Dimming device, dimming device and dimming product

Abstract

The utility model relates to the technical field of dimming, and provides a dimming device, a dimming device and a dimming product, the dimming device comprises a dimming assembly, a first adhesive layer is arranged on the edge part of the dimming assembly, and the first adhesive layer is provided with a first surface close to a first conductive substrate; a part of the first adhesive layer is adhered to the peripheral area of the first conductive substrate through the first surface; the second adhesive layer is arranged on the edge part of the dimming assembly, the second adhesive layer is provided with a second surface close to the second conductive substrate, and part of the second adhesive layer is bonded to the peripheral area of the second conductive substrate through the second surface; in addition, part of the first adhesive layer and part of the second adhesive layer are bonded through contact of the first surface and the second surface. The first adhesive layer and the second adhesive layer wrap the side edge of the dimming assembly, so that the difficulty that water vapor in the environment enters the dimming device is increased.

Description

Technical Field

[0001] The present application relates to the field of dimming technology, and in particular provides a dimming device, a dimming apparatus and a dimming product. Background Art

[0002] With the development of technology, people have an increasing demand for regulating light and heat, and dimming technology has also attracted more and more attention. Specifically, dimming technology refers to the technology in which the optical properties of dimming materials change under the influence of external electric fields, external light intensity and other external factors. Under normal circumstances, the dimming device containing the dimming material will show reversible changes in color and transparency in appearance. In recent years, dimming devices have been widely used in energy-saving windows, car rearview mirrors, display devices, mobile terminals and other fields, and have good market application prospects. However, for some dimming devices, the dimming materials they contain are very sensitive to water vapor in the environment. After the dimming materials come into contact with water vapor, they are prone to discoloration and failure, which in turn accelerates the damage of the dimming device and reduces its service life.

[0003] In the prior art, the side edges of the dimming device are usually in direct contact with the external environment. At this time, water vapor can easily come into contact with the dimming material therein through the side edges of the dimming device, thereby causing the dimming material to discolor and fail, accelerating the damage of the dimming device and reducing its service life. Utility Model Content

[0004] To this end, the present application provides a dimming device, a dimming apparatus and a dimming product including the dimming device, aiming to solve the problem that water vapor can easily come into contact with the dimming material therein through the side edges of the dimming device, causing the dimming material to discolor and fail, thereby accelerating the damage of the dimming device and reducing its service life.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, an embodiment of the present application provides a dimming device, including a dimming component, the dimming component including a first conductive substrate, a dimming medium layer, and a second conductive substrate stacked in sequence; a first adhesive layer, the first adhesive layer is arranged at an edge portion of the dimming component, and the first adhesive layer has a first surface close to the first conductive substrate, and a portion of the first adhesive layer is bonded to a peripheral area of ​​the first conductive substrate through the first surface; a second adhesive layer, the second adhesive layer is arranged at an edge portion of the dimming component, and the second adhesive layer has a second surface close to the second conductive substrate, and a portion of the second adhesive layer is bonded to a peripheral area of ​​the second conductive substrate through the second surface; wherein a portion of the first adhesive layer and a portion of the second adhesive layer are also bonded through contact between the first surface and the second surface.

[0007] In some embodiments, the dimming device further includes a first protective layer disposed on a side of the first adhesive layer away from the first conductive substrate; and / or a second protective layer disposed on a side of the second adhesive layer away from the second conductive substrate.

[0008] In some embodiments, the first adhesive layer and / or the second adhesive layer is a waterproof adhesive layer.

[0009] In some embodiments, a water-absorbing substance is disposed in the waterproof adhesive layer.

[0010] In some embodiments, a first water and oxygen barrier layer is disposed on a side of the first protective layer away from the first adhesive layer, and / or a second water and oxygen barrier layer is disposed on a side of the second protective layer away from the second adhesive layer.

[0011] In some embodiments, in the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0<X≤30mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer, and the second conductive substrate;

[0012] In some embodiments, in the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0.2 mm ≤ X ≤ 5 mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer, and the second conductive substrate;

[0013] In some embodiments, in the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0.5mm≤X≤3mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer, and the second conductive substrate.

[0014] In some embodiments, the first adhesive layer includes at least two first sub-adhesive layers, which are interconnected to form the first adhesive layer; and / or the second adhesive layer includes at least two second sub-adhesive layers, which are interconnected to form the second adhesive layer.

[0015] In some embodiments, a first groove and a second groove are further provided at the edge portion of the dimming component, the first groove passes through the first conductive substrate and the dimming medium layer so that a portion of the first adhesive layer is bonded to a side of the second conductive substrate close to the dimming medium layer, and the second groove passes through the second conductive substrate and the dimming medium layer so that a portion of the second adhesive layer is bonded to a side of the first conductive substrate close to the dimming medium layer.

[0016] In some embodiments, the dimming device also includes a first bus bar and a second bus bar, at least a portion of the first bus bar is arranged on a side of the second conductive substrate close to the dimming medium layer through a first groove, at least a portion of the second bus bar is arranged on a side of the first conductive substrate close to the dimming medium layer through a second groove, and the first glue layer covers the first bus bar, and the second glue layer covers the second bus bar.

[0017] In some embodiments, the first bus bar portion is arranged on a side of the first conductive substrate away from the dimming medium layer, the first adhesive layer includes at least two first sub-adhesive layers, at least two first sub-adhesive layers are interconnected to form the first adhesive layer, and the connection between at least two first sub-adhesive layers is staggered with the first bus bar; and / or, the second bus bar portion is arranged on a side of the second conductive substrate away from the dimming medium layer, the second adhesive layer includes at least two second sub-adhesive layers, at least two second sub-adhesive layers are interconnected to form the second adhesive layer, and the connection between at least two second sub-adhesive layers is staggered with the second bus bar.

[0018] In some embodiments, the first adhesive layer includes at least one arc segment, and / or the second adhesive layer includes at least one arc segment.

[0019] In some embodiments, the minimum radius of the arc segment is R, and the value range of R is R≥200 mm.

[0020] In some embodiments, the first conductive substrate includes a first substrate layer and a first conductive layer, the second conductive substrate includes a second substrate layer and a second conductive layer, a first etching groove is arranged on the peripheral side of the first groove, a second etching groove is arranged on the peripheral side of the second groove, the first etching groove at least penetrates the first conductive layer, and the second etching groove at least penetrates the second conductive layer.

[0021] In some embodiments, the first glue layer covers the first etched groove, and the second glue layer covers the second etched groove.

[0022] In the second aspect, the present embodiment provides a dimming device, comprising a first substrate layer, a first adhesive layer, a dimming device, a second adhesive layer and a second substrate layer stacked in sequence, a seal is provided between the first substrate layer and the second substrate layer, and the seal is located on the peripheral side of the dimming device.

[0023] In a third aspect, an embodiment of the present application provides a dimming product, including a dimming device or a dimming apparatus, wherein the dimming product includes any one of a vehicle, a curtain wall, an electronic device, and glasses.

