Lamp bead support for SMD LED lamp bead and SMD LED lamp bead

Abstract

The utility model discloses a lamp bead support for SMD LED lamp bead and an SMD LED lamp bead, the lamp bead support is simple in structure and easy to realize, the upper surface of the support body is concavely provided with a first light reflecting cavity, the light emitting effect can be enhanced, and the service life of the support body is prolonged. In specific use, the problem of optical crosstalk caused by light emission between adjacent SMD LED lamp beads or adjacent pixel units can be prevented; due to the arrangement of a third mounting position / conductive connection position and a fourth mounting position / conductive connection position on the third bonding pad, the electrodes of the LED chips mounted on the mounting positions / conductive connection positions on the third bonding pad can be electrically connected together conveniently during specific implementation, and the practicability is good; the height of the fourth mounting position / conductive connection position is lower than that of the third mounting position / conductive connection position, so that the LED chip with larger thickness can be conveniently mounted on the fourth mounting position / conductive connection position with lower position during specific implementation, and the height of the upper end of the mounted LED chip is reduced; therefore, the height of the upper end of the LED chip which is small in thickness and is attached to the third attaching position / conductive connecting position at the higher position can be matched, the depth required by the light reflecting cavity / bowl cup can be reduced, the appearance size of the product can be finally reduced, and the practicability is good.

Description

Technical Field

[0001] The utility model relates to a lamp bead bracket for an SMD LED lamp bead and an SMD LED lamp bead. Background Art

[0002] The LED display screen is composed of many single-pixel LED lamp beads corresponding to a certain dot pitch.

[0003] Each LED chip on the lamp bead bracket of the existing SMD LED lamp bead is mounted on a soldering pad at the same height. However, different types of LED chips, such as vertical structure LED chips, are thicker than upright or flip-down structure LED chips. When the vertical structure LED chip is mounted on a soldering pad at the same height together with the upright or flip-down structure LED chip, the vertical structure LED chip will be higher than the upright or flip-down structure LED chip. This will subsequently increase the upper end packaging height of the SMD LED lamp bead, which is not conducive to reducing the external dimensions of the SMD LED lamp bead. It is necessary to solve this problem. Utility Model Content

[0004] The utility model overcomes the deficiencies of the above-mentioned technology and provides a lamp bead bracket for SMD LED lamp beads and an SMD LED lamp bead.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A lamp bead holder for SMD LED lamp beads, comprising a holder body 9, wherein the upper surface of the holder body 9 is concavely provided with a first reflective cavity 81, and the holder body 9 is further provided with a first soldering pad 1, a second soldering pad 2, and a third soldering pad 3, wherein the first soldering pad 1 is provided with a first mounting position / conductive connection position 11 located in the first reflective cavity 81, the second soldering pad 2 is provided with a second mounting position / conductive connection position 21 located in the first reflective cavity 81, and the third soldering pad 3 is provided with a third mounting position / conductive connection position 31 and a fourth mounting position / conductive connection position 32 located in the first reflective cavity 81, wherein the first mounting position / conductive connection position 11, the second mounting position / conductive connection position 21, and the third mounting position / conductive connection position 31 are at the same height, and the height of the fourth mounting position / conductive connection position 32 is lower than the height of the third mounting position / conductive connection position 31.

[0007] Preferably, the bracket body 9 is also provided with a second reflective cavity 82 adjacent to the first reflective cavity 81, and the bracket body 9 is also provided with a fourth pad 4, the fourth pad 4 is provided with a fifth mounting position / conductive connection position 41 and a sixth mounting position / conductive connection position 42 located in the second reflective cavity 82, the first pad 1 is provided with a seventh mounting position / conductive connection position 12 located in the second reflective cavity 82, and the second pad 2 is provided with an eighth mounting position / conductive connection position 22 located in the second reflective cavity 82, wherein the fifth mounting position / conductive connection position 41, the seventh mounting position / conductive connection position 12, and the eighth mounting position / conductive connection position 22 are at the same height, and the sixth mounting position / conductive connection position 42 is at a height lower than the fifth mounting position / conductive connection position 41.

