Liquid preparation system capable of automatically adding copper sulfate

Abstract

According to the liquid preparation system capable of automatically adding the copper sulfate, a liquid preparation tank is communicated with a liquid preparation barrel through a first liquid preparation channel, and the liquid preparation tank is further communicated with a copper plating tank through a second liquid preparation channel; the liquid preparation barrel is connected with a feeding mechanism, and the upper barrel edge of the liquid preparation barrel is higher than the upper edge of the liquid preparation tank; and an overflow port of the copper plating tank is connected into the batching barrel through a backflow pipeline. Copper sulfate powder is added into the solution preparation barrel through the feeding mechanism, the stirring device fully stirs the added copper sulfate powder to accelerate dissolution, the circulating pump pumps a solution in the solution preparation tank and pumps the solution into the solution preparation barrel, the solution overflows to the solution preparation tank after the solution in the solution preparation barrel is full, and the solution preparation tank and the solution preparation barrel are self-circulated to achieve uniform solution preparation. The prepared plating solution is supplemented into each copper plating tank through a circulating pump and a pipeline, and the excessive plating solution in the copper plating tanks flows back into the solution preparation barrel through a pipeline, so that a dynamic circulating automatic solution preparation system is formed, and the concentration of the plating solution sulfuric acid intermittently added each time is ensured to be consistent.

Description

Technical Field

[0001] The utility model belongs to automatic material feeding and liquid dispensing equipment, in particular to a material feeding and liquid dispensing system for a copper plating tank solution of a gas shielded welding wire chemical plating line. Background Art

[0002] During the production process of copper-plated welding wire, the copper sulfate in the plating solution is continuously consumed. In order to ensure the stable quality of the copper layer of the copper-plated welding wire, the plating solution needs to be replenished with sulfuric acid barrel powder in time to keep the copper sulfate concentration in the plating solution stable within a certain range. Since copper sulfate powder is a non-flowing sticky powder and is easy to agglomerate, there is currently no corresponding feeding equipment in the market that matches the copper plating production line. Domestic welding wire manufacturers all use manual intermittent addition of copper sulfate powder, which not only has high labor costs, but also makes it difficult to ensure consistent sulfuric acid concentration in the plating solution. Now there is an urgent need for an automatic liquid preparation system to replace manual feeding and liquid preparation, so as to reduce production costs and ensure stable product quality. Improve the market competitiveness of enterprises. Utility Model Content

[0003] The technical problem to be solved by the utility model is: how to ensure that the concentration of sulfuric acid added to the plating solution each time is consistent, so a solution preparation system for automatically adding copper sulfate is provided.

[0004] In order to achieve the above object, the utility model is realized by the following technical solutions:

[0005] A liquid dispensing system for automatically adding copper sulfate comprises a liquid dispensing tank, a liquid dispensing barrel and a copper plating tank; wherein the liquid dispensing tank is connected to the liquid dispensing barrel through a first liquid dispensing channel, and the liquid dispensing tank is also connected to the copper plating tank through a second liquid dispensing channel; the liquid dispensing barrel is connected to a feeding mechanism, and the upper barrel edge height of the liquid dispensing barrel is higher than the upper edge height of the liquid dispensing tank; the overflow port of the copper plating tank is connected to the liquid dispensing barrel through a reflux pipe.

[0006] The liquid distribution tank is connected to a liquid replenishing channel, a circulating pump is arranged in the liquid replenishing channel, and the liquid replenishing channel is respectively connected to the first liquid distribution channel and the second liquid distribution channel, and corresponding solenoid valves are respectively arranged on the first liquid distribution channel and the second liquid distribution channel.

[0007] The feeding mechanism comprises a hopper, a distribution bin is arranged below the hopper, and the bottom of the distribution bin is connected with the liquid mixing barrel; wherein a stirring rod is arranged in the hopper, and the stirring rod is driven by a stirring cylinder; a distribution wheel is arranged in the distribution bin, and the distribution wheel is driven by a distribution cylinder.

