Protective device for wafer unloading after wafer thinning

Abstract

The utility model discloses a protection device for wafer unloading after wafer thinning, and relates to the technical field of semiconductor chip processing, the protection device for wafer unloading after wafer thinning comprises a spacing ring, the interior of the spacing ring is slidably connected with four moving plates which are circumferentially arranged at equal intervals, one end of each moving plate is fixedly connected with an arc-shaped protection plate, and the other end of each moving plate is fixedly connected with an arc-shaped groove. Four first gears which are circumferentially arranged at equal intervals are rotationally connected into the limiting ring, a rack is fixedly connected to one side of the moving plate, the surface of the rack is in meshed connection with the surfaces of the first gears, a first inner gear ring is arranged in the limiting ring, and the surface of the first inner gear ring is in meshed connection with the surfaces of the four first gears. According to the protection device for wafer discharging after wafer thinning, when the device is used, a worker can rotate an operation screw rod to drive certain protection plates to move synchronously, so that the device can wrap carrying tables of different sizes, the device can further protect wafers of different sizes, and the operation range of the device is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a protective device for wafer lowering after wafer thinning. Background Art

[0002] Since the wafer is cut very thin and adhered to the carrier by means of glue and wax, it is necessary to use high-temperature heated organic solvents to peel the wafer from the carrier. The wafer is prone to move during the process of peeling off the carrier, causing the wafer to slip off the carrier. In addition, the physical properties of the wafer can easily cause damage and contamination to the wafer.

[0003] Patent No.: CN215896314U, provides a protective device for wafer unloading after wafer thinning, which can effectively reduce the risk of the wafer sliding off the carrier during the unloading process, and solves the problem of wafer breakage and contamination caused by the wafer sliding off the carrier when there is no effective protection in the prior art. It has the advantages of easy placement, adjustable height, and long-term repeated use.

[0004] However, during the implementation of this solution, since the size of the protective inner ring is fixed, the device can only protect wafers on a carrier of one size. Therefore, when protecting wafers of different sizes, it is often necessary to set up protective devices of various specifications to protect the wafers. Therefore, when using the protective devices, the staff often need to distinguish the required protective devices, which is inconvenient. Therefore, a protective device for removing the wafer after thinning is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a protective device for wafer lowering after wafer thinning, which can solve the problems of the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a protective device for wafer lowering after thinning, comprising a limiting ring, wherein the limiting ring is internally slidably connected with four movable plates arranged equidistantly around the circumference, the movable plates penetrate the surface of the limiting ring, one end of the movable plate is fixedly connected with an arc-shaped protective plate, the limiting ring is internally rotatably connected with four first gears arranged equidistantly around the circumference, a rack is fixedly connected to one side of the movable plate, the surface of the rack is also slidably connected with the inside of the limiting ring, the surface of the rack is meshed with the surface of the first gear, a first inner gear ring is arranged inside the limiting ring, and the surface of the first inner gear ring is meshed with the surfaces of the four first gears.

[0007] Preferably, the interior of the limiting ring is fixedly connected with support columns which are equidistantly arranged in a circumference, and the upper ends of the support columns are slidably connected to the bottom of the first inner gear ring.

[0008] Preferably, the internal thread connection of the limiting ring is connected to two operating screws, both of which penetrate the surface of the limiting ring, and the lower ends of the operating screws are slidably connected to the inside of a first gear.

[0009] Preferably, a slide groove is provided on the surface of the operating screw, a limiting bar is fixedly connected to the interior of a first gear, and the surface of the limiting bar is slidably connected to the inner wall of the slide groove.

[0010] Preferably, the bottom of the limiting ring is rotatably connected to a second inner gear ring, and the bottom of the limiting ring is rotatably connected to four second gears arranged equidistantly on a long circumference, the surface of the second gear is meshed with the surface of the second inner gear ring, the internal thread of the limiting ring is connected to a support screw, the support screw passes through the surface of the limiting ring, the surface of the support screw and the inside of the second gear slide with each other, and the second gear and the first gear do not correspond to each other.

[0011] Preferably, a sliding groove and a limiting strip are also provided between the support screw and the second gear.

[0012] Preferably, one end of the support screw away from the limiting ring is fixedly connected to a truncated cone block.

[0013] Preferably, the outer surface of the second inner gear ring is provided with anti-slip grooves.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] (1) The protective device for the wafer after thinning. When the device is in use, the staff can drive some protective plates to move synchronously by turning the operating screw, so that the device can wrap the carriers of different sizes, and then the device can protect wafers of different sizes, which improves the operating range of the device and the practicability of the device, and is worthy of promotion.

