Circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board assembly and electronic equipment, the circuit board assembly comprises a circuit board and a capacitor arranged on the circuit board, the capacitor comprises a capacitor body, the capacitor body is opposite to a first surface of the circuit board, and the capacitor body comprises a plurality of electrode slice units arranged in a preset arrangement mode. Each electrode plate unit comprises a positive electrode plate and a negative electrode plate which are stacked, and the preset arrangement mode is configured in the mode that the vibration directions of the at least two electrode plate units are opposite, or the vibration directions of the electrode plate units are parallel to the first surface or form a non-vertical included angle with the first surface. Therefore, the vibration directions of the electrode plate units are opposite, so that the vibration of the electrode plate units can be mutually counteracted, and the vibration directions of the electrode plate units are parallel to the circuit board or form a non-vertical included angle with the circuit board, so that the vibration of the electrode plate units in the direction perpendicular to the circuit board can be effectively reduced or eliminated; the problem of noise squeal generated by vibration of the circuit board driven by the capacitor is reduced, and the use experience of a user is further improved.

Description

Technical Field

[0001] The present disclosure relates to the electrical field, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] In electronic devices, chip capacitors are widely used due to their large capacitance and small size. However, chip capacitors are prone to vibration during use, and long-term vibration can cause chip capacitor damage. When the chip capacitor vibrates, the chip capacitor will drive the circuit board to vibrate, which will cause "howling" and affect the user experience. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a circuit board assembly and an electronic device.

[0004] According to a first aspect of the present disclosure, a circuit board assembly is provided, the circuit board assembly comprising:

[0005] A circuit board; a capacitor arranged on the circuit board, the capacitor comprising a capacitor body, the capacitor body being opposite to the first surface of the circuit board, the capacitor body comprising a plurality of electrode sheet units arranged in a preset arrangement, each of the electrode sheet units comprising a stacked positive electrode sheet and a negative electrode sheet, the preset arrangement being configured such that the vibration directions of at least two of the electrode sheet units are opposite, or the vibration directions of the electrode sheet units are parallel to the first surface or are arranged at a non-vertical angle.

[0006] In some embodiments of the present disclosure, the plurality of electrode sheet units are arranged along a first direction, and the first direction is parallel to the first surface or is arranged at a non-vertical angle.

[0007] In some embodiments of the present disclosure, the multiple electrode sheet units are arranged along a second direction perpendicular to the first surface, and the positive electrode sheets of two adjacent electrode sheet units are arranged close to each other, or the negative electrode sheets of two adjacent electrode sheet units are arranged close to each other.

[0008] In some embodiments of the present disclosure, a first solder pad and a second solder pad are provided on the circuit board; the capacitor also includes a first conductive structure connected to each of the positive electrode sheets and a second conductive structure connected to each of the negative electrode sheets; the circuit board assembly also includes a connecting portion, which conductively connects the first conductive structure to the first solder pad and conductively connects the second conductive structure to the second solder pad.

[0009] In some embodiments of the present disclosure, the positive electrode sheet includes a first dielectric layer and a positive conductive layer disposed on the first dielectric layer, and the negative electrode sheet includes a second dielectric layer and a negative conductive layer disposed on the second dielectric layer;

[0010] The first portion of the positive electrode conductive layer protrudes from the negative electrode conductive layer in the third direction and extends to the first edge of the first dielectric layer, and the first conductive structure is attached to the first edge of each of the first dielectric layers to be electrically connected to each of the first portions;

[0011] The second portion of the negative conductive layer protrudes from the positive conductive layer in the fourth direction and extends to the second edge of the second dielectric layer, and the second conductive structure is attached to the second edge of each second dielectric layer to be electrically connected to each second portion.

[0012] In some embodiments of the present disclosure, the third direction is opposite to the fourth direction, the first conductive structure includes a first shell, the first shell covers the end of the capacitor body in the third direction, and the second conductive structure includes a second shell, the second shell covers the end of the capacitor body in the fourth direction.

[0013] In some embodiments of the present disclosure, the first dielectric layer and the positive conductive layer are both rectangular, a first side of the positive conductive layer is flush with an side of the first dielectric layer, and other sides of the positive conductive layer except the first side are located within the edge of the first dielectric layer;

[0014] The second dielectric layer and the negative conductive layer are both rectangular, the second side of the negative conductive layer is flush with one side of the second dielectric layer, and the sides of the negative conductive layer except the second side are located within the edge of the second dielectric layer.

[0015] In some embodiments of the present disclosure, the plurality of electrode sheet units are arranged along the first direction, each of the first edges is located on the first surface of the capacitor body, each of the second edges is located on a second surface of the capacitor body opposite to the first surface of the capacitor body, and the capacitor body further includes a third surface and a fourth surface connecting the first surface and the second surface and respectively located on opposite sides of the capacitor body;

[0016] The first conductive structure includes a first conductive plate and a second conductive plate that are connected and arranged at an angle, the first conductive plate is attached to the second surface, the connecting portion includes a first welding portion, and the second conductive plate is welded to the first pad through the first welding portion;

[0017] The second conductive structure includes a third conductive plate and a fourth conductive plate that are connected and arranged at an angle, the third conductive plate is in contact with the first surface of the capacitor body, the connecting portion includes a second welding portion, and the fourth conductive plate is welded to the second pad through the second welding portion.

[0018] In some embodiments of the present disclosure, the positive electrode sheet includes a first dielectric layer and a positive conductive layer disposed on the first dielectric layer, and the negative electrode sheet includes a second dielectric layer and a negative conductive layer disposed on the second dielectric layer, and the first dielectric layer and the second dielectric layer are rectangular with flush edges;

[0019] The positive electrode conductive layer comprises a positive electrode conductive layer body and two first conductive connection parts connected to the positive electrode conductive layer body, the two first conductive connection parts are respectively located at first diagonal positions of the first dielectric layer, the first conductive structure is arranged corresponding to the first conductive connection parts, and each of the first conductive structures is electrically connected to the corresponding first conductive connection parts;

[0020] The negative conductive layer includes a negative conductive layer body and two second conductive connection parts connected to the negative conductive layer body, the two second conductive connection parts are respectively located at second diagonal positions of the second dielectric layer that are different from the first diagonal positions, the second conductive structures are arranged corresponding to the second conductive connection parts, and each second conductive structure is electrically connected to the corresponding second conductive connection part.

