High-temperature displacement sensor

Abstract

The utility model discloses a high-temperature displacement sensor, and belongs to the technical field of sensors. A high-temperature displacement sensor comprises a circuit board body and further comprises an outer shell and an inner shell fixed in the outer shell, the circuit board body is arranged in the inner shell, a vacuum cavity is formed between the outer shell and the inner shell, a channel of a snakelike structure is formed in the outer shell, and the two ends of the channel extend out of the outer shell; a heat-insulating coating is fixedly arranged on the surface of the outer shell; the heat insulation coating is fixedly arranged on the surface of the outer shell, heat can be effectively isolated, the vacuum cavity is arranged, heat conduction between the outer shell and the inner shell can be isolated, the influence of high temperature on the inner shell is reduced, the channel is formed in the outer shell, heat exchange media are led into the channel, and heat exchange efficiency is improved. And heat on the outer shell can be taken away through heat exchange, so that the influence of high temperature on internal components is further reduced, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a high-temperature displacement sensor. Background Art

[0002] Displacement sensor, also known as linear sensor, is a linear device belonging to metal induction. The function of the sensor is to convert various measured physical quantities into electrical quantities. In the production process, the measurement of displacement is generally divided into two types: measuring physical size and mechanical displacement. According to the different forms of transformation of the measured variable, displacement sensors can be divided into analog and digital types. Analog types can be divided into physical type and structural type. Commonly used displacement sensors are mostly analog structural types, including potentiometer displacement sensors, inductive displacement sensors, synchro, capacitive displacement sensors, eddy current displacement sensors, Hall displacement sensors, etc. An important advantage of digital displacement sensors is that it is easy to send signals directly into computer systems. This type of sensor is developing rapidly and is increasingly widely used.

[0003] Existing displacement sensors work in high temperature environments and are prone to malfunctions, which causes the displacement sensors to be very unstable and easily damaged during use, and the displacement sensors cannot be temperature-insulated. Utility Model Content

[0004] The utility model aims to solve the problem that the displacement sensor in the prior art is prone to failure and unstable state when working in a high temperature environment, and proposes a high temperature displacement sensor.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A high-temperature displacement sensor comprises a circuit board body, on which a displacement measuring component is fixedly arranged, and further comprises: an outer shell, and an inner shell fixed in the outer shell, wherein the circuit board body is arranged in the inner shell, a vacuum cavity is provided between the outer shell and the inner shell, a channel with a serpentine structure is provided in the outer shell, and both ends of the channel extend out of the outer shell; and a heat-insulating coating is fixedly provided on the surface of the outer shell.

[0007] In order to facilitate the introduction of heat exchange medium into the channel, preferably, an air inlet and an air outlet are opened at one end of the outer shell, both ends of the channel are connected to the air inlet and the air outlet respectively, and a one-way valve is fixedly set in the air inlet and the air outlet.

[0008] In order to reduce the dust from entering the channel, further, the openings of the air inlet and the air outlet are both fixedly provided with a first dustproof net.

[0009] In order to facilitate the installation of the circuit board body, preferably, an installation cavity is opened in the inner shell, the circuit board body is slidably arranged in the installation cavity, and a limiting plate for supporting the circuit board body is fixedly arranged in the installation cavity.

[0010] Furthermore, a rubber pad is fixedly installed in one end of the installation cavity, one end of the circuit board body is abutted against the rubber pad, a threaded hole is opened at the other end of the installation cavity, a limiting column is threadedly connected in the threaded hole, the other end of the circuit board body is abutted against the limiting column, and a knob is fixedly installed on the limiting column.

[0011] Furthermore, a connecting wire is fixedly provided at the other end of the circuit board body, a through hole is opened on the limiting column, the connecting wire passes through the through hole, and a sealing ring is fixedly provided in the through hole, and the inner wall of the sealing ring abuts against the outer wall of the connecting wire.

[0012] Furthermore, a plurality of through slots are evenly formed on the limiting column, the plurality of through slots are all connected to the installation cavity, and a second dustproof net is fixedly arranged in the plurality of through slots.

[0013] Preferably, a fixing plate is fixedly provided on the outer wall of the housing, and a plurality of groups of mounting holes are evenly arranged on the fixing plate.