[0024] The beneficial effect of the present application is that by setting a first adhesive layer and a second adhesive layer bonded to each other, the first adhesive layer and the second adhesive layer can form a whole that can cover the side edges of the dimming component formed by the first conductive substrate, the dimming medium layer, and the second conductive substrate, so that the side edges of the dimming medium layer are not directly exposed to the environment, which increases the difficulty of water vapor in the environment contacting the dimming material in the dimming medium layer, and improves the service life of the dimming device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the structure of a dimming device provided in one embodiment of the present application;

[0027] Figure 2 for Figure 1 AA section view in;

[0028] Figure 3 for Figure 1 BB section view in;

[0029] Figure 4 for Figure 1 CC section view in;

[0030] Figure 5 A schematic diagram of the BB cross-sectional structure of a dimming device provided in another embodiment of the present application;

[0031] Figure 6 A schematic diagram of the BB cross-sectional structure of a dimming device provided in another embodiment of the present application;

[0032] Figure 7 A schematic diagram of the BB cross-sectional structure of a dimming device provided in another embodiment of the present application;

[0033] Figure 8 A CC cross-sectional structural diagram of a dimming device provided in another embodiment of the present application;

[0034] Fig. 9 A schematic diagram of the BB cross-sectional structure of a dimming device provided in another embodiment of the present application;

[0035] Fig.10 A schematic diagram of the BB cross-sectional structure of a dimming device provided in another embodiment of the present application;

[0036] Fig.11 A schematic diagram of the structure of a dimming device provided in another embodiment of the present application;

[0037] Fig.12 A schematic diagram of the structure of a dimming device provided in one embodiment of the present application;

[0038] Fig.13 A schematic structural diagram of a dimming device provided in another embodiment of the present application.

[0039] Description of reference numerals:

[0040] 100-dimming device; 110-first conductive substrate; 111-first substrate layer; 112-first conductive layer; 120-dimming medium layer; 130-second conductive substrate; 131-second substrate layer; 132-second conductive layer; 140-first adhesive layer; 150-second adhesive layer; 160-first bus bar; 170-second bus bar; 180-first etching groove; 190-second etching groove; 141-first protective layer; 142-first water and oxygen barrier layer; 1 51-second protective layer; 152-second water and oxygen barrier layer; 140a-first sub-glue layer; 150a-second sub-glue layer; 140b-first connecting piece; 150b-second connecting piece; 200-dimming device; 210-first substrate layer; 220-first adhesive layer; 230-second substrate layer; 240-second adhesive layer; 250-sealing piece; 310-first groove; 320-second groove; 400-arc segment; M-first direction; N-second direction. DETAILED DESCRIPTION

[0041] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0042] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0046] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, in some embodiments of the present application, the dimming device 100 includes a dimming component, the dimming component includes a first conductive substrate 110, a dimming medium layer 120, and a second conductive substrate 130 which are stacked in sequence; a first adhesive layer 140, the first adhesive layer 140 is arranged at an edge portion of the dimming component, and the first adhesive layer 140 has a first surface close to the first conductive substrate 110, and a portion of the first adhesive layer 140 is bonded to a peripheral area of ​​the first conductive substrate 110 through the first surface; a second adhesive layer 150, the second adhesive layer 150 is arranged at an edge portion of the dimming component, and the second adhesive layer 150 has a second surface close to the second conductive substrate 130, and a portion of the second adhesive layer 150 is bonded to a peripheral area of ​​the second conductive substrate 130 through the second surface; and a portion of the first adhesive layer 140 and a portion of the second adhesive layer 150 are also bonded through contact between the first surface and the second surface.

[0047] It should be noted that part of the first adhesive layer 140 is bonded to the peripheral area of ​​the first conductive substrate 110 through the first surface. Part of the first adhesive layer 140 may be directly bonded to the peripheral area of ​​the first conductive substrate 110, or part of the first adhesive layer 140 may be bonded to the peripheral area of ​​the first conductive substrate 110 through a gap or an intermediate (e.g. Figure 3 The first bus bar 160 shown in FIG. 1 is indirectly bonded to the peripheral area of ​​the first conductive substrate 110. When part of the first adhesive layer 140 is indirectly bonded to the peripheral area of ​​the first conductive substrate 110 through a gap, it means that there is a gap between part of the first adhesive layer 140 and the peripheral area of ​​the first conductive substrate 110, such as Figure 3 shown.

[0048] Similarly, part of the second adhesive layer 150 is bonded to the peripheral area of ​​the second conductive substrate 130 through the second surface. Part of the second adhesive layer 150 may be directly bonded to the peripheral area of ​​the second conductive substrate 130, or part of the second adhesive layer 150 may be bonded to the peripheral area of ​​the second conductive substrate 130 through a gap or an intermediate (e.g. Figure 3 The second bus bar 170 shown in FIG. 1 is indirectly bonded to the peripheral area of ​​the second conductive substrate 130. When part of the second adhesive layer 150 is indirectly bonded to the peripheral area of ​​the second conductive substrate 130 through a gap, it means that there is a gap between part of the second adhesive layer 150 and the peripheral area of ​​the second conductive substrate 130, such as Figure 3 shown.

[0049] It is understandable that if Figure 3 , Figure 4 As shown, when part of the first adhesive layer 140 is bonded to the peripheral area of ​​the first conductive substrate 110 through the first surface, and part of the second adhesive layer 150 is bonded to the peripheral area of ​​the second conductive substrate 130 through the second surface, and part of the first adhesive layer 140 and part of the second adhesive layer 150 are also bonded through the contact between the first surface and the second surface, the whole formed by the first adhesive layer 140 and the second adhesive layer 150 can cover the side edge of the dimming component, so that the side edge of the dimming medium layer 120 is not directly exposed to the environment, which increases the difficulty of water vapor in the environment entering the dimming medium layer 120, reduces the probability of water vapor contacting the dimming material in the dimming medium layer 120, and reduces the risk of discoloration and failure of the dimming material, thereby delaying the damage of the dimming device 100 and increasing its service life.

[0050] It should be noted that the side edges of the dimming component include the side edges of the first conductive substrate 110, the side edges of the dimming medium layer 120, and the side edges of the second conductive substrate 130. Figure 4 As shown, the side edge of the dimming component can be a flush plane or a flat surface. Figure 3As shown, there are two parallel planes. It can be understood that the specific structure of the side edge of the dimming component is different according to the different structures of the dimming device 100. Other possible situations are not described here.

[0051] At the same time, since the dimming component is a multi-layer structure, when external force acts on the device, the layers of the dimming component may be separated from each other, for example, the dimming medium layer 120 and the first conductive substrate 110 are separated from each other, the dimming medium layer 120 and the second conductive substrate 130 are separated from each other, and the separation of each layer of the structure generally starts from the side edge of each layer of the structure. Therefore, when the first adhesive layer 140 and the second adhesive layer 150 form a whole that can cover the side edge of the dimming component, it can also reduce the risk of layer structure separation at the side edge of the dimming component, thereby increasing the structural stability of the entire dimming device 100.