[0021] In some embodiments of the present disclosure, one of the first conductive connection parts is flush with two edges adjacent to the first dielectric layer, and another of the first conductive connection parts is flush with the other two edges adjacent to the first dielectric layer;

[0022] One of the second conductive connection parts is flush with two adjacent edges of the second dielectric layer, and the other of the second conductive connection parts is flush with the other two adjacent edges of the second dielectric layer.

[0023] In some embodiments of the present disclosure, the first conductive structure includes a third shell, and the third shell covers a corner area of ​​the capacitor body corresponding to the location of the first conductive connection portion;

[0024] The second conductive structure includes a fourth shell, and the fourth shell covers a corner area of ​​the capacitor body corresponding to the second conductive connecting portion.

[0025] According to a second aspect of the present disclosure, an electronic device is provided, wherein the electronic device comprises the circuit board assembly as described in the second aspect of the present disclosure.

[0026] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0027] In the circuit board assembly provided by the present invention, multiple electrode sheet units in the capacitor body are arranged in a preset arrangement, and the preset arrangement is configured so that the vibration directions of at least two electrode sheet units are opposite, or the vibration directions of the electrode sheet units are parallel to the circuit board or are set at a non-vertical angle. The opposite vibration directions of the electrode sheet units can make the vibrations of the electrode sheet units cancel each other out. The vibration directions of the electrode sheet units are parallel to the circuit board or are set at a non-vertical angle, which can effectively reduce or eliminate the vibration of the electrode sheet units in a direction perpendicular to the circuit board, thereby reducing the noise generated by the vibration of the circuit board, thereby avoiding the damage to the capacitor caused by long-term oscillation, reducing the noise "howling" problem caused by the capacitor driving the circuit board to vibrate, and thereby improving the user experience.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0030] Figure 1 It is a structural schematic diagram of a circuit board assembly in the related art;

[0031] Figure 2 It is a structural schematic diagram of another circuit board assembly in the related art;

[0032] Figure 3 is a three-dimensional schematic diagram of a circuit board assembly according to an exemplary embodiment;

[0033] Figure 4 is a structural schematic diagram showing an arrangement of a positive electrode conductive layer and a negative electrode conductive layer according to an exemplary embodiment;

[0034] Figure 5 is a schematic structural diagram of a current path in a capacitor according to an exemplary embodiment;

[0035] Figure 6 is a schematic structural diagram of a positive electrode sheet according to an exemplary embodiment;

[0036] Figure 7 is a schematic structural diagram of a negative electrode sheet according to an exemplary embodiment;

[0037] Figure 8 is a schematic cross-sectional structure diagram showing an arrangement of a positive electrode sheet and a negative electrode sheet according to an exemplary embodiment;

[0038] Fig. 9is a structural schematic diagram showing an arrangement of positive electrode sheets and negative electrode sheets according to another exemplary embodiment;

[0039] Fig.10 is a structural schematic diagram showing a current path in a capacitor according to another exemplary embodiment;

[0040] Fig.11 is a schematic structural diagram of a positive electrode sheet according to another exemplary embodiment;

[0041] Fig.12 is a schematic structural diagram of a negative electrode sheet according to another exemplary embodiment;

[0042] Fig.13 is a structural schematic diagram showing an arrangement of positive electrode conductive layers and negative electrode conductive layers in a plurality of electrode sheet units according to an exemplary embodiment;

[0043] Fig.14 is a schematic cross-sectional structure diagram showing an arrangement of multiple electrode sheet units according to another exemplary embodiment;

[0044] Fig.15 is a schematic diagram showing the vibration direction of two adjacent electrode sheet units according to an exemplary embodiment;

[0045] Fig.16 is a schematic cross-sectional structural diagram of an arrangement of multiple electrode sheet units according to yet another exemplary embodiment.

[0046] In the figure:

[0047] 1-circuit board; 11-first pad; 12-second pad; 13-first surface;

[0048] 2-capacitor; 20-electrode sheet unit; 201-positive electrode sheet; 211-first dielectric layer; 2111-first edge; 212-positive conductive layer; 2121-positive conductive layer body; 2122-first conductive connection portion; 202-negative electrode sheet; 221-second dielectric layer; 2211-second edge; 222-negative conductive layer; 2221-negative conductive layer body; 2222-second conductive connection portion; 21-first conductive structure; 210-first shell; 2101-first conductive plate; 2102-second conductive plate; 213-third shell; 22-second conductive structure; 220-second shell; 2201-third conductive plate; 2202-fourth conductive plate; 223-fourth shell;

[0049] 3-connecting part; 31-first welding part; 32-second welding part;

[0050] 4-protective layer; 5-solder; 6-metal frame. DETAILED DESCRIPTION

[0051] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0052] With the continuous advancement of technology, chip capacitors are widely used in smartphones and wearable products due to their large capacitance and small size. However, when using chip capacitors, when a large voltage change is applied to both ends of the chip capacitors, the chip capacitors on the circuit board are prone to vibration. Long-term vibration will cause damage to the chip capacitors, and when the chip capacitors vibrate, the chip capacitors will drive the circuit board to vibrate, which will cause "howling" and affect the user experience.

[0053] In related technologies, such as Figure 1 and Figure 2 As shown, a plurality of stacked positive electrode sheets 201 and negative electrode sheets 202 are arranged in the capacitor 2, wherein the positive electrode sheets 201 and the negative electrode sheets 202 are arranged along a second direction ( Figure 1 or Figure 2 Therefore, when a large voltage change is applied to both ends of capacitor 2, capacitor 2 is easily moved along the z-axis direction shown in FIG. Figure 1 or Figure 2 Therefore, capacitor 2 will drive circuit board 1 to vibrate, causing capacitor 2 to collide with circuit board 1, resulting in "howling". To solve the howling problem, refer to Figure 1 , usually thicken the protective layer 4 between the bottom electrode sheet and the circuit board 1, and then ensure that the height of the solder 5 at both ends of the capacitor 2 does not exceed the thickness of the protective layer 4 at the bottom of the electrode sheet, or refer to Figure 2 , by welding metal frames 6 at high temperature at both ends of capacitor 2, capacitor 2 is separated from circuit board 1 by metal frames 6. However, both of the above methods will increase the height of capacitor 2. In smartphones or wearable products with narrow installation space, the stacking space is extremely limited, and the device height and volume requirements are extremely high. Therefore, both of the above methods are not applicable.