[0008] Preferably, the first mounting position / conductive connection position 11, the second mounting position / conductive connection position 21, the third mounting position / conductive connection position 31, the fifth mounting position / conductive connection position 41, the seventh mounting position / conductive connection position 12, and the eighth mounting position / conductive connection position 22 are at the same height, and the fourth mounting position / conductive connection position 32 and the sixth mounting position / conductive connection position 42 are at the same height.

[0009] Preferably, the bracket body 9 is further provided with a fifth soldering pad 5 , and the fifth soldering pad 5 is provided with a ninth mounting position / conductive connection position 51 located in the second reflective cavity 82 .

[0010] Preferably, the bracket body 9 is also provided with a third reflective cavity 83, a fourth reflective cavity 84, and a plurality of solder pads, the first reflective cavity 81, the second reflective cavity 82, the third reflective cavity 83, and the fourth reflective cavity 84 are arranged in 2*2, and the lamp bead bracket is an axisymmetric structure.

[0011] This case also protects another lamp bead bracket for SMD LED lamp beads, including a bracket body 9, the upper surface of which is recessed with a first reflective cavity 81, the bracket body 9 is also provided with a third soldering pad 3, the third soldering pad 3 is provided with a third mounting position / conductive connection position 31 and a fourth mounting position / conductive connection position 32 located in the first reflective cavity 81, and the height of the fourth mounting position / conductive connection position 32 is lower than the height of the third mounting position / conductive connection position 31.

[0012] The present case also protects an SMD LED lamp bead, which adopts the lamp bead bracket for SMD LED lamp beads, wherein LED chips are mounted on the third mounting position / conductive connection position 31 and the fourth mounting position / conductive connection position 32 respectively.

[0013] Preferably, a vertically structured LED chip is mounted on the fourth mounting position / conductive connection position 32 .

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The structure of the lamp bead bracket in this case is simple and easy to implement. The upper surface of the bracket body is recessed with a first reflective cavity, which is conducive to enhancing the light-emitting effect. When used specifically, it can prevent the problem of light crosstalk caused by light emission between adjacent SMD LED lamp beads or adjacent pixel units. The third mounting position / conductive connection position and the fourth mounting position / conductive connection position on the third soldering pad are arranged so that when implemented specifically, one electrode of the LED chip mounted to each mounting position / conductive connection position on the third soldering pad is electrically connected together, which is practical. The height of the fourth mounting position / conductive connection position is lower than the height of the third mounting position / conductive connection position, which is convenient for mounting a thicker LED chip to the lower fourth mounting position / conductive connection position during specific implementation, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted to the higher third mounting position / conductive connection position, which is conducive to reducing the depth required for the reflective cavity / bowl, and ultimately reducing the product size, which is practical.

[0016] 2. The second reflective cavity of the bracket body and its corresponding soldering pad are arranged in this case, which is convenient for forming a lamp bead bracket for two pixels. In specific implementation, the LED chip is mounted in the first reflective cavity to form a first pixel unit, and the LED chip is mounted in the second reflective cavity to form a second pixel unit, which is beneficial to improving the integration; the fifth mounting position / conductive connection position and the sixth mounting position / conductive connection position of the fourth soldering pad are arranged, which is convenient for specific implementation so that one electrode of the LED chip mounted to each mounting position / conductive connection position on the fourth soldering pad is electrically connected together, which is practical, and the height of the sixth mounting position / conductive connection position is lower than the height of the fifth mounting position / conductive connection position, which is convenient for specific implementation so that the thicker LED chip can be mounted on the lower sixth mounting position / conductive connection position, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher fifth mounting position / conductive connection position, which is beneficial to reducing the depth required for the reflective cavity / bowl, and ultimately can reduce the product size, which is practical.

