (B) is a guide portion 30B provided as a transition zone.

[0059] By disposing the guide portion 30 , possible blockage of the cooling liquid between the cavity 4 and the cooling liquid channel 3 can be avoided, thereby further improving the reliability of heat dissipation of the electronic device.

[0060] Optional, such as Figure 7 As shown, the thickness of the spoiler 6 decreases along the flow direction of the cooling liquid in the liquid cooling plate 100 .

[0061] That is, in the liquid cooling plate 100 , the spoiler 6 may be configured to have a larger size near the inlet 70 and a smaller size near the outlet 71 , so that the spoiler 6 forms a shape that is approximately trapezoidal or triangular.

[0062] With the above arrangement, when the cooling liquid flows into the recess 4, it encounters greater resistance, and when it flows out of the recess 4, the flow rate of the cooling liquid is increased, thereby reducing the problem of decreased heat dissipation effect caused by excessive decrease in the flow rate of the cooling liquid.

[0063] Moreover, by setting up in a nearly trapezoidal or triangular shape, the contact area between the cooling liquid in the recess 4 and the spoiler 6 can be increased. Since the spoiler 6 can also absorb the heat generated by the heat dissipation object, increasing the contact area can improve the heat dissipation of this part of the heat, thereby further improving the overall heat dissipation efficiency of the liquid cooling plate 100.

[0064] Optional, such as Figure 8 As shown, the size of the projected area of ​​the spoiler 6 arranged in the recess 4 on the cold liquid channel 3 on the substrate 1 increases along the flow direction of the cold liquid in the cold liquid channel 3 .

[0065] If a plurality of recesses 4 and spoilers 6 are provided on a cooling liquid channel 3, the flow velocity can be slightly reduced due to the lower temperature of the cooling liquid on the upstream side and the higher efficiency of absorbing heat. On the downstream side, the flow velocity can be significantly reduced due to the higher temperature of the cooling liquid and the lower efficiency of absorbing heat, thereby improving the heat absorption amount of the cooling liquid on the downstream side and achieving the overall heat dissipation efficiency of the liquid cooling plate 100.

[0066] Correspondingly, the present application also provides a circuit board assembly 200, such as Fig. 9 As shown, including:

[0067] heat dissipation object 8; and

[0068] The liquid cooling plate 100 described in any one of the above items, wherein the liquid cooling plate 100 is attached to the heat dissipation object 8.

[0069] Since the size of the liquid cooling plate 100 can be set according to actual needs, the liquid cooling plate 100 can correspond to one or more heat dissipation objects 8. In the case where the liquid cooling plate 100 corresponds to one heat dissipation object 8, the overall size of the liquid cooling plate 100 is small, and heat dissipation balance is achieved for different areas of one heat dissipation object 8.

[0070] In the case where one liquid cooling plate 100 corresponds to multiple heat dissipation objects 8, the overall size of the liquid cooling plate 100 is relatively large, and heat dissipation balance can be achieved among the multiple heat dissipation objects 8. For example, optionally, the number of the heat dissipation objects 8 is at least two;

[0071] At least two heat dissipation objects 8 are arranged in sequence along the flow direction of the cooling liquid in the liquid cooling plate 100 .

[0072] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0073] In the embodiments of the present specification, recesses are arranged in the cold liquid channel of the liquid cooling plate along the flow direction of the cold liquid, and the arrangement density of the recesses on the downstream side of the flow direction is higher than the arrangement density on the upstream side, so that the flow rate of the cold liquid on the downstream side of the flow direction is reduced, and the heat dissipation effect of the cold liquid on the downstream area is increased, thereby avoiding uneven heat dissipation in liquid cooling and improving the reliability of electronic equipment.

[0074] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0075] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0076] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A liquid cooling plate, characterized in that: include: substrate; A plurality of fins, wherein cooling channels are formed between adjacent fins, and recesses are formed in at least some of the cooling channels, wherein the width of the recesses is greater than the size of the cooling channels; A housing, wherein the substrate and the housing cover the plurality of fins; A spoiler, disposed in the recess; The arrangement density of the recesses formed in a cooling liquid channel increases along the flow direction of the cooling liquid in the liquid cooling plate.

2. The liquid cooling plate according to claim 1, characterized in that: The recesses are arranged at intervals between the formed cooling liquid channels.

3. The liquid cooling plate according to claim 2, characterized in that: A cooling liquid channel without a recess is arranged between adjacent cooling liquid channels with recesses.

4. The liquid cooling plate according to claim 1, characterized in that: Concave holes are formed on adjacent cooling liquid channels, wherein the concave holes formed on adjacent cooling liquid channels are staggered.

5. The liquid cooling plate according to claim 1, characterized in that: A guide portion is provided at the connection between the recess and the cold liquid channel.

6. The liquid cooling plate according to claim 1, characterized in that: The thickness of the spoiler decreases along the flow direction of the cooling liquid in the liquid cooling plate.

7. The liquid cooling plate according to claim 1, characterized in that: The size of the projected area of ​​the spoiler arranged in a recess on one of the cold liquid channels on the substrate increases along the flow direction of the cold liquid in the cold liquid channel.

8. The liquid cooling plate according to claim 1, characterized in that: The thickness of the fin is 0.15 mm to 0.5 mm, and the width of the cooling liquid channel is 0.2 mm to 1 mm.

9. A circuit board assembly, characterized in that: include: Heat dissipation object; as well as, The liquid cooling plate according to any one of claims 1 to 8, wherein the liquid cooling plate is attached to the heat dissipation object.

10. The circuit board assembly according to claim 9, characterized in that: The number of the heat dissipation objects is at least two; At least two of the heat dissipation objects are arranged in sequence along the flow direction of the cooling liquid in the liquid cooling plate.

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