Chip turnover mechanism and chip laminating equipment

Abstract

The utility model provides a chip turnover mechanism and a chip laminating device. The chip turnover mechanism comprises a rack, a chip turnover mechanism and a chip laminating mechanism, the buffering part is movably arranged on the rack; the overturning part is arranged on the buffering part; the driving part is arranged on the rack and used for driving the buffering part to move in the first direction; and the buffer part is used for providing a buffer effect in the contact process of the overturning part and the chip. According to the utility model, the buffer part can provide a buffer effect, and hard contact between the overturning part and the chip can be avoided, so that the risk that the overturning part presses and damages the chip can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounting, in particular to a chip flipping mechanism and chip mounting equipment. Background Art

[0002] In the chip bonding process, the chip needs to be flipped 180 degrees so that the bonding surface of the chip is turned over before the bonding process. Due to the low structural strength of the chip, there is a risk of crushing the chip when grabbing it before flipping. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a chip flipping mechanism, wherein the buffer portion can provide a buffering effect to avoid hard contact between the flipping portion and the chip, thereby reducing the risk of the flipping portion damaging the chip.

[0004] Another object of the utility model is to provide a chip bonding device which has high safety and can ensure the chip bonding quality.

[0005] The embodiments of the present invention are implemented by the following technical solutions:

[0006] A chip flipping mechanism comprises: a frame; a buffer part movably arranged on the frame; a flip part arranged on the buffer part; a driving part arranged on the frame and used to drive the buffer part to move along a first direction; the buffer part is used to provide a buffering effect when the flip part contacts the chip.

[0007] According to a preferred embodiment, the buffer portion includes a connecting plate and a mounting plate; the connecting plate is movably arranged on the frame, the mounting plate and the connecting plate are slidably installed, and a damping member is arranged between the mounting plate and the connecting plate; the flip portion is arranged on the mounting plate.

[0008] According to a preferred embodiment, the damping element is a first spring.

[0009] According to a preferred embodiment, the driving part includes a telescopic member, which is mounted on the frame, and a telescopic end of the telescopic member is connected to the buffer part.

[0010] According to a preferred embodiment, the telescopic member is a voice coil motor.

[0011] According to a preferred embodiment, the driving part further includes a second spring, one end of the second spring is connected to the frame, and the other end of the second spring is connected to the buffer part.

[0012] According to a preferred embodiment, the flipping part includes a mounting seat, which is arranged on the buffer part; a flipping shaft is rotatably mounted on the mounting seat, and a suction nozzle is arranged on the flipping shaft; a driving member is arranged on the mounting seat for driving the flipping shaft to rotate.

[0013] According to a preferred embodiment, a negative pressure airway is arranged in the flip shaft, the suction nozzle is connected to the negative pressure airway, a rotating joint is connected to the end of the flip shaft away from the driving member, the rotating joint is connected to the negative pressure airway, and the rotating joint is rotatably connected to the flip shaft; a limiting frame plate is arranged on the mounting seat, and the rotating joint is clamped to the limiting frame plate.

[0014] A chip bonding device comprises a material tray and the aforementioned chip flipping mechanism, wherein the material tray is used for placing chips to be flipped.

[0015] The technical solution of the embodiment of the utility model has at least the following advantages and beneficial effects:

[0016] The buffer part of the utility model can provide a buffering effect, and can avoid hard contact between the flip part and the chip, thereby reducing the risk of the flip part damaging the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A first three-dimensional structural schematic diagram of a chip flipping mechanism provided by an embodiment of the utility model;

[0019] Figure 2 A second three-dimensional structural schematic diagram of the chip flipping mechanism provided in an embodiment of the utility model.

