Relay working state monitoring device

Abstract

The utility model relates to the technical field of relays, in particular to a relay working state monitoring device which comprises a relay body, a wire holder is arranged on the rear side of the relay body, an operation panel is detachably connected to the front side of the relay body, first rectangular openings are formed in the left side and the right side of the relay body respectively, and heat conduction plates are arranged in the two first rectangular openings respectively. A second rectangular opening is formed in the top of the relay body, a semiconductor chilling plate is arranged in the second rectangular opening, a temperature sensor is arranged at the bottom of the inner wall of the relay body, and a monitoring controller and a wireless communication module are arranged at the position, close to the front side, of the bottom of the relay body. According to the relay working state monitoring device, the temperature in the relay body can be monitored in real time through the temperature sensor. Once the temperature abnormally rises, the temperature sensor can immediately send data to the monitoring controller, so that the relay is ensured to work in a safe temperature range, and equipment faults and potential safety hazards caused by overheating are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of relays, in particular to a relay working state monitoring device. Background Art

[0002] Relays play a vital role in power systems, automation control, and a wide range of industrial applications. They can not only realize complex logic control functions, but also undertake key duties such as switching loads and providing isolation protection in circuits. Due to their excellent functionality and reliability, relays have become an indispensable part of modern industry.

[0003] However, relays are prone to overheating during long-term operation, especially under high load or harsh environment. Overheating not only directly affects the normal operation of the relay and reduces its service life, but may also cause aging of the insulation material due to untimely heat dissipation. In severe cases, it may even burn and cause safety accidents. In addition, relay overheating may also be a sign of other circuit failures, which need to be discovered and handled in a timely manner.

[0004] At present, the temperature monitoring of relays mainly relies on regular manual inspections or the installation of basic temperature alarms. These methods have obvious blind spots and delays, and cannot achieve real-time monitoring and fine management of relay status. With the advancement of technology and the improvement of safety requirements, effective and real-time temperature monitoring of relays and timely detection and resolution of overheating problems have become an inevitable requirement for the development of the industry.

[0005] Modern monitoring systems need to have high-precision temperature detection capabilities and be able to issue an immediate alarm when the relay begins to overheat. At the same time, such a system should be able to combine with modern communication technology to achieve remote monitoring and data recording for data analysis, trend prediction and remote diagnosis. In addition, intelligent processing and response mechanisms are also important components of modern temperature monitoring systems. They can not only issue an alarm when an overheating signal is detected, but also automatically take corresponding protective measures according to preset strategies to ensure the stable operation of the system and the safety of personnel. In view of this, we propose a relay working status monitoring device. Utility Model Content

[0006] The purpose of the utility model is to provide a relay working state monitoring device to solve the problems raised in the above background technology.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] The relay working state monitoring device comprises a relay body, which is the core of the device and is responsible for executing the task of switching the circuit. The rear side of the relay body is provided with a wiring seat for installing and fixing the wires to ensure the stability of the electrical connection. The front side of the relay body is detachably connected with an operation panel, which provides a user operation interface for directly configuring or controlling the settings of the relay.

[0009] A first rectangular opening is provided on both sides of the left and right sides of the relay body, and a heat conducting plate is provided in each of the two first rectangular openings. The heat conducting plate helps to transfer the heat generated by the relay. A second rectangular opening is provided on the top of the relay body, and a semiconductor cooling plate is provided in the second rectangular opening. The cooling surface of the semiconductor cooling plate is arranged toward the interior of the relay body, and is used to provide direct cooling when the relay is over-temperature. A temperature sensor is provided at the bottom of the inner wall of the relay body. The temperature sensor monitors the temperature inside the relay in real time and provides a data basis for temperature management. A monitoring controller and a wireless communication module are provided at the bottom of the relay body and near the front side.

[0010] Preferably, a frame-shaped mounting plate is provided on the front side of the relay body, and the operation panel is detachably connected to the front side of the frame-shaped mounting plate by bolts, so as to facilitate maintenance of the relay.

[0011] Preferably, the connection between the heat conducting plate and the first rectangular opening is sealed with adhesive, and the opposite sides of the two heat conducting plates are provided with a plurality of heat dissipation fins which are arranged equidistantly up and down, and the heat dissipation fins enhance the heat dissipation efficiency.

[0012] Preferably, a heat sink is provided on the top of the relay body, and silicone grease is filled between the heat sink and the heating surface of the semiconductor refrigeration plate to help the heating surface of the semiconductor refrigeration plate dissipate heat, create a heat pump effect, and improve cooling efficiency.

[0013] Preferably, four connecting columns arranged in a matrix are provided on the rear side and near the top of the inner wall of the relay body, and the front sides of the four connecting columns are commonly connected to a small axial flow fan to assist the semiconductor refrigeration plate in air circulation and accelerate the cooling efficiency.

