Silicon wafer cutting and liquid distributing mechanism

Abstract

The utility model discloses a silicon wafer cutting and liquid distributing mechanism which comprises a frame body, a placing seat is arranged in the frame body, a servo electric cylinder is fixedly connected to the outer wall of the top of the frame body, one end of an output shaft of the servo electric cylinder penetrates through the frame body and is fixedly connected with a mounting frame, and two wire rollers are rotationally connected into the mounting frame. A plurality of cutting lines are wound between the two line rollers, a motor for driving the line rollers to rotate is fixedly connected to one side of the mounting frame, a plurality of water outlet pipes are fixedly connected to the bottoms of the two liquid distribution pipes, and the two liquid distribution pipes are rotationally connected into the mounting frame. According to the utility model, the cutting line can be cooled, the cutting line is prevented from being broken due to too high temperature, the silicon wafer cutting stability is improved, the spraying range of the water outlet pipe can be expanded, the use effect of the liquid distribution mechanism is improved, the cutting liquid can be uniformly distributed on the cutting line, and the spraying effect of the cutting liquid is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a liquid distributing mechanism for silicon slice cutting. Background Art

[0002] Silicon wafers are usually cut from silicon rods. The cutting of silicon rods requires the use of a silicon rod cutting machine, which can cut silicon rods of equal length according to the required length size of the silicon rods.

[0003] After searching, the announcement number CN209440566U discloses a silicon rod cutting device, which can improve work efficiency and reduce production costs. However, during cutting, it is necessary to spray cutting fluid to protect the steel wire. The lack of a cutting fluid spraying mechanism will make the steel wire temperature too high, causing the steel wire to break, affecting the flatness of the cut surface of the silicon wafer. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a silicon wafer cutting liquid distribution mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The silicon wafer cutting and liquid distribution mechanism comprises a frame body, a placing seat is provided in the frame body, a servo electric cylinder is fixedly connected to the top outer wall of the frame body, one end of the servo electric cylinder output shaft passes through the frame body and is fixedly connected to a mounting frame, two wire rollers are rotatably connected in the mounting frame, a plurality of cutting wires are wound around the two wire rollers, a motor for driving the wire rollers to rotate is fixedly connected to one side of the mounting frame, two liquid dispensing tubes are rotatably connected in the mounting frame, a plurality of water outlet pipes are fixedly connected to the bottom of the two liquid dispensing tubes, a rotating disk is provided at one end of the two liquid dispensing tubes, the rotating disk is connected to the liquid dispensing tube through a coupling, and a power component for causing the rotating disk to swing is provided on one side of the mounting frame.

[0007] As a further solution of the utility model, the power assembly includes a reduction motor, the reduction motor is fixedly connected to one side of the mounting frame, one end of the reduction motor output shaft passes through the mounting frame and is fixedly connected to a turntable, one side of the turntable is provided with a plurality of threaded holes, one of the threaded holes is threadedly connected with a shoulder screw, one side of the mounting frame is fixedly connected with a fixing block, one side of the fixing block is provided with a sliding opening, a T-shaped frame is slidably connected in the sliding opening, a guide groove is provided on one side of the T-shaped frame, so that the shoulder screw can reciprocate up and down along the guide groove, one end of the T-shaped frame is rotatably connected to a connecting rod 1, and the connecting rod 1 is rotatably connected to the adjacent rotating disk, and a connecting rod 2 is rotatably connected between the two rotating disks.

[0008] As a further solution of the present invention, the connecting rod 1 and the connecting rod 2 are both in an inclined state.

[0009] As a further solution of the utility model, a sponge is fixedly connected to the top inner wall of the mounting frame.

[0010] As a further solution of the utility model, a water reservoir is provided at the bottom of the frame, and baffles are fixedly connected to positions on both sides of the frame.

[0011] As a further solution of the utility model, two rotation grooves are provided on one side of the frame, and door panels are rotatably connected in the two rotation grooves.

[0012] As a further solution of the utility model, a drainage hole connected to the water reservoir is opened on one side of the frame, and a plug is inserted into the drainage hole.

[0013] The beneficial effects of the utility model are:

[0014] 1. Through the coordinated use of the liquid dispensing tube and the water outlet pipe, the cutting liquid is transported into the liquid dispensing tube, and then sprayed out through the water outlet pipe on the liquid dispensing tube and sprayed onto the cutting line, thereby cooling the cutting line to avoid the cutting line from breaking due to excessive temperature, thereby improving the stability of silicon wafer cutting.

[0015] 2. Through the setting of the driving component, the driving component drives the rotating disk to swing, and the rotating disk drives the liquid distribution pipe to swing, thereby expanding the spraying range of the water outlet pipe and improving the use effect of the liquid distribution mechanism.