[0054] In order to solve the above technical problems, in a circuit board assembly provided by the present invention, multiple electrode sheet units in a capacitor body are arranged in a preset arrangement, and the preset arrangement is configured so that the vibration directions of at least two electrode sheet units are opposite, or the vibration directions of the electrode sheet units are parallel to the circuit board or are set at a non-vertical angle. The opposite vibration directions of the electrode sheet units can make the vibrations of the electrode sheet units cancel each other out. The vibration directions of the electrode sheet units are parallel to the circuit board or are set at a non-vertical angle, which can effectively reduce or eliminate the vibration of the electrode sheet units in a direction perpendicular to the circuit board, thereby reducing the noise generated by the vibration of the circuit board, thereby avoiding the damage to the capacitor caused by long-term oscillation, reducing the noise "howling" problem caused by the capacitor driving the circuit board to vibrate, and thereby improving the user experience.

[0055] An exemplary embodiment of the present disclosure provides a circuit board assembly, such as Figure 3 and Fig. 9 As shown, the circuit board assembly includes a circuit board 1 and a capacitor 2. The capacitor 2 is arranged on the circuit board 1, and the capacitor 2 includes a capacitor body, such as Figure 8 and Fig.14 As shown, the capacitor body is opposite to the first surface 13 of the circuit board 1, and the capacitor body includes a plurality of electrode sheet units 20 arranged in a preset arrangement, each electrode sheet unit 20 includes a stacked positive electrode sheet 201 and a negative electrode sheet 202, wherein the plurality of positive electrode sheets 201 and the plurality of negative electrode sheets 202 can be arranged along a first direction (e.g. Figure 3 , Figure 4 and Figure 8 The plurality of positive electrode sheets 201 and the plurality of negative electrode sheets 202 may also be stacked and arranged along the second direction (eg, Fig. 9 , Fig.13 and Fig.14 The circuit boards 1 may be stacked and arranged in the z-axis direction as shown in the figure, wherein the circuit board 1 may be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board.

[0056] The preset arrangement is configured so that the vibration directions of at least two electrode sheet units 20 are opposite, or the vibration direction of the electrode sheet unit 20 is parallel to the first surface 13 or is arranged at a non-vertical angle. With such an arrangement, the vibration directions of at least two electrode sheet units 20 are opposite, which can make the vibrations between the electrode sheet units 20 cancel each other out. The vibration direction of the electrode sheet unit 20 is parallel to the circuit board 1 or is arranged at a non-vertical angle, which can effectively reduce or eliminate the vibration of the electrode sheet unit 20 in a direction perpendicular to the circuit board 1, thereby reducing the noise "howling" problem caused by the vibration of the circuit board 1 driven by the capacitor 2, thereby avoiding the damage to the capacitor 2 caused by long-term vibration, thereby improving the user experience, and at the same time will not increase the height of the capacitor 2 in the z-axis direction, which is conducive to the miniaturization design of electronic equipment.

[0057] like Figure 3 , Figure 4 and Figure 8 As shown, in one embodiment, the circuit board 1 includes a first surface 13 disposed opposite to the capacitor 2. It can be understood that the first surface 13 of the circuit board 1 is Figure 3 On one side of the circuit board 1 close to the capacitor 2, a plurality of electrode sheet units 20 are arranged along a first direction (eg Figure 3 , Figure 4 and Figure 8 The first direction is arranged in parallel with the first surface 13 or at a non-vertical angle. For example, referring to Figure 3 and Figure 8 In the capacitor body, a plurality of positive electrode sheets 201 and a plurality of negative electrode sheets 202 are stacked and arranged, wherein the plurality of positive electrode sheets 201 and the plurality of negative electrode sheets 202 are arranged alternately in a manner that a negative electrode sheet 202 is provided between two adjacent positive electrode sheets 201, or a positive electrode sheet 201 is provided between two adjacent negative electrode sheets 202. Figure 8 y-axis direction shown in FIG) is arranged parallel to the first surface 13 of the circuit board 1, Figure 8 The direction of the arrow in the figure indicates the direction of the deformation force F1 generated by the deformation of the capacitor 2 under the voltage effect. When a voltage is applied to both ends of the capacitor 2, the piezoelectric effect causes the positive electrode plate and the negative electrode plate in the capacitor 2 to expand and contract along the direction of the deformation force F1, with an amplitude of about 1pm to 1nm. With such a setting, when the capacitor 2 is set on the circuit board 1, the contact points between the capacitor 2 and the first solder pad 11 and the second solder pad 12 on the circuit board 1 are on the xy plane, and the arrangement direction of the multiple positive electrode sheets 201 and the multiple negative electrode sheets 202 are parallel to each other in the y direction or the x direction with the first surface 13 of the circuit board 1, and are only connected at the two solder pads by soldering. Therefore, if Figure 8 As shown, when the capacitor 2 is deformed along the y-axis or the x-axis due to the piezoelectric effect, the capacitor 2 will not collide with the circuit board 1 to generate noise.

[0058] The capacitor 2 can be applied to electronic devices such as smart phones or wearable products. The circuit board 1 of the electronic devices such as smart phones or wearable products has a small height in the z-axis direction and a large size in the x-axis or y-axis direction. Figure 8 When capacitor 2 deforms along the y-axis, it is difficult for capacitor 2 to drive circuit board 1 to vibrate along the y-axis. Even if there is a weak vibration (amplitude less than 1pm), the noise generated is much smaller than that generated by circuit board 1 because the cross-sectional area of ​​​​circuit board 1 on the yz plane is also very small. Figure 1 or Figure 2 The noise generated when the capacitor 2 drives the circuit board 1 to vibrate along the z-axis direction.