[0016] (2) The protective device for the lower wafer after wafer thinning can synchronously adjust some support screws through the setting of the second internal gear ring, thereby avoiding the situation where the protruding lengths of the support screws are different when the device is in use, causing the support of the limit ring to be skewed, thereby improving the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the limit ring of the utility model;

[0020] Figure 3 For this utility model Figure 2A in the middle is an enlarged schematic diagram;

[0021] Figure 4 This is a schematic diagram of the internal structure of the limit ring of the utility model;

[0022] Figure 5 It is a schematic diagram of the surface structure of the limit ring of the utility model.

[0023] Figure numerals: 1. limit ring; 2. protective plate; 3. movable plate; 4. operating screw; 5. supporting screw; 6. truncated cone block; 7. rack; 8. first gear; 9. first inner gear ring; 10. slide groove; 11. limiting strip; 12. support column; 13. second inner gear ring; 14. second gear. DETAILED DESCRIPTION

[0024] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0025] See also Figure 1-5 The utility model provides a technical solution: a protective device for wafer lowering after wafer thinning, comprising a limit ring 1, the interior of the limit ring 1 is slidably connected with four movable plates 3 arranged equidistantly in a circle, the movable plates 3 penetrate the surface of the limit ring 1, and one end of the movable plate 3 is fixedly connected with an arc-shaped protective plate 2, so that the protective plate 2 can fit more closely with the surrounding of the carrier.

[0026] The interior of the limiting ring 1 is rotatably connected with four first gears 8 which are equidistantly arranged in a circle. A rack 7 is fixedly connected to one side of the movable plate 3. The surface of the rack 7 is also slidably connected to the interior of the limiting ring 1. The surface of the rack 7 is meshed with the surface of the first gear 8. A first inner gear ring 9 is arranged inside the limiting ring 1. The surface of the first inner gear ring 9 is meshed with the surfaces of the four first gears 8. Through the arrangement of the first inner gear ring 9, when one first gear 8 rotates, all the first gears 8 can be driven to rotate synchronously, so that the staff only needs to drive one first gear 8 to rotate, thereby facilitating the operation of the device.

[0027] Furthermore, the interior of the limit ring 1 is fixedly connected with support columns 12 which are arranged equidistantly in a circle, and the upper ends of the support columns 12 are slidably connected to the bottom of the first inner gear ring 9. Through the arrangement of the support columns 12, the first inner gear ring 9 can be erected inside the limit ring 1, so that the first inner gear ring 9 and the movable plate 3 are not at the same height, thereby avoiding movement interference between the first inner gear ring 9 and the movable plate 3, thereby ensuring the smooth operation of the device.

[0028] The internal thread connection of the limiting ring 1 is connected to two operating screws 4, and the two operating screws 4 both penetrate the surface of the limiting ring 1. The lower end of the operating screw 4 is slidingly connected to the inside of a first gear 8, so that the staff can drive the first gear 8 by rotating the operating screw 4. At the same time, the setting of the operating screw 4 can be used as a handle to facilitate the staff to take the entire device.

[0029] Furthermore, a slide groove 10 is provided on the surface of the operating screw 4, and a limiting bar 11 is fixedly connected to the inside of the first gear 8. The surface of the limiting bar 11 is slidably connected to the inner wall of the slide groove 10, and then through the setting of the limiting bar 11 and the slide groove 10, when the operating screw 4 rotates, it can push the limiting bar 11 through the inner wall of the slide groove 10, drive the first gear 8 to rotate synchronously, and will not drive the first gear 8 to move up and down in the limit ring 1, thereby ensuring the smooth operation of the device.

[0030] The bottom of the limiting ring 1 is rotatably connected to a second inner gear ring 13, and the bottom of the limiting ring 1 is rotatably connected to four second gears 14 arranged equidistantly on a long circumference. The surfaces of the second gears 14 mesh with the surfaces of the second inner gear ring 13, and the second gears 14 do not correspond to the first gear 8, thereby avoiding interference in the operation of the device.

[0031] Furthermore, the outer surface of the second inner tooth ring 13 is provided with anti-slip grooves, so that when the staff member moves the second inner tooth ring 13, the friction between the staff member's hand and the second inner tooth ring 13 is increased, the occurrence of slipping is reduced, and the use effect of the device is improved.

[0032] The internal thread of the limiting ring 1 is connected to a support screw 5, which passes through the surface of the limiting ring 1. The surface of the support screw 5 and the inside of the second gear 14 slide against each other. A slide groove 10 and a limiting strip 11 are also provided between the support screw 5 and the second gear 14. The end of the support screw 5 away from the limiting ring 1 is fixedly connected to a truncated cone block 6, and then through the setting of the truncated cone block 6, the device can be placed stably on a curved surface or a flat surface. At the same time, through the setting of the second internal gear ring 13, some support screws 5 can be adjusted synchronously, thereby avoiding the situation where the protruding length of the support screw 5 is different when the device is in use, which causes the support of the limiting ring 1 to be skewed, thereby improving the use effect of the device.

