Dipping mechanism for improving end sealing precision of chip capacitor

Abstract

The utility model discloses a slurry dipping mechanism for improving chip capacitor end sealing precision. The slurry dipping mechanism comprises a pre-dipping device, a drying platform and a slurry dipping device which are sequentially arranged in the left-right direction. According to the scheme, two sets of dipping devices are introduced into the dipping mechanism, firstly, the end part of the chip capacitor is subjected to pre-dipping through the pre-dipping device and is dried to form a pre-dipping layer, and then the chip capacitor is subjected to formal dipping through the dipping devices, so that the dipping process of the chip capacitor is completed. According to the scheme, twice dipping is realized in the dipping mechanism, and the existence of the pre-dipping layer is beneficial to improving the bonding property of the paste and the chip capacitor in the formal dipping process, and ensures that the surface of the sealing layer of the chip capacitor is flat and the end sealing line is flat, so that the end sealing quality of the chip capacitor is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitor production equipment, and in particular to a slurry dipping mechanism for improving the sealing accuracy of chip capacitors. Background Art

[0002] With the rapid development of electronic technology, the types of electronic components are becoming more and more diverse. As people's requirements for the quality of electronic products continue to increase, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products, and the production and processing technology of capacitors is also constantly improving.

[0003] As one of the key processes in capacitor manufacturing, the capping process plays a decisive role in the production efficiency, product performance and quality of capacitors. The capping process usually requires a capping machine to complete.

[0004] The Chinese patent with the publication number CN109904012A discloses a multi-terminal component sealing machine, including a base, a sealing assembly arranged on the base, a first driving assembly arranged under the base and used to drive the sealing assembly, a carrier is arranged on the base below the sealing assembly, a second driving assembly is arranged on the carrier, a roller, a roller driving assembly connected to the roller, a scraper, and a multi-terminal component fixing assembly for fixing the multi-terminal component are fixed on the carrier in sequence, the carrier is slidably connected with the bracket in the vertical direction, a groove paddle disk is arranged at the bottom of the sealing assembly, and the roller is connected to the slurry box. When working, the roller first rolls and adheres the slurry, and then the roller rolls and brushes the slurry on the groove slurry disk at the bottom of the sealing assembly, and then the scraper is used to flatten the slurry on the groove slurry disk, and then the multi-terminal component fixing assembly is slid to the bottom of the groove slurry disk, and the sealing assembly is driven to press down, so as to apply silver paste to the upper end surface of the multi-terminal component.

[0005] It can be seen from the above-mentioned prior art that when the existing terminal sealing machine is dipping the chip capacitor, it generally only drives the chip capacitor to press down into the slurry tank to complete the terminal sealing of its end. However, since the silver paste used for terminal sealing is relatively thick, if the chip capacitor is only pressed down into the slurry tank during terminal sealing, it is easy to form an irregular sealing layer shape at the end of the chip capacitor after dipping, and there will be bubbles between the end surface of the capacitor and the sealing layer, resulting in uneven thickness of the sealing layer and poor bonding, which will affect the terminal sealing quality of the chip capacitor.

[0006] In addition, the termination requirement of chip capacitors is generally to form a straight termination line on the surface of the capacitor. However, the termination lines of chip capacitors that are terminated using the existing dipping mechanism are generally not straight and are prone to sagging outside the sealing layer, which also affects the termination quality of the chip capacitors. Utility Model Content

[0007] The purpose of the utility model is to propose a slurry dipping mechanism for improving the sealing accuracy of chip capacitors, which is beneficial to improving the bonding between the chip capacitors and the sealing layer, ensuring the sealing quality of the chip capacitors, thereby overcoming the shortcomings of the prior art.

