Heat dissipation structure, frequency conversion control box and dehumidifier

Abstract

The utility model discloses a heat radiation structure, a frequency conversion control box and a dehumidifier, and the heat radiation structure comprises a box body and a radiator. An inner cavity used for installing a circuit module is formed in the box body, a heat dissipation window corresponding to the position of an electronic component in the circuit module to be subjected to heat dissipation is formed in the box body, and a plurality of limiting buckles arranged at intervals are arranged on the inner side of the edge of the heat dissipation window; the radiator comprises a substrate and a plurality of radiating fins, and the radiating fins are connected to one side of the substrate at intervals; the substrate is located in the box body and corresponds to the position of the heat dissipation window, the side, connected with the heat dissipation fins, of the substrate is attached to the multiple limiting buckles, the other side of the substrate is attached to the electronic component, the multiple heat dissipation fins extend out of the box body from the heat dissipation window, and the limiting buckles extend between the adjacent heat dissipation fins; the heat conduction efficiency can be improved by attaching the substrate to the electronic component, the assembly structure of the radiator is simple, the assembly cost is reduced, and the assembly efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of electrical boxes, and particularly relates to a heat dissipation structure, a frequency conversion control box and a dehumidifier. Background Art

[0002] The IGBT and other power devices on the dehumidifier inverter board will generate a lot of heat during operation, causing the local temperature to be too high. In order to ensure the reliability of the system, a heat sink needs to be added.

[0003] The heat dissipation effect of the existing heat sink on the dehumidifier variable frequency control box is not ideal and cannot meet the heat dissipation requirements of the power devices on the variable frequency board. In addition, the heat sink requires multiple screws for fixed installation, which increases the assembly cost and is time-consuming and labor-intensive.

[0004] Therefore, a solution is urgently needed to solve the problems of unsatisfactory heat dissipation effect and inconvenient assembly of the radiator in the existing frequency conversion control box. Utility Model Content

[0005] The utility model aims at the above-mentioned technical problems in the prior art and provides a heat dissipation structure, a frequency conversion control box and a dehumidifier which have good heat dissipation effect and are easy to install.

[0006] In order to achieve the above technical objectives, the utility model adopts the following technical solutions:

[0007] According to a first aspect of the utility model, a heat dissipation structure is provided for dissipating heat from a circuit module, comprising:

[0008] A box body, wherein an inner cavity for installing the circuit module is formed in the box body, a heat dissipation window corresponding to the position of the electronic components in the circuit module to be dissipated is formed on the box body, and a plurality of spaced limiting buckles are arranged inside the edge of the heat dissipation window;

[0009] A heat sink, comprising a substrate and a plurality of heat sinks, wherein the plurality of heat sinks are connected to one side of the substrate at intervals;

[0010] Among them, the substrate is located inside the box body and corresponds to the position of the heat dissipation window. One side of the substrate connected to the heat sink is abutted against the multiple limiting buckles, and the other side is abutted against the electronic components. Multiple heat sinks extend out of the box body from the heat dissipation window, and the limiting buckles extend between adjacent heat sinks.

[0011] In some embodiments of the present invention, a water retaining edge surrounding the edge of the heat dissipation window is provided on the outer side of the box body.

[0012] Through the above technical solution, the water retaining edge can prevent water outside the box from entering through the heat dissipation window and causing damage to the circuit module in the box.

[0013] In some embodiments of the present invention, the inner side of the water retaining edge is flush with the inner side of the edge of the heat dissipation window, and the heat sink is attached to the inner side of the edge of the heat dissipation window and the inner side of the water retaining edge.

[0014] Through the above technical solution, the inner side of the water retaining edge and the inner side of the edge of the heat dissipation window can limit the radiator.

[0015] In some embodiments of the present invention, the shape of the substrate matches the shape of the heat dissipation window and blocks the heat dissipation window.

[0016] Through the above technical solution, the substrate blocks the heat dissipation window and can protect the circuit module in the box.

[0017] In some embodiments of the present invention, the plurality of heat sinks are parallel to each other, and the plurality of limit buckles are disposed on two opposite side edges of the heat dissipation window.

[0018] Through the above technical solution, multiple heat sinks and multiple limiting buckles can give way to each other.

[0019] In some embodiments of the present invention, edges of the plurality of heat sinks away from one end of the substrate are provided with chamfers or rounded corners.