[0033] Specifically, when the solution is needed to soak the lower film, the second inner gear ring 13 is turned to drive the second gear 14 to rotate, thereby driving the support screw 5 to rotate synchronously, thereby driving the support screw 5 to extend out of the limit ring 1 to adjust the length, thereby adjusting the height of the limit ring 1. After the carrier is placed in the liquid medicine pot, the limit ring 1 is sleeved on the edge of the carrier, and then the liquid medicine is heated, and one or two operating screws 4 are rotated to drive the first gear 8 to rotate in the limit ring 1, thereby driving the first inner gear ring 9 to rotate, thereby driving the remaining first gears 8 to rotate synchronously, so that the rotation of the first gear 8 drives the rack 7 to slide in the limit ring 1, thereby causing the protective plate 2 to gradually approach the carrier and wrap the edge of the carrier, thereby protecting the wafer on the carrier. When the device is in use, the staff can drive all the protective plates 2 to move synchronously by rotating the operating screw 4, so that the device can wrap carriers of different sizes, thereby enabling the device to protect wafers of different sizes, thereby improving the operating range of the device and the practicality of the device, and it is worthy of promotion.

[0034] Working principle: Move the second inner gear ring 13 to drive the second gear 14 to rotate, thereby driving the support screw 5 to rotate synchronously, thereby driving the support screw 5 to extend the length of the limit ring 1 to adjust, thereby adjusting the height of the limit ring 1. After the carrier is placed in the medicine pot, the limit ring 1 is sleeved on the edge of the carrier, and then the medicine is heated, and one or two operating screws 4 are rotated, thereby driving the first gear 8 to rotate in the limit ring 1, thereby driving the first inner gear ring 9 to rotate, thereby driving the remaining first gears 8 to rotate synchronously, so that the rotation of the first gear 8 drives the rack 7 to slide in the limit ring 1, thereby causing the protective plate 2 to gradually approach the carrier and wrap the edge of the carrier, thereby protecting the wafer on the carrier.

[0035] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A protective device for wafer unloading after wafer thinning, comprising a limiting ring (1), characterized in that: The interior of the limiting ring (1) is slidably connected to four circumferentially equidistantly arranged movable plates (3), the movable plates (3) penetrate the surface of the limiting ring (1), one end of the movable plates (3) is fixedly connected to an arc-shaped protective plate (2), the interior of the limiting ring (1) is rotatably connected to four circumferentially equidistantly arranged first gears (8), one side of the movable plate (3) is fixedly connected to a rack (7), the surface of the rack (7) is also slidably connected to the interior of the limiting ring (1), the surface of the rack (7) is meshingly connected to the surface of the first gear (8), and a first internal gear ring (9) is provided inside the limiting ring (1), the surface of the first internal gear ring (9) is meshingly connected to the surfaces of the four first gears (8).

2. The protective device for wafer unloading after wafer thinning according to claim 1, characterized in that: The interior of the limiting ring (1) is fixedly connected with support columns (12) arranged equidistantly in a circumference, and the upper ends of the support columns (12) are slidably connected to the bottom of the first inner gear ring (9).

3. The protective device for wafer unloading after wafer thinning according to claim 1, characterized in that: The inner thread of the limiting ring (1) is connected to two operating screws (4), and the two operating screws (4) both penetrate the surface of the limiting ring (1). The lower ends of the operating screws (4) are slidably connected to the inside of a first gear (8).

4. The protective device for wafer unloading after wafer thinning according to claim 3, characterized in that: A sliding groove (10) is provided on the surface of the operating screw rod (4), a limiting strip (11) is fixedly connected to the interior of a first gear (8), and the surface of the limiting strip (11) is slidably connected to the inner wall of the sliding groove (10).

5. The protective device for wafer unloading after wafer thinning according to claim 4, characterized in that: The bottom of the limiting ring (1) is rotatably connected to a second inner toothed ring (13), and the bottom of the limiting ring (1) is rotatably connected to four second gears (14) arranged equidistantly on a long circumference, the surface of the second gear (14) is meshed with the surface of the second inner toothed ring (13), the internal thread of the limiting ring (1) is connected to a support screw (5), the support screw (5) passes through the surface of the limiting ring (1), the surface of the support screw (5) and the inside of the second gear (14) slide against each other, and the second gear (14) and the first gear (8) do not correspond to each other.

6. The protective device for wafer unloading after wafer thinning according to claim 5, characterized in that: A sliding groove (10) and a limiting strip (11) are also provided between the support screw rod (5) and the second gear (14).

7. The protective device for wafer unloading after wafer thinning according to claim 5, characterized in that: One end of the support screw rod (5) away from the limiting ring (1) is fixedly connected to a truncated cone block (6).

8. The protective device for wafer unloading after wafer thinning according to claim 5, characterized in that: The outer surface of the second inner gear ring (13) is provided with anti-slip grooves.

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