[0014] Preferably, an audible and visual alarm is provided at the bottom of the relay body, which is used to issue audible and visual warnings when the temperature is abnormal to quickly attract attention.

[0015] Preferably, the semiconductor refrigerator, temperature sensor, small axial flow fan, wireless communication module and sound and light alarm are electrically connected to the monitoring controller through wires respectively. The monitoring controller serves as the "brain" of the system and is responsible for receiving data from the temperature sensor and controlling the operation of the semiconductor refrigerator, small axial flow fan and sound and light alarm. The wireless communication module works together with the monitoring controller to send monitoring data to external devices or receive remote commands.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The relay working status monitoring device can monitor the temperature inside the relay body in real time through the temperature sensor. Once the temperature rises abnormally, the temperature sensor can immediately send data to the monitoring controller to ensure that the relay works within a safe temperature range and avoid equipment failure and safety hazards caused by overheating.

[0018] 2. The relay working status monitoring device can quickly activate the semiconductor cooling plate and start the small axial flow fan after receiving the high temperature signal, so as to enhance the internal air circulation, effectively improve the cooling efficiency, prevent the relay from being damaged due to overheating, and improve the stability and reliability of the system.

[0019] 3. The relay working status monitoring device will activate the sound and light alarm when the internal temperature of the relay is abnormal, reminding the on-site personnel to take prompt countermeasures through sound and light. At the same time, the wireless communication module supports real-time communication with external management systems or equipment, transmits temperature monitoring data or receives remote control instructions, and realizes remote monitoring and management.

[0020] 4. The relay working status monitoring device has heat conducting plates on the left and right sides of the relay body, which are connected to the first rectangular opening by adhesive sealing and supplemented with multiple heat dissipation fins. A heat dissipation plate is provided on the top and silicone grease is filled between the top and the heating surface of the semiconductor refrigeration plate, which greatly enhances the heat transfer and dissipation efficiency and ensures reliable operation of the device under high load or harsh environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall first-view structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the overall structure of the utility model from a second viewing angle;

[0023] Figure 3 It is a partial structural schematic diagram of the utility model;

[0024] Figure 4 It is a schematic diagram of the cross-sectional structure of the relay body in the utility model.

[0025] In the figure: 1. Relay body; 10. Frame-shaped mounting plate; 11. First rectangular opening; 12. Second rectangular opening; 13. Connecting column; 2. Terminal block; 3. Operation panel; 4. Heat conducting plate; 40. Heat dissipating fins; 5. Semiconductor cooling plate; 6. Temperature sensor; 7. Small axial fan; 8. Heat dissipating plate; 9. Monitoring controller; 14. Wireless communication module; 15. Sound and light alarm. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0029] The relay working state monitoring device comprises a relay body 1, which is the core of the device and is responsible for executing the task of switching the circuit. A wiring seat 2 is provided on the rear side of the relay body 1 for installing and fixing the wires to ensure the stability of the electrical connection. An operation panel 3 is detachably connected to the front side of the relay body 1, providing a user operation interface for directly configuring or controlling the settings of the relay.

[0030] A first rectangular opening 11 is provided on both sides of the left and right sides of the relay body 1, and a heat conducting plate 4 is provided in each of the two first rectangular openings 11. The heat conducting plate 4 helps to transfer the heat generated by the relay. A second rectangular opening 12 is provided on the top of the relay body 1, and a semiconductor cooling plate 5 is provided in the second rectangular opening 12. The cooling surface of the semiconductor cooling plate 5 is arranged toward the interior of the relay body 1, and is used to provide direct cooling when the relay is over-temperature. A temperature sensor 6 is provided at the bottom of the inner wall of the relay body 1. The temperature sensor 6 monitors the temperature inside the relay in real time and provides a data basis for temperature management. A monitoring controller 9 and a wireless communication module 14 are provided at the bottom of the relay body 1 and near the front side.

[0031] In this embodiment, a frame-shaped mounting plate 10 is provided on the front side of the relay body 1, and the operation panel 3 is detachably connected to the front side of the frame-shaped mounting plate 10 by bolts, so as to facilitate maintenance of the relay.

[0032] Specifically, the connection between the heat conducting plate 4 and the first rectangular opening 11 is sealed with adhesive, and the opposite sides of the two heat conducting plates 4 are provided with a plurality of heat dissipation fins 40 arranged equidistantly up and down, and the heat dissipation fins 40 enhance the heat dissipation efficiency.

[0033] Furthermore, a heat sink 8 is provided on the top of the relay body 1, and silicone grease is filled between the heat sink 8 and the heating surface of the semiconductor refrigeration plate 5 to help the heating surface of the semiconductor refrigeration plate 5 dissipate heat, create a heat pump effect, and improve cooling efficiency.