[0008] To achieve this purpose, the utility model adopts the following technical solutions:

[0009] A slurry dipping mechanism for improving the sealing accuracy of a chip capacitor, comprising a pre-dipping device, a drying platform and a slurry dipping device sequentially arranged in a left-right direction;

[0010] The prepreg device comprises a prepreg head and a prepreg trough, wherein the prepreg head is arranged above the prepreg trough and can move horizontally in the left and right directions, and the horizontal movement range of the prepreg head is located above the prepreg trough and the drying platform;

[0011] The slurry soaking device comprises a slurry soaking frame, a scraper, a slurry soaking head and a slurry soaking tank; the scraper is installed at the bottom of the slurry soaking frame, and the scraper can move up and down relative to the slurry soaking frame; the slurry soaking tank is arranged below the scraper, and the slurry soaking tank can move along the front and back direction of the slurry soaking frame; the slurry soaking head is installed at the front end of the scraper, and the slurry soaking head can move horizontally along the left and right direction, and the horizontal movement range of the slurry soaking head is located above the drying platform and the slurry soaking tank;

[0012] The bottom of the prepreg head and the impregnation head are both provided with an impregnation suction cup, which is used to adsorb the loading plate, and the impregnation suction cup of the prepreg device can move up and down relative to the prepreg slurry tank, and the impregnation suction cup of the impregnation device can move up and down relative to the impregnation slurry tank.

[0013] Preferably, the drying platform comprises an infrared heating box and a positioning bracket, the positioning bracket is mounted on the top of the infrared heating box, and the positioning bracket is used to place a loading tray.

[0014] Preferably, the prepreg head and the impregnation head both include the impregnation suction cup, the displacement chassis, the mounting plate and the driving screw which are sequentially connected from bottom to top;

[0015] The mounting plate, displacement base and slurry soaking sucker of the prepreg head can all move up and down relative to the prepreg slurry tank, and the up and down movement of the mounting plate, displacement base and slurry soaking sucker of the prepreg head is relatively static;

[0016] The mounting plate, displacement base plate and slurry soaking sucker of the slurry soaking head can all move up and down relative to the slurry soaking tank, and the up and down movement of the mounting plate, displacement base plate and slurry soaking sucker of the slurry soaking head is relatively static;

[0017] The output end of the driving screw is connected to the mounting plate, and the driving screw is used to drive the mounting plate, the displacement chassis and the slurry immersion suction cup to move up and down; the displacement chassis and the slurry immersion suction cup can both move left and right relative to the mounting plate, and the left and right movement of the displacement chassis and the slurry immersion suction cup is relatively stationary.

[0018] Preferably, the prepreg head and the impregnation head also include a clamping cylinder, the clamping cylinder is fixedly mounted on the edge of the mounting plate, the connecting end of the clamping cylinder is connected to the impregnation suction cup, and the impregnation suction cup is detachably mounted on the bottom of the displacement chassis through the clamping cylinder.

[0019] Preferably, the prepreg head and the slurry dipping head both further include a limit rod, which is protrudingly mounted on the top of the mounting plate, and is used to limit the up and down movement range of the mounting plate, the displacement chassis and the slurry dipping suction cup.

[0020] Preferably, the prepreg head and the slurry dipping head both further include a lifting sensor, the lifting sensor is mounted on the mounting plate, and the lifting sensor is used to detect the up and down movement distance of the mounting plate, the displacement chassis and the slurry dipping suction cup.

[0021] Preferably, the slurry soaking device further comprises a scraper, which is mounted on the bottom of the slurry soaking frame and located at the rear end of the scraper, and the bottom of the scraper is in contact with the bottom of the slurry soaking tank.

[0022] Preferably, the scraper can move up and down relative to the slurry soaking frame.

[0023] The technical solution provided by the embodiment of the utility model may have the following beneficial effects:

[0024] This solution introduces two sets of dipping devices in the dipping mechanism. First, the end of the chip capacitor is pre-dipped by the pre-dip device and dried to form a pre-dip layer. Then, the chip capacitor is formally dipped by the dipping device, thereby completing the dipping process of the chip capacitor. The dipping mechanism of this solution implements two dippings, and the presence of the pre-dip layer is conducive to improving the bonding between the slurry and the chip capacitor during the formal dipping process, ensuring that the sealing surface of the chip capacitor is flat and the sealing line is flat, so as to ensure the sealing quality of the chip capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The utility model is a structural schematic diagram of a slurry dipping mechanism for improving the sealing accuracy of chip capacitors.

[0026] Figure 2 The utility model is a side view of a dipping device in a dipping mechanism for improving the sealing accuracy of a chip capacitor.

[0027] Figure 3 The utility model is a partial structural schematic diagram of a slurry dipping device in a slurry dipping mechanism for improving the termination accuracy of a chip capacitor.

