Clamp for testing heat-conducting property of heat-conducting interface material of optical module

Abstract

The utility model discloses a fixture for testing the heat-conducting property of a heat-conducting interface material of an optical module, which belongs to the technical field of testing the heat-conducting property of the heat-conducting interface material of the optical module and comprises a fixed plate, a side plate is fixed on one side of the fixed plate, a top plate is fixed at the top of the side plate, and a screw is mounted on the top plate in a penetrating manner. A pressing plate is rotatably mounted at the bottom of the screw rod, limiting rods are arranged at the four corners of the pressing plate, limiting holes are slidably formed in the limiting rods, mounting holes are uniformly formed in the screw rod, movable rods are connected into the mounting holes in a penetrating mode, and the movable rods are slidably connected with the mounting holes; a fixing ring is fixed to the outer side of the movable rod. According to the fixture, the vertical position of the ejector block can be automatically adjusted according to the flatness of the material, so that each part of the material is extruded and fixed by the ejector block, and the material is more uniformly contacted with the test head, thereby improving the test precision of the fixture for the heat-conducting property of the heat-conducting interface material of the optical module.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal conductivity testing of thermal conductive interface materials of optical modules, in particular to a testing fixture for thermal conductive interface materials of optical modules. Background Art

[0002] In the optical module, there is a very fine uneven gap between the surface of the heating element and the heat dissipation element. If they are directly installed, the actual contact area is only 10% of the bottom area of ​​the heat dissipation element, and the rest is air gap, which leads to a very large contact thermal resistance between the heating element and the heat dissipation element, seriously hindering the heat conduction of the heating device, and finally causing the component to fail. Thermal conductive interface materials are widely used in the thermal management design of optical modules. Thermal conductive interface materials are used to fill the gap between the heating element and the heat dissipation shell, remove the air in it, establish an efficient heat conduction channel, greatly reduce the contact thermal resistance, and maximize the heat conduction of the heating element, ensuring that the optical module will not fail due to excessive temperature.

[0003] For example, the utility model with application number 202321296445.X discloses a test fixture for the thermal conductivity of the thermal interface material of an optical module. By setting a heating table 1, a simulated heat source 2 and a simulated tube shell 4, the interface material to be tested is set between the heating table 1 and the simulated tube shell 4, so that the test environment is closer to the actual application environment of the thermal interface material in the optical module; by setting two thermal sensors, the temperature difference between the two thermal sensors is read to compare the thermal conductivity of the thermal interface material of the same specification, so that the test results are more accurate, the test is rapid and quick, and the results are intuitive and clear.

[0004] Similar to the above application, there are still some shortcomings:

[0005] This kind of test fixture for the thermal conductivity of optical module thermal interface materials has poor fixing and clamping effect for the detection of thermal conductivity of different optical module thermal interface materials, and can only test the thermal conductivity of one optical module thermal interface material in a targeted manner. The detection range is small, and the contact surface between the detection head and the tested optical module thermal interface material is uneven and unstable, which may lead to reduced accuracy of the test results.

[0006] Therefore, a test fixture for the thermal conductivity of the thermal interface material of an optical module is designed to optimize the above problems. Utility Model Content

[0007] The main purpose of the utility model is to provide a test fixture for the thermal conductivity of a thermal interface material of an optical module, so as to solve the related technical problems raised in the above background technology.

[0008] The purpose of the utility model can be achieved by adopting the following technical solutions:

[0009] A test fixture for the thermal conductivity of a thermal interface material of an optical module comprises a fixed plate, a side plate is fixed to one side of the fixed plate, a top plate is fixed to the top of the side plate, a screw is installed through the top plate, a pressure plate is rotatably installed at the bottom of the screw, limit rods are provided at the four corners of the pressure plate, limit holes are slidably installed inside the limit rods, mounting holes are evenly provided on the screw, movable rods are connected through the inside of the mounting holes, and the movable rods are slidably connected to the mounting holes, a fixing ring is fixed to the outside of the movable rod, a spring is fixed to the top of the fixing ring, and the top end of the spring is fixedly connected to the bottom of the pressure plate, and a top block is fixed to the bottom of the movable rod.

[0010] Preferably: a support plate is fixed to the top of one end of the fixing plate away from the side plate, a slot is provided on the top of the support plate, a limiting slot is provided at the bottom of the slot, and a retaining bar is evenly annularly arranged inside the limiting slot.

[0011] Preferably: a fixing pad is fixed to the bottom of the fixing plate, grooves are evenly formed at the bottom of the fixing pad, a through hole is formed at the top of the groove, and the top of the through hole extends to the top of the fixing plate, and a fixing plug is provided inside the through hole.