[0014] Compared with the prior art, the utility model provides a high temperature displacement sensor, which has the following beneficial effects:

[0015] 1. The high-temperature displacement sensor can effectively isolate heat by fixing a heat-insulating coating on the surface of the outer shell, reducing the heat conduction and heat absorption of the outer shell. A vacuum chamber is provided between the outer shell and the inner shell to isolate the heat conduction between the outer shell and the inner shell, reducing the influence of high temperature on the inner shell. A channel is provided in the outer shell, and a heat exchange medium is introduced into the channel to remove the heat on the outer shell through heat exchange, further reducing the influence of high temperature on internal components, ensuring its reliable operation, and extending its service life.

[0016] 2. The high-temperature displacement sensor has an installation cavity in the inner shell, a limit plate for supporting the circuit board body is fixedly arranged in the installation cavity, and a limit column is threadedly connected in the installation cavity, and a through groove is opened on the limit column. On the one hand, it is convenient to dissipate the heat of the circuit board body to ensure its reliable operation, and on the other hand, the limit column is easy to assemble and disassemble, which is convenient for maintenance of the circuit board body and improves the use effect.

[0017] The parts not involved in the device are the same as the prior art or can be implemented by the prior art. The utility model can effectively isolate heat by fixing a heat-insulating coating on the surface of the outer shell, and is provided with a vacuum chamber to isolate heat conduction between the outer shell and the inner shell, reducing the influence of high temperature on the inner shell, and a channel is opened in the outer shell. By passing a heat exchange medium into the channel, the heat on the outer shell can be taken away through heat exchange, further reducing the influence of high temperature on internal components and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural schematic diagram of a high temperature displacement sensor proposed by the utility model;

[0019] Figure 2 This is a structural schematic diagram of a high-temperature displacement sensor limit column proposed by the utility model;

[0020] Figure 3 This is a cross-sectional view of a high-temperature displacement sensor proposed by the utility model;

[0021] Figure 4 A high temperature displacement sensor proposed by the utility model Figure 3 A magnified view of part A;

[0022] Figure 5 The utility model is a structural schematic diagram of a high-temperature displacement sensor housing in an expanded state.

[0023] In the figure: 1. circuit board body; 101. displacement measurement component; 102. connecting line; 2. outer shell; 201. inner shell; 202. fixing plate; 203. vacuum chamber; 204. installation chamber; 205. limiting plate; 206. passage; 207. air inlet; 208. air outlet; 209. first dustproof net; 3. thermal insulation coating; 4. limiting column; 401. knob; 402. through hole; 403. sealing ring; 404. through groove; 405. second dustproof net. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0026] Example:

[0027] Reference Figure 1-Figure 5 A high-temperature displacement sensor includes a circuit board body 1, on which a displacement measuring component 101 is fixedly arranged. The displacement measuring component 101 includes a measuring rod. A measuring sleeve is fixedly arranged on the circuit board body 1. The measuring rod is slidably arranged in the measuring sleeve. A winding is arranged in the measuring sleeve. When the measuring rod moves, the magnetic induction principle of the transformer is used to generate voltage, and then the measured displacement is obtained through circuit conversion. The principle is similar to that of an LVDT linear displacement sensor. It also includes: an outer shell 2, and an inner shell 201 fixed in the outer shell 2, wherein the circuit board body 1 is arranged in the inner shell 201, a vacuum chamber 203 is opened between the outer shell 2 and the inner shell 201, a channel 206 with a serpentine structure is opened in the outer shell 2, and both ends of the channel 206 are extended to the outside of the outer shell 2. When in use, by setting the vacuum chamber 203 between the outer shell 2 and the inner shell 201, the heat conduction between the outer shell 2 and the inner shell 201 can be well isolated, and the influence of high temperature on the inner shell 201 can be reduced. Moreover, a channel 206 is opened in the outer shell 2, and by passing a heat exchange medium into the channel 206, the heat on the outer shell 2 can be taken away through heat exchange, which can further reduce the influence of high temperature on internal components, ensure their reliable operation, and extend their service life; a thermal insulation coating 3 is fixedly arranged on the surface of the outer shell 2, and the thermal insulation coating 3 can be a ceramic coating, a metal oxide coating, a polymer coating, etc., preferably a ceramic coating, which is usually composed of ceramic particles such as aluminum oxide and zirconium oxide, and has good high temperature resistance and thermal insulation ability. The ceramic coating can effectively isolate heat in a high temperature environment, reduce heat conduction and heat absorption, thereby reducing the impact of high temperature on components in the outer shell 2 and ensuring their reliable use.