[0017] 3. The SMD LED lamp beads in this case adopt the lamp bead bracket in this case. The mounting position / conductive connection position on a certain soldering pad has high and low positions. In the specific implementation, the thicker LED chip can be mounted on the fourth mounting position / conductive connection position with a lower position, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher mounting position / conductive connection position. It is beneficial to reduce the depth required for the reflective cavity / bowl, and finally reduce the product size, which is practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is one of the top views of this case.

[0019] Figure 2 This is the second top view of this case.

[0020] Figure 3 yes Figure 2 Schematic diagram of the pad on the left side of the circuit as viewed from the left. DETAILED DESCRIPTION

[0021] The following examples further illustrate the features of the present invention and other related features to facilitate understanding by those skilled in the art:

[0022] like Figures 1 to 3 As shown, a lamp bead holder for SMD LED lamp beads includes a holder body 9, the upper surface of the holder body 9 is recessed with a first reflective cavity 81, the holder body 9 is also provided with a first soldering pad 1, a second soldering pad 2, and a third soldering pad 3, the first soldering pad 1 is provided with a first mounting position / conductive connection position 11 located in the first reflective cavity 81, the second soldering pad 2 is provided with a second mounting position / conductive connection position 21 located in the first reflective cavity 81, the third soldering pad 3 is provided with a third mounting position / conductive connection position 31 and a fourth mounting position / conductive connection position 32 located in the first reflective cavity 81, wherein the first mounting position / conductive connection position 11, the second mounting position / conductive connection position 21, and the third mounting position / conductive connection position 31 are at the same height, and the height of the fourth mounting position / conductive connection position 32 is lower than the height of the third mounting position / conductive connection position 31.

[0023] As described above, in a specific implementation, each pad extends to the lower end of the bracket body 9 to form a pin for SMD.

[0024] As described above, the structure of the lamp bead bracket in this case is simple and easy to implement. The upper surface of the bracket body 9 is concavely provided with a first reflective cavity 81, which is conducive to enhancing the light output effect and can prevent adjacent SMD The problem of light crosstalk caused by light emission between LED lamp beads or between adjacent pixel units; the setting of the third mounting position / conductive connection position 31 and the fourth mounting position / conductive connection position 32 on the third soldering pad 3 is convenient for the specific implementation so that one electrode of the LED chip mounted to each mounting position / conductive connection position on the third soldering pad 3 is electrically connected together, which is practical, and the setting of the height of the fourth mounting position / conductive connection position 32 is lower than the height of the third mounting position / conductive connection position 31, which is convenient for the specific implementation so that the thicker LED chip can be mounted on the lower fourth mounting position / conductive connection position 32, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher third mounting position / conductive connection position 31, which is conducive to reducing the depth required for the reflective cavity / bowl, and ultimately can reduce the product size, which is practical.

[0025] As described above, in a specific implementation, the bracket body 9 is further provided with a second reflective cavity 82 adjacent to the first reflective cavity 81, and the bracket body 9 is further provided with a fourth pad 4, and the fourth pad 4 is provided with a fifth mounting position / conductive connection position 41 and a sixth mounting position / conductive connection position 42 located in the second reflective cavity 82, the first pad 1 is provided with a seventh mounting position / conductive connection position 12 located in the second reflective cavity 82, and the second pad 2 is provided with an eighth mounting position / conductive connection position 22 located in the second reflective cavity 82, wherein the fifth mounting position / conductive connection position 41, the seventh mounting position / conductive connection position 12, and the eighth mounting position / conductive connection position 22 are at the same height, and the sixth mounting position / conductive connection position 42 is at a height lower than the fifth mounting position / conductive connection position 41.

