Chip temperature measurement system for ADAS product
By setting a thermistor probe between the chip and the metal thermal conductor in automotive ADAS products, the problem of the small heat dissipation gap of the chip is solved, and high-precision chip temperature detection is achieved, meeting the high-precision and high reliability requirements of ADAS products.
Patent Information
- Application Number
- CN202421842510.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-31
AI Technical Summary
In automotive ADAS products, the chip heat dissipation gap is small, which makes it difficult to accurately detect the chip temperature. The measurement accuracy of traditional temperature monitoring methods is insufficient, which cannot meet the temperature measurement requirements of high accuracy and high reliability.
By setting several thermistor probes between the chip and the metal thermal conductor, the upper computer detects the resistance signal of the probe, converts it into a digital signal, and obtains the temperature of the chip based on the comparison data, displays and processes it. This solution only requires a wire to connect the probe and the data processing device, and does not need to occupy a large space and is suitable for narrow heat dissipation gaps.
It realizes high-precision detection of chip temperature, avoids measurement errors in traditional methods, and meets the temperature measurement requirements for high accuracy and high reliability in ADAS products.
Smart Images
Figure CN222850181U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of temperature measurement, in particular to a chip temperature measurement system for ADAS products. Background Art
[0002] In electronic devices, integrated chips generate heat during operation. If the heat cannot be dissipated in time, the chip performance may be degraded or even damaged.
[0003] At present, in some automotive ADAS products, the bosses of the metal shell and the heat dissipation glue are generally used to conduct heat to the high-heat chip. However, the chip is in a structure with a narrow gap and heats up quickly, so the chip temperature needs to be monitored. Due to the limitations of probe size, line length and measurement environment, traditional temperature monitoring methods can only measure the temperature of the ambient space around the chip, and the measurement accuracy is insufficient. Therefore, it cannot meet the narrow space in ADAS products and the temperature measurement requirements that require high precision and high reliability. Summary of the invention
[0004] Purpose of the utility model: In order to overcome the defects of the prior art, the utility model provides a chip temperature measurement system for ADAS products, which solves the problem that it is inconvenient to detect the temperature of the chip in the narrow space of the heat dissipation gap of the ADAS product.
[0005] The technical solution of the utility model is: a chip temperature measurement system for ADAS products, comprising a circuit board with a chip, a mounting shell, a metal heat conductor for heat dissipation of the chip, and a host computer for processing and displaying data, a heat dissipation gap is provided between the chip and the metal heat conductor, a plurality of thermistor probes are arranged in the heat dissipation gap, and each of the thermistor probes is electrically connected to the host computer.
[0006] By adopting the above technical scheme, the temperature of the chip is detected by setting a thermistor probe between the chip and the metal heat conductor. The resistance of the thermistor probe changes with the chip temperature. The resistance of the thermistor probe is detected by the host computer, and the resistance signal is converted into a digital signal. The temperature of the chip can be obtained and displayed according to the comparison data of the temperature and resistance corresponding to the thermistor probe. In addition, only one wire needs to be set as a connecting wire to connect the thermistor probe and the data processing device to measure the resistance of the thermistor probe. It does not need to occupy a large space and can be set in an environment with a narrow heat dissipation gap.
[0007] A further configuration of the utility model is as follows: the heat dissipation gap is coated with heat dissipation glue, and the thermistor probe is arranged in the heat dissipation glue.
[0008] With the above further configuration, heat dissipation glue is applied to the heat dissipation gap, so that the chip and the metal heat conductive member are connected through the heat dissipation glue, so that the heat conduction efficiency is higher and the heat dissipation of the chip is better.
[0009] A further configuration of the utility model is that the connection line between the thermistor probe and the host computer is fixed on the mounting shell by means of temperature-resistant glue.
[0010] With the above further configuration, the data of the thermistor probe is transmitted through a connecting wire, which is fixed with a temperature-resistant glue to prevent the glue fixing the connecting wire from melting in a high temperature environment, causing the connecting wire to shake or even fall off.