[0052] In addition, in the present embodiment, the first adhesive layer 140 and the second adhesive layer 150 are provided, and part of the first adhesive layer 140 and part of the second adhesive layer 150 are bonded to each other to form a covering on the side edge of the dimming component, rather than directly providing one adhesive layer to cover the side edge of the dimming component. This is because when directly providing one adhesive layer, part of the adhesive layer needs to be bonded to the peripheral area of ​​the first conductive substrate 110 or the second conductive substrate 130, and the other part of the adhesive layer exceeds the side edge of the first conductive substrate 110 or the second conductive substrate 130, and then the part of the adhesive layer exceeding the side edge of the first conductive substrate 110 or the second conductive substrate 130 is folded to achieve covering of the side edge of the dimming component. In this process, on the one hand, the part of the adhesive layer that exceeds the side edge of the first conductive substrate 110 or the second conductive substrate 130 is prone to adhesion to the working platform; on the other hand, when folding the adhesive layer, the dimming component must be lifted up, which can easily cause the layer structure of the dimming component to separate, or even bend and damage; in addition, the solution of directly setting an adhesive layer is only suitable for sealing the side edges of the dimming component with regular edges, and is not suitable for dimming components with irregular edges, such as curved or wavy edges. If it is applied to dimming components with irregular edges, wrinkles will inevitably form on the adhesive layer at the irregular edges, thereby affecting the overall aesthetics of the dimming device 100. The presence of wrinkles will further affect the sealing performance of the adhesive layer, thereby making the adhesive layer insufficient to protect the side edges of the dimming medium layer, and it is still easy for the side edges of the dimming medium layer 120 to contact the external environment, thereby still causing the dimming material therein to discolor and fail, accelerating the damage of the dimming device 100 and reducing its service life.

[0053] When the first adhesive layer 140 and the second adhesive layer 150 are used, and part of the first adhesive layer 140 and part of the second adhesive layer 150 are bonded to form a covering for the side edge of the dimming component, since the part of the first adhesive layer 140 that exceeds the side edge of the first conductive substrate 110 and the part of the second adhesive layer 150 that exceeds the side edge of the second conductive substrate 130 are bonded to each other, the first adhesive layer 140 and the second adhesive layer 150 will not be bonded to the working platform; at the same time, since there is no need to fold the first adhesive layer 140 and the second adhesive layer 150, there is no need to lift the dimming component, thereby avoiding separation of the layer structure and bending damage of the dimming component caused by lifting the dimming component; in addition, for the dimming component with irregular edges, at the irregular edges, the first adhesive layer 140 and the second adhesive layer 150 can offset the bending stress through their own ductility, thereby reducing or even offsetting wrinkles, and reducing the impact on the sealing performance of the first adhesive layer 140 and the second adhesive layer 150. In summary, by providing the first adhesive layer 140 and the second adhesive layer 150 and bonding part of the first adhesive layer 140 and part of the second adhesive layer 150 to cover the side edge of the dimming component, the overall production efficiency and sealing performance of the dimming device 100 can be improved.

[0054] It should be noted that the dimming medium layer 120 contains a dimming material. Optionally, the dimming medium layer 120 can be a liquid dimming medium, a solid dimming medium or a sol-state dimming medium. Specifically, the dimming medium layer 120 can be a polymer dispersed liquid crystal (PDLC) layer, a suspended particle layer (SPD) and an electrochromic (EC) layer. Preferably, the dimming medium layer 120 is a solid dimming medium. More preferably, the dimming medium layer 120 is a solid electrochromic layer, and the electrochromic layer includes an ion storage layer, an electrolyte layer and an electrochromic material layer stacked in sequence. The materials of each layer in the electrochromic layer can adopt materials that have been disclosed in the prior art, which will not be described here.

[0055] The first adhesive layer 140 may be any adhesive having a conventional bonding function in the art, such as a pressure-sensitive adhesive, a hot melt adhesive, a UV light-curing adhesive, a heat-curing adhesive, or a UV-heating dual-curing adhesive, etc. Preferably, the first adhesive layer 140 is a pressure-sensitive adhesive, such as an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive, etc. More preferably, the first adhesive layer 140 is a silicone pressure-sensitive adhesive.

[0056] Furthermore, the first adhesive layer 140 is a waterproof adhesive layer.

[0057] Furthermore, water-absorbing material is provided in the waterproof adhesive layer.

[0058] It is understandable that in Figure 3 In the dimming device 100 shown, water vapor can enter the dimming device 100 through the first adhesive layer 140 along a direction perpendicular to the first surface (i.e., the second direction). Therefore, when the first adhesive layer 140 is a waterproof adhesive layer, the risk of water vapor entering the dimming device 100 through the first adhesive layer 140 along a direction perpendicular to the first surface can be reduced, further increasing the difficulty of water vapor in the environment entering the dimming medium layer 120, reducing the probability of water vapor contacting the dimming material in the dimming medium layer 120, and increasing the service life of the dimming device 100.

[0059] It should also be noted that in Figure 3 In the dimming device 100 shown, the surfaces where the first adhesive layer 140 and other structures are bonded to each other may not be completely bonded due to various factors, thus becoming a weak point for water vapor intrusion in the environment. For example, when water vapor intrudes the dimming device 100 along the first direction (the first direction is a direction perpendicular to the stacking direction of the first conductive substrate 110, the dimming medium layer 120, and the second conductive substrate 130), it may enter along the bonding surface of the first adhesive layer 140 and the second adhesive layer 150, or along the bonding surface of the first adhesive layer 140 and the first conductive substrate 110. At this time, by providing a water-absorbing substance in the waterproof adhesive layer, water vapor entering the dimming device 100 along the surface where the first adhesive layer 140 and other structures are bonded to each other can be absorbed. At the same time, water vapor entering the dimming device 100 through the first adhesive layer 140 in a direction perpendicular to the first surface can also be absorbed, further increasing the difficulty of water vapor in the environment entering the dimming medium layer 120, reducing the probability of water vapor contacting the dimming material in the dimming medium layer 120, and increasing the service life of the dimming device 100.

[0060] Similarly, the second adhesive layer 150 can be any adhesive with a conventional bonding function in the art, such as a pressure-sensitive adhesive, a hot melt adhesive, a UV light-curing adhesive, a heat-curing adhesive, or a UV-heating dual-curing adhesive, etc. Preferably, the second adhesive layer 150 is a pressure-sensitive adhesive, such as an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive, etc. More preferably, the second adhesive layer 150 is a silicone pressure-sensitive adhesive.

[0061] Furthermore, the second adhesive layer 150 is a waterproof adhesive layer.

[0062] Furthermore, water-absorbing material is provided in the waterproof adhesive layer.