[0016] 3. Through the setting of the sponge, after the cutting liquid is sprayed onto the cutting line, the sponge will smooth the cutting liquid on the cutting line, so that the cutting liquid is evenly distributed on the cutting line, thereby improving the spraying effect of the cutting liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural diagram of the silicon wafer cutting and liquid dispensing mechanism proposed by the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the silicon wafer cutting and liquid distribution mechanism proposed by the utility model;

[0019] Figure 3 This is a partial enlarged structural diagram of the silicon wafer cutting and liquid distribution mechanism proposed by the utility model;

[0020] Figure 4 This is a partial cross-sectional structural diagram of the silicon wafer cutting and liquid dispensing mechanism proposed by the utility model;

[0021] Figure 5 This is an enlarged structural diagram of the turntable of the silicon wafer cutting and liquid distribution mechanism proposed by the utility model.

[0022] In the figure: 1. frame; 2. baffle; 3. drain hole; 4. door panel; 5. mounting frame; 6. servo electric cylinder; 7. placement seat; 8. water reservoir; 9. dispensing pipe; 10. connecting rod 1; 11. connecting rod 2; 12. rotating disk; 13. wire roller; 14. cutting wire; 15. sponge; 16. water outlet pipe; 17. T-frame; 18. fixing block; 19. boss screw; 20. guide groove; 21. turntable; 22. threaded hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1-Figure 5 The silicon wafer cutting liquid distribution mechanism comprises a frame 1, a placement seat 7 is arranged in the frame 1, a servo electric cylinder 6 is fixed to the top outer wall of the frame 1 by bolts, one end of the output shaft of the servo electric cylinder 6 passes through the frame 1 and is fixed to a mounting frame 5 by bolts, two wire rollers 13 are rotatably connected in the mounting frame 5, a plurality of cutting wires 14 are wound between the two wire rollers 13, a motor for driving the wire rollers 13 to rotate is fixed to one side of the mounting frame 5 by bolts, two liquid dispensing tubes 9 are rotatably connected in the mounting frame 5, a plurality of water outlet pipes 16 are fixed to the bottom of the two liquid dispensing tubes 9 by bolts, a rotating disk 12 is arranged at one end of the two liquid dispensing tubes 9, and the rotating disk 12 is connected to the coupling by a coupling The device is connected to the dispensing tube 9, and a power component for swinging the rotating disk 12 is provided on one side of the mounting frame 5. The silicon rod is placed on the placement seat 7, and then the servo electric cylinder 6 is extended to push the mounting frame 5 to move downward, so that the cutting line 14 contacts the silicon rod, and then the motor drives the wire roller 13 to rotate, so that the cutting line 14 cuts the silicon rod, and then the pipeline for conveying the cutting liquid is connected to the dispensing tube 9, so that the cutting liquid enters the dispensing tube 9, and the cutting liquid entering the dispensing tube 9 will be sprayed onto the cutting line 14 through the outlet pipe 16, so as to cool the cutting line 14 and prevent the cutting line 14 from breaking due to excessive temperature.

[0025] In the utility model, the power assembly includes a reduction motor, which is fixed to one side of the mounting frame 5 by bolts. One end of the reduction motor output shaft passes through the mounting frame 5 and is fixed with a turntable 21 by bolts. A plurality of threaded holes 22 are provided on one side of the turntable 21, and a boss screw 19 is connected to one of the threaded holes 22. A fixing block 18 is welded to one side of the mounting frame 5. A sliding opening is provided on one side of the fixing block 18, and a T-shaped frame 17 is slidably connected in the sliding opening. A guide groove 20 is provided on one side of the T-shaped frame 17, so that the boss screw 19 can reciprocate up and down along the guide groove 20. A connecting rod 10 is rotatably connected to one end of the T-shaped frame 17, and the connecting rod 10 is rotatably connected to the adjacent rotating disk 12. A connecting rod 2 11 is rotatably connected between the two rotating disks 12, and the connecting rod 10 and The connecting rod 11 is in an inclined state, and the turntable 21 is driven to rotate by the reduction motor. The turntable 21 will drive the boss screw 19 to rotate. The boss screw 19 will reciprocate along the guide groove 20 on the T-frame 17 during the rotation, so that the T-frame 17 will reciprocate along the sliding mouth on the fixed block 18. The T-frame 17 will pull one of the rotating disks 12 to rotate through the connecting rod 10. At the same time, the connecting rod 10 will swing between the T-frame 17 and the rotating disk 12, and one of the rotating disks 12 will drive the other rotating disk 12 to swing through the connecting rod 11. At the same time, the connecting rod 11 will rotate between the two rotating disks 12, and the two rotating disks 12 will respectively drive the two liquid dispensing pipes 9 to swing, thereby expanding the spraying range of the water outlet pipe 16;

[0026] A sponge 15 is bonded to the inner wall of the top of the mounting frame 5, and the sponge 15 is in contact with the cutting line 14. The sponge 15 can smooth the cutting liquid on the cutting line 14 so that the cutting liquid is evenly distributed. A water reservoir 8 is provided at the bottom of the frame 1, and the water reservoir 8 can collect the sprayed cutting liquid. Baffles 2 are fixed by bolts at both sides of the frame 1. Two rotating grooves are provided on one side of the frame 1, and door panels 4 are rotatably connected in the two rotating grooves. A drainage hole 3 connected to the water reservoir 8 is provided on one side of the frame 1, and a plug is inserted in the drainage hole 3. The plug is discharged from the drainage hole 3, and the cutting liquid in the water reservoir 8 will be discharged through the drainage hole 3.