[0020] Through the above technical solution, the chamfered or rounded corners of the heat sink are conducive to passing through the spaced limiting buckles, making it convenient to install the heat sink into the heat dissipation window.

[0021] In some embodiments of the present invention, the box body includes an upper cover and a bottom box that are snap-fitted together, the circuit module is arranged between the upper cover and the bottom box, and the heat dissipation window is arranged on the bottom surface of the bottom box.

[0022] Through the above technical solution, the heat dissipation window is arranged on the bottom surface of the bottom box so that water cannot easily enter.

[0023] According to the second aspect of the utility model, a frequency conversion control box is also provided, including a circuit module, the circuit module includes a circuit board and electronic components, and the frequency conversion control box also includes the above-mentioned heat dissipation structure.

[0024] In some embodiments of the present invention, the electronic component is an IGBT.

[0025] According to a third aspect of the utility model, a dehumidifier is also provided, comprising the above-mentioned frequency conversion control box.

[0026] Compared with the prior art, the advantages and positive effects of the utility model are:

[0027] The heat dissipation structure provided by the utility model comprises a box body and a heat sink, the heat sink is mounted on the heat dissipation window of the box body, the position of the heat dissipation window corresponds to the position of the electronic components of the circuit module to be dissipated in the box body, the heat sink comprises a substrate and a plurality of heat sinks, one side of the substrate is pressed against a plurality of spaced limit buckles on the inner side of the edge of the heat dissipation window, the other side of the substrate is pressed against the electronic components, a plurality of heat sinks extend out of the box body from the heat dissipation window, the substrate is pressed against the electronic components to improve the heat conduction efficiency, and the plurality of heat sinks can quickly dissipate the heat out of the box body;

[0028] The limit buckle can block the base plate so that the radiator cannot be separated from the heat dissipation window. The limit buckle extends between adjacent heat sinks and can limit the radiator to a position corresponding to the heat dissipation window, thereby realizing the installation of the radiator. There is no need to use screws for fixing, which simplifies the assembly structure of the radiator, helps to reduce assembly costs and improve assembly efficiency.

[0029] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a three-dimensional diagram of the frequency conversion control box provided by the utility model;

[0032] Figure 2 It is an exploded view of the frequency conversion control box provided by the utility model;

[0033] Figure 3 This is a bottom view of the frequency conversion control box provided by the utility model;

[0034] Figure 4 It is a cross-sectional view of the frequency conversion control box provided by the utility model;

[0035] Figure 5 It is a structural schematic diagram of a base box of a frequency conversion control box provided by the utility model.

[0036] In the figure,

[0037] 1. Box body;

[0038] 11. Upper cover; 12. Bottom box; 13. Heat dissipation window; 14. Limit buckle; 15. Water retaining edge;

[0039] 2. Radiator;

[0040] 21. substrate; 22. heat sink;

[0041] 3. Circuit module;

[0042] 31. Circuit boards; 32. Electronic components. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be understood as a limitation on the present invention.

[0045] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In the description of the implementation method, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0046] In the description of the present invention, unless otherwise specified, “plurality” means two or more. Embodiment 1

[0047] Embodiment 1 of the present invention provides a heat dissipation structure for dissipating heat from a circuit module. The circuit module includes a circuit board and electronic components arranged on the circuit board. Figures 1 to 5 As shown, the heat dissipation structure includes a box body 1 and a heat sink 2.

[0048] An inner cavity for installing the circuit module 3 is formed in the box body 1. A heat dissipation window 13 corresponding to the position of the electronic components 32 in the circuit module 3 to be dissipated is formed on the box body 1. A plurality of spaced limiting buckles 14 are arranged inside the edge of the heat dissipation window 13.

[0049] The heat sink 2 includes a base plate 21 and a plurality of heat sinks 22 . The plurality of heat sinks 22 are connected to one side of the base plate 21 at intervals.

[0050] The substrate 21 is located in the box body 1, and the position of the substrate 21 corresponds to the position of the heat dissipation window 13. One side of the substrate 21 connected to the heat sink 22 is against the multiple limiting buckles 14, and the other side of the substrate 21 is against the electronic components 32 in the circuit module 3. The multiple heat sinks 22 extend out of the box body 1 from the heat dissipation window 13, and the limiting buckles 14 extend between adjacent heat sinks 22.