[0012] Preferably, a fixing block is fixed on the outer side of the fixing plug, and the fixing block is an anti-slip fixing block.

[0013] Preferably, a rotating handle is arranged at the top end of the screw rod, and anti-slip patterns are evenly arranged on the rotating handle.

[0014] Preferably, the baffles are all trapezoidal blocks, and the baffles are all rubber trapezoidal blocks.

[0015] The beneficial effects of the utility model are:

[0016] The utility model provides a test fixture for the thermal conductivity of the thermal interface material of an optical module. Through the coordinated use of a fixed plate, a side plate, a top plate, a screw, a pressure plate, a limit rod, a limit hole, a mounting hole, a movable rod, a fixed ring, a spring and a top block, the upper and lower positions of the top block are automatically adjusted according to the flatness of the material, so that each part of the material is squeezed and fixed by the top block, and the contact between the material and the test head is more uniform, thereby improving the test accuracy of the fixture for the thermal conductivity of the thermal interface material of the optical module;

[0017] By using the supporting plate, the card slot, the limit slot and the baffle, the probe connection line used for testing is passed through the card slot and clamped inside the limit slot. The baffle is used to limit and fix the outer side of the connection line of the test head, thereby maintaining the stability of the test head and preventing the movement of the test head during the placement of the thermal conductive material, thereby improving the practicality of the fixture for the thermal conductivity of the thermal conductive interface material of the optical module;

[0018] By using the fixing pad, the groove, the through hole and the fixing plug in coordination, after placing the fixing plate on the desktop, the fixing ring is pressed down so that the air in the groove at the bottom of the fixing plate is discharged upward through the through hole, so that negative pressure is formed inside the groove and the plate is tightly adsorbed on the desktop, and then the fixing plug is blocked inside the through hole. When moving the fixing plate, the fixing plug is taken out of the through hole, so that the air quickly enters the groove, thereby facilitating and quickly lifting and moving the fixing plate, thereby improving the convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is the front view of the utility model;

[0020] Figure 2 For the utility model Figure 1 A magnified view of the structure at center;

[0021] Figure 3 It is a schematic diagram of a fixing pad of the utility model.

[0022] In the figure: 1. fixed plate; 2. side plate; 3. top plate; 4. screw; 5. pressure plate; 6. limit rod; 7. limit hole; 8. mounting hole; 9. movable rod; 10. fixed ring; 11. spring; 12. top block; 13. support plate; 14. slot; 15. limit slot; 16. baffle; 17. fixed pad; 18. groove; 19. through hole; 20. fixing plug. DETAILED DESCRIPTION

[0023] In order to make the technical solution of the utility model more clear and specific to those skilled in the art, the utility model is further described in detail below in conjunction with embodiments and drawings, but the implementation methods of the utility model are not limited thereto.

[0024] Embodiment 1

[0025] like Figure 1-Figure 3 As shown, the present embodiment provides a test fixture for the thermal conductivity of the thermal conductive interface material of an optical module, comprising a fixed plate 1, a side plate 2 is fixed to one side of the fixed plate 1, a top plate 3 is fixed to the top of the side plate 2, a screw 4 is installed through the top plate 3, a pressing plate 5 is rotatably installed at the bottom of the screw 4, limiting rods 6 are provided at the four corners of the pressing plate 5, limiting holes 7 are slidably installed inside the limiting rods 6, mounting holes 8 are evenly provided on the screw 4, movable rods 9 are connected through the inside of the mounting holes 8, and the movable rods 9 are slidably connected to the mounting holes 8, a fixing ring 10 is fixed to the outside of the movable rod 9, a spring 11 is fixed to the top of the fixing ring 10, and the top of the spring 11 is fixedly connected to the bottom of the pressing plate 5, a top block 12 is fixed to the bottom of the movable rod 9, a support plate 13 is fixed to the top of the fixed plate 1 away from the end of the side plate 2, a card slot 14 is provided on the top of the support plate 13, a limiting slot 15 is provided at the bottom of the card slot 14, and a retaining bar 16 is evenly annularly arranged inside the limiting slot 15.

[0026] Place the thermal interface material of the optical module to be tested on the fixed plate 1 either singly or in stacks, then place the test head on it, and then cover the test head with the remaining thermal interface materials of the optical module, and then rotate the screw 4 to move the bottom pressure plate 5 downward, until the pressure plate 5 drives the movable rod 9 and the bottom top block 12 to move downward, and push the top block 12 to press on the top of the material, pass the probe connection line used for testing through the slot 14, and engage it in the limiting slot 15, and limit and fix the outside of the connection line of the test head through the blocking bar 16.