[0026] As described above, the second reflective cavity 82 of the bracket body 9 and its corresponding soldering pad are arranged in this case, so as to facilitate the formation of a lamp bead bracket for two pixels. In specific implementation, an LED chip is mounted in the first reflective cavity 81 to form a first pixel unit, and an LED chip is mounted in the second reflective cavity 82 to form a second pixel unit, which is beneficial to improve the integration degree; the fifth mounting position / conductive connection position 41 and the sixth mounting position / conductive connection position 42 of the fourth soldering pad 4 are arranged, so as to facilitate the specific implementation so that one electrode of the LED chip mounted to each mounting position / conductive connection position on the fourth soldering pad 4 is electrically connected to The sixth mounting position / conductive connection position 42 is located at a height lower than the fifth mounting position / conductive connection position 41, so that during specific implementation, a thicker LED chip can be mounted on the lower sixth mounting position / conductive connection position 42, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher fifth mounting position / conductive connection position 41, which is beneficial to reducing the depth required for the reflective cavity / bowl, and ultimately can reduce the product size, and has good practicality.

[0027] As described above, during specific implementation, the first mounting position / conductive connection position 11, the second mounting position / conductive connection position 21, the third mounting position / conductive connection position 31, the fifth mounting position / conductive connection position 41, the seventh mounting position / conductive connection position 12, and the eighth mounting position / conductive connection position 22 are at the same height, and the fourth mounting position / conductive connection position 32 and the sixth mounting position / conductive connection position 42 are at the same height, which is convenient for specific implementation.

[0028] As described above, in a specific implementation, the bracket body 9 is further provided with a fifth solder pad 5, and the fifth solder pad 5 is provided with a ninth mounting position / conductive connection position 51 located in the second reflective cavity 82, which is used for mounting LED chips or providing aerial flying wire connections for LED chips.

[0029] As described above, in a specific implementation, the bracket body 9 is further provided with a third reflective cavity 83, a fourth reflective cavity 84, and a plurality of solder pads, the first reflective cavity 81, the second reflective cavity 82, the third reflective cavity 83, and the fourth reflective cavity 84 are arranged in 2*2, and the lamp bead bracket is an axisymmetric structure, so it is convenient to form a lamp bead bracket for 4 pixels, which has good practicality.

[0030] The present case also discloses another lamp bead bracket for SMD LED lamp beads, including a bracket body 9, wherein the upper surface of the bracket body 9 is recessed with a first reflective cavity 81, and the bracket body 9 is also provided with a third soldering pad 3, and the third soldering pad 3 is provided with a third mounting position / conductive connection position 31 and a fourth mounting position / conductive connection position 32 located in the first reflective cavity 81, and the height of the fourth mounting position / conductive connection position 32 is lower than the height of the third mounting position / conductive connection position 31.

[0031] As described above, the height of the fourth mounting position / conductive connection position 32 in this case is set lower than the height of the third mounting position / conductive connection position 31, so that during specific implementation, a thicker LED chip can be mounted on the lower fourth mounting position / conductive connection position 32, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher third mounting position / conductive connection position 31, which is beneficial to reducing the depth required for the reflective cavity / bowl, and ultimately can reduce the product size, with good practicality.

[0032] like Figure 1 As shown, the present case also discloses an SMD LED lamp bead, which adopts the above-mentioned lamp bead bracket for SMD LED lamp beads, wherein LED chips are mounted on the third mounting position / conductive connection position 31 and the fourth mounting position / conductive connection position 32 respectively.

[0033] As described above, the SMD LED lamp bead of this case adopts the lamp bead bracket of this case, and the mounting position / conductive connection position on a certain soldering pad thereof has high and low positions, so that during specific implementation, the thicker LED chip can be mounted on the fourth mounting position / conductive connection position with a lower position, thereby reducing the upper end height of the LED chip after mounting, so as to adapt to the upper end height of the LED chip with a smaller thickness mounted on the higher mounting position / conductive connection position, which is beneficial to reducing the depth required for the reflective cavity / bowl, and ultimately can reduce the product's external dimensions, and has good practicality.

[0034] As described above, in a specific implementation, a vertical structure LED chip is mounted on the fourth mounting position / conductive connection position 32, so that the upper end electrode of the vertical structure LED chip can be electrically connected to other mounting positions / conductive connection positions through aerial flying wires.

[0035] As mentioned above, this case protects a lamp bead bracket for SMD LED lamp beads and an SMD LED lamp bead. All technical solutions that are the same or similar to this case should be shown to fall within the scope of protection of this case.