[0008] A scraper plate is arranged on the dividing wheel, and the scraper plate is driven by a scraper cylinder.

[0009] The hopper and the sub-bin are an integral chamber, a partition is arranged in the integral chamber, the center position of the partition is concave downwards, and a through hole is arranged at the concave position.

[0010] A stirring device is arranged in the liquid preparation barrel.

[0011] Compared with the prior art, the utility model has the following beneficial effects: the utility model forms a liquid dispensing system by adding a liquid dispensing tank and connecting the copper plating tank with a pipeline. Copper sulfate powder is added to the liquid dispensing tank through a feeding mechanism, and a stirring device fully stirs the added copper sulfate powder to accelerate dissolution. A circulating pump draws the solution in the liquid dispensing tank and pumps it into the liquid dispensing tank. When the solution in the liquid dispensing tank is full, it overflows into the liquid dispensing tank. The liquid dispensing tank and the liquid dispensing tank self-circulate to achieve uniform liquid dispensing. The prepared plating solution is supplemented into each copper plating tank through a pipeline through a circulating pump, and the excess plating solution in the copper plating tank flows back into the liquid dispensing tank through a pipeline, thus forming a dynamic circulation automatic liquid dispensing system, which ensures that the concentration of sulfuric acid in the plating solution added intermittently each time is consistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is the main view of the general assembly drawing of the utility model;

[0013] Figure 2 This is the front view of the feeding mechanism in the utility model;

[0014] Figure 3 It is a left view of the feeding mechanism in the utility model. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0017] like Figure 1 , Figure 2 , Figure 3As shown, a liquid dispensing system for automatically adding copper sulfate includes a liquid dispensing tank 1, a liquid dispensing barrel 7 and a copper plating tank 5; wherein the liquid dispensing tank 1 is connected to the liquid dispensing barrel 7 through a first liquid dispensing channel 15, and the liquid dispensing tank 1 is also connected to the copper plating tank 5 through a second liquid dispensing channel 16; the liquid dispensing barrel 7 is connected to a feeding mechanism, and the upper barrel edge height of the liquid dispensing barrel 7 is higher than the upper edge height of the liquid dispensing tank 1; the overflow port of the copper plating tank 5 is connected to the liquid dispensing barrel 7 through a reflux pipe 6.

[0018] Furthermore, the liquid distribution tank 1 is connected to a liquid replenishment channel 3, a circulation pump 2 is arranged in the liquid replenishment channel 3, and the liquid replenishment channel 3 is respectively connected to the first liquid distribution channel 15 and the second liquid distribution channel 16, and corresponding solenoid valves are respectively arranged on the first liquid distribution channel 15 and the second liquid distribution channel 16.

[0019] Furthermore, the feeding mechanism includes a hopper 10, a material distribution bin 17 is provided below the hopper 10, and the bottom of the material distribution bin 17 is connected to the liquid dispensing barrel 7; wherein a stirring rod 14 is provided in the hopper 10, and the stirring rod 14 is driven by a stirring cylinder 13; a material distribution wheel 11 is provided in the material distribution bin 17, and the material distribution wheel 11 is driven by a material distribution cylinder 12. Preferably, a scraper plate 8 is provided on the material distribution wheel 11, and the scraper plate 8 is driven by a scraper cylinder 9.

[0020] Furthermore, the hopper 10 and the sub-bin 17 are an integral chamber, and a partition is provided in the integral chamber. The center of the partition is recessed downward, and a through hole is provided in the recessed portion, so that the hopper 10 and the sub-bin 17 are connected.

[0021] Furthermore, a stirring device 4 is provided in the liquid preparation barrel 7 .

[0022] It should be noted that in this patent application, the circulation pump 2, the solenoid valve on the liquid distribution channel, the stirring cylinder 13, the material distribution cylinder 12, and the scraping cylinder 9 are all connected to a computer control system, and each action is controlled by the computer control system. The computer control system is a prior art well known to those skilled in the art and will not be described in detail here.

