Semiconductor optical glass forming heating device

By designing a semiconductor optical glass forming heating device, the lifting action of the drive motor and the lifting rod table, combined with the limit lifting action of the insulation cylinder and the piston push rod, the problems of waste of energy, large temperature, uneasy to control, slow heating speed and poor working environment in the traditional optical glass forming mold heating device are solved, and efficient and safe heating effects are achieved.

CN222834189UActive Publication Date: 2025-05-06SICHUAN SHUWANG CHENSHENG NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202421533047.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-28
Publication Date
2025-05-06
Estimated Expiration
2034-06-28

AI Technical Summary

Technical Problem

Traditional optical glass mold heating devices have problems such as waste of energy, large, uncontrollable temperature, slow heating speed and poor working environment.

Method used

Design a semiconductor optical glass forming heating device, including heating equipment, heating conductors, parts cylinders, drive motors, lifting rod tables, struts, insulation cylinders and heating molds. The driving motor drives the lifting rod table lifting action, combined with the limit lifting action of the insulation cylinder and the synchronous action of the piston push rod, the lifting and insulation of the heating mold is achieved, and the heating effect of the heating conductor is maintained.

Benefits of technology

It effectively reduces energy waste, improves the working environment, improves the heating speed, and ensures the cooling effect of the insulation cylinder by automatically replenishing the water body, avoiding overheating of the heating mold.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor optical glass forming and heating device, and belongs to the field of glass processing. A semiconductor optical glass forming and heating device comprises heating equipment, a heating conductor, a part barrel, a driving motor, a lifting rod table, a supporting rod, a heat preservation barrel and a heating mold. The heating conductor penetrates through the part cylinder and is electrically connected with the heating equipment; the part cylinder is fixedly mounted on the top surface of the heating equipment; the driving motor is fixedly mounted in the part cylinder; the two supporting rods are rotationally connected to the interior of the part barrel in a symmetrical structure; and the heating mold is placed in the groove of the lifting rod table and is in running fit with the lifting rod table. The lifting rod table is driven by the driving motor to ascend and descend, so that when the lifting rod table drives the lifting heating mold to ascend and descend to take and place semiconductor optical glass, the heat preservation barrel hinged to the supporting rod and the lifting rod table act reversely, and the heat preservation barrel flexibly conducts sleeving heat preservation protection on the heating mold heated by a heating conductor.
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Description

Technical Field

[0001] The invention relates to the field of glass processing, and more particularly to a semiconductor optical glass forming and heating device. Background Art

[0002] During the optical glass forming process, the mold needs to be heated so that the optical glass can be hot-pressed in the mold. The traditional production process is to heat the hot-pressing mold by burning natural gas mixed with compressed air or liquefied petroleum gas mixed with compressed air. Therefore, the traditional production process wastes a lot of energy, has a poor working environment, is difficult to control the temperature, and has a slow heating speed and is not easy to automate.

[0003] A document with prior art disclosure (announcement) number CN216890627U provides a heating device for a hot pressing mold of optical glass. In the related technology of the device, a metal conductor is wound around the periphery of the heating mold, and one end of the metal conductor is connected to the current output port of the high-frequency power transformer, and the other end is connected to the current loop port of the high-frequency power transformer; the metal conductor and the hot pressing mold are fixed on the workbench. Through this device, the energy waste of heating the hot pressing mold of optical glass can be reduced, the working environment can be improved, and the heating speed can be increased.

[0004] Although the device has many beneficial effects, the following problems still exist: when the thermoforming mold is heated by the heating wire, the heat generated by the heating wire will dissipate, causing heat loss.

[0005] In view of this, we propose a semiconductor optical glass molding heating device. Summary of the invention

[0006] 1. Technical issues to be solved

[0007] The object of the present invention is to provide a semiconductor optical glass forming and heating device to solve the problems raised in the above background technology.

[0008] 2. Technical solution

[0009] The present invention is achieved through the following technical solutions:

[0010] A semiconductor optical glass forming heating device comprises a heating device, a heating conductor, a component cylinder, a driving motor, a lifting rod platform, a support rod, a heat preservation cylinder and a heating mold;

[0011] The heating conductor passes through the cylinder of the component and is electrically connected to the heating device;

[0012] The component cylinder is fixedly mounted on the top surface of the heating device and slidably cooperates with the heat preservation cylinder;

[0013] The drive motor is fixedly installed inside the cylinder of the part, and the screw rod fixedly connected to the output end of the drive motor is adapted to the thread of the lifting rod platform;

[0014] The support rods are provided with two and are rotatably connected inside the cylinder body of the component in a symmetrical structure. One end of the support rod is hingedly installed with the lifting rod platform, and the other end is hingedly installed outside the heat preservation cylinder.