[0034] Furthermore, four connection columns 13 arranged in a matrix are provided on the rear side of the inner wall of the relay body 1 and near the top. The front sides of the four connection columns 13 are commonly connected to a small axial flow fan 7 to assist the semiconductor cooling plate 5 in air circulation and accelerate the cooling efficiency.

[0035] Furthermore, an audible and visual alarm 15 is provided at the bottom of the relay body 1 for issuing audible and visual warnings when the temperature is abnormal to quickly draw attention.

[0036] Furthermore, the semiconductor cooling sheet 5, the temperature sensor 6, the small axial flow fan 7, the wireless communication module 14 and the sound and light alarm 15 are electrically connected to the monitoring controller 9 through wires. The monitoring controller 9 serves as the "brain" of the system and is responsible for receiving data from the temperature sensor 6 and controlling the operation of the semiconductor cooling sheet 5, the small axial flow fan 7 and the sound and light alarm 15. The wireless communication module 14 works together with the monitoring controller 9 to send monitoring data to an external device or receive remote commands.

[0037] The temperature sensor 6 monitors the temperature inside the relay body 1 in real time. If an abnormal increase is detected, data is immediately sent to the monitoring controller 9. After receiving the high temperature signal, the monitoring controller 9 activates the semiconductor cooling plate 5 for cooling. At the same time, the monitoring controller 9 starts the small axial flow fan 7 to enhance the internal air circulation and improve the cooling efficiency. The wireless communication module 14 allows the monitoring device to communicate with an external management system or equipment to transmit real-time data or receive remote control instructions. Once the temperature is abnormal, the sound and light alarm 15 is activated at the same time, reminding the on-site personnel to take immediate action through sound and light.

[0038] When the relay working state monitoring device of this embodiment is in use, the built-in temperature sensor 6 will monitor the temperature inside the relay body 1 in real time. Once the temperature is found to be abnormally high, the temperature sensor 6 immediately sends alarm data to the monitoring controller 9. After receiving the high temperature signal, the monitoring controller 9 automatically starts the semiconductor refrigeration plate 5 and the small axial flow fan 7 to speed up the cooling process and improve the internal air circulation, thereby effectively preventing the relay from overheating and damage. At the same time, the design of the heat conducting plate 4 and the heat sink 8 ensures that the device can dissipate heat efficiently and operate reliably even under high load or harsh environment. The addition of the wireless communication module 14 provides the device with the ability of real-time data transmission and remote monitoring, allowing users to monitor the status of the device from a remote location and make necessary adjustments. Once the temperature abnormality is detected, the sound and light alarm 15 will be activated in time to remind the on-site personnel to take prompt measures through sound and light.

[0039] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A relay working state monitoring device, comprising a relay body (1), characterized in that: A terminal block (2) is provided on the rear side of the relay body (1); an operation panel (3) is detachably connected to the front side of the relay body (1); first rectangular openings (11) are provided on both left and right sides of the relay body (1); heat conducting plates (4) are provided in the two first rectangular openings (11); a second rectangular opening (12) is provided on the top of the relay body (1); a semiconductor cooling plate (5) is provided in the second rectangular opening (12); a cooling surface of the semiconductor cooling plate (5) is arranged toward the inside of the relay body (1); a temperature sensor (6) is provided at the bottom of the inner wall of the relay body (1); and a monitoring controller (9) and a wireless communication module (14) are provided at the bottom of the relay body (1) and near the front side.

2. The relay working state monitoring device according to claim 1, characterized in that: A frame-shaped mounting plate (10) is provided on the front side of the relay body (1), and the operating panel (3) is detachably connected to the front side of the frame-shaped mounting plate (10) via bolts.

3. The relay working state monitoring device according to claim 1, characterized in that: The connection between the heat conducting plate (4) and the first rectangular opening (11) is sealed with adhesive, and the opposite sides of the two heat conducting plates (4) are each provided with a plurality of heat dissipation fins (40) arranged equidistantly up and down.

4. The relay working state monitoring device according to claim 1, characterized in that: A heat sink (8) is provided on the top of the relay body (1), and silicone grease is filled between the heat sink (8) and the heating surface of the semiconductor cooling plate (5).

5. The relay working state monitoring device according to claim 1, characterized in that: Four connection columns (13) arranged in a matrix are provided on the rear side of the inner wall of the relay body (1) and close to the top, and the front sides of the four connection columns (13) are commonly connected to a small axial flow fan (7).

6. The relay working state monitoring device according to claim 1, characterized in that: An audible and visual alarm (15) is provided at the bottom of the relay body (1).

7. The relay working state monitoring device according to claim 6, characterized in that: The semiconductor cooling sheet (5), the temperature sensor (6), the small axial flow fan (7), the wireless communication module (14) and the sound and light alarm (15) are electrically connected to the monitoring controller (9) via wires.

Images