[0028] Figure 4 It is a structural schematic diagram of the material loading tray in the utility model.

[0029] Wherein: prepreg device 1, prepreg head 11, prepreg slurry tank 12;

[0030] Drying platform 2, infrared heating box 21, positioning bracket 22;

[0031] Slurry dipping device 3, slurry dipping frame 31, scraper 32, slurry dipping head 33, slurry dipping suction cup 331, displacement chassis 332, mounting plate 333, driving screw rod 334, clamping cylinder 335, limiting rod 336, slurry dipping tank 34, scraper 35;

[0032] Loading tray 4. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] The technical solution provides a slurry dipping mechanism for improving the sealing accuracy of chip capacitors, including a pre-dipping device 1, a drying platform 2 and a slurry dipping device 3 arranged in sequence along the left and right directions;

[0035] The prepreg device 1 comprises a prepreg head 11 and a prepreg tank 12, wherein the prepreg head 11 is arranged above the prepreg tank 12, and the prepreg head 11 can move horizontally in the left-right direction, and the horizontal movement range of the prepreg head 11 is located above the prepreg tank 12 and the drying platform 2;

[0036] The slurry dipping device 3 includes a slurry dipping frame 31, a scraper 32, a slurry dipping head 33 and a slurry dipping tank 34; the scraper 32 is installed at the bottom of the slurry dipping frame 31, and the scraper 32 can move up and down relative to the slurry dipping frame 31; the slurry dipping tank 34 is arranged below the scraper 32, and the slurry dipping tank 34 can move along the front and back direction of the slurry dipping frame 31; the slurry dipping head 33 is installed at the front end of the scraper 32, and the slurry dipping head 33 can move horizontally along the left and right direction, and the horizontal movement range of the slurry dipping head 33 is located above the drying platform 2 and the slurry dipping tank 34;

[0037] The bottom of the prepreg head 11 and the impregnation head 33 are both provided with an impregnation suction cup 331, and the impregnation suction cup 331 is used to adsorb the loading plate 4, and the impregnation suction cup 331 of the prepreg device 1 can move up and down relative to the prepreg slurry tank 12, and the impregnation suction cup 331 of the impregnation device 3 can move up and down relative to the impregnation slurry tank 34.

[0038] When the chip capacitor is dipped into slurry, the terminal sealing machine in the prior art generally only drives the chip capacitor to be pressed down into the slurry tank to complete the terminal sealing of its end. However, since the silver paste used for terminal sealing is relatively thick, if the chip capacitor is only pressed down into the slurry tank during terminal sealing, it is easy for the end of the chip capacitor after dipping to form an irregular sealing layer shape, and there will be bubbles between the end surface of the capacitor and the sealing layer, resulting in uneven thickness of the sealing layer and poor bonding, which will affect the terminal sealing quality of the chip capacitor. In addition, the terminal sealing requirement of the chip capacitor is generally to form a straight terminal sealing line on the surface of the capacitor, but the terminal sealing line of the chip capacitor after being sealed using the existing dipping mechanism is generally not straight, and it is easy to produce sagging outside the sealing layer, which also affects the terminal sealing quality of the chip capacitor.

[0039] Therefore, in order to effectively improve the sealing accuracy of the patch capacitor, the present technical solution proposes a slurry dipping mechanism for improving the sealing accuracy of the patch capacitor, such as Figure 1-3 As shown, it includes a pre-impregnation device 1 for pre-impregnating the end of the chip capacitor, a drying platform 2 for drying the pre-impregnation and forming a pre-impregnation layer, and a dipping device 3 for formally dipping the end of the chip capacitor. This scheme introduces two sets of dipping devices (1, 3) in the dipping mechanism. First, the end of the chip capacitor is pre-impregnated by the pre-impregnation device 1 and dried to form a pre-impregnation layer, and then the chip capacitor is formally dipped by the dipping device 3, thereby completing the dipping process of the chip capacitor. The dipping mechanism of this scheme implements two dippings, and the presence of the pre-impregnation layer is conducive to improving the bonding between the slurry and the chip capacitor during the formal dipping process, ensuring that the sealing surface of the chip capacitor is flat and the sealing line is flat, so as to ensure the sealing quality of the chip capacitor. In a specific embodiment, the ends of the chip capacitors can be pre-dipped with a relatively thin silver paste in the pre-dip device 1, and then the ends of the chip capacitors can be formally dipped with a silver paste of normal consistency in the dipping device 3, which can further improve the sealing effect and quality of the chip capacitors.

