Semiconductor component feeding and conveying mechanism

Abstract

The utility model discloses a semiconductor component feeding and conveying mechanism, which relates to the technical field of semiconductor components and comprises a control box, a bottom frame, a tray and a conveying device, the conveying device is arranged in the bottom frame, side guard plates are fixedly connected to two inner sides of the bottom frame and are positioned on two sides of the conveying device, and the side guard plates are arranged on the bottom frame. The stacked trays are subjected to first-step calibration through the side protection plates on the two sides, the trays with large position deviation are corrected, the two sets of pushing frames move close to the middle, the two sides where the length of the multiple sets of trays is located are pushed to be aligned, and after all the trays pass through the pushing frames, the trays are pushed to be aligned with the pushing frames. The two sets of pushing frames are continuously pushed by the corresponding third electric cylinders to get close, the end plates block the sides where the width of the multiple sets of trays is located and push the multiple sets of trays to enable the other sides where the width of the multiple sets of trays is located to abut against the pushing frames, and therefore the multiple sets of stacked trays are aligned from the periphery, it is guaranteed that the stacked trays are neat and do not topple over, and follow-up transfer and storage are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor components, in particular to a feeding and conveying mechanism for semiconductor components. Background Art

[0002] Semiconductor components refer to electronic devices made of semiconductor materials, including various transistors, diodes, integrated circuits, optoelectronic devices, etc. Semiconductor components are one of the most commonly used components in modern electronic devices.

[0003] However, in the prior art, during the semiconductor production process, semiconductor components usually need to be conveyed with the help of trays. The tray conveying system can effectively protect and organize semiconductor components, and at the same time, it also helps to improve production efficiency and reduce the risk of damage. In order to improve the conveying efficiency, multiple trays are often stacked together for conveying, but it is easy to have position deviation when multiple trays are stacked, and there is a risk of tipping during the conveying process. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problem that there is an easy position deviation when multiple trays of semiconductor components are stacked in the prior art, and there is a risk of tipping during the conveying process, and to propose a feeding and conveying mechanism for semiconductor components.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: A feeding and conveying mechanism for semiconductor components, including a control box, a chassis, a tray and a conveying device. The conveying device is arranged inside the chassis. Side guards are fixedly connected to both inner sides of the chassis and on both sides of the conveying device. A lifting mechanism is fixedly connected to the inside of the chassis and at the end of the conveying device. An end stop mechanism is fixedly connected to the inside of the chassis and at the end of the conveying device. A side push mechanism is fixedly connected to the inside of the chassis and at the end of the side guard. The side push mechanism includes a C-shaped plate, a third electric cylinder, a connecting plate and a pushing frame. The pushing frame penetrates through the C-shaped plate and is fixedly connected to one side of the connecting plate. The movable end of the third electric cylinder is fixedly connected to the other side of the connecting plate.

[0006] Preferably, both the C-shaped plate and the third electric cylinder are fixedly connected to the inner side of the chassis.

[0007] Preferably, the end stop mechanism includes an end plate, a first electric cylinder and side support plates. Two groups of side support plates are respectively fixedly connected to the two inner walls of the chassis. Two groups of first electric cylinders are respectively fixedly installed at the ends of the two groups of side support plates.

[0008] Preferably, the end plate is fixedly connected to the movable ends of the two groups of first electric cylinders, and the end plate is located above the conveying device.

[0009] Preferably, a mounting plate is fixedly connected to the inner side of the base frame and below the side support plate, and sliding columns are fixedly connected to the lower corners of the mounting plate.

[0010] Preferably, a partition is slidably connected to the outer side of the sliding column, and a top rod is fixedly connected to the upper corner of the partition. The top rod passes through the mounting plate, and the upper sides of the two groups of top rods located on the same side are fixedly connected to the top plate.

[0011] Preferably, a second electric cylinder is fixedly connected to the lower side of the partition, a bottom plate is fixedly connected to the lower side of the second electric cylinder, and the bottom plate is fixedly connected to the lower side of the sliding column.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, the first step of calibration of the stacked pallets is performed by the side guard plates on both sides, and the pallets with large position offset are corrected, and the two groups of push frames move toward the middle to push and align the two sides where the lengths of the multiple groups of pallets are located. When all the pallets have passed the push frames, the two groups of push frames continue to be pushed and approached by the corresponding third electric cylinders, and the end plates block the side where the widths of the multiple groups of pallets are located, and push the multiple groups of pallets so that the other side where the widths are located is against the push frames. Thus, the stacked multiple groups of pallets are aligned from all sides to ensure that the stacked pallets are neat and do not tip over, which is convenient for subsequent transportation and storage.