[0015] The heating mold is placed in the groove of the lifting rod platform and is rotatably matched therewith.

[0016] As an optional solution to the technical solution of the present application document, a pressure cylinder is fixedly installed on one side of the part cylinder, and a piston push rod is slidably adapted inside the pressure cylinder. The other end of the piston push rod is fixedly connected to the side wall of the insulation cylinder, and one end of the pressure cylinder is fixedly connected to a one-way water suction valve tube and a telescopically adjustable copper conduit. A water tank is provided on the outside of the other end of the one-way water suction valve tube, and the water tank is fixedly installed on the side wall of the heating equipment, and the other end of the copper conduit is fixedly connected to the insulation cylinder.

[0017] As an optional solution to the technical solution of the present application document, a heat-insulating disk made of ceramic fiber material is rotatably connected in the groove of the lifting rod platform through a ball bearing, and the heat-insulating disk is gap-matched with the heating mold.

[0018] As an optional solution of the technical solution of this application document, the support rod includes a sleeve and two extension rods;

[0019] The sleeve is rotatably connected inside the part cylinder, the two extension rods are slidably connected inside the sleeve in a symmetrical structure, and are hingedly installed with the lifting rod platform and the insulation cylinder respectively, and the two extension rods are elastically connected by a tension spring.

[0020] As an optional solution of the technical solution of this application document, the insulation cylinder is made of ceramic fiber material, the interior of the insulation cylinder is hollow structured, and one side of the insulation cylinder is fixedly connected to an exhaust copper pipe, and a groove is opened on the side wall of the heating mold.

[0021] 3. Beneficial effects

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present application utilizes the forward and reverse rotation of the driving motor to drive the screw fixedly connected at its output end and the lifting rod platform adapted to the external thread to transmit the information. At this time, the lifting rod platform is pushed by the screw and connected to the support rod hingedly installed inside the cylinder body of the part to realize the lifting and lowering action of the lifting rod platform. When the lifting rod platform drives the lifting and lowering action of the heating mold to take and place the semiconductor optical glass, the insulation cylinder hingedly installed through the support rod and the lifting rod platform perform reverse actions, so that the insulation cylinder can flexibly cover the heating mold heated by the heating conductor for insulation protection, thereby maintaining the heating effect of the heating conductor.

[0024] 2. The present application utilizes the limiting lifting and lowering action of the insulation cylinder to drive the connected and fixed piston push rod to move synchronously. At this time, the limiting lifting and lowering action of the piston push rod is limited to slide in the pressure cylinder, and the sliding piston push rod discharges the water pre-filled in the pressure cylinder into the insulation cylinder through the copper guide tube. When the piston push rod moves up, the suction force can open the one-way water suction valve pipe channel to suck the water inside the water tank into the pressure cylinder, thereby realizing the automatic replenishment of the evaporated water in the insulation cylinder, ensuring the cooling effect of the insulation cylinder, and preventing the insulation cylinder from scalding the cylinder body of the parts. The water filled in the heating mold is evaporated and vaporized under the heat of the heating conductor, and the steam is limitedly discharged outside through the exhaust copper tube and impacts the groove on the side wall of the heating mold to realize the rotation of the heating mold, thereby ensuring the uniform heat treatment of the semiconductor optical glass in the heating mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of a semiconductor optical glass forming and heating device;

[0026] Figure 2 It is a schematic diagram of the cross-section connection of the pressure cylinder structure of a semiconductor optical glass forming and heating device;

[0027] Figure 3 It is a schematic diagram of the structure of a lifting rod platform of a semiconductor optical glass forming and heating device;

[0028] Figure 4 It is a schematic cross-sectional view of a support rod structure of a semiconductor optical glass forming and heating device;

[0029] Figure 5 It is a schematic diagram of the cut-away installation of a heat preservation tube structure of a semiconductor optical glass forming heating device;