[0027] Working principle: when it is needed, the silicon rod is placed on the placement seat 7, and then the servo electric cylinder 6 is extended to push the mounting frame 5 downward to make the cutting line 14 contact the silicon rod, and then the motor drives the wire roller 13 to rotate, so that the cutting line 14 cuts the silicon rod, and then the pipeline for conveying the cutting liquid is connected to the liquid dispensing tube 9, so that the cutting liquid enters the liquid dispensing tube 9, and the cutting liquid entering the liquid dispensing tube 9 will be sprayed onto the cutting line 14 through the water outlet pipe 16, so as to cool the cutting line 14, avoid the cutting line 14 from breaking due to excessive temperature, and improve the stability of silicon wafer cutting, and at the same time, the reducer motor drives the turntable 21 to rotate, and the turntable 21 will drive the more boss screws 19 rotates, and the shoulder screw 19 reciprocates along the guide groove 20 on the T-frame 17 during the rotation process, so that the T-frame 17 reciprocates along the sliding mouth on the fixed block 18, and the T-frame 17 pulls one of the rotating disks 12 to rotate through the connecting rod 10, and the connecting rod 10 swings between the T-frame 17 and the rotating disk 12, and one of the rotating disks 12 drives the other rotating disk 12 to swing through the connecting rod 2 11, and the connecting rod 2 11 rotates between the two rotating disks 12, and the two rotating disks 12 respectively drive the two liquid dispensing pipes 9 to swing, thereby expanding the spraying range of the water outlet pipe 16 and improving the spraying effect.

[0028] Finally, it should be noted that: for those skilled in the art, they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this utility model shall be included in the protection scope of this utility model.

Claims

1. A silicon wafer cutting and dispensing mechanism, comprising a frame (1), characterized in that: A placement seat (7) is provided in the frame body (1), a servo electric cylinder (6) is fixedly connected to the top outer wall of the frame body (1), one end of the output shaft of the servo electric cylinder (6) passes through the frame body (1) and is fixedly connected to a mounting frame (5), two line rollers (13) are rotatably connected in the mounting frame (5), a plurality of cutting lines (14) are wound between the two line rollers (13), a motor for driving the line rollers (13) to rotate is fixedly connected to one side of the mounting frame (5), two liquid dispensing tubes (9) are rotatably connected in the mounting frame (5), a plurality of water outlet pipes (16) are fixedly connected to the bottom of the two liquid dispensing tubes (9), a rotating disk (12) is provided at one end of the two liquid dispensing tubes (9), the rotating disk (12) is connected to the liquid dispensing tube (9) via a coupling, and a power component for causing the rotating disk (12) to swing is provided on one side of the mounting frame (5).

2. The silicon wafer cutting liquid distribution mechanism according to claim 1, characterized in that: The power assembly comprises a reduction motor, which is fixedly connected to one side of a mounting frame (5); one end of the output shaft of the reduction motor passes through the mounting frame (5) and is fixedly connected to a turntable (21); a plurality of threaded holes (22) are provided on one side of the turntable (21); a shoulder screw (19) is internally threadedly connected to one of the threaded holes (22); a fixing block (18) is fixedly connected to one side of the mounting frame (5); a sliding opening is provided on one side of the fixing block (18); a T-shaped frame (17) is slidably connected in the sliding opening; a guide groove (20) is provided on one side of the T-shaped frame (17) so that the shoulder screw (19) can reciprocate up and down along the guide groove (20); one end of the T-shaped frame (17) is rotatably connected to a connecting rod 1 (10); and the connecting rod 1 (10) is rotatably connected to the adjacent rotating disk (12); a connecting rod 2 (11) is rotatably connected between the two rotating disks (12).

3. The silicon wafer cutting liquid distribution mechanism according to claim 2, characterized in that: The connecting rod 1 (10) and the connecting rod 2 (11) are both in an inclined state.

4. The silicon wafer cutting liquid distribution mechanism according to claim 1, characterized in that: A sponge (15) is fixedly connected to the inner wall of the top of the mounting frame (5).

5. The silicon wafer cutting liquid distribution mechanism according to claim 1, characterized in that: A water reservoir (8) is provided at the bottom of the frame (1), and baffles (2) are fixedly connected to positions on both sides of the frame (1).

6. The silicon wafer cutting liquid distribution mechanism according to claim 5, characterized in that: Two rotation grooves are provided on one side of the frame body (1), and door panels (4) are rotationally connected in the two rotation grooves.

7. The silicon wafer cutting and distributing liquid mechanism according to claim 6, characterized in that: A drainage hole (3) connected to the water reservoir (8) is provided on one side of the frame (1), and a plug is inserted into the drainage hole (3).

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