[0027] Embodiment 2

[0028] In this embodiment, if Figure 1-Figure 3 As shown, a fixing pad 17 is fixed to the bottom of the fixing plate 1, a groove 18 is evenly formed at the bottom of the fixing pad 17, a through hole 19 is formed at the top of the groove 18, and the top of the through hole 19 extends to the top of the fixing plate 1, and a fixing plug 20 is arranged inside the through hole 19.

[0029] After placing the fixing plate 1 on the desktop, press down the fixing ring 10 so that the air in the groove 18 at the bottom of the fixing plate 1 is discharged upward through the through hole 19, so that negative pressure is formed inside the groove 18 and it is tightly adsorbed on the desktop, and then the fixing plug 20 is blocked inside the through hole 19. When moving the fixing plate 1, the fixing plug 20 is taken out of the through hole 19, so that the air quickly enters the groove 18, thereby facilitating and quickly lifting and moving the fixing plate 1.

[0030] In this embodiment, a fixing block is fixed to the outer side of the fixing plug 20 , and the fixing block is an anti-slip fixing block.

[0031] The fixing block makes it easy for the worker to pull the fixing plug 20 out of the through hole 19, which is more labor-saving and convenient to use.

[0032] In this embodiment, a rotating handle is provided at the top end of the screw rod 4, and anti-slip grooves are evenly provided on the rotating handle.

[0033] The setting of the turning handle and the anti-slip pattern facilitates the staff to adjust and use the screw rod 4.

[0034] In this embodiment, the blocking bars 16 are all trapezoidal blocks, and the blocking bars 16 are all rubber trapezoidal blocks.

[0035] The setting of the rubber trapezoidal blocks not only allows the placement of connecting wires of different diameters, but also increases the friction and provides a better fixing effect.

[0036] The above is only a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the scope disclosed by the present invention according to the technical solution and concept of the present invention, which fall within the protection scope of the present invention.

Claims

1. A test fixture for thermal conductivity of thermal interface materials of optical modules, characterized by: The invention comprises a fixed plate (1), a side plate (2) is fixed on one side of the fixed plate (1), a top plate (3) is fixed on the top of the side plate (2), a screw rod (4) is installed through the top plate (3), a pressure plate (5) is rotatably installed at the bottom of the screw rod (4), limiting rods (6) are provided at four corners of the pressure plate (5), limiting holes (7) are slidably installed inside the limiting rods (6), mounting holes (8) are evenly provided on the screw rod (4), movable rods (9) are connected through the inside of the mounting holes (8), and the movable rods (9) are slidably connected to the mounting holes (8), a fixing ring (10) is fixed on the outer side of the movable rod (9), a spring (11) is fixed on the top of the fixing ring (10), and the top end of the spring (11) is fixedly connected to the bottom of the pressure plate (5), and a top block (12) is fixed at the bottom of the movable rod (9).

2. A test fixture for thermal conductivity of a thermal interface material of an optical module according to claim 1, characterized in that: A support plate (13) is fixed to the top of one end of the fixed plate (1) away from the side plate (2), a clamping groove (14) is provided on the top of the support plate (13), a limiting groove (15) is provided at the bottom of the clamping groove (14), and a retaining strip (16) is evenly arranged in an annular shape inside the limiting groove (15).

3. A test fixture for thermal conductivity of a thermal interface material of an optical module according to claim 1, characterized in that: A fixing pad (17) is fixed to the bottom of the fixing plate (1), a groove (18) is evenly formed at the bottom of the fixing pad (17), a through hole (19) is formed at the top of the groove (18), and the top of the through hole (19) extends to the top of the fixing plate (1), and a fixing plug (20) is provided inside the through hole (19).

4. A test fixture for thermal conductivity of a thermal interface material of an optical module according to claim 3, characterized in that: A fixing block is fixed on the outer side of the fixing plug (20), and the fixing block is an anti-slip fixing block.

5. The test fixture for thermal conductivity of a thermal interface material of an optical module according to claim 1, characterized in that: The top end of the screw rod (4) is provided with a rotating handle, and anti-slip patterns are evenly arranged on the rotating handle.

6. A test fixture for thermal conductivity of a thermal interface material of an optical module according to claim 2, characterized in that: The baffles (16) are all trapezoidal blocks, and the baffles (16) are all rubber trapezoidal blocks.

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