Pressure regulator heat dissipation structure for motorcycle

Abstract

The utility model discloses a motorcycle voltage regulator heat radiation structure, comprising a housing and a voltage regulator assembly, the housing is provided with a groove, the voltage regulator is packaged in the groove through a potting material, the voltage regulator assembly comprises a substrate installed at the bottom of the groove and a plurality of power devices installed at one side of the substrate away from the bottom of the groove; a heat conduction structure layer is arranged between the substrate and the bottom of the groove, a plurality of heat conduction holes penetrating through the two sides of the substrate are formed in the substrate corresponding to the power devices, and the heat conduction holes are filled with heat conduction materials. According to the utility model, the heat conduction structure layer is arranged on the substrate and is directly arranged at the bottom of the groove of the shell, a first material filling and sealing process is not needed during production, the production process is simplified, the production efficiency is improved, and meanwhile, the heat conduction holes corresponding to the power device needing heat dissipation are arranged on the substrate and are filled with the heat conduction materials, so that the heat dissipation efficiency is improved. The heat resistance is reduced, and the heat dissipation performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of voltage regulators, in particular to a heat dissipation structure of a voltage regulator for motorcycles. Background Art

[0002] Motorcycles are widely used as a means of transportation for the public, with a wide coverage and a very high usage rate. As an important part of the motorcycle's electrical system, the voltage regulator converts the AC power generated by the generator into 12V low-voltage DC power for the entire motorcycle. As the voltage conversion center, the power devices will generate a lot of heat during the working process, so the heat dissipation of the voltage regulator is an issue that needs to be considered and solved.

[0003] At present, the commonly used voltage regulator structure is manufactured by first mounting the power device and other peripheral electronic components on the aluminum substrate as an aluminum substrate assembly, then injecting the first potting compound into the groove of the shell to form a base, and then installing the aluminum substrate assembly into the groove of the shell and curing it, and then installing the connector into the shell and welding it to the substrate assembly through the connecting terminal, and finally filling the groove with the second potting compound and curing it to realize the packaging of the voltage regulator.

[0004] It can be seen that the existing structure requires secondary potting and curing during production, which is time-consuming, has low production efficiency and increased costs. At the same time, the aluminum substrate of the voltage regulator relies on heat conduction between the potting material and the shell, and the heat dissipation effect is poor. In addition, the cost of the aluminum substrate is high and the economy is poor. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the utility model is to provide a heat dissipation structure of a voltage regulator for a motorcycle to solve the problems of poor heat dissipation effect, high cost and low production efficiency in the prior art.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows: a heat dissipation structure of a voltage regulator for a motorcycle, comprising a shell and a voltage regulator assembly, a groove is provided on the shell, the voltage regulator is encapsulated in the groove by a potting material, and the voltage regulator assembly comprises a substrate installed at the bottom of the groove and a plurality of power devices installed on the side of the substrate away from the bottom of the groove; a heat-conducting structure layer is provided between the substrate and the bottom of the groove, a plurality of heat-conducting holes penetrating both sides of the substrate are respectively provided on the substrate corresponding to each power device, and a heat-conducting material is filled in the heat-conducting hole to form a heat-conducting column structure in the heat-conducting hole, one end of the heat-conducting column structure is in contact with the corresponding power device, and the other end is in contact with the heat-conducting structure layer.

[0007] As an optimization, the substrate is an epoxy substrate made of epoxy resin.

[0008] As an optimization, an integrally formed heat-conducting layer is provided on one side of the substrate close to the heat-conducting structure layer and on the hole wall of the heat-conducting hole.

[0009] As an optimization, the heat conducting layer is made of copper.

[0010] As an optimization, the power device is fixed on the substrate by reflow soldering. Correspondingly, the thermal conductive column structure is formed during the reflow soldering process when the solder melts and fills the thermal conductive hole and then solidifies.

[0011] As an optimization, the heat-conducting structural layer is a heat-conducting adhesive, and the substrate is adhered to the bottom of the groove by the heat-conducting adhesive.

[0012] As an optimization, it also includes a plug connector (7), which is installed on the housing and has a connection terminal welded on the substrate.

[0013] As an optimization, the heat conducting holes are distributed directly below the power device, or directly below the power device and around it.

[0014] As an optimization, the potting material is epoxy resin.

[0015] Compared with the prior art, the utility model has the following advantages: by arranging a heat-conducting structure layer on the substrate and directly installing it at the bottom of the housing groove, the first potting material process is no longer required during production, which simplifies the production process and improves production efficiency. At the same time, by arranging heat-conducting holes corresponding to power devices on the substrate and filling the heat-conducting holes with heat-conducting materials, the heat of the power devices can be efficiently transferred to the heat-conducting structure layer through the heat-conducting column structure formed by the heat-conducting material in the heat-conducting holes, thereby better dissipating heat through the housing, reducing thermal resistance and improving heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 It is a cross-sectional structural schematic diagram of the utility model;

[0018] In the figure: 1-housing, 2-potting material, 3-substrate, 4-power device, 5-thermal conductive structure layer, 6-thermal conductive hole, 7-connector. DETAILED DESCRIPTION