[0059] In this embodiment, the area of ​​a single positive electrode sheet 201 or a negative electrode sheet 202 is z×y. Figure 1 or Figure 2 The area of ​​a single positive electrode sheet 201 or negative electrode sheet 202 is x×y. Therefore, the capacitance value of capacitor 2 in this embodiment is:

[0060]

[0061] Among them, C1 is the capacitance value of capacitor 2 in this embodiment, ε is a constant (polarizability of dielectric material), n1 is the number of stacking layers of positive electrode sheet 201 and negative electrode sheet 202 in this embodiment, d is the distance between adjacent positive electrode sheet 201 and negative electrode sheet 202 in the direction perpendicular to their planes, and yz is the area of ​​a single positive electrode sheet 201 or negative electrode sheet 202 in this embodiment.

[0062] Figure 1 and Figure 2 The capacitance value of capacitor 2 is,

[0063]

[0064] Among them, C2 is Figure 1 and Figure 2 The capacitance value of capacitor 2, ε is a constant (polarizability of dielectric material), and n2 is Figure 1 and Figure 2 The number of stacked layers of the positive electrode sheet 201 and the negative electrode sheet 202, d is the distance between the adjacent positive electrode sheet 201 and the negative electrode sheet 202 in the direction perpendicular to their planes, and xy is Figure 1 and Figure 2 The area of ​​a single positive electrode sheet 201 or a negative electrode sheet 202 in the embodiment is smaller than that of a single positive electrode sheet 201 or a negative electrode sheet 202 in the embodiment. It can be understood that, under the same package size, the area of ​​a single electrode sheet in this embodiment is smaller than that of Figure 1 and Figure 2 The area of ​​a single electrode sheet in the y-axis direction is greater than that of the positive electrode sheet 201 and the negative electrode sheet 202. Figure 1 and Figure 2 The number of stacked layers of the positive electrode sheet 201 and the negative electrode sheet 202 is n2. Therefore, in this embodiment, by configuring the number of stacked layers of the positive electrode sheet 201 and the negative electrode sheet 202 to be n1, the capacitance value can be the same as that of the capacitor under the same package size. Figure 1 and Figure 2 The capacitance value of the capacitor 2 is the same, and the problem of "howling" of the capacitor 2 can also be solved, which is beneficial to the miniaturization design of the electronic equipment.

[0065] like Fig. 9 , Fig.13 and Fig.14As shown, in one embodiment, the plurality of electrode sheet units 20 are arranged along a second direction perpendicular to the first surface 13 (eg Fig. 9 and Fig.14 The electrode sheet unit 20 includes a stacked positive electrode sheet 201 and a negative electrode sheet 202, and the parameters Fig.13 and Fig.14 , the positive electrode sheets 201 of two adjacent electrode sheet units 20 are arranged close to each other, or the negative electrode sheets 202 of two adjacent electrode sheet units 20 are arranged close to each other. Fig.14 In this embodiment, four groups of electrode sheet units 20 are provided, wherein the polarities of the electrode sheets are [+, -, -, +, +, -, -, +] from bottom to top. Therefore, when a voltage is applied across the capacitor 2, the piezoelectric effect causes the internal electrode sheet unit 20 to deform along the z-axis direction (this deformation is very small, with an amplitude of about 1pm to 1nm). Fig.15 , the first vibration curve A1 of the positive electrode sheet 201 and the negative electrode sheet 202 in the first group of electrode sheet units 20 from bottom to top, and the second vibration curve A2 of the positive electrode sheet 201 and the negative electrode sheet 202 in the adjacent second group of electrode sheet units 20 can be obtained. The deformation amplitudes of the first vibration curve A1 and the second vibration curve A2 are the same but in opposite directions. With such a setting, by moving the first vibration curve A1 in the second direction (such as perpendicular to the first surface 13 of the circuit board 1) perpendicular to the first surface 13 of the circuit board 1, the first vibration curve A1 and the second vibration curve A2 are the same but in opposite directions. Fig. 9 and Fig.14 There are multiple electrode sheet units 20 arranged in the z-axis direction (shown in the figure), when voltage is applied across the capacitor 2, the piezoelectric effect will cause the internal electrode sheet unit 20 to deform along the z-axis direction. Since the deformation amplitudes of two adjacent electrode sheet units 20 are the same but the directions are opposite, the deformation can be offset, thereby reducing the influence of the force on the circuit board 1, thereby eliminating the problem of "capacitor howling" caused by capacitor stacking vibration.

[0066] like Figure 3 and Fig. 9 As shown, in one embodiment, the circuit board 1 is provided with a first pad 11 and a second pad 12, and the capacitor 2 also includes a first conductive structure 21 connected to each positive electrode sheet 201 and a second conductive structure 22 connected to each negative electrode sheet 202; the circuit board assembly also includes a connecting portion 3, the connecting portion 3 conductively connects the first conductive structure 21 to the first pad 11, and conductively connects the second conductive structure 22 to the second pad 12. With such a configuration, the capacitor 2 is electrically connected to the circuit board 1 through the connecting portion 3, the first conductive structure 21 and the second conductive structure 22 to meet the functions of tuning, bypassing, coupling or filtering in the circuit, and at the same time, the height of the capacitor 2 in the z-axis direction will not be increased, which is conducive to the miniaturization design of electronic equipment.

[0067] like Figure 6 and Figure 7 As shown, in one embodiment, the positive electrode sheet 201 includes a first dielectric layer 211 and a positive conductive layer 212 disposed on the first dielectric layer 211, and the negative electrode sheet 202 includes a second dielectric layer 221 and a negative conductive layer 222 disposed on the second dielectric layer 221. The first portion of the positive conductive layer 212 is disposed in the third direction (e.g. Figure 6 In the direction of the z-axis shown in FIG. 2 , the first edge 2111 of the first dielectric layer 211 protrudes from the negative conductive layer 222 and extends to the first dielectric layer 211. Figure 8 The first conductive structure 21 is attached to the first edge 2111 of each first dielectric layer 211 to be electrically connected to each first portion.

[0068] Reference Figure 7 , the second portion of the negative conductive layer 222 is in the fourth direction (eg Figure 7 The positive electrode conductive layer 212 is provided on the opposite direction of the z-axis shown in FIG. 2 and extends to the second edge 2211 of the second dielectric layer 221, referring to FIG. Figure 8 The second conductive structure 22 is attached to the second edge 2211 of each second dielectric layer 221 to be electrically connected to each second portion, wherein the third direction (eg Figure 6 ) and a fourth direction (eg Figure 7 ) are both perpendicular to the first surface 13.