[0028] When in use, by fixing a heat-insulating coating 3 on the surface of the outer shell 2, heat can be effectively isolated, and the heat conduction and heat absorption of the outer shell 2 can be reduced. A vacuum chamber 203 is provided between the outer shell 2 and the inner shell 201 to isolate the heat conduction between the outer shell 2 and the inner shell 201 and reduce the influence of high temperature on the inner shell 201. A channel 206 is provided in the outer shell 2. By introducing a heat exchange medium into the channel 206, the heat on the outer shell 2 can be taken away through heat exchange, further reducing the influence of high temperature on the internal components, ensuring their reliable operation, and extending their service life. By providing an installation cavity 204 in the inner shell 201, a limit plate 205 for supporting the circuit board body 1 is fixedly provided in the installation cavity 204, and a limit column 4 is threadedly connected in the installation cavity 204, and a through groove 404 is provided on the limit column 4. On the one hand, it is convenient to dissipate heat for the circuit board body 1 and ensure its reliable operation. On the other hand, the limit column 4 is easy to assemble and disassemble, which is convenient for maintenance of the circuit board body 1 and improves the use effect.

[0029] Reference Figure 1 , Figure 3-Figure 5 An air inlet 207 and an air outlet 208 are provided at one end of the outer shell 2. Here, the heat exchange medium can be water or air, and we prefer air. The two ends of the channel 206 are connected to the air inlet 207 and the air outlet 208, respectively, and a one-way valve is fixedly provided in the air inlet 207 and the air outlet 208. A first dustproof net 209 is fixedly provided at the mouth of the air inlet 207 and the air outlet 208. The first dustproof net 209 can reduce dust from entering the channel 206 and prevent blockage. When in use, air enters the channel 206 through the air inlet 207, flows along the channel 206, and finally flows out from the air outlet 208. In this process, the heat in the outer shell 2 can be taken away. A blowing fan or the like can be used to send the gas into the channel 206 through the air inlet 207. Here, according to the actual use situation, we divide the outer shell 2 into two parts through the fixing plate 202, one end of the limit column 4 is exposed to the outside of the device, and the other end is located inside the device. The end located inside the device will be affected by the high temperature inside the device, and the gas in the channel 206 will be heated. Since the density of the heated gas decreases, the density of the gas with low external temperature is large. According to the principle of "temperature difference motion", since the gas has mass, after the density difference exists, the airflow will flow from the high-density area to the low-density area, that is, convection motion is formed. This convection motion will develop as the temperature difference continues, and finally form a gas flow state. By utilizing the temperature difference to drive the flow of gas, the purpose of accelerating the gas delivery is achieved. Therefore, the external gas can automatically enter the channel 206 through the air inlet 207, realize the circulation of air, and improve the heat dissipation effect.

[0030] Reference Figure 3A mounting cavity 204 is opened in the inner shell 201, and the circuit board body 1 is slidably set in the mounting cavity 204, and a limiting plate 205 for supporting the circuit board body 1 is fixedly set in the mounting cavity 204. When in use, the mounting cavity 204 is opened in the inner shell 201, which facilitates the installation of the circuit board body 1, and the limiting plate 205 is set in the mounting cavity 204, which can not only support the circuit board body 1, but also form a gap between the circuit board body 1 and the inner wall of the mounting cavity 204, which is convenient for heat dissipation.

[0031] Reference Figure 2-Figure 4 A rubber pad is fixedly provided on the inner wall of one end of the installation cavity 204, and one end of the circuit board body 1 is abutted against the rubber pad. A threaded hole is opened at the other end of the installation cavity 204, and a limiting column 4 is threadedly connected in the threaded hole, and the other end of the circuit board body 1 is abutted against the limiting column 4, and a knob 401 is fixedly provided on the limiting column 4. When in use, by threading the limiting column 4 on the installation cavity 204, on the one hand, it is convenient to fix the circuit board body 1, and on the other hand, it is also convenient to assemble and disassemble, which can improve the maintenance efficiency of the circuit board body 1.