[0011] The utility model is further configured as follows: a cable harness hole is provided on the installation shell, and the connecting wire passes through the cable harness hole and then passes out of the installation shell to be connected to the host computer.
[0012] By further adopting the above arrangement, each connecting wire is passed through the mounting shell through the wiring hole to connect with the host computer outside the mounting shell, and the host computer is placed outside the mounting shell, which can avoid the high temperature environment in the mounting shell from affecting the host computer and make the temperature measurement more accurate.
[0013] A further configuration of the utility model is that the heat dissipation gap size is larger than the thermistor probe width by 0-0.1 mm.
[0014] With the above further configuration, the smaller the heat dissipation gap is, the closer the distance between the metal heat conductor and the chip is, so that the heat conduction efficiency is higher, the heat dissipation effect is better, and the closer the thermistor probe is to the chip, the more accurate the measured temperature is. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of a specific embodiment of the utility model;
[0016] Figure 2 It is a schematic diagram of the top view of a specific embodiment of the utility model;
[0017] Figure 3 for Figure 2 Schematic diagram of the AA section structure;
[0018] Figure 4 for Figure 4 A partial enlarged view of point B in the middle.
[0019] In the figure: 1. Circuit board; 2. Mounting shell; 3. Thermistor probe; 5. Host computer; 6. Metal thermal conductor; 61. Metal boss; 7. Chip; 8. Heat dissipation gap; 9. Heat dissipation glue; 10. Connecting wire; 11. Wire harness hole. DETAILED DESCRIPTION
[0020] The technical scheme in this embodiment will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] It should be noted that in the description of the present invention, all directional indications (such as up, down, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0022] In addition, the descriptions of "first", "second", etc. in the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. In the description of the present invention, the meaning of "several" is at least two, such as two, three, etc., unless otherwise clearly and specifically limited.
[0023] like Figure 1-4 As shown, a chip temperature measurement system for ADAS products includes a mounting shell 2, a circuit board 1 is fixed on the mounting shell 2, a chip 7 is mounted on the circuit board 1, a metal heat conductor 6 for heat dissipation of the chip 7 is mounted on the mounting shell 2, a heat sink can be connected to the metal heat conductor 6, and a fan blowing toward the heat sink is provided to achieve heat dissipation of the chip 7.
[0024] The metal heat conducting member 6 includes a metal boss 61, and a heat dissipation gap 8 is provided between the metal boss 61 and the chip 7. The heat dissipation gap 8 is filled with heat dissipation glue to assist in heat conduction, so that the chip 7 and the metal heat conducting member 6 are connected by the heat dissipation glue 9, so that the heat conduction efficiency is higher and the heat dissipation of the chip 7 is better;
[0025] A plurality of thermistor probes 3 may be provided in the heat dissipation adhesive 9 to detect the temperature of the chip 7. The thermistor probe 3 includes a thermistor, and its resistance value changes with the ambient temperature. The resistance and temperature range of a common thermistor may be -20°F to 500°F, and its corresponding resistance value may be 4.5KΩ to 0.05KΩ. The corresponding thermistor probe 3 may be selected according to the temperature environment.
[0026] The heat dissipation adhesive 9 is in direct contact with the chip 7, and the temperature of the chip 7 is directly transferred to the heat dissipation adhesive 9. The temperature of the heat dissipation adhesive 9 is almost the same as the temperature of the chip 7. The thermistor probe 3 is in the heat dissipation adhesive 9. The heat of the chip 7 is directly transferred to the thermistor probe 3 in the heat dissipation adhesive 9. Therefore, the resistance value of the thermistor probe 3 changes with the temperature of the chip 7. The measured temperature is the temperature in the heat dissipation adhesive 9, which is almost the same as the temperature of the chip 7 body, rather than the temperature of the air around the chip 7. The measurement error is smaller and the result is more accurate.
[0027] The present embodiment also includes a host computer 5, which is connected to each thermistor probe 3 via a connecting line 10. The connecting line 10 is a conductor. The host computer 5 can obtain the resistance value of each thermistor probe 3 through each connecting line 10, process and convert it into a digital signal, and obtain and display temperature data based on the resistance and temperature standard data corresponding to the thermistor probe 3.