[0069] Reference Figure 5 When the plurality of positive electrode sheets 201 and the plurality of negative electrode sheets 202 are arranged along a first direction (eg Figure 4 and Figure 8 After stacking and arranging (in the y-axis direction shown in FIG), capacitor 2 has two terminals, and the current path flows from left to right. Among them, the first dielectric layer 211 and the second dielectric layer 221 can be made of ceramics and other materials, and the first dielectric layer 211 with the positive conductive layer 212 and the second dielectric layer 221 with the negative conductive layer 222 are stacked and arranged along the first direction (for example, Figure 4 and Figure 8 The y-axis direction shown in FIG) is staggered and stacked, and then sintered at a high temperature once to form a ceramic chip, such as Figure 3 As shown, a first conductive structure 21 is provided on the positive conductive layer 212 of the ceramic chip, protruding from the negative conductive layer 222 and extending to one end of the first edge 2111 of the first dielectric layer 211, and a second conductive structure 22 is provided on the negative conductive layer 222 of the ceramic chip, protruding from the positive conductive layer 212 and extending to one end of the second edge 2211 of the second dielectric layer 221. The capacitor 2 is formed with two terminals, and the current path is as shown in FIG. Figure 5With this arrangement, the positive conductive layer 212 and the negative conductive layer 222 in the capacitor 2 are arranged in parallel with the circuit board 1. It can be understood that Figure 6 and Figure 7 In the embodiment, the cross-section of the positive electrode sheet 201 and the negative electrode sheet 202 in the xz plane is arranged perpendicular to the first surface 13 of the circuit board 1. Therefore, when the deformation force F1 generated by the voltage effect of the capacitor 2 is mainly a force in the direction parallel to the first surface 13 of the circuit board 1, the force in the direction parallel to the first surface 13 of the circuit board 1 does not directly contact the circuit board 1, so that the circuit board 1 is subjected to less force and the vibration amplitude is smaller, so the howling noise can be reduced. In addition, since there is no need to use other high-cost capacitors 2 to replace the low-cost multilayer ceramic capacitors 2, the cost can be taken into account while reducing the howling noise.

[0070] like Fig. 9 , Fig.13 , Fig.14 and Fig.16 As shown, in one embodiment, the third direction (eg Figure 6 ) and a fourth direction (eg Figure 7 The direction is opposite to the z-axis shown in FIG. Figure 3 and Figure 5 The first conductive structure 21 includes a first shell 210, and the first shell 210 covers the end of the capacitor body in the third direction. The second conductive structure 22 includes a second shell 220, and the second shell 220 covers the end of the capacitor body in the fourth direction.

[0071] It should be noted that, in this embodiment, the capacitor body includes a Fig. 9 , Fig.13 and Fig.14 The plurality of electrode sheet units 20 are arranged in a third direction (for example, in the z-axis direction shown in FIG), wherein the electrode sheet unit 20 includes a stacked positive electrode sheet 201 and a negative electrode sheet 202, and the positive electrode sheets 201 of two adjacent electrode sheet units 20 are arranged close to each other, or the negative electrode sheets 202 of two adjacent electrode sheet units 20 are arranged close to each other, and the first portion of the positive conductive layer 212 is arranged in a third direction (for example, in the z-axis direction shown in FIG Fig.16 The negative conductive layer 222 is protruding from the negative conductive layer 222 in the y-axis direction shown in FIG. 1 and extending to the first edge 2111 of the first dielectric layer 211. The second portion of the negative conductive layer 222 is protruding from the negative conductive layer 222 in the fourth direction (eg, Fig.16The first shell 210 and the second shell 220 can both be made of metal materials with good conductive properties such as copper, aluminum and nickel. With such a setting, on the one hand, it is convenient to conductively connect the first shell 210 and the second shell 220 to the first pad 11 and the second pad 12 on the circuit board 1 through the connecting part 3, and on the other hand, the first conductive structure 21 and the second conductive structure 22 can protect the first dielectric layer 211 and the second dielectric layer 221 inside the capacitor 2, and prevent the external environment from damaging the first dielectric layer 211 and the second dielectric layer 221, thereby extending the service life of the capacitor 2. At the same time, when a voltage is applied across the capacitor 2, the piezoelectric effect will cause the internal electrode sheet unit 20 to deform along the z-axis direction. Since the deformation amplitudes of the two adjacent electrode sheet units 20 are the same but the directions are opposite, the deformation can be offset, thereby reducing the influence of the force on the circuit board 1, thereby eliminating the problem of "capacitor howling" caused by capacitor stacking vibration.

[0072] like Figure 6 and Figure 7 As shown, in one embodiment, the first dielectric layer 211 and the positive conductive layer 212 are both rectangular, the first side of the positive conductive layer 212 is flush with one side of the first dielectric layer 211, and the other sides of the positive conductive layer 212 except the first side are located within the edge of the first dielectric layer 211; the second dielectric layer 221 and the negative conductive layer 222 are both rectangular, the second side of the negative conductive layer 222 is flush with one side of the second dielectric layer 221, and the other sides of the negative conductive layer 222 except the second side are located within the edge of the second dielectric layer 221. By adopting such a configuration, the first dielectric layer 211 and the second dielectric layer 221 can prevent the two adjacent electrode layers from directly contacting each other, and at the same time, the capacitance 2, insulation resistance, dielectric loss and other parameters of the capacitor 2 can be controlled to maintain the stable performance of the capacitor 2 and ensure the normal operation of the capacitor 2. The ceramic dielectric layer is arranged around the positive conductive layer 212 and the negative conductive layer 222, which can also reduce the volume and weight of the capacitor 2 and improve the energy density and reliability of the capacitor 2. The edges of the first dielectric layer 211 and the second dielectric layer 221 are stacked in sequence to ensure a smooth appearance, and the first part protruding in the third direction is in contact with the first conductive structure 21 and the second part protruding in the fourth direction is in contact with the second conductive structure 22. At the same time, the first dielectric layer 211, the second dielectric layer 221, the positive conductive layer 212 and the negative conductive layer 222 are all arranged in a rectangular shape, which can make the manufacturing process simpler and more convenient, thereby reducing the production cost.