[0032] Reference Figure 1-Figure 4 A connecting wire 102 is fixedly arranged at the other end of the circuit board body 1, and a through hole 402 is opened on the limiting column 4, and the connecting wire 102 passes through the through hole 402, and a sealing ring 403 is fixedly arranged in the through hole 402, and the inner wall of the sealing ring 403 is abutted against the outer wall of the connecting wire 102. When in use, by opening the through hole 402 on the limiting column 4, interference with the connecting wire 102 can be avoided, and the sealing ring 403 is fixedly arranged in the through hole 402, which can reduce dust from entering the installation cavity 204.

[0033] Reference Figure 2 and Figure 4 A plurality of through slots 404 are evenly provided on the limiting column 4, and the through slots 404 are provided with two to ten groups. Here, we prefer six groups, and the six groups of through slots 404 are all connected with the installation cavity 204, and a second dustproof net 405 is fixedly provided in each of the six groups of through slots 404. When in use, the through slots 404 connected with the installation cavity 204 are provided on the limiting column 4, so that the heat in the installation cavity 204 can be dissipated outwardly to improve the heat dissipation effect, and the second dustproof net 405 can reduce the dust from entering the installation cavity 204 through the through slots 404, thereby improving the use effect.

[0034] Reference Figure 1 and Figure 3A fixing plate 202 is fixedly arranged on the outer wall of the outer shell 2. The fixing plate 202 is disc-shaped. A plurality of groups of mounting holes are evenly arranged on the fixing plate 202. There are two to eight groups of mounting holes, preferably four groups. When in use, the detection end of the outer shell 2 can be extended into the device by fixing the fixing plate 202 on the outer shell 2. Then, the fixing plate 202 is fixed to the outer wall of the device with bolts. Moreover, a sealing gasket is fixedly arranged between the fixing plate 202 and the outer wall of the device, which can improve the sealing effect between the fixing plate 202 and the device, reduce the leakage of high-temperature gas in the device, and improve the use effect.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high temperature displacement sensor, comprising a circuit board body (1), on which a displacement measuring component (101) is fixedly arranged, characterized in that: Also includes: an outer shell (2), and an inner shell (201) fixed inside the outer shell (2), The circuit board body (1) is arranged in an inner shell (201), a vacuum chamber (203) is provided between the outer shell (2) and the inner shell (201), a channel (206) in a serpentine structure is provided in the outer shell (2), and both ends of the channel (206) extend outward from the outer shell (2); A heat-insulating coating (3) is fixedly disposed on the surface of the outer shell (2).

2. A high temperature displacement sensor according to claim 1, characterized in that: An air inlet (207) and an air outlet (208) are provided at one end of the outer shell (2), and two ends of the channel (206) are respectively connected to the air inlet (207) and the air outlet (208), and one-way valves are fixedly arranged in the air inlet (207) and the air outlet (208).

3. A high temperature displacement sensor according to claim 2, characterized in that: The openings of the air inlet (207) and the air outlet (208) are both fixedly provided with a first dustproof net (209).

4. A high temperature displacement sensor according to claim 1, characterized in that: The inner shell (201) is provided with a mounting cavity (204), the circuit board body (1) is slidably arranged in the mounting cavity (204), and a limiting plate (205) for supporting the circuit board body (1) is fixedly arranged in the mounting cavity (204).

5. A high temperature displacement sensor according to claim 4, characterized in that: A rubber pad is fixedly arranged in one end of the installation cavity (204), and one end of the circuit board body (1) abuts against the rubber pad. A threaded hole is opened at the other end of the installation cavity (204), and a limit column (4) is threadedly connected in the threaded hole. The other end of the circuit board body (1) abuts against the limit column (4), and a knob (401) is fixedly arranged on the limit column (4).

6. A high temperature displacement sensor according to claim 5, characterized in that: A connecting wire (102) is fixedly arranged at the other end of the circuit board body (1), a through hole (402) is opened on the limiting column (4), the connecting wire (102) passes through the through hole (402), and a sealing ring (403) is fixedly arranged in the through hole (402), and the inner wall of the sealing ring (403) abuts against the outer wall of the connecting wire (102).

7. A high temperature displacement sensor according to claim 6, characterized in that: The limiting column (4) is evenly provided with a plurality of through slots (404), the plurality of through slots (404) are all connected to the installation cavity (204), and a second dustproof net (405) is fixedly arranged in the plurality of through slots (404).

8. A high temperature displacement sensor according to claim 1, characterized in that: A fixing plate (202) is fixedly arranged on the outer wall of the outer shell (2), and a plurality of groups of mounting holes are evenly arranged on the fixing plate (202).

Images