[0063] It is understandable that in Figure 3In the dimming device 100 shown, water vapor can enter the dimming device 100 through the second adhesive layer 150 in a direction perpendicular to the second surface. Therefore, when the second adhesive layer 150 is a waterproof adhesive layer, the risk of water vapor entering the dimming device 100 through the second adhesive layer 150 in a direction perpendicular to the second surface can be reduced, and the difficulty of water vapor in the environment entering the dimming medium layer 120 is further increased, and the probability of water vapor contacting the dimming material in the dimming medium layer 120 is reduced, thereby increasing the service life of the dimming device 100.

[0064] It should also be noted that in Figure 3 In the dimming device 100 shown, the surfaces where the second adhesive layer 150 and other structures are bonded to each other may not be completely bonded due to various factors, thus becoming a weak point for water vapor intrusion in the environment. For example, when water vapor intrudes the dimming device 100 along the first direction, it may enter along the bonding surface of the first adhesive layer 140 and the second adhesive layer 150, or along the bonding surface of the second adhesive layer 150 and the second conductive substrate 130. At this time, by providing a water-absorbing substance in the waterproof adhesive layer, the water vapor that enters the dimming device 100 along the surface where the second adhesive layer and other structures are bonded to each other can be absorbed. At the same time, the water vapor that enters the dimming device 100 through the second adhesive layer 150 in a direction perpendicular to the second surface can also be absorbed, further increasing the difficulty of water vapor in the environment entering the dimming medium layer 120, reducing the probability of water vapor contacting the dimming material in the dimming medium layer 120, and increasing the service life of the dimming device 100.

[0065] In addition, if Figure 3 , Figure 4 As shown, in some embodiments of the present application, the first conductive substrate 110 includes a first substrate layer 111 and a first conductive layer 112 , and the second conductive substrate 130 includes a second substrate layer 131 and a second conductive layer 132 .

[0066] The first substrate layer 111 and the second substrate layer 131 are both transparent substrates, and the "transparent substrate" is an optical grade transparent material, specifically a flexible substrate material, and the flexible substrate material is polyethylene glycol terephthalate (PET), polycarbonate (PC), polyimide (PI), cycloolefin copolymer or triacetyl cellulose, etc. The first substrate layer 111 and the second substrate layer 131 can also be set as glass substrates.

[0067] In addition, the first conductive layer 112 and the second conductive layer 132 are both transparent conductive layers, and the material of the "transparent conductive layer" can be a transparent conductive material well known to those skilled in the art, such as indium-tin oxide (ITO), aluminum zinc oxide (AZO), fluorine doped tin oxide (FTO), silver nanowires, graphene, carbon nanotubes, metal grids or silver nanoparticles. In this embodiment, ITO is attached to the first substrate layer 111 and the second substrate layer 131 by magnetron sputtering.

[0068] like Figure 1 As shown, in some embodiments of the present application, a first groove 310 and a second groove 320 are further provided at the edge of the dimming device 100. The number of the first groove 310 and the number of the second groove 320 can be one or more, which can be specifically set according to actual conditions.

[0069] The first grooves 310 and the second grooves 320 may be arranged alternately or non-alternately, for example, a plurality of first grooves 310 may be arranged continuously, and then a plurality of second grooves 320 may be arranged, etc. The specific arrangement method may be adaptively selected according to the requirements of the color change effect of the product.

[0070] Specifically, Figure 2 As shown, the first groove 310 penetrates the first conductive substrate 110 and the dimming medium layer 120, and the second groove 320 penetrates the second conductive substrate 130 and the dimming medium layer 120, thereby exposing the first conductive substrate 110 and the second conductive substrate 130, so as to facilitate the electrical connection between the second conductive substrate 130 and the outside through the first groove 310 and the electrical connection between the first conductive substrate 110 and the outside through the second groove 320. At this time, the first groove 310 is arranged so that part of the first adhesive layer 140 is bonded to the side of the second conductive substrate 130 close to the dimming medium layer 120, and the second groove 320 is arranged so that part of the second adhesive layer 150 is bonded to the side of the first conductive substrate 110 close to the dimming medium layer 120.

[0071] It should be noted that, when the first adhesive layer 140 is bonded to the first conductive substrate 110, the first adhesive layer 140 cannot completely fit with the side wall of the first groove 310, but an air channel is generated at the bend between the side wall of the first groove 310 and the bottom of the first groove 310. Similarly, when the second adhesive layer 150 is bonded to the second conductive substrate 130, the second adhesive layer 150 cannot completely fit with the side wall of the second groove 320, but an air channel is generated at the bend between the side wall of the second groove 320 and the bottom of the second groove 320. Therefore, if the side edge of the dimming component is not covered by the first adhesive layer 140 and the second adhesive layer 150, water vapor in the environment can easily enter the interior of the dimming component through the air duct, thereby causing the dimming material to discolor and fail. Therefore, when the edge portion of the dimming device 100 is also provided with a first groove 310 and a second groove 320, the side edge of the dimming component is covered by the first adhesive layer 140 and the second adhesive layer 150 as a whole, and the direct contact between the air duct and the environment is blocked, thereby reducing the risk of water vapor entering the interior of the dimming component through the air duct and improving the service life of the dimming device 100.

[0072] In some embodiments of the present application, the dimming device 100 further includes a first protective layer 141, which is disposed on a side of the first adhesive layer 140 away from the first conductive substrate 110; and / or, a second protective layer 151, which is disposed on a side of the second adhesive layer 150 away from the second conductive substrate 130. That is, in some embodiments, the dimming device 100 further includes a first protective layer 141, which is disposed on a side of the first adhesive layer 140 away from the first conductive substrate 110, but may not include a second protective layer. In other embodiments, the dimming device 100 further includes a second protective layer 151, which is disposed on a side of the second adhesive layer 150 away from the second conductive substrate 130, but does not include the first protective layer. In still other embodiments, Figure 5 As shown, the dimming device 100 may include a first protective layer 141 and a second protective layer 151 at the same time, wherein the first protective layer 141 is disposed on a side of the first adhesive layer 140 away from the first conductive substrate 110 , and the second protective layer 151 is disposed on a side of the second adhesive layer 150 away from the second conductive substrate 130 .

[0073] It can be understood that when the first protective layer 141 is disposed on a side of the first adhesive layer 140 away from the first conductive substrate 110 , the first protective layer 141 can protect the first adhesive layer 140 .

[0074] The first protective layer 141 may be polyethylene glycol terephthalate (PET), polycarbonate (PC), polyimide (PI), cycloolefin copolymer or triacetyl cellulose.

[0075] Furthermore, when the first protective layer 141 and the first adhesive layer 140 are a whole, for example, the first protective layer 141 and the first adhesive layer 140 together form a high-temperature tape, a waterproof tape, a high-temperature waterproof tape, etc., the first protective layer 141 and the first adhesive layer 140 can be more conveniently arranged on the first conductive substrate 110, especially easier to be partially bonded with the second adhesive layer 150, thereby covering the side edges of the dimming component, thereby improving the production efficiency of the dimming device 100.