[0023] The working principle of the utility model is:

[0024] Under the control of the computer control system, after the copper sulfate powder is added to the hopper 10, the stirring cylinder 13 drives the stirring rod 14 to stir evenly, so that the copper sulfate powder enters the distribution bin 17. In the distribution wheel 11 of the distribution bin 17, the distribution cylinder 12 drives the distribution wheel 11 to turn downward, so that the copper sulfate powder falls into the liquid distribution barrel 7. The scraper cylinder 9 drives the scraper plate 8 to reciprocate to scrape off the sulfuric acid powder adhering to the distribution wheel 11, so that the copper sulfate powder in the groove of the distribution wheel 11 falls completely into the distribution barrel 7. At the same time, the stirring device 4 fully stirs the added copper sulfate powder to accelerate dissolution, and the circulation pump 2 extracts the solution in the distribution tank 1 and injects it into the distribution barrel 7 through the liquid replenishment pipeline 3 and the first distribution channel 15 in turn. After the distribution barrel 7 is full, it overflows to the distribution tank 1, so that the liquid circulation of the distribution tank 1 and the distribution barrel 7 achieves uniform distribution. The prepared plating solution is injected into the copper plating tank 5 through the circulation pump 2 through the first distribution channel 15 and the second distribution channel 16 in turn, thereby achieving the purpose of adding copper sulfate. After the solution in the copper plating tank 5 reaches the overflow port, it flows back to the liquid dispensing barrel 7 through the reflux pipe 6 to flush the newly added copper sulfate powder into the liquid dispensing barrel 7. When the liquid dispensing barrel 7 is full, it overflows and flows into the liquid dispensing tank 1, thus forming a dynamic circulation system, thereby achieving the purpose of automatically adding copper sulfate.

[0025] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. A liquid preparation system for automatically adding copper sulfate, characterized in that: The invention comprises a liquid dispensing tank (1), a liquid dispensing barrel (7) and a copper plating tank (5); wherein the liquid dispensing tank (1) is connected to the liquid dispensing barrel (7) via a first liquid dispensing channel (15), and the liquid dispensing tank (1) is also connected to the copper plating tank (5) via a second liquid dispensing channel (16); the liquid dispensing barrel (7) is connected to a feeding mechanism, and the upper barrel edge height of the liquid dispensing barrel (7) is higher than the upper barrel edge height of the liquid dispensing tank (1); and the overflow port of the copper plating tank (5) is connected to the liquid dispensing barrel (7) via a reflux pipe (6).

2. A liquid preparation system for automatically adding copper sulfate according to claim 1, characterized in that: The liquid distribution tank (1) is connected to a liquid replenishing channel (3), a circulating pump (2) is arranged in the liquid replenishing channel (3), and the liquid replenishing channel (3) is respectively connected to a first liquid distribution channel (15) and a second liquid distribution channel (16), and corresponding solenoid valves are respectively arranged on the first liquid distribution channel (15) and the second liquid distribution channel (16).

3. A liquid preparation system for automatically adding copper sulfate according to claim 1, characterized in that: The feeding mechanism comprises a hopper (10), a material distribution bin (17) is arranged below the hopper (10), and the bottom of the material distribution bin (17) is connected to the liquid mixing barrel (7); wherein a stirring rod (14) is arranged in the hopper (10), and the stirring rod (14) is driven by a stirring cylinder (13); and a material distribution wheel (11) is arranged in the material distribution bin (17), and the material distribution wheel (11) is driven by a material distribution cylinder (12).

4. A liquid preparation system for automatically adding copper sulfate according to claim 3, characterized in that: A scraper plate (8) is provided on the material dividing wheel (11), and the scraper plate (8) is driven by a scraper cylinder (9).

5. A liquid preparation system for automatically adding copper sulfate according to claim 3, characterized in that: The hopper (10) and the material distribution bin (17) form an integral chamber, and a partition is provided in the integral chamber. The center of the partition is concave downward, and a through hole is provided at the concave position.

6. A liquid preparation system for automatically adding copper sulfate according to claim 1, characterized in that: A stirring device (4) is arranged in the liquid preparation barrel (7).

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