[0073] like Figure 3 , Figure 4 and Figure 8 As shown, in one embodiment, a plurality of electrode sheet units 20 are arranged along a first direction (eg Figure 8 That is, the plurality of positive electrode sheets 201 and the plurality of negative electrode sheets 202 are arranged along a first direction (eg, Figure 8 The first edges 2111 are arranged in the y-axis direction shown in the figure, each first edge 2111 is located on the first surface of the capacitor body, each second edge 2211 is located on the second surface of the capacitor body opposite to the first surface of the capacitor body, and the capacitor body also includes a third surface and a fourth surface connecting the first surface and the second surface and respectively located on opposite sides of the capacitor body. It can be understood that the first surface of the capacitor body is Figure 3 The second surface of the capacitor body is the side opposite to the first surface of the capacitor body, that is, the surface away from the circuit board 1, and the third surface of the capacitor body is Figure 3 The fourth surface of the capacitor body is shown as the surface on the x-axis side. Figure 3 The surface on the side opposite to the x-axis is shown.

[0074] like Figure 8 As shown, the first conductive structure 21 includes a first conductive plate 2101 and a second conductive plate 2102 connected and arranged at an angle, the first conductive plate 2101 is attached to the second surface, the connecting portion 3 includes a first welding portion 31, the second conductive plate 2102 is welded to the first pad 11 through the first welding portion 31, and the second conductive structure 22 includes a third conductive plate 2201 and a fourth conductive plate 2202 connected and arranged at an angle, the third conductive plate 2201 is attached to the first surface of the capacitor body, the connecting portion 3 includes a second welding portion 32, and the fourth conductive plate 2202 is welded to the second pad 12 through the second welding portion 32. Among them, the first conductive plate 2101 and the second conductive plate 2102 can be integrally formed, or connected by welding or the like, and the third conductive plate 2201 and the fourth conductive plate 2202 can be integrally formed, or connected by welding or the like.

[0075] For example, in Figure 8 In the embodiment, the first conductive plate 2101 and the second conductive plate 2102 are arranged vertically, the third conductive plate 2201 and the fourth conductive plate 2202 are arranged vertically, the first conductive plate 2101 is attached to the second surface, and the third conductive plate 2201 is attached to the first surface of the capacitor body, that is, the plurality of positive conductive layers 212 and the plurality of negative conductive layers 222 are arranged along Figure 8The layers are evenly spaced in the y-axis direction, a negative conductive layer 222 is provided between two adjacent positive conductive layers 212, a positive conductive layer 212 is provided between two adjacent negative conductive layers 222, the first conductive plate 2101 is respectively connected to the upper ends of the plurality of positive conductive layers 212, and the lower ends of the plurality of positive conductive layers 212 are not connected to the third conductive plate 2201, the third conductive plate 2201 is respectively connected to the lower ends of the plurality of negative conductive layers 222, and the upper ends of the plurality of negative conductive layers 222 are not connected to the first conductive plate 2101. Then, the second conductive plate 2102 is welded to the first pad 11 through the first welding portion 31, and the fourth conductive plate 2202 is welded to the second pad 12 through the second welding portion 32, wherein the first welding portion 31 and the second welding portion 32 can be completed by solder, and the first conductive plate 2101, the second conductive plate 2102, the third conductive plate 2201 and the fourth conductive plate 2202 can be made of metal materials with good conductive properties such as copper, aluminum and nickel. With such a setting, multiple positive conductive layers 212 are connected through the first conductive plate 2101, and then the first conductive plate 2101 is conductively connected to the first pad 11 through the second conductive plate 2102, multiple negative conductive layers 222 are connected through the third conductive plate 2201, and then the third conductive plate 2201 is conductively connected to the second pad 12 through the fourth conductive plate 2202. The structure is simple and easy to process. When a voltage is applied to the capacitor 2, the second conductive plate 2102 and the fourth conductive plate 2202 can be used to buffer the vibration transmitted to the circuit board 1 by the capacitor 2.

[0076] like Fig.11 , Fig.12 , Fig.13 and Fig.14 As shown, in one embodiment, the positive electrode sheet 201 includes a first dielectric layer 211 and a positive electrode conductive layer 212 disposed on the first dielectric layer 211, and the negative electrode sheet 202 includes a second dielectric layer 221 and a negative electrode conductive layer 222 disposed on the second dielectric layer 221, and the first dielectric layer 211 and the second dielectric layer 221 are rectangular with flush edges; wherein the first dielectric layer 211 and the second dielectric layer 221 can be made of materials such as ceramics. The positive electrode conductive layer 212 includes a positive electrode conductive layer body 2121 and two first conductive connecting portions 2122 connected to the positive electrode conductive layer body 2121, the two first conductive connecting portions 2122 are respectively located at the first diagonal positions of the first dielectric layer 211, the first conductive structure 21 is correspondingly disposed to the first conductive connecting portion 2122, and each first conductive structure 21 is electrically connected to the corresponding first conductive connecting portion 2122.

[0077] For example, in Fig.11In the embodiment, the positive electrode conductive layer body 2121 is arranged in the middle of the first dielectric layer 211, wherein one first conductive connection part 2122 is arranged at the upper left of the positive electrode conductive layer body 2121, and the other first conductive connection part 2122 is arranged at the lower right of the positive electrode conductive layer body 2121. The negative electrode conductive layer 222 includes a negative electrode conductive layer body 2221 and two second conductive connection parts 2222 connected to the negative electrode conductive layer body 2221, the two second conductive connection parts 2222 are respectively located at the second diagonal position of the second dielectric layer 221 which is different from the first diagonal position, the second conductive structure 22 is arranged corresponding to the second conductive connection part 2222, and each second conductive structure 22 is respectively electrically connected to the corresponding second conductive connection part 2222. For example, in Fig.12 In the embodiment, the negative electrode conductive layer body 2221 is arranged in the middle of the second dielectric layer 221, one second conductive connection part 2222 is arranged at the upper right of the negative electrode conductive layer body 2221, and the other second conductive connection part 2222 is arranged at the lower left of the negative electrode conductive layer body 2221. With such an arrangement, referring to Fig.10 , four terminals can be formed on capacitor 2, so that the path of the current in capacitor 2 can be along Fig.10 The current flows in the direction of the arrow in the middle, so that the capacitor 2 can handle a larger current load, making the current distribution on the capacitor 2 more uniform, thereby reducing the local current concentration, thereby reducing the heating and howling caused by the uneven current, and the electrode sheet unit 20 is moved along the second direction (such as Fig. 9 and Fig.14 When voltage is applied across the capacitor 2, the piezoelectric effect causes the internal electrode sheet unit 20 to deform along the z-axis direction. Since the deformation amplitudes of two adjacent electrode sheet units 20 are the same but the directions are opposite, the deformation can be offset, thereby reducing the influence of the force on the circuit board 1, thereby eliminating the problem of "capacitor howling" caused by capacitor stacking vibration.