[0040] It should be noted that if Figure 4 As shown, the material carrier 4 of this solution is a carrier used for sealing the chip capacitor in the prior art, and a plurality of mounting holes (not shown in the figure) for mounting the chip capacitor are opened on its surface.

[0041] Specifically, the working process of the slurry dipping mechanism of this scheme is as follows:

[0042] First, the prepreg head 11 uses the slurry impregnation suction cup 331 arranged at the bottom to absorb the loading tray 4 containing the chip capacitor to be terminated, and then the prepreg head 11 moves horizontally to just above the prepreg slurry groove 12, and the slurry impregnation suction cup 331 in the prepreg head 11 moves downward relative to the prepreg slurry groove 12 to achieve prepreg of the chip capacitor.

[0043] Then, the impregnation suction cup 331 in the prepreg head 11 moves upward relative to the prepreg tank 12, and the prepreg head 11 moves horizontally to just above the drying platform 2, and the loading tray 4 is placed on the drying platform 2 for drying.

[0044] After drying, the dipping head 33 moves horizontally to just above the drying platform 2, and the loading tray 4 is taken out from the drying platform 2. Then the dipping head 33 moves horizontally to just above the dipping tank 34, and the dipping suction cup 331 in the dipping head 33 moves downward relative to the dipping tank 34 to achieve formal dipping of the chip capacitor.

[0045] To further explain, the drying platform 2 includes an infrared heating box 21 and a positioning bracket 22 . The positioning bracket 22 is mounted on the top of the infrared heating box 21 , and the positioning bracket 22 is used to place the loading tray 4 .

[0046] In a preferred embodiment of the present technical solution, the drying platform 2 includes an infrared heating box 21 for generating heat and a positioning bracket 22 for positioning and installing the material loading tray 4, which has a simple structure and reliable performance. It should be noted that the infrared heating box 21 of the present solution is a conventional infrared heating device available on the market, and its structure is not described in detail here.

[0047] Further, the prepreg head 11 and the slurry impregnation head 33 each include the slurry impregnation suction cup 331, the displacement chassis 332, the mounting plate 333 and the driving screw 334 which are sequentially connected from bottom to top;

[0048] The mounting plate 333, displacement base plate 332 and slurry immersion suction cup 331 of the prepreg head 11 can all move up and down relative to the prepreg tank 12, and the up and down movement of the mounting plate 333, displacement base plate 332 and slurry immersion suction cup 331 of the prepreg head 11 is relatively static;

[0049] The mounting plate 333, displacement base plate 332 and slurry immersion suction cup 331 of the slurry immersion head 33 can all move up and down relative to the slurry immersion tank 34, and the up and down movement of the mounting plate 333, displacement base plate 332 and slurry immersion suction cup 331 of the slurry immersion head 33 is relatively static;

[0050] The output end of the driving screw rod 334 is connected to the mounting plate 333, and the driving screw rod 334 is used to drive the mounting plate 333, the displacement chassis 332 and the slurry immersion suction cup 331 to move up and down; the displacement chassis 332 and the slurry immersion suction cup 331 can both move left and right relative to the mounting plate 333, and the left and right movements of the displacement chassis 332 and the slurry immersion suction cup 331 are relatively stationary.

[0051] In a preferred embodiment of the present technical solution, the prepreg head 11 and the slurry dipping head 33 both include a slurry dipping suction cup 331, a displacement chassis 332, a mounting plate 333 and a driving screw 334 which are sequentially connected from bottom to top; and the mounting plate 333, the displacement chassis 332 and the slurry dipping suction cup 331 can move up and down synchronously relative to their corresponding slurry grooves (12, 34), and the displacement chassis 332 and the slurry dipping suction cup 331 can move left and right synchronously relative to the mounting plate 333.