Claims

1. A lamp bead bracket for SMD LED lamp beads, characterized in that The invention comprises a support body (9), wherein the upper surface of the support body (9) is concavely provided with a first reflective cavity (81), and the support body (9) is also provided with a first soldering pad (1), a second soldering pad (2), and a third soldering pad (3); the first soldering pad (1) is provided with a first mounting position / conductive connection position (11) located in the first reflective cavity (81); the second soldering pad (2) is provided with a second mounting position / conductive connection position (21) located in the first reflective cavity (81); the third soldering pad (3) is provided with a third mounting position / conductive connection position (31) and a fourth mounting position / conductive connection position (32) located in the first reflective cavity (81); wherein the first mounting position / conductive connection position (11), the second mounting position / conductive connection position (21), and the third mounting position / conductive connection position (31) are at the same height, and the fourth mounting position / conductive connection position (32) is at a lower height than the third mounting position / conductive connection position (31).

2. A lamp bead bracket for SMD LED lamp beads according to claim 1, characterized in that The support body (9) is also provided with a second reflective cavity (82) adjacent to the first reflective cavity (81); the support body (9) is also provided with a fourth pad (4); the fourth pad (4) is provided with a fifth mounting position / conductive connection position (41) and a sixth mounting position / conductive connection position (42) located in the second reflective cavity (82); the first pad (1) is provided with a seventh mounting position / conductive connection position (12) located in the second reflective cavity (82); the second pad (2) is provided with an eighth mounting position / conductive connection position (22) located in the second reflective cavity (82); wherein the fifth mounting position / conductive connection position (41), the seventh mounting position / conductive connection position (12) and the eighth mounting position / conductive connection position (22) are at the same height; and the sixth mounting position / conductive connection position (42) is at a lower height than the fifth mounting position / conductive connection position (41).

3. A lamp bead bracket for SMD LED lamp beads according to claim 2, characterized in that The first mounting position / conductive connection position (11), the second mounting position / conductive connection position (21), the third mounting position / conductive connection position (31), the fifth mounting position / conductive connection position (41), the seventh mounting position / conductive connection position (12), and the eighth mounting position / conductive connection position (22) are at the same height, and the fourth mounting position / conductive connection position (32) and the sixth mounting position / conductive connection position (42) are at the same height.

4. A lamp bead bracket for SMD LED lamp beads according to claim 3, characterized in that The support body (9) is also provided with a fifth solder pad (5), and the fifth solder pad (5) is provided with a ninth mounting position / conductive connection position (51) located in the second reflective cavity (82).

5. A lamp bead bracket for SMD LED lamp beads according to claim 4, characterized in that The bracket body (9) is also provided with a third reflective cavity (83), a fourth reflective cavity (84), and a plurality of solder pads; the first reflective cavity (81), the second reflective cavity (82), the third reflective cavity (83), and the fourth reflective cavity (84) are arranged in a 2*2 pattern; and the lamp bead bracket is an axisymmetric structure.

6. A lamp bead bracket for SMD LED lamp beads, characterized in that The invention comprises a support body (9), wherein the upper surface of the support body (9) is concavely provided with a first reflective cavity (81), the support body (9) is further provided with a third soldering pad (3), the third soldering pad (3) is provided with a third mounting position / conductive connection position (31) and a fourth mounting position / conductive connection position (32) located in the first reflective cavity (81), and the fourth mounting position / conductive connection position (32) is located at a height lower than the third mounting position / conductive connection position (31).

7. An SMD LED lamp bead, characterized in that A lamp bead bracket for SMD LED lamp beads according to any one of claims 1 to 6 is adopted, wherein LED chips are mounted on the third mounting position / conductive connection position (31) and the fourth mounting position / conductive connection position (32), respectively.

8. The SMD LED lamp bead according to claim 7, characterized in that A vertically structured LED chip is mounted on the fourth mounting position / conductive connection position (32).

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