[0020] Icons: 100, frame; 200, driving part; 201, telescopic part; 202, second spring; 300, buffer part; 3001, damping part; 301, connecting plate; 302, mounting plate; 400, flip part; 401, flip axis; 4010, suction nozzle; 4011, rotating joint; 4012, limiting frame plate; 402, mounting seat; 403, driving part; X, first direction. DETAILED DESCRIPTION

[0021] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0024] Please refer to Figure 1 and Figure 2 , a chip flipping mechanism, comprising a frame 100, a buffer part 300, a flipping part 400 and a driving part 200, wherein: the buffer part 300 is movably arranged on the frame 100; the flipping part 400 is arranged on the buffer part 300; the driving part 200 is arranged on the frame 100, and is used to drive the buffer part 300 to move along the first direction X; the buffer part 300 is used to provide a buffering effect during the contact process between the flipping part 400 and the chip. In this embodiment, the first direction X is a longitudinal direction, and the driving part 200 drives the buffer part 300 so that the flipping part 400 moves in the first direction X to grab the chip placed on the wafer or the TRAY (not shown in the figure). During the process, the buffer part 300 can provide a buffering effect, which can avoid hard contact between the flipping part 400 and the chip, thereby reducing the risk of the flipping part 400 damaging the chip.

[0025] Specifically, the buffering part 300 includes a connecting plate 301 and a mounting plate 302; the connecting plate 301 is movably arranged on the frame 100, the mounting plate 302 is slidably mounted on the connecting plate 301, and a damping member 3001 is arranged between the mounting plate 302 and the connecting plate 301; the flipping part 400 is arranged on the mounting plate 302. Optionally, the connecting plate 301 and the frame 100 are connected by a cross roller guide rail to realize relative movement between the two, and further realize that the connecting plate 301 can move relative to the frame 100 under the action of the driving part 200. The extension direction of the cross roller guide rail is parallel to the first direction X. Optionally, the mounting plate 302 and the connecting plate 301 are slidably connected by a cross roller guide rail, and the damping member 3001 between the two can provide a buffer damping force for the mounting plate 302, that is, the flipping part 400 arranged on the mounting plate 302. In another embodiment, the connecting plate 301 and the rack 100 as well as the mounting plate 302 and the connecting plate 301 may be slidably connected via a slide rail and slider structure.

[0026] like Figure 1 As shown, preferably, the damping member 3001 is a first spring.

[0027] In another embodiment, the damping member 3001 may also be an elastic member such as a rubber tube.

[0028] When in use, the driving part 200 drives the connecting plate 301 to move downward along the first direction X so that the flipping part 400 is close to the chip. When the flipping part 400 abuts against the chip, the chip reacts to the flipping part 400, that is, the mounting plate 302. Compared with the connecting plate 301, the mounting plate 302 has a tendency to move upward along the first direction X, thereby stretching the damping member 3001 to achieve buffering.

[0029] In this embodiment, the driving part 200 includes a telescopic member 201, which is mounted on the frame 100, and the telescopic end of the telescopic member 201 is connected to the buffer part 300. Preferably, the telescopic member 201 is a voice coil motor. The voice coil motor is convenient for accurately controlling its telescopic length and strength in the first direction X. In another embodiment, the telescopic member 201 includes but is not limited to a cylinder and an electric push rod.

[0030] The driving part 200 further includes a second spring 202, one end of which is connected to the frame 100, and the other end of which is connected to the buffer part 300, specifically to the connecting plate 301. Preferably, the second spring 202 is a constant force spring, which is used to overcome the gravity of the buffer part 300 and the flip part 400, so that the buffer part 300 and the flip part 400 maintain a stable position relative to the frame 100 in the first direction X.

[0031] like Figure 1 As shown, the flipping part 400 includes a mounting seat 402, which is arranged on the buffer part 300; a flip shaft 401 is rotatably mounted on the mounting seat 402, and a suction nozzle 4010 is arranged on the flip shaft 401; a driving member 403 is arranged on the mounting seat 402 for driving the flip shaft 401 to rotate. In this embodiment, the mounting seat 402 is detachably mounted on the mounting plate 302. In this embodiment, the mounting seat 402 can be detachably connected to the mounting plate 302 by means of a pin, a bolt or a screw, so as to facilitate the replacement of different flipping parts 400. Optionally, the driving member 403 is a driving motor, and the flip shaft 401 is connected to the conveying shaft of the driving motor through a coupling. The suction nozzle 4010 here is used to grab the chip, and after grabbing the chip, the driving member 403 drives the flip shaft 401 to rotate 180° to realize the flipping of the chip.