[0052] When the pre-impregnation head 11 and the immersion head 33 immerse the chip capacitor in the carrier tray 7, first, the slurry tank (12, 34) is moved to below the moving range of the corresponding immersion head (11, 33), and then the carrier tray 7 is moved to above the slurry tank (12, 34), and then moved downward by a preset distance, and the end of the chip capacitor in the carrier tray 7 is immersed in the silver paste; then, during the immersion process, the slurry tank (12, 34) is moved back and forth in a small range, and the displacement chassis 332 and the immersion suction cup 331 are moved left and right in a small range. Through the mutual coordination of the above movements, the end of the chip capacitor can achieve a "circling" action in the horizontal direction relative to the silver paste layer. On the one hand, it is beneficial to improve the uniformity of the silver paste coating on the end of the chip capacitor. On the other hand, when the chip capacitor moves upward and leaves the silver paste layer, its end can also avoid forming an irregular sealing shape, thereby ensuring the sealing quality of the chip capacitor.

[0053] Further, the prepreg head 11 and the impregnation head 33 also include a clamping cylinder 335, which is fixedly mounted on the edge of the mounting plate 333, and the connecting end of the clamping cylinder 335 is connected to the impregnation suction cup 331, and the impregnation suction cup 331 is detachably mounted on the bottom of the displacement chassis 332 through the clamping cylinder 335.

[0054] Furthermore, the present invention also adds a clamping cylinder 335 for installing the slurry soaking cup 331 in the prepreg head 11 and the slurry soaking head 33, so as to realize the rapid replacement of the slurry soaking cup 331 during maintenance and repair. Compared with the method of fixing and installing by screws in the prior art, the present invention uses clamping and installation, which is more conducive to improving the disassembly and assembly speed of the slurry soaking cup 331.

[0055] Further, the prepreg head 11 and the slurry dipping head 33 also include a limit rod 336, and the limit rod 336 is protrudingly installed on the top of the mounting plate 333, and the limit rod 336 is used to limit the up and down movement range of the mounting plate 333, the displacement chassis 332 and the slurry dipping suction cup 331.

[0056] Furthermore, the present solution also adds a limit rod 336 in the prepreg head 11 and the immersion head 33 for limiting the up and down movement range of the mounting plate 333, the displacement chassis 332 and the immersion suction cup 331. When the limit rod 336 is abutted against other structures (not shown in the figure) in the prepreg device 1 (or the immersion device 3), the mounting plate 333, the displacement chassis 332 and the immersion suction cup 331 can be prevented from continuing to move, thereby effectively improving the service life of the prepreg head 11 and the immersion head 33.

[0057] It should be noted that the length of the limiting rod 336 can be adjusted according to the installation position and volume of other unshown structures in the prepreg device 1 (or the slurry impregnation device 3), and is not limited here.

[0058] Further, the prepreg head 11 and the slurry dipping head 33 also include a lifting sensor, which is installed on the mounting plate 333 and is used to detect the up and down movement distance of the mounting plate 333, the displacement chassis 332 and the slurry dipping suction cup 331.

[0059] In addition, since different usage requirements have different requirements on the end sealing layer length of the chip capacitor, in order to improve the sealing accuracy of the prepreg device 1 (or the slurry dipping device 3), the present solution also provides a lifting sensor (not shown in the figure) in the prepreg head 11 and the slurry dipping head 33 for detecting the up and down moving distance thereof, so as to improve the controllability of the chip capacitor sealing process.

[0060] To further explain, the slurry soaking device 3 also includes a scraper 35, which is installed at the bottom of the slurry soaking frame 31 and located at the rear end of the scraper 32, and the bottom of the scraper 35 is in contact with the bottom of the slurry soaking tank 34.

[0061] In a preferred embodiment of the present technical solution, the slurry dipping device 3 also includes a scraper 35 in contact with the bottom of the slurry dipping tank 34. When the second slurry dipping process in the formal slurry dipping is carried out, the present solution can first use the scraper 35 to accumulate the silver paste after the first slurry dipping at the rear end of the slurry tank 423, and then use the scraper 32 to simultaneously flatten and thicken the accumulated silver paste according to the thickness requirement of the second slurry dipping, thereby effectively speeding up the silver paste preparation speed of the slurry dipping process. If the silver paste preparation process of the second slurry dipping process is performed only by the scraper 32, the slurry dipping tank 34 and the scraper 32 need to be repeatedly moved multiple times to form a silver paste layer of the required thickness, which is not conducive to improving the slurry dipping speed of the slurry dipping device 3.