[0019] The utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invention product is usually placed when used, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In addition, the terms "horizontal", "vertical", etc. do not mean that the components are absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] Example: See Figure 1-Figure 2A heat dissipation structure of a voltage regulator for a motorcycle includes a housing 1 and a voltage regulator assembly. A groove is provided on the housing 1. The voltage regulator assembly is encapsulated in the groove by a potting material 2. The potting material 2 is made of epoxy resin. The voltage regulator assembly includes a substrate 3 installed at the bottom of the groove and a plurality of power devices 4 installed on the side of the substrate 3 away from the bottom of the groove, as well as peripheral electronic components. The present application mainly dissipates heat from devices with large heat generation such as the power device 4 to maintain good performance. In this embodiment, the substrate 3 is an epoxy substrate made of epoxy resin, which has a lower cost than an aluminum substrate, but its own heat dissipation performance is not as good as that of an aluminum substrate. Therefore, a heat-conducting structural layer 5 is provided between the substrate 3 and the bottom of the groove. The heat-conducting structural layer 5 is a heat-conducting adhesive. The substrate 3 is attached to the bottom of the groove through the heat-conducting adhesive, which makes installation more convenient and quick. The first potting material 2 process is no longer required during production, thereby improving production efficiency. In this embodiment, the heat-conducting adhesive is made of a material with a higher thermal conductivity than the potting material 2, and the heat dissipation effect is better. On the substrate 3, a plurality of heat-conducting holes 6 are provided corresponding to each power device 4, and pass through both sides of the substrate 3. The heat-conducting holes 6 are distributed directly below the power device 4, or distributed directly below and around the power device 4, so as to improve versatility and adapt to power devices 4 of various sizes. The heat-conducting holes 6 are filled with heat-conducting materials, so that a heat-conducting column structure is formed in the heat-conducting holes 6. One end of the heat-conducting column structure is in contact with the corresponding power device 4, and the other end is in contact with the heat-conducting structure layer 5. Specifically, in the present embodiment, the power device 4 is fixed on the substrate 3 by reflow soldering. Correspondingly, the heat-conducting column structure is formed by the solder melting and filling the heat-conducting holes 6 and then solidifying during the reflow soldering process, that is, the heat-conducting column structure is solder, and its thermal conductivity is better than that of the epoxy substrate, so that the heat generated by the power device 4 can be well transferred to the heat-conducting structure layer 5 through the heat-conducting column structure in the heat-conducting hole 6, and further transferred to the housing 1 through the heat-conducting structure layer 5. A plurality of heat sinks are provided on the housing 1 to increase the heat dissipation effect.

[0023] In order to further improve the heat transfer effect, in this embodiment, an integrally formed heat-conducting layer is provided on the side of the substrate 3 close to the heat-conducting structure layer 5 and on the hole wall of the heat-conducting hole 6. The heat-conducting layer is made of copper, so that the heat of the heat-conducting column structure can be better dispersed in the heat-conducting layer on the surface of the substrate 3 through the heat-conducting layer on the hole wall of the heat-conducting hole 6, thereby improving the heat transfer effect.

[0024] In this embodiment, the plug connector 7 is directly mounted on the housing 1, and its terminal is welded to the substrate 3, abandoning the traditional connection between the terminal and the substrate 3, further simplifying the structure, making it easier to produce, and improving production efficiency.

[0025] The utility model provides a heat-conducting structure layer on the substrate and directly installs it at the bottom of the housing groove, so that the first potting material process is no longer required during production, thereby simplifying the production process and improving production efficiency. At the same time, by providing heat-conducting holes corresponding to power devices that need heat dissipation on the substrate and filling the heat-conducting holes with heat-conducting materials, the heat of the power devices can be efficiently transferred to the heat-conducting structure layer through the heat-conducting column structure formed in the heat-conducting holes, and then the heat is better dissipated through the housing, thereby reducing thermal resistance and improving heat dissipation performance.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit the technical solution. Ordinary technicians in this field should understand that those modifications or equivalent replacements of the technical solution of the utility model without departing from the purpose and scope of the technical solution of the utility model should be included in the scope of the claims of the utility model.

Claims

1. A heat dissipation structure of a voltage regulator for a motorcycle, comprising a housing and a voltage regulator assembly, wherein a groove is provided on the housing, the voltage regulator is encapsulated in the groove by a potting material, and the voltage regulator assembly comprises a substrate mounted on the bottom of the groove and a plurality of power devices mounted on a side of the substrate away from the bottom of the groove; characterized in that: A heat-conducting structure layer is provided between the substrate and the bottom of the groove, and a plurality of heat-conducting holes penetrating both sides of the substrate are provided on the substrate corresponding to each power device, and the heat-conducting holes are filled with heat-conducting materials to form a heat-conducting column structure in the heat-conducting holes, one end of the heat-conducting column structure is in contact with the corresponding power device, and the other end is in contact with the heat-conducting structure layer.

2. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: The substrate is an epoxy substrate made of epoxy resin.

3. The heat dissipation structure of a voltage regulator for motorcycle according to claim 2, characterized in that: An integrally formed heat-conducting layer is provided on one side of the substrate close to the heat-conducting structural layer and on the hole wall of the heat-conducting hole.

4. The heat dissipation structure of a voltage regulator for motorcycle according to claim 3, characterized in that: The heat conducting layer is made of copper.

5. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: The power device is fixed on the substrate by reflow soldering. Correspondingly, the heat-conducting column structure is formed by the solder melting and filling the heat-conducting hole and then solidifying during the reflow soldering process.

6. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: The heat-conducting structural layer is a heat-conducting adhesive, and the substrate is adhered to the bottom of the groove by the heat-conducting adhesive.

7. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: It also includes a plug connector (7), which is mounted on the housing and has a connection terminal welded to the substrate.

8. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: The heat conduction holes are distributed directly below the power device, or directly below the power device and around it.

9. The heat dissipation structure of a voltage regulator for motorcycle according to claim 1, characterized in that: The potting material is epoxy resin.

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