[0032] In this embodiment, a negative pressure airway is provided in the flip shaft 401, the suction nozzle 4010 is connected to the negative pressure airway, the end of the flip shaft 401 away from the driving member 403 is connected to a rotating joint 4011, the rotating joint 4011 is connected to the negative pressure airway, and the rotating joint 4011 is rotatably connected to the flip shaft 401; a limited frame plate 4012 is provided on the mounting seat 402, and the rotating joint 4011 is snapped onto the limited frame plate 4012. The rotating joint 4011 here is used to be connected to the negative pressure source through the air pipe, and the rotating joint 4011 is snapped onto the limited frame plate 4012 to prevent the rotating joint 4011 from rotating with the flip shaft 401, thereby preventing the air pipe from being entangled.

[0033] This embodiment also provides a chip bonding device, including the aforementioned chip flipping mechanism of the material tray, the material tray is used to place the chip to be flipped. Based on the chip flipping mechanism, the chip bonding device has high safety and can ensure the chip bonding quality.

[0034] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.

Claims

1. A chip flipping mechanism, characterized in that: include: Rack(100); A buffer part (300) is movably arranged on the frame (100); A turning portion (400) is arranged on the buffer portion (300); A driving unit (200), arranged on the frame (100), and used for driving the buffer unit (300) to move along a first direction (X); The buffer portion (300) is used to provide a buffering effect during the contact process between the flip portion (400) and the chip.

2. The chip flipping mechanism according to claim 1, characterized in that: The buffer portion (300) comprises a connecting plate (301) and a mounting plate (302); The connecting plate (301) is movably arranged on the frame (100), the mounting plate (302) and the connecting plate (301) are slidably mounted, and a damping member (3001) is arranged between the mounting plate (302) and the connecting plate (301); The turning portion (400) is arranged on the mounting plate (302).

3. The chip flipping mechanism according to claim 2, characterized in that: The damping element (3001) is a first spring.

4. The chip flipping mechanism according to claim 1, characterized in that: The driving part (200) comprises a telescopic member (201), the telescopic member (201) being mounted on the frame (100), and the telescopic end of the telescopic member (201) being connected to the buffer part (300).

5. The chip flipping mechanism according to claim 4, characterized in that: The telescopic member (201) is a voice coil motor.

6. The chip flipping mechanism according to claim 4 or 5, characterized in that: The driving part (200) further comprises a second spring (202), one end of the second spring (202) being connected to the frame (100) and the other end of the second spring (202) being connected to the buffer part (300).

7. The chip flipping mechanism according to claim 1, characterized in that: The flip portion (400) comprises a mounting seat (402), and the mounting seat (402) is arranged on the buffer portion (300); A turning shaft (401) is rotatably mounted on the mounting seat (402), and a suction nozzle (4010) is disposed on the turning shaft (401); The mounting seat (402) is provided with a driving member (403) for driving the flip shaft (401) to rotate.

8. The chip flipping mechanism according to claim 7, characterized in that: A negative pressure airway is provided in the flip shaft (401), the suction nozzle (4010) is connected to the negative pressure airway, and one end of the flip shaft (401) away from the driving member (403) is connected to a rotating joint (4011), the rotating joint (4011) is connected to the negative pressure airway, and the rotating joint (4011) is rotationally connected to the flip shaft (401); A limit frame plate (4012) is provided on the mounting seat (402), and the rotary joint (4011) is snap-connected to the limit frame plate (4012).

9. A chip bonding device, comprising a material tray and a chip flipping mechanism as claimed in any one of claims 1 to 8, wherein the material tray is used for placing chips to be flipped.

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