[0078] like Fig.11 and Fig.12 As shown, in one embodiment, one of the first conductive connecting portions 2122 is flush with two edges adjacent to the first dielectric layer 211, and another first conductive connecting portion 2122 is flush with the other two edges adjacent to the first dielectric layer 211; illustratively, referring to Fig.11 , the first conductive connection part 2122 in the upper left corner is flush with the two edges adjacent to the first dielectric layer 211, and the first conductive connection part 2122 in the lower right corner is flush with the other two edges adjacent to the first dielectric layer 211. One of the second conductive connection parts 2222 is flush with the two edges adjacent to the second dielectric layer 221, and the other second conductive connection part 2222 is flush with the other two edges adjacent to the second dielectric layer 221. For example, referring to Fig.12, the second conductive connection part 2222 at the upper right corner is flush with the two edges adjacent to the second dielectric layer 221, and the second conductive connection part 2222 at the lower left corner is flush with the other two edges adjacent to the second dielectric layer 221. With such a configuration, by aligning each first conductive connection part 2122 with the two edges adjacent to the first dielectric layer 211, and aligning the second conductive connection part 2222 with the two edges adjacent to the second dielectric layer 221, the stability of the connection between the positive electrode sheet 201 and the negative electrode sheet 202 and the first conductive structure 21 and the second conductive structure 22 can be enhanced, and the failure caused by poor contact or disconnection can be reduced. At the same time, the production process can be simplified and the manufacturing cost can be reduced through standardized design.

[0079] like Fig. 9 and Fig.10 As shown, in one embodiment, the first conductive structure 21 includes a third shell 213, and the third shell 213 covers the corner area of ​​the capacitor body corresponding to the first conductive connection part 2122, and the second conductive structure 22 includes a fourth shell 223, and the fourth shell 223 covers the corner area of ​​the capacitor body corresponding to the second conductive connection part 2222. It can be understood that the first conductive structure 21 includes two third shells 213, and the two third shells 213 respectively cover a first conductive structure 21, and the second conductive structure 22 includes two fourth shells 223, and the two fourth shells 223 respectively cover a second conductive structure 22, so that the positive electrode sheet 201 is connected to the circuit board 1 through the first conductive structure 21, and the negative electrode sheet 202 is connected to the circuit board 1 through the second conductive structure 22. With such a configuration, the capacitor body is conductively connected to the circuit board 1 through the third shell 213 and the fourth shell 223, and four terminals can be formed on the capacitor 2, so that the path of the current in the capacitor 2 can be along Fig.10 The current flows in the direction of the middle arrow, so that the capacitor 2 can handle a larger current load and the current distribution on the capacitor 2 is more uniform, thereby reducing the local current concentration, thereby reducing the heat and howling caused by the uneven current. The first dielectric layer 211 and the second dielectric layer 221 inside the capacitor 2 can also be protected by the third conductive structure and the fourth conductive structure to prevent the external environment from damaging the first dielectric layer 211 and the second dielectric layer 221, thereby extending the service life of the capacitor 2.

[0080] An exemplary embodiment of the present disclosure provides an electronic device, which may be, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or a self-service machine.

[0081] The electronic device includes the circuit board assembly as described above. For example, when a plurality of positive electrode sheets 201 and a plurality of negative electrode sheets 202 are arranged along a first direction (eg Figure 3 , Figure 4 and Figure 8 When the arrangement is arranged in the y-axis direction shown in FIG. Figure 8 yx axis direction shown in FIG) is arranged parallel to the first surface 13 of the circuit board 1, Figure 8 The direction of the arrow in the figure indicates the direction of the deformation force F1 generated by the deformation of the capacitor 2 due to the voltage effect. When a voltage is applied to both ends of the capacitor 2, the piezoelectric effect causes the positive electrode plate and the negative electrode plate in the capacitor 2 to expand and contract along the direction of the deformation force F1, with an amplitude of about 1pm to 1nm. When the capacitor 2 is set on the circuit board 1 in this way, the contact points between the capacitor 2 and the first pad 11 and the second pad 12 on the circuit board 1 are on the xy plane, and the arrangement directions of the multiple positive electrode sheets 201 and the multiple negative electrode sheets 202 are parallel to each other in the y direction or the x direction with the first surface 13 of the circuit board 1, and are only connected at the two pads by soldering. Therefore, if Figure 8 As shown, when the capacitor 2 is deformed along the y-axis or the x-axis due to the piezoelectric effect, the capacitor 2 will not collide with the circuit board 1 to generate noise.

[0082] When the capacitor body includes a second direction perpendicular to the first surface 13 (eg Fig. 9 and Fig.14 The plurality of electrode sheet units 20 are arranged in the z-axis direction shown in FIG. 1 , and the electrode sheet unit 20 includes a stacked positive electrode sheet 201 and a negative electrode sheet 202, referring to Fig.14 , 4 groups of electrode sheet units 20 are set, where the polarity of the electrode sheets is [+, -, -, +, +, -, -, +] from bottom to top. Therefore, when a voltage is applied across the capacitor 2, the piezoelectric effect will cause the internal electrode sheet unit 20 to deform along the z-axis direction (this deformation is very small, with an amplitude of about 1pm to 1nm). Fig.15, the first vibration curve A1 of the positive electrode sheet 201 and the negative electrode sheet 202 in the first group of electrode sheet units 20 from bottom to top, and the second vibration curve A2 of the positive electrode sheet 201 and the negative electrode sheet 202 in the adjacent second group of electrode sheet units 20 can be obtained. The deformation amplitudes of the first vibration curve A1 and the second vibration curve A2 are the same but in opposite directions. With such a setting, by moving the first vibration curve A1 in the second direction (such as perpendicular to the first surface 13 of the circuit board 1) perpendicular to the first surface 13 of the circuit board 1, the first vibration curve A1 and the second vibration curve A2 are the same but in opposite directions. Fig. 9 and Fig.14 There are multiple electrode sheet units 20 arranged in the z-axis direction (shown in the figure), when voltage is applied across the capacitor 2, the piezoelectric effect will cause the internal electrode sheet unit 20 to deform along the z-axis direction. Since the deformation amplitudes of two adjacent electrode sheet units 20 are the same but the directions are opposite, the deformation can be offset, thereby reducing the influence of the force on the circuit board 1, thereby eliminating the problem of "capacitor howling" caused by capacitor stacking vibration.