[0062] To further explain, the scraper 35 can move up and down relative to the slurry soaking frame 31.

[0063] As a better embodiment of the above embodiment, the present solution also arranges the scraper 35 to move up and down. When the scraper 35 is not needed for silver paste accumulation, the scraper 35 is moved upward so that it does not contact the bottom of the slurry tank 34, thereby effectively reducing the wear rate of the scraper 35.

[0064] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0065] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0066] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0067] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0068] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0069] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0070] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A slurry dipping mechanism for improving the termination accuracy of a chip capacitor, characterized in that: It includes a pre-preg device, a drying platform and a slurry dipping device which are arranged in sequence along the left and right directions; The prepreg device comprises a prepreg head and a prepreg trough, wherein the prepreg head is arranged above the prepreg trough and can move horizontally in the left and right directions, and the horizontal movement range of the prepreg head is located above the prepreg trough and the drying platform; The slurry soaking device comprises a slurry soaking frame, a scraper, a slurry soaking head and a slurry soaking tank; the scraper is installed at the bottom of the slurry soaking frame, and the scraper can move up and down relative to the slurry soaking frame; the slurry soaking tank is arranged below the scraper, and the slurry soaking tank can move along the front and back direction of the slurry soaking frame; the slurry soaking head is installed at the front end of the scraper, and the slurry soaking head can move horizontally along the left and right direction, and the horizontal movement range of the slurry soaking head is located above the drying platform and the slurry soaking tank; The bottom of the prepreg head and the impregnation head are both provided with an impregnation suction cup, which is used to adsorb the loading plate, and the impregnation suction cup of the prepreg device can move up and down relative to the prepreg slurry tank, and the impregnation suction cup of the impregnation device can move up and down relative to the impregnation slurry tank.

2. A slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 1, characterized in that: The drying platform comprises an infrared heating box and a positioning bracket, wherein the positioning bracket is mounted on the top of the infrared heating box and is used for placing a loading tray.

3. The slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 1, characterized in that: The prepreg head and the slurry dipping head both include the slurry dipping suction cup, the displacement chassis, the mounting plate and the driving screw rod which are sequentially connected from bottom to top; The mounting plate, displacement base and slurry soaking sucker of the prepreg head can all move up and down relative to the prepreg slurry tank, and the up and down movement of the mounting plate, displacement base and slurry soaking sucker of the prepreg head is relatively static; The mounting plate, displacement base plate and slurry soaking sucker of the slurry soaking head can all move up and down relative to the slurry soaking tank, and the up and down movement of the mounting plate, displacement base plate and slurry soaking sucker of the slurry soaking head is relatively static; The output end of the driving screw is connected to the mounting plate, and the driving screw is used to drive the mounting plate, the displacement chassis and the slurry immersion suction cup to move up and down; the displacement chassis and the slurry immersion suction cup can both move left and right relative to the mounting plate, and the left and right movement of the displacement chassis and the slurry immersion suction cup is relatively stationary.

4. A slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 3, characterized in that: The prepreg head and the slurry impregnation head both include a clamping cylinder, which is fixedly mounted on the edge of the mounting plate, and the connecting end of the clamping cylinder is connected to the slurry impregnation suction cup, and the slurry impregnation suction cup is detachably mounted on the bottom of the displacement chassis through the clamping cylinder.

5. The slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 3, characterized in that: The prepreg head and the slurry dipping head both further include a limit rod, which is protrudingly mounted on the top of the mounting plate and is used to limit the up and down movement range of the mounting plate, the displacement chassis and the slurry dipping suction cup.

6. The slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 3, characterized in that: The prepreg head and the slurry dipping head both further include a lifting sensor, which is mounted on the mounting plate and is used to detect the up and down movement distances of the mounting plate, the displacement chassis and the slurry dipping suction cup.

7. The slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 1, characterized in that: The slurry soaking device also includes a scraper, which is installed at the bottom of the slurry soaking frame and located at the rear end of the scraper, and the bottom of the scraper is in contact with the bottom of the slurry soaking tank.

8. The slurry dipping mechanism for improving the termination accuracy of a chip capacitor according to claim 7, characterized in that: The scraper can move up and down relative to the slurry soaking frame.

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