[0076] Similarly, when the second protective layer 151 is disposed on a side of the second adhesive layer 150 away from the second conductive substrate 130 , the second protective layer 151 can protect the second adhesive layer 150 .

[0077] The second protective layer 151 may be polyethylene glycol terephthalate (PET), polycarbonate (PC), polyimide (PI), cycloolefin copolymer or triacetyl cellulose.

[0078] Furthermore, when the second protective layer 151 and the second adhesive layer 150 are a whole, for example, the second protective layer 151 and the second adhesive layer 150 together form a high-temperature tape, a waterproof tape, a high-temperature waterproof tape, etc., the second protective layer 151 and the second adhesive layer 150 can be more conveniently arranged on the second conductive substrate 130, especially easier to be partially bonded to the first adhesive layer 140, thereby covering the side edges of the dimming component, thereby improving the production efficiency of the dimming device 100.

[0079] In some embodiments of the present application, a first water and oxygen barrier layer 142 is disposed on a side of the first protective layer 141 away from the first adhesive layer 140 , and / or a second water and oxygen barrier layer 152 is disposed on a side of the second protective layer 151 away from the second adhesive layer 150 .

[0080] Specifically, the first water-oxygen barrier layer 142 may be disposed on the side of the first protective layer 141 away from the first adhesive layer 140; the second water-oxygen barrier layer 152 may be disposed on the side of the second protective layer 151 away from the second adhesive layer 150; or Figure 6 As shown, a first water and oxygen barrier layer 142 is disposed on a side of the first protective layer 141 away from the first adhesive layer 140 , and a second water and oxygen barrier layer 152 is disposed on a side of the second protective layer 151 away from the second adhesive layer 150 .

[0081] Because in Figure 3In the dimming device 100 shown, water vapor can enter the dimming device 100 through the first adhesive layer 140 in a direction perpendicular to the first surface. Therefore, by providing a first water and oxygen barrier layer 142 on the side of the first protective layer 141 away from the first adhesive layer 140, the risk of water vapor entering the dimming device 100 through the first adhesive layer 140 in a direction perpendicular to the first surface can be reduced, thereby improving the service life of the dimming device 100.

[0082] Similarly, by providing a second water and oxygen barrier layer 152 on the side of the second protective layer 151 away from the second adhesive layer 150, the risk of water vapor entering the dimming device 100 through the second adhesive layer 150 in a direction perpendicular to the second surface can be reduced, thereby increasing the service life of the dimming device 100.

[0083] In some embodiments of the present application, in the first direction, the width of the portion of the first adhesive layer 140 and the portion of the second adhesive layer 150 bonded by the contact between the first surface and the second surface is X. Figure 3 , Figure 4 shown.

[0084] The value range of X is 0<X≤30mm, for example, X can be 0.05mm, 0.1mm, 0.2mm, 0.5mm, 1mm, 2mm, 3mm, 5mm, 7mm, 10mm, 15mm, 20mm, 30mm, etc., which can be set according to actual conditions. Preferably, 0.2mm≤X≤5mm. More preferably, 0.5mm≤X≤3mm.

[0085] It is understandable that when X is too small, the first adhesive layer 140 and the second adhesive layer 150 are easily separated from each other and cannot form a stable bond. It is also impossible to form a longer water vapor invasion path when water vapor invades the dimming device 100 along the first direction, especially when water vapor invades the dimming device 100 along the bonding surface of the first adhesive layer 140 and the second adhesive layer 150, thereby increasing the risk of water vapor invasion; and when X is too large, the proportion of the non-color-changing area of ​​the dimming device 100 will increase. Here, the proportion of the non-color-changing area is the ratio of the non-color-changing area of ​​the dimming device 100 to the total area of ​​the dimming device 100. When the proportion of the non-color-changing area is large, the proportion of the color-changing area that can realize the dimming function will be reduced accordingly.

[0086] like Figure 7 , 8 As shown in FIGS. 9 and 10 , in some embodiments of the present application, the first adhesive layer 140 includes at least two first sub-adhesive layers 140 a, and at least two first sub-adhesive layers 140 a are interconnected to form the first adhesive layer 140; and / or, the second adhesive layer 150 includes at least two second sub-adhesive layers 150 a, and at least two second sub-adhesive layers 150 a are interconnected to form the second adhesive layer 150.

[0087] It is understandable that the first sub-glue layers 140a may be connected to each other in various ways, for example, Figure 7 , 8 The overlap shown can be as follows Fig. 9 The abutment shown can also be as Fig.10 As shown, the connection is performed using the first connecting member 140b, etc., and the specific connection can be selected according to the actual situation.

[0088] It is understandable that when the first connecting member 140b is provided to connect the two first sub-glue layers 140a, the first connecting member 140b is also a part of the first glue layer 140. Preferably, the first sub-glue layers 140a are connected to each other in an overlapping manner to improve the production efficiency of the product, increase the stability of the connection, and increase the path length of water vapor invading the dimming device 100 from the overlapping portion.

[0089] Similarly, the second sub-glue layers 150a may be connected in various ways, for example, Figure 7 , 8 The overlap shown can be as follows Fig. 9 The abutment shown can also be as Fig.10 As shown, the connection is performed using the second connecting member 150b, etc., and the specific connection can be selected according to the actual situation.

[0090] It is understandable that when the second connecting member 150b is provided to connect the two second sub-glue layers 150a, the second connecting member 150b is also a part of the second glue layer 150. Preferably, the second sub-glue layers 150a are connected to each other in an overlapping manner to improve the production efficiency of the product, increase the stability of the connection, and increase the path length of water vapor invading the dimming device 100 from the overlapping portion.

[0091] It should be noted that when the first adhesive layer 140 is wider, the process complexity is higher when the first adhesive layer 140 is set on the dimming component, especially when the first adhesive layer 140 is a tape-like structure, it is more difficult to ensure the bonding flatness of the first adhesive layer 140 and the dimming component. At the same time, when the first adhesive layer 140 covers a position with a height difference, such as a bend formed by the side wall of the first groove 310 and the first base layer 111, a bend formed by the side wall of the first groove 310 and the second conductive layer 132, etc., it is difficult for the first adhesive layer 140 to achieve a tight fit with these positions. When the first adhesive layer 140 is an independent structure, that is, the first adhesive layer 140 is not formed by connecting multiple first sub-adhesive layers 140a, the first adhesive layer 140 needs to independently cover multiple positions with height differences, that is, there are multiple places where the fit is not tight, so there may be a certain risk of connection stability between the first adhesive layer 140 and the dimming component. Similarly, the second adhesive layer 150 also has similar problems.

[0092] Based on this, the embodiment of the present application reduces the width of each first sub-glue layer 140a by setting the first glue layer 140 as an interconnected first sub-glue layer 140a, reduces the complexity of the process, and ensures the flatness of the attachment of the first sub-glue layer 140a and the dimming component; at the same time, reduces the number of positions with height differences covered by the first sub-glue layer 140a, and ensures the connection stability between the first sub-glue layer 140a and the dimming component.