[0083] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0084] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: Circuit boards; A capacitor is arranged on the circuit board, the capacitor includes a capacitor body, the capacitor body is opposite to the first surface of the circuit board, the capacitor body includes a plurality of electrode sheet units arranged in a preset arrangement, each of the electrode sheet units includes a stacked positive electrode sheet and a negative electrode sheet, and the preset arrangement is configured so that the vibration directions of at least two of the electrode sheet units are opposite, or the vibration direction of the electrode sheet unit is parallel to the first surface or is arranged at a non-vertical angle.

2. The circuit board assembly according to claim 1, characterized in that: The plurality of electrode sheet units are arranged along a first direction, and the first direction is parallel to the first surface or is arranged at a non-vertical angle.

3. The circuit board assembly according to claim 1, characterized in that: The plurality of electrode sheet units are arranged along a second direction perpendicular to the first surface, and the positive electrode sheets of two adjacent electrode sheet units are arranged close to each other, or the negative electrode sheets of two adjacent electrode sheet units are arranged close to each other.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The circuit board is provided with a first soldering pad and a second soldering pad; The capacitor further includes a first conductive structure connected to each of the positive electrode sheets and a second conductive structure connected to each of the negative electrode sheets; The circuit board assembly further includes a connecting portion that conductively connects the first conductive structure to the first pad and conductively connects the second conductive structure to the second pad.

5. The circuit board assembly according to claim 4, characterized in that: The positive electrode sheet comprises a first dielectric layer and a positive conductive layer disposed on the first dielectric layer, and the negative electrode sheet comprises a second dielectric layer and a negative conductive layer disposed on the second dielectric layer; The first portion of the positive electrode conductive layer protrudes from the negative electrode conductive layer in the third direction and extends to the first edge of the first dielectric layer, and the first conductive structure is attached to the first edge of each of the first dielectric layers to be electrically connected to each of the first portions; The second portion of the negative conductive layer protrudes from the positive conductive layer in the fourth direction and extends to the second edge of the second dielectric layer, and the second conductive structure is attached to the second edge of each second dielectric layer to be electrically connected to each second portion.

6. The circuit board assembly according to claim 5, characterized in that: The third direction is opposite to the fourth direction, the first conductive structure includes a first shell, the first shell covers the end of the capacitor body in the third direction, and the second conductive structure includes a second shell, the second shell covers the end of the capacitor body in the fourth direction.

7. The circuit board assembly according to claim 6, characterized in that: The first dielectric layer and the positive conductive layer are both rectangular, a first side of the positive conductive layer is flush with one side of the first dielectric layer, and other sides of the positive conductive layer except the first side are located within the edge of the first dielectric layer; The second dielectric layer and the negative conductive layer are both rectangular, the second side of the negative conductive layer is flush with one side of the second dielectric layer, and the sides of the negative conductive layer except the second side are located within the edge of the second dielectric layer.

8. The circuit board assembly according to claim 5, characterized in that: The plurality of electrode sheet units are arranged along a first direction, each of the first edges is located on a first surface of the capacitor body, each of the second edges is located on a second surface of the capacitor body opposite to the first surface of the capacitor body, and the capacitor body further includes a third surface and a fourth surface connecting the first surface and the second surface and respectively located on opposite sides of the capacitor body; The first conductive structure includes a first conductive plate and a second conductive plate that are connected and arranged at an angle, the first conductive plate is attached to the second surface, the connecting portion includes a first welding portion, and the second conductive plate is welded to the first pad through the first welding portion; The second conductive structure includes a third conductive plate and a fourth conductive plate that are connected and arranged at an angle, the third conductive plate is in contact with the first surface of the capacitor body, the connecting portion includes a second welding portion, and the fourth conductive plate is welded to the second pad through the second welding portion.

9. The circuit board assembly according to claim 4, characterized in that: The positive electrode sheet comprises a first dielectric layer and a positive conductive layer disposed on the first dielectric layer, and the negative electrode sheet comprises a second dielectric layer and a negative conductive layer disposed on the second dielectric layer, and the first dielectric layer and the second dielectric layer are rectangular with flush edges; The positive electrode conductive layer comprises a positive electrode conductive layer body and two first conductive connection parts connected to the positive electrode conductive layer body, the two first conductive connection parts are respectively located at first diagonal positions of the first dielectric layer, the first conductive structure is arranged corresponding to the first conductive connection parts, and each of the first conductive structures is electrically connected to the corresponding first conductive connection parts; The negative conductive layer includes a negative conductive layer body and two second conductive connection parts connected to the negative conductive layer body, the two second conductive connection parts are respectively located at second diagonal positions of the second dielectric layer that are different from the first diagonal positions, the second conductive structures are arranged corresponding to the second conductive connection parts, and each second conductive structure is electrically connected to the corresponding second conductive connection part.

10. The circuit board assembly according to claim 9, characterized in that: One of the first conductive connecting portions is flush with two edges adjacent to the first dielectric layer, and another of the first conductive connecting portions is flush with the other two edges adjacent to the first dielectric layer; One of the second conductive connection parts is flush with two adjacent edges of the second dielectric layer, and the other of the second conductive connection parts is flush with the other two adjacent edges of the second dielectric layer.

11. The circuit board assembly according to claim 9, characterized in that: The first conductive structure includes a third shell, and the third shell covers a corner area of ​​the capacitor body corresponding to the location of the first conductive connecting portion; The second conductive structure includes a fourth shell, and the fourth shell covers a corner area of ​​the capacitor body corresponding to the second conductive connecting portion.

12. An electronic device, characterized in that: The electronic device comprises the circuit board assembly according to any one of claims 1 to 11.

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