[0014] 2. In the utility model, after aligning multiple groups of pallets, the second electric cylinder installed in the frame composed of the bottom plate, the sliding column and the mounting plate is started, and its movable end extends upward to push the partition plate to move upward along the sliding column, thereby driving the top rod. The transmission device is a double conveyor belt distributed at intervals, and the top plate passes through the intervals to lift up the stacked multiple groups of pallets for subsequent processing, which is convenient for automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional structural schematic diagram of a semiconductor component feeding and conveying mechanism is proposed for the utility model;

[0016] Figure 2 The utility model provides a three-dimensional structural schematic diagram of the interior of a semiconductor component feeding and conveying mechanism;

[0017] Figure 3 The utility model provides a first three-dimensional structural schematic diagram of a part of a semiconductor component feeding and conveying mechanism;

[0018] Figure 4 The utility model provides a second three-dimensional structural schematic diagram of a part of a semiconductor component feeding and conveying mechanism.

[0019] Legend: 1. Control box; 2. Underframe; 3. Tray; 4. Side guard plate; 5. Conveyor; 6. End stop mechanism; 61. End plate; 62. First electric cylinder; 63. Side support plate; 7. Lifting mechanism; 71. Bottom plate; 72. Slide post; 73. Second electric cylinder; 74. Partition board; 75. Jack; 76. Mounting plate; 77. Top plate; 8. Side push mechanism; 81. C-shaped plate; 82. Third electric cylinder; 83. Connecting plate; 84. Pushing frame. Detailed implementation

[0020] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0021] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the present invention is not limited by the specific embodiments disclosed in the following specification.

[0022] Embodiment 1

[0023] As Figure 1-4 shown, the present invention provides a feeding and conveying mechanism for semiconductor components, including a control box 1, an underframe 2, a tray 3 and a conveyor 5. The conveyor 5 is arranged inside the underframe 2. Side guard plates 4 are fixedly connected to both inner sides of the underframe 2 and on both sides of the conveyor 5. A lifting mechanism 7 is fixedly connected to the inside of the underframe 2 and at the end of the conveyor 5. An end stop mechanism 6 is fixedly connected to the inside of the underframe 2 and at the end of the conveyor 5. A side push mechanism 8 is fixedly connected to the inside of the underframe 2 and at the end of the side guard plate 4. The side push mechanism 8 includes a C-shaped plate 81, a third electric cylinder 82, a connecting plate 83 and a pushing frame 84. The pushing frame 84 passes through the C-shaped plate 81 and is fixedly connected to one side of the connecting plate 83. The movable end of the third electric cylinder 82 is fixedly connected to the other side of the connecting plate 83. The C-shaped plate 81 and the third electric cylinder 82 are both fixedly connected to the inner side of the underframe 2. The end stop mechanism 6 includes an end plate 61, a first electric cylinder 62 and a side support plate 63. Two groups of side support plates 63 are respectively fixedly connected to the two inner walls of the underframe 2. Two groups of first electric cylinders 62 are respectively fixedly installed at the ends of the two groups of side support plates 63. The end plate 61 is fixedly connected to the movable ends of the two groups of first electric cylinders 62. The end plate 61 is located above the conveyor 5.

[0024] The specific settings and functions of this embodiment are described below: By placing semiconductor devices in the tray 3, multiple trays 3 are stacked into groups and placed into one end of the conveying device 5. The conveying device 5 drives the tray 3 to move in the chassis 2. The side guard plates 4 on both sides perform the first step of calibration on the stacked trays 3, correcting the trays 3 with large position offsets, ensuring that the stacked trays 3 do not topple during the process of the conveying device 5 transporting the trays 3. When approaching the end of the side guard plate 4, the third electric cylinder 82 is controlled to start. The movable end of the third electric cylinder 82 pushes the connecting plate 83, thereby pushing the pushing frame 84 to slide inside the C-shaped plate 81. Then, the two sets of pushing frames 84 move closer to the middle, pushing and aligning the two sides where the lengths of multiple groups of trays 3 are located. After all the trays 3 pass through the pushing frames 84, the two sets of pushing frames 84 continue to be pushed closer by the corresponding third electric cylinders 82. The first electric cylinder 62 is controlled to start, and its movable end pushes the end plate 61. The end plate 61 blocks one side where the widths of multiple groups of trays 3 are located and pushes the multiple groups of trays 3, making the other side where their widths are located abut against the pushing frame 84. Thus, the stacked multiple groups of trays 3 are aligned from all around, ensuring that the stacked trays 3 are neat and do not topple, facilitating subsequent transportation and storage.

[0025] Embodiment Two

[0026] As Figure 2-4 shown, an installation plate 76 is fixedly connected to the inner side of the chassis 2 and below the side support plate 63. The lower side corners of the installation plate 76 are fixedly connected with sliding columns 72. The outer sides of the sliding columns 72 are slidably connected with a partition plate 74. The upper side corners of the partition plate 74 are fixedly connected with ejector rods 75. The ejector rods 75 penetrate through the installation plate 76. The upper sides of the two sets of ejector rods 75 on the same side are fixedly connected with a top plate 77. The lower side of the partition plate 74 is fixedly connected with a second electric cylinder 73. The lower side of the second electric cylinder 73 is fixedly connected with a bottom plate 71. The bottom plate 71 is fixedly connected to the lower side of the sliding column 72.