[0093] Similarly, the second adhesive layer 150 is set as an interconnected second sub-adhesive layer 150a, which reduces the width of each second sub-adhesive layer 150a, reduces the complexity of the process, and ensures the flatness of the attachment of the second sub-adhesive layer 150a and the dimming component; at the same time, it reduces the number of positions with height differences covered by the second sub-adhesive layer 150a, and ensures the connection stability between the second sub-adhesive layer 150a and the dimming component.

[0094] The first sub-adhesive layer 140a and the second sub-adhesive layer 150a can be conventional adhesives with bonding effects in the art, such as pressure-sensitive adhesives, hot melt adhesives, UV light-cured adhesives, heat-cured adhesives, or UV-heated dual-cured adhesives, etc. Preferably, the first sub-adhesive layer 140a and the second sub-adhesive layer 150a are pressure-sensitive adhesives, such as acrylic pressure-sensitive adhesives, rubber-type pressure-sensitive adhesives, or silicone pressure-sensitive adhesives, etc. More preferably, the first sub-adhesive layer 140a and the second sub-adhesive layer 150a are silicone pressure-sensitive adhesives.

[0095] Furthermore, the first sub-glue layer 140a and the second sub-glue layer 150a are waterproof glue layers.

[0096] Furthermore, water-absorbing material is provided in the waterproof adhesive layer.

[0097] It should be noted that different materials can be selected for each first sub-glue layer 140a and the second sub-glue layer 150a. For example, a material with better sealing performance can be selected at the sealing weak point of the dimming device 100. In this case, the sealing of the entire dimming device 100 can be ensured while saving material costs.

[0098] In some embodiments of the present application, the dimming device 100 also includes a first bus bar 160 and a second bus bar 170, at least a portion of the first bus bar 160 is disposed on a side of the second conductive substrate 130 close to the dimming medium layer 120 through a first groove 310, at least a portion of the second bus bar 170 is disposed on a side of the first conductive substrate 110 close to the dimming medium layer 120 through a second groove 320, and the first adhesive layer 140 covers the first bus bar 160, and the second adhesive layer 150 covers the second bus bar 170.

[0099] In some embodiments, a portion of the first bus bar 160 is disposed on a side of the second conductive substrate 130 close to the dimming medium layer 120 through the first groove 310, and another portion of the first bus bar 160 is disposed on a side of the first conductive substrate 110 away from the dimming medium layer 120. A portion of the second bus bar 170 is disposed on a side of the first conductive substrate 110 close to the dimming medium layer 120 through the second groove 320, and another portion of the second bus bar 170 is disposed on a side of the second conductive substrate 130 away from the dimming medium layer 120.

[0100] In other embodiments, all first bus bars 160 are disposed on a side of the second conductive substrate 130 close to the dimming medium layer 120 through the first groove 310 , and all second bus bars 170 are disposed on a side of the first conductive substrate 110 close to the dimming medium layer 120 through the second groove 320 .

[0101] The first bus bar 160 and the second bus bar 170 can be made of conductive materials known to those skilled in the art, for example, at least one of conductive silver paste, conductive copper paste, conductive carbon paste, nanosilver conductive ink, copper foil, copper wire and conductive adhesive film.

[0102] By providing the first bus bar 160 and the second bus bar 170, when the external power source supplies power to the dimming device 100, the current can be quickly conducted to the periphery of the second conductive substrate 130 through the first bus bar 160, and can be quickly conducted to the periphery of the first conductive substrate 110 through the second bus bar 170, thereby accelerating the color change speed of the dimming device 100. In addition, by covering the first bus bar 160 with the first adhesive layer 140, the first bus bar 160 can be prevented from being corroded by water vapor in the environment, thereby affecting its conductivity and further affecting the color change speed of the dimming device 100. At the same time, the first adhesive layer 140 can also enhance the adhesion between the first bus bar 160 and the second conductive substrate 130, reduce the probability of local electrical conduction failure caused by partial separation of the first bus bar 160 and the second conductive substrate 130, and avoid its influence on the color change speed of the dimming device 100. Similarly, by covering the second bus bar 170 with the second adhesive layer 150, the second bus bar 170 can be prevented from being corroded by water vapor in the environment, which would affect its conductivity and further affect the color changing speed of the dimming device 100. At the same time, the second adhesive layer 150 can also enhance the adhesion between the second bus bar 170 and the first conductive substrate 110, thereby reducing the probability of local electrical conduction failure caused by partial separation of the second bus bar 170 and the first conductive substrate 110, thereby avoiding its influence on the color changing speed of the dimming device 100.

[0103] Further, such as Figure 2As shown, the first bus bar 160 is electrically connected to the second conductive layer 132 in the second conductive substrate 130 layer through a plurality of first grooves 310, and the second bus bar 170 is electrically connected to the first conductive layer 112 in the first conductive substrate 110 layer through a plurality of second grooves 320, thereby, a multi-electrode structure can be alternately formed at the peripheral edge of the dimming device 100, further accelerating the color change speed of the dimming device 100.

[0104] In some embodiments of the present application, the first bus bar 160 is partially disposed on a side of the first conductive substrate 110 away from the dimming medium layer 120, the first adhesive layer 140 includes at least two first sub-adhesive layers 140a, at least two first sub-adhesive layers 140a are interconnected to form the first adhesive layer 140, and the connection between at least two first sub-adhesive layers 140a is staggered with the first bus bar 160; and / or, the second bus bar 170 is partially disposed on a side of the second conductive substrate 130 away from the dimming medium layer 120, the second adhesive layer 150 includes at least two second sub-adhesive layers 150a, at least two second sub-adhesive layers 150a are interconnected to form the second adhesive layer 150, and the connection between at least two second sub-adhesive layers 150a is staggered with the second bus bar 170.

[0105] In some embodiments, the first bus bar 160 is partially disposed on a side of the first conductive substrate 110 away from the dimming medium layer 120, and the first adhesive layer 140 includes at least two first sub-adhesive layers 140a, and at least two first sub-adhesive layers 140a are interconnected to form the first adhesive layer 140, and the connection between the at least two first sub-adhesive layers 140a is staggered with the first bus bar 160.

[0106] In other embodiments, the second bus bar 170 is partially disposed on a side of the second conductive substrate 130 away from the dimming medium layer 120, the second adhesive layer 150 includes at least two second sub-adhesive layers 150a, at least two second sub-adhesive layers 150a are interconnected to form the second adhesive layer 150, and the connection between at least two second sub-adhesive layers 150a is staggered with the second bus bar 170.