[0030] In the figure: 1. Heating equipment; 2. Heating conductor; 3. Part cylinder; 4. Driving motor; 5. Lifting rod platform; 6. Support rod; 7. Insulation cylinder; 8. Heating mold; 31. Pressure cylinder; 32. Piston push rod; 33. One-way water suction valve pipe; 34. Copper conduit; 35. Water tank; 51. Insulation plate; 61. Sleeve; 62. Extension rod; 63. Tension spring; 71. Exhaust copper pipe. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0032] See also Figure 1 , the present invention provides a technical solution:

[0033] A semiconductor optical glass molding heating device comprises a heating device 1, a heating conductor 2, a component cylinder 3, a driving motor 4, a lifting rod platform 5, a support rod 6, a heat preservation cylinder 7 and a heating mold 8;

[0034] The heating conductor 2 passes through the component cylinder 3 and is electrically connected to the heating device 1;

[0035] The component cylinder 3 is fixedly mounted on the top surface of the heating device 1 and is slidably matched with the heat preservation cylinder 7;

[0036] The driving motor 4 is fixedly installed inside the component cylinder 3, and the driving motor 4 is threadably adapted to the lifting rod platform 5 through a screw rod fixedly connected to the output end thereof;

[0037] Two support rods 6 are provided and are rotatably connected to the inside of the component cylinder 3 in a symmetrical structure. One end of the support rod 6 is hingedly installed with the lifting rod platform 5, and the other end is hingedly installed outside the heat preservation cylinder 7;

[0038] The heating mold 8 is placed in the groove of the lifting rod platform 5 and rotates therewith.

[0039] This technical solution utilizes the forward and reverse rotation of the driving motor 4 to drive the screw rod fixedly connected to its output end and the lifting rod platform 5 adapted to the external thread to transmit. At this time, the lifting rod platform 5 is pushed by the screw rod and connected with the support rod 6 hingedly installed inside the part cylinder 3 to realize the lifting and lowering action of the lifting rod platform 5. When the lifting rod platform 5 drives the lifting and lowering action of the heating mold 8 to take and place the semiconductor optical glass, the insulation cylinder 7 hingedly installed by the support rod 6 and the lifting rod platform 5 perform reverse action, so that the insulation cylinder 7 can flexibly cover the heating mold 8 heated by the heating conductor 2 for insulation protection, thereby maintaining the heating effect of the heating conductor 2.

[0040] See also Figure 2 and 1 A pressure cylinder 31 is fixedly installed on one side of the part cylinder 3, and a piston push rod 32 is slidably adapted inside the pressure cylinder 31. The other end of the piston push rod 32 is fixedly connected to the side wall of the insulation cylinder 7, and a one-way water suction valve tube 33 and a telescopically adjustable copper conduit 34 are fixedly connected to one end of the pressure cylinder 31. A water tank 35 is provided outside the other end of the one-way water suction valve tube 33. The water tank 35 is fixedly installed on the side wall of the heating device 1, and the other end of the copper conduit 34 is fixedly connected to the insulation cylinder 7.

[0041] This technical solution utilizes the limiting lifting action of the insulation cylinder 7 to drive the connected and fixed piston push rod 32 to move synchronously. At this time, the limiting lifting action of the piston push rod 32 is limited to slide in the pressure cylinder 31, and the sliding piston push rod 32 discharges the water pre-filled in the pressure cylinder 31 into the insulation cylinder 7 through the copper conduit 34. When the piston push rod 32 moves up, the suction force can open the one-way water suction valve tube 33 channel, and the water inside the water tank 35 is sucked into the pressure cylinder 31, thereby realizing the automatic replenishment of the evaporated water in the insulation cylinder 7, ensuring the cooling effect of the insulation cylinder 7, and preventing the insulation cylinder 7 from scalding the component cylinder 3.

[0042] See also Figure 3 and 1 A heat-insulating plate 51 made of ceramic fiber material is rotatably connected in the groove of the lifting rod platform 5 through a ball bearing, and the heat-insulating plate 51 is clearance-matched with the heating mold 8.

[0043] This technical solution utilizes a ceramic fiber insulation disk 51 that can rotate flexibly and insulate, to support the heating mold 8 and ensure the flexible rotation function of the heating mold 8, so as to facilitate the rotation of the heating mold 8 to shake and level the internal semiconductor optical glass.

[0044] See also Figure 4 and 1 , the support rod 6 includes a sleeve 61 and two extension rods 62;

[0045] The sleeve 61 is rotatably connected inside the part cylinder 3, and multiple extension rods 62 are slidably connected inside the sleeve 61 in a symmetrical structure, and are hingedly installed with the lifting rod platform 5 and the insulation cylinder 7 respectively, and a tension spring member 63 is fixedly connected between two opposite extension rods 62.