[0027] The effect achieved by the entire embodiment is that after aligning multiple groups of trays 3, the second electric cylinder 73 installed in the frame composed of the bottom plate 71, the sliding column 72, and the installation plate 76 starts, and its movable end extends upward, pushing the partition plate 74 to move upward along the sliding column 72, thereby driving the ejector rods 75. The conveying device 5 has double conveyor belts distributed at intervals, and the top plate 77 passes through the intervals, lifting the stacked multiple groups of trays 3 for subsequent processing, facilitating automated production.

[0028] Usage method and working principle of the device: When using the semiconductor device feeding and conveying mechanism, place the semiconductor device on the tray 3. After stacking multiple trays 3 into a group, place them from one end of the conveying device 5. The conveying device 5 drives the tray 3 to move in the chassis 2. The side guard plates 4 on both sides perform the first step of calibration on the stacked trays 3, and correct the trays 3 with large position offsets. When approaching the end of the side guard plate 4, the third electric cylinder 82 is controlled to start. The movable end of the third electric cylinder 82 pushes the connecting plate 83, thereby pushing the pushing frame 84 to slide inside the U-shaped plate 81. Then, the two groups of pushing frames 84 move closer to the middle, and push and align the two sides where the lengths of multiple groups of trays 3 are located. After all the trays 3 pass through the pushing frames 84, the two groups of pushing frames 84 continue to be pushed by the corresponding third electric cylinders 82 and move closer. The first electric cylinder 62 is controlled to start, and its movable end pushes the end plate 61. The end plate 61 blocks one side where the widths of multiple groups of trays 3 are located, and pushes multiple groups of trays 3, so that the other side where the widths are located abuts against the pushing frame 84. Thus, the stacked multiple groups of trays 3 are aligned from all around. Then, the second electric cylinder 73 installed in the frame composed of the bottom plate 71, the sliding column 72 and the mounting plate 76 is started, and its movable end extends upward, pushing the partition plate 74 to move upward along the sliding column 72, thereby driving the ejector rod 75 to jack up the stacked multiple groups of trays 3 for subsequent processing.

[0029] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor component feeding and conveying mechanism, comprising a control box (1), a base frame (2), a tray (3) and a conveying device (5), characterized in that: The conveying device (5) is arranged inside the chassis (2). On both inner sides of the chassis (2) and on both sides of the conveying device (5), side guard plates (4) are fixedly connected. Inside the chassis (2) and at the end of the conveying device (5), a lifting mechanism (7) is fixedly connected. Inside the chassis (2) and at the end of the conveying device (5), an end stop mechanism (6) is fixedly connected. Inside the chassis (2) and at the end of the side guard plate (4), a side pushing mechanism (8) is fixedly connected. The side pushing mechanism (8) includes a C-shaped plate (81), a third electric cylinder (82), a connecting plate (83), and a pushing frame (84). The pushing frame (84) penetrates through the C-shaped plate (81) and is fixedly connected to one side of the connecting plate (83). The movable end of the third electric cylinder (82) is fixedly connected to the other side of the connecting plate (83).

2. A semiconductor component feeding and conveying mechanism according to claim 1, characterized in that: Both the C-shaped plate (81) and the third electric cylinder (82) are fixedly connected to the inner side of the chassis (2).

3. A semiconductor component feeding and conveying mechanism according to claim 2, characterized in that: The end stop mechanism (6) includes an end plate (61), a first electric cylinder (62), and side support plates (63). Two groups of the side support plates (63) are respectively fixedly connected to the two inner walls of the chassis (2). Two groups of the first electric cylinders (62) are respectively fixedly installed at the ends of the two groups of the side support plates (63).

4. A semiconductor component feeding and conveying mechanism according to claim 3, characterized in that: The end plate (61) is fixedly connected to the movable ends of the two groups of the first electric cylinders (62). The end plate (61) is located above the conveying device (5).

5. A semiconductor component feeding and conveying mechanism according to claim 4, characterized in that: An installation plate (76) is fixedly connected to the inner side of the chassis (2) and below the side support plates (63). At the lower side corners of the installation plate (76), sliding columns (72) are fixedly connected respectively.

6. A semiconductor component feeding and conveying mechanism according to claim 5, characterized in that: A partition plate (74) is slidably connected to the outer sides of the sliding columns (72). At the upper side corners of the partition plate (74), ejector rods (75) are fixedly connected respectively. The ejector rods (75) penetrate through the installation plate (76). On the upper sides of the two groups of the ejector rods (75) on the same side, a top plate (77) is fixedly connected.

7. A semiconductor component feeding and conveying mechanism according to claim 6, characterized in that: A second electric cylinder (73) is fixedly connected to the lower side of the partition plate (74). A bottom plate (71) is fixedly connected to the lower side of the second electric cylinder (73). The bottom plate (71) is fixedly connected to the lower sides of the sliding columns (72).

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