[0107] In some other embodiments, the first bus bar 160 is partially disposed on a side of the first conductive substrate 110 away from the dimming medium layer 120, the first adhesive layer 140 includes at least two first sub-adhesive layers 140a, at least two first sub-adhesive layers 140a are interconnected to form the first adhesive layer 140, and the connection between at least two first sub-adhesive layers 140a is staggered with the first bus bar 160; and the second bus bar 170 is partially disposed on a side of the second conductive substrate 130 away from the dimming medium layer 120, the second adhesive layer 150 includes at least two second sub-adhesive layers 150a, at least two second sub-adhesive layers 150a are interconnected to form the second adhesive layer 150, and the connection between at least two second sub-adhesive layers 150a is staggered with the second bus bar 170.

[0108] More specifically, Figure 7 , 8 As shown, the first adhesive layer 140 includes two first sub-adhesive layers 140a, and the two first sub-adhesive layers 140a are interconnected to form the first adhesive layer 140. The connection between the two first sub-adhesive layers 140a is staggered with the first bus bar 160, and the connection between the two second sub-adhesive layers 150a is staggered with the second bus bar 170. At the same time, the second adhesive layer 150 includes two second sub-adhesive layers 150a, and the two second sub-adhesive layers 150a are interconnected to form the second adhesive layer 150. The connection between the two second sub-adhesive layers 150a is staggered with the second bus bar 170.

[0109] It is understandable that the first adhesive layer 140 may also include three first sub-adhesive layers 140a, or more first sub-adhesive layers. The specific number may be determined according to actual product design and will not be described in detail here.

[0110] Similarly, the second adhesive layer 150 may also include three second sub-adhesive layers 150a, or more second sub-adhesive layers. The specific number may be determined according to actual product design and will not be described in detail here.

[0111] It should be noted that, since the first bus bar 160 is provided, Figure 8As shown, in terms of thickness, the thickness of the dimming device 100 at the first bus bar 160 will be greater than the thickness at the center of the dimming device 100, and when the first bus bar 160 is provided with two connecting portions of the first sub-glue layers 140a, the thickness difference between the dimming device 100 at the first bus bar 160 and the center of the dimming device 100 will be further increased. When the thickness difference is too large, the concentrated stress at this location during the assembly process will also increase, thereby increasing the risk of glass cracking at this location. Therefore, by staggering the connecting portions of the two first sub-glue layers 140a with the first bus bar 160, the thickness difference between the first bus bar 160 and the center of the dimming device 100 will not be too large due to the two connecting portions of the first sub-glue layers 140a, so that while ensuring the sealing of the dimming device 100, the risk of glass cracking during assembly is reduced as much as possible.

[0112] Similarly, by staggering the connection points of the two second sub-glue layers 150a and the second bus bar 170, the thickness difference between the second bus bar 170 and the center of the dimming device 100 will not be too large due to the two connection points of the second sub-glue layers 150a, thereby ensuring the sealing of the dimming device 100 and minimizing the risk of glass breakage during assembly.

[0113] In some embodiments of the present application, the first adhesive layer 140 includes at least one arc segment 400, and / or the second adhesive layer 150 includes at least one arc segment 400. That is, in some embodiments, the first adhesive layer 140 includes at least one arc segment 400; in other embodiments, the second adhesive layer 150 includes at least one arc segment 400; in still other embodiments, the first adhesive layer 140 includes at least one arc segment 400, and the second adhesive layer 150 includes at least one arc segment 400.

[0114] Specifically, Fig.11 As shown, the first adhesive layer 140 includes a plurality of arc segments 400, and the second adhesive layer 150 includes a plurality of arc segments 400. It should be noted that when the first adhesive layer 140 is a non-arc structure, for example, a straight-edge structure, it is difficult to form the first adhesive layer 140 at the intersection of two straight edges as a whole, because wrinkles may be generated, and even the first adhesive layer 140 may be broken, thereby affecting the sealing effect of the edge of the dimming device 100. At this time, the connection can only be achieved by overlapping the two first adhesive layers 140, that is, by overlapping.

[0115] By providing the first adhesive layer 140 with a structure including at least one arc segment 400, the first adhesive layer 140 can be integrally formed. At this time, the wrinkles formed by the bending of the first adhesive layer 140 can be offset by the ductility of the first adhesive layer 140 itself, which can effectively avoid the formation of overlaps, thereby avoiding the increase in thickness caused by the overlaps and reducing the risk of glass cracking during assembly.

[0116] Similarly, by providing the second adhesive layer 150 with a structure including at least one arc segment 400, the second adhesive layer 150 can be integrally formed. At this time, the wrinkles formed by the bending of the second adhesive layer 150 can be offset by the ductility of the second adhesive layer 150 itself, thereby effectively avoiding the formation of overlaps, thereby avoiding the increase in thickness caused by the formation of overlaps, and reducing the risk of glass breakage during assembly; it also avoids the problem of reduced sealing at the overlap when the overlap is formed, as mentioned above.

[0117] Preferably, in some embodiments of the present application, the first adhesive layer 140 and the second adhesive layer 150 each include at least one arc segment 400 .

[0118] It should be noted that, when the radius of the arc segment 400 is smaller, the ductility requirement of the adhesive layer itself is higher. Therefore, in some embodiments of the present application, the minimum radius of the arc segment 400 is R, and the value range of R is R ≥ 200mm. For example, R can be 200mm, 210mm, 220mm, 240mm, 250mm, 280mm, 300mm, 310mm, 320mm, 340mm, 360mm, 380mm, 400mm, etc., which can be set according to actual conditions. More preferably, the value range of R is R ≥ 250mm.

[0119] like Figure 3 , Figure 4 As shown, in some embodiments of the present application, a first etched groove 180 is disposed around the first groove 310, and a second etched groove 190 is disposed around the second groove 320. The first etched groove 180 at least penetrates the first conductive layer 112, and the second etched groove 190 at least penetrates the second conductive layer 132. The first etched groove 180 and the second etched groove 190 function to block or reduce the conduction of current from the conductive layer of the etched groove to the conductive layer at the center of the dimming device 100.

[0120] Specifically, the first etching groove 180 penetrates the first substrate layer 111 and the first conductive layer 112, and the second etching groove 190 penetrates the second substrate layer 131 and the second conductive layer 132; it can be understood that the first etching groove 180 can also penetrate the first substrate layer 111, the first conductive layer 112 and the dimming medium layer 120, and the second etching groove 190 penetrates the second substrate layer 131, the second conductive layer 132 and the dimming medium layer 120; the first etching groove 180 can also penetrate the first substrate layer 111, the first conductive layer 112, the dimming medium layer 120 and a part of the second conductive layer 132, and the second etching groove 190 penetrates the second substrate layer 131, the second conductive layer 132, the dimming medium layer 120 and a part of the first conductive layer 112. When the dimming medium layer 120 is a multi-layer structure, the etching groove can penetrate a part of the layer structure of the dimming medium layer 120, or the whole layer structure, which can be selected according to actual conditions.