[0046] This technical solution utilizes the lifting and lowering movement of the lifting rod platform 5 to drive the support rod 6 connected to the inside of the part cylinder 3 to limit the flipping, so that the flipped support rod 6 changes the lifting rod platform 5 and the insulation cylinder 7 hinged at both ends to adjust the orientation. While meeting the insulation effect of the insulation cylinder 7, it is also convenient for the heating mold 8 placed in the groove of the lifting rod platform 5 to be taken and placed. The sleeve 61 and multiple extension rods 62 that make up the support rod 6 can ensure the stable extension and retraction of the support rod 6 under the elastic support of the tension spring 63.

[0047] See also Figure 5 and 1 The heat preservation tube 7 is made of ceramic fiber material, the interior of the heat preservation tube 7 is a hollow structure, and one side of the heat preservation tube 7 is fixedly connected to an exhaust copper pipe 71, and a groove is opened on the side wall of the heating mold 8.

[0048] When the technical solution utilizes the heating mold 8 to keep the heating conductor 2 warm, the water filled inside the heating mold 8 evaporates and vaporizes under the heat of the heating conductor 2, and the steam is limitedly discharged outside through the exhaust copper tube 71 and impacts the groove on the side wall of the heating mold 8, thereby realizing the rotation of the heating mold 8, thereby ensuring the uniform heat treatment of the semiconductor optical glass in the heating mold 8.

Claims

1. A semiconductor optical glass forming and heating device, characterized in that: It comprises a heating device (1), a heating conductor (2), a component cylinder (3), a driving motor (4), a lifting rod platform (5), a support rod (6), a heat preservation cylinder (7) and a heating mold (8); The heating conductor (2) passes through the component cylinder (3) and is electrically connected to the heating device (1); The component cylinder (3) is fixedly mounted on the top surface of the heating device (1) and is slidably matched with the heat preservation cylinder (7); The driving motor (4) is fixedly installed inside the component cylinder (3), and the driving motor (4) is threadably adapted to the lifting rod platform (5) through a screw rod fixedly connected to the output end thereof; Two support rods (6) are provided and are rotatably connected inside the component cylinder (3) in a symmetrical structure. One end of the support rod (6) is hingedly mounted on the lifting rod platform (5), and the other end is hingedly mounted on the outside of the heat preservation cylinder (7); The heating mold (8) is placed in the groove of the lifting rod platform (5) and is rotatably matched therewith.

2. The semiconductor optical glass forming and heating device according to claim 1, characterized in that: A pressure cylinder (31) is fixedly mounted on one side of the component cylinder (3), a piston push rod (32) is slidably adapted inside the pressure cylinder (31), the other end of the piston push rod (32) is fixedly connected to the side wall of the heat preservation cylinder (7), and a one-way water suction valve tube (33) and a telescopically adjustable copper conduit (34) are fixedly connected to one end of the pressure cylinder (31), a water tank (35) is externally arranged at the other end of the one-way water suction valve tube (33), the water tank (35) is fixedly mounted on the side wall of the heating device (1), and the other end of the copper conduit (34) is fixedly connected to the heat preservation cylinder (7).

3. The semiconductor optical glass forming and heating device according to claim 1, characterized in that: A heat-insulating plate (51) made of ceramic fiber material is rotatably connected in the groove of the lifting rod platform (5) via a ball bearing, and the heat-insulating plate (51) is clearance-matched with the heating mold (8).

4. The semiconductor optical glass forming and heating device according to claim 1, characterized in that: The support rod (6) comprises a sleeve (61) and two extension rods (62); The sleeve (61) is rotatably connected inside the component cylinder (3), and the two extension rods (62) are slidably connected inside the sleeve (61) in a symmetrical structure and are hingedly installed with the lifting rod platform (5) and the insulation cylinder (7) respectively. The two extension rods (62) are elastically connected via a tension spring (63).

5. The semiconductor optical glass forming and heating device according to claim 1, characterized in that: The heat-insulating cylinder (7) is made of ceramic fiber material, the interior of the heat-insulating cylinder (7) is arranged in a hollow structure, and one side of the heat-insulating cylinder (7) is fixedly connected to an exhaust copper pipe (71), and a groove is provided on the side wall of the heating mold (8).

Citation Information

Patent Citations

  • Heating device for hot-press forming mold of optical glass

    CN216890627U