[0051] The electronic components 32 in the circuit module 3 can be IGBTs (insulated gate bipolar transistors) or other power devices that generate heat, which is not limited in this embodiment. The electronic components 32 generate heat during operation, and the substrate 21 close to the electronic components 32 can improve the thermal conductivity, and the multiple heat sinks 22 can quickly dissipate the heat on the substrate 21 out of the box body 1. The limit buckle 14 can block the substrate 21 so that the heat sink 2 cannot be separated from the heat dissipation window 13. The limit buckle 14 extends between adjacent heat sinks 22, which can limit the heat sink 2 to a position corresponding to the heat dissipation window 13, thereby achieving the installation of the heat sink 2.

[0052] During assembly, the heat sink 2 is first installed into the heat dissipation window 13 from the inside of the box body 1, and then the circuit module 3 is installed. The heat sink 2 does not need to be fixed with screws, which simplifies the assembly structure, helps to reduce assembly costs and improve assembly efficiency.

[0053] Specifically, the shape of the heat dissipation window 13 can be set according to the specific position of the electronic components 32, so that each electronic component 32 to be dissipated is located within the range of the heat dissipation window 13. The shape of the substrate 21 is adapted to the shape of the heat dissipation window 13, and the heat dissipation window 13 is blocked to protect the circuit module 3 in the box body 1, and prevent water, dust, flying insects, etc. from entering the box body 1 through the heat dissipation window 13.

[0054] like Figure 4 In a specific embodiment shown, the heat dissipation window 13 is rectangular, and the substrate 21 is a rectangular flat plate structure having the same shape and size as the heat dissipation window 13 .

[0055] The plurality of heat sinks 22 are parallel to each other, and the plurality of limit buckles 14 are disposed on two opposite sides of the heat dissipation window 13. Figure 3From a perspective of , multiple heat sinks 22 extend in the lateral direction, multiple limit buckles 14 are distributed on the left and right sides of the heat dissipation window 13, and at least one limit buckle 14 is respectively provided on the left and right edges of the heat dissipation window 13. The position of each limit buckle 14 corresponds to the gap between adjacent heat sinks 22 to avoid interference with the heat sink 22. The limit buckle 14 can be configured to be engaged between two adjacent heat sinks 22 to play a limiting role.

[0056] In order to make the radiator 2 easier to assemble, chamfers or rounded corners are set on the edges of the multiple heat sinks 22 away from the substrate 21. When the radiator 2 is installed into the heat dissipation window 13, the chamfers or rounded corners are helpful in avoiding the limit buckles 14. The heat sink 22 can easily pass through the spaced limit buckles 14, making installation convenient.

[0057] In some embodiments, Figure 2 , Figure 3 and Figure 4 As shown, a water retaining edge 15 is arranged on the outside of the box body 1 around the edge of the heat dissipation window 13. The water retaining edge 15 is a raised structure, which can prevent water outside the box body 1 from entering the box body 1 through the heat dissipation window 13 and causing damage to the circuit module 3.

[0058] Furthermore, if Figure 4 As shown, the inner side of the water retaining edge 15 is flush with the inner side of the edge of the heat dissipation window 13, and the heat sink 22 is close to the inner side of the edge of the heat dissipation window 13 and the inner side of the water retaining edge 15, which can further limit the radiator 2 and prevent the radiator 2 from shaking in the heat dissipation window 13.

[0059] The plurality of limit buckles 14 and the water retaining edge 15 may be an integrally formed structure with the box body 1 .

[0060] In some embodiments, Figure 2 and Figure 5 As shown, the box body 1 includes an upper cover 11 and a bottom box 12 that are buckled together, and the circuit module 3 is arranged between the upper cover 11 and the bottom box 12. The upper cover 11 and the bottom box 12 can form a closed space to protect the circuit module 3. The heat dissipation window 13 is arranged on the bottom surface of the bottom box 12 and is blocked by the base plate 21 of the radiator 2, so that water is not easy to enter. Embodiment 2

[0061] The second embodiment of the present utility model provides a frequency conversion control box, including a circuit module 3 and a heat dissipation structure provided in the above-mentioned embodiment 1. The circuit module 3 includes a circuit board 31 and electronic components 32, and the heat dissipation structure includes a box body 1 and a heat sink 2.