[0028] Each connecting wire 10 is fixed to the mounting shell 2 by heat-resistant glue. The mounting shell 2 is provided with a wire harness hole 11 connecting the inside and outside of the mounting shell 2. Each connecting wire 10 is led to the outside through the wire harness hole 11 and electrically connected to the host computer 5. Placing the host computer 5 outside the mounting shell can avoid the high temperature environment inside the mounting shell from affecting the host computer 5, making the temperature measurement more accurate.
[0029] Furthermore, the connection line 10 between the thermistor probe 3 and the host computer 5 is fixed to the mounting shell 2 by a temperature-resistant glue to prevent the glue fixing the connection line 10 from melting in a high temperature environment, causing the connection line 10 to shake or even fall off.
[0030] In this embodiment, the size of the heat dissipation gap 8 is larger than the width of the thermistor probe 3 0~0.1mm. The thermistor probe 3 used in this embodiment can select a miniature thermistor probe with a width of 0.3mm. The width of the heat dissipation gap 8 is set to 0.3~0.4mm, which is larger than the width of the thermistor probe 3 0~0.1mm. The smaller the heat dissipation gap 8 is, the closer the distance between the metal heat conductor 6 and the chip 7 is, so that the heat conduction efficiency is higher and the heat dissipation effect is better. The closer the thermistor probe 3 is to the chip, the more accurate the measured temperature is. The size of the heat dissipation gap 8 is preferably 0.35mm to avoid the situation where the thermistor probe 3 cannot be installed due to the error of the metal heat conductor 6.
[0031] When multiple chips 7 are installed on the circuit board 1, metal heat conductors 6 can be set accordingly, so that there is a heat dissipation gap 8 between each chip 7 and the metal heat conductor 6. Each heat dissipation gap 8 can be provided with a thermistor probe 3 to detect the temperature, and connected to the host computer 5 using connecting wires 10 respectively, so that multiple chips can be detected simultaneously, and the test efficiency is higher.
[0032] Specifically, the temperature of the chip 7 is detected by setting a thermistor probe 3 between the chip 7 and the metal heat conductor 6. Different numbers of thermistor probes 3 can be set according to the number and position of the chips 7 to meet the temperature measurement requirements.
[0033] Each thermistor probe 3 is electrically connected to the host computer 5 through a connecting line 10. The host computer 5 energizes the thermistor probe 3, and the resistance data is measured and processed by the host computer 5. The host computer 5 obtains the temperature data based on the temperature and resistance standard data of the thermistor probe 3 and displays it.
[0034] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that technical personnel in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
Claims
1. A chip temperature measurement system for an ADAS product, comprising a circuit board (1) with a chip (7), a mounting shell (2), and a metal heat conductor (6) for dissipating heat from the chip (7), characterized in that: It also includes a host computer (5) for processing and displaying data, a heat dissipation gap (8) is provided between the chip (7) and the metal heat conductor (6), a plurality of thermistor probes (3) are provided in the heat dissipation gap (8), and each of the thermistor probes (3) is electrically connected to the host computer (5).
2. A chip temperature measurement system for ADAS products according to claim 1, characterized in that: The heat dissipation gap (8) is coated with heat dissipation glue (9), and the thermistor probe (3) is arranged in the heat dissipation glue (9).
3. A chip temperature measurement system for ADAS products according to claim 1, characterized in that: The size of the heat dissipation gap (8) is larger than the width of the thermistor probe (3) by 0-0.1 mm.
4. The chip temperature measurement system for ADAS products according to claim 1, characterized in that: The connection line (10) between the thermistor probe (3) and the host computer (5) is fixed to the mounting shell (2) by means of temperature-resistant glue.
5. A chip temperature measurement system for ADAS products according to claim 4, characterized in that: The mounting shell (2) is provided with a wire harness hole (11), and the connecting wire (10) passes through the wire harness hole (11) and out of the mounting shell (2) to be connected to the host computer (5).