[0062] An inner cavity for installing the circuit module 3 is formed in the box body 1. A heat dissipation window 13 corresponding to the position of the electronic components 32 in the circuit module 3 to be dissipated is formed on the box body 1. A plurality of spaced limiting buckles 14 are arranged inside the edge of the heat dissipation window 13.

[0063] The heat sink 2 includes a base plate 21 and a plurality of heat sinks 22 . The plurality of heat sinks 22 are connected to one side of the base plate 21 at intervals.

[0064] The substrate 21 is located in the box body 1, and the position of the substrate 21 corresponds to the position of the heat dissipation window 13. One side of the substrate 21 connected to the heat sink 22 is against the multiple limiting buckles 14, and the other side of the substrate 21 is against the electronic components 32 in the circuit module 3. The multiple heat sinks 22 extend out of the box body 1 from the heat dissipation window 13, and the limiting buckles 14 extend between adjacent heat sinks 22.

[0065] The electronic component 32 in the circuit module 3 may be an IGBT (insulated gate bipolar transistor), and the substrate 21 of the heat sink 2 is close to the IGBT to dissipate heat for the IGBT. Of course, the electronic component 32 may also be other types of power devices, which are dissipated by the heat sink 2 .

[0066] The other structures, principles, functions, etc. of the box body 1 and the radiator 2 of the frequency conversion control box can all refer to the heat dissipation structure provided in the first embodiment, and will not be described in detail in this embodiment.

[0067] The frequency conversion control box can be applied to dehumidifiers, frequency conversion air conditioners, refrigerators or other electrical products. Embodiment 3

[0068] A third embodiment of the present invention provides a dehumidifier, comprising a frequency conversion control box provided in the second embodiment, wherein the frequency conversion control box is arranged inside the body of the dehumidifier.

[0069] The specific structure, principle, function, etc. of the frequency conversion control box can refer to the frequency conversion control box provided in the above embodiment, and will not be repeated in this embodiment.

[0070] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, it is still possible for a person skilled in the art to modify the technical solutions described in the above embodiments, or to replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present invention.

Claims

1. A heat dissipation structure for dissipating heat from a circuit module, characterized in that: include: A box body, wherein an inner cavity for installing the circuit module is formed in the box body, a heat dissipation window corresponding to the position of the electronic components in the circuit module to be dissipated is formed on the box body, and a plurality of spaced limiting buckles are arranged inside the edge of the heat dissipation window; A heat sink, comprising a substrate and a plurality of heat sinks, wherein the plurality of heat sinks are connected to one side of the substrate at intervals; Among them, the substrate is located inside the box body and corresponds to the position of the heat dissipation window. One side of the substrate connected to the heat sink is abutted against the multiple limiting buckles, and the other side is abutted against the electronic components. Multiple heat sinks extend out of the box body from the heat dissipation window, and the limiting buckles extend between adjacent heat sinks.

2. The heat dissipation structure according to claim 1, characterized in that: The outer side of the box body is provided with a water retaining edge surrounding the edge of the heat dissipation window.

3. The heat dissipation structure according to claim 2, characterized in that: The inner side of the water retaining edge is flush with the inner side of the edge of the heat dissipation window, and the heat sink is attached to the inner side of the edge of the heat dissipation window and the inner side of the water retaining edge.

4. The heat dissipation structure according to claim 1, characterized in that: The shape of the substrate matches the shape of the heat dissipation window and blocks the heat dissipation window.

5. The heat dissipation structure according to claim 1, characterized in that: The plurality of heat sinks are parallel to each other, and the plurality of limit buckles are arranged on two opposite side edges of the heat dissipation window.

6. The heat dissipation structure according to claim 1, characterized in that: The edges of the plurality of heat sinks away from one end of the substrate are provided with chamfers or rounded corners.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The box body comprises an upper cover and a bottom box which are buckled together, the circuit module is arranged between the upper cover and the bottom box, and the heat dissipation window is arranged on the bottom surface of the bottom box.

8. A frequency conversion control box, comprising a circuit module, wherein the circuit module comprises a circuit board and electronic components, characterized in that: The frequency conversion control box also includes the heat dissipation structure described in any one of claims 1 to 7 above.

9. The frequency conversion control box according to claim 8, characterized in that: The electronic component is an IGBT.

10. A dehumidifier, characterized in that: It comprises a frequency conversion control box as described in claim 8 or 9 above.

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