[0121] It should be noted that when cutting the electrode, such as the first groove 310 and the second groove 320, the first conductive layer 112 and the second conductive layer 132 at the cutting position may contact each other, thereby causing a short circuit in the dimming device 100. By providing the first etching groove 180 and the second etching groove 190, the first etching groove 180 penetrates at least the first conductive layer 112, and the second etching groove 190 penetrates at least the second conductive layer 132, the short circuit can be controlled to be limited to a small conductive layer area between the etching groove and the electrode, thereby avoiding a short circuit between the first conductive layer 112 and the second conductive layer 132 of the entire dimming device 100.

[0122] Further, such as Figure 3 , Figure 4 As shown, in some embodiments of the present application, the first adhesive layer 140 covers the first etching groove 180 , and the second adhesive layer 150 covers the second etching groove 190 , thereby preventing water vapor in the environment from entering the dimming device 100 through the first etching groove 180 and the second etching groove 190 .

[0123] like Fig.12 , 13 As shown, some embodiments of the present application also provide a dimming device 200, including a first substrate layer 210, a first adhesive layer 220, a dimming device 100, a second adhesive layer 240 and a second substrate layer 230 stacked in sequence, a seal 250 is arranged between the first substrate layer 210 and the second substrate layer 230, and the seal 250 is located on the peripheral side of the dimming device 100.

[0124] Specifically, the first substrate layer 210 and the second substrate layer 230 are transparent structures, for example, the first substrate layer 210 and the second substrate layer 230 can be transparent glass, a transparent acrylic plate or a transparent PVC plate, etc. Preferably, the first substrate layer 210 and the second substrate layer 230 are glass, and the dimming device 100 is sandwiched between the first substrate layer 210 and the second substrate layer 230, and a sealing member 250 is provided on the peripheral area of ​​the first substrate layer 210 and the second substrate layer 230, so as to form a sealed dimming device 200.

[0125] It can be understood that since the whole formed by the first adhesive layer 140 and the second adhesive layer 150 can cover the side edges of the dimming component, thereby increasing the sealing performance of the overall dimming device 100, the width of the seal 250 of the dimming device 100 of this embodiment can be smaller (under the condition of the same sealing performance) when forming the dimming device 200, thereby reducing the sealing width of the entire dimming device 200, reducing the ratio of the non-color-changing area of ​​the dimming device 200 to the total area of ​​the dimming device 200, and increasing the proportion of the color-changing area that can realize the dimming function on the entire dimming device 200, thereby improving the aesthetics of the dimming device 200.

[0126] The first adhesive layer 220 and the second adhesive layer 240 can be made of at least one of polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA), OCA (Optically Clear Adhesive) optical glue, SCA optical glue, ionic intermediate film (Surper Safe Glas, SGP), liquid optical glue LOCA (Liquid Optical Clear Adhesive) or acrylic.

[0127] The material of the seal 250 includes a conventional adhesive in the art that has a water and oxygen barrier effect, such as a pressure-sensitive adhesive, a hot melt adhesive, a UV light-curing adhesive, a heat-curing adhesive, or a UV heating dual-curing adhesive. It can be understood that in some cases, the seal 250 can be made of the same material as the first adhesive layer 220 and the second adhesive layer 240.

[0128] In addition, a shielding layer is provided on the surface of the first substrate layer 210 and the second substrate layer 230 corresponding to the edge of the dimming device 100. The shielding layer can be provided on the inner surface or the outer surface of the first substrate layer 210 and the second substrate layer 230; the shielding layer can be made of shielding materials such as metal and black ink. In order to prevent users from directly seeing the edge of the dimming device 100 through the transparent first substrate layer 210 and the second substrate layer 230, the appearance of the entire device is made more beautiful. Therefore, a shielding layer is provided at the edge of the first substrate layer 210 and the second substrate layer 230, and the bus bar and the barrier part of the dimming device 100 are shielded by the shielding layer, thereby improving the aesthetics of the dimming device 200.

[0129] Some embodiments of the present application further provide a dimming product, including the dimming device 100 or dimming apparatus 200 described above, wherein the dimming product includes any one of a vehicle, a curtain wall, an electronic device, and glasses. Since the dimming device 100 or dimming apparatus 200 described above is adopted, all the advantages of the dimming device 100 or dimming apparatus 200 described above are possessed, and they are not described one by one here.

[0130] Specifically, it can be applied to rearview mirrors of vehicles, various windows of vehicles (such as front windshields, skylight glass, rear windshields, front side windows, rear side windows and airplane windows, etc.), housings and display panels of electronic devices; vehicles include cars, trains, airplanes, ships, etc., electronic devices include mobile phones, computers, tablets, smart wearable devices, etc.; glasses include ordinary glasses, AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, sunglasses or ski goggles, etc.

[0131] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0132] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0133] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be noted that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0134] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A dimming device, characterized in that: include: A dimming component, the dimming component comprising a first conductive substrate, a dimming medium layer, and a second conductive substrate stacked in sequence; a first adhesive layer, the first adhesive layer being disposed at an edge portion of the dimming component, and the first adhesive layer having a first surface close to the first conductive substrate, and a portion of the first adhesive layer being bonded to a peripheral region of the first conductive substrate through the first surface; a second adhesive layer, the second adhesive layer is disposed at an edge portion of the dimming component, and the second adhesive layer has a second surface close to the second conductive substrate, and a portion of the second adhesive layer is bonded to a peripheral area of ​​the second conductive substrate through the second surface; wherein, Part of the first adhesive layer and part of the second adhesive layer are also bonded by the contact between the first surface and the second surface.

2. The dimming device according to claim 1, characterized in that: Also includes: A first protective layer, which is disposed on a side of the first adhesive layer away from the first conductive substrate; and / or, The second protective layer is arranged on a side of the second adhesive layer away from the second conductive substrate.

3. The dimming device according to claim 1, characterized in that: The first adhesive layer and / or the second adhesive layer is a waterproof adhesive layer.

4. The dimming device according to claim 3, characterized in that: The waterproof adhesive layer is provided with water absorbing material.

5. The dimming device according to claim 2, characterized in that: A first water and oxygen barrier layer is disposed on a side of the first protective layer away from the first adhesive layer, and / or a second water and oxygen barrier layer is disposed on a side of the second protective layer away from the second adhesive layer.

6. The dimming device according to claim 1, characterized in that: In the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0<X≤30mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer and the second conductive substrate.

7. The dimming device according to claim 1, characterized in that: In the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0.2mm≤X≤5mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer and the second conductive substrate.

8. The dimming device according to claim 1, characterized in that: In the first direction, the width of the portion of the first adhesive layer and the portion of the second adhesive layer bonded by the contact between the first surface and the second surface is X, and the value range of X is 0.5mm≤X≤3mm, wherein the first direction is a direction perpendicular to the stacking direction of the first conductive substrate, the dimming medium layer and the second conductive substrate.

9. The dimming device according to claim 1, characterized in that: The first adhesive layer includes at least two first sub-adhesive layers, and the at least two first sub-adhesive layers are connected to each other to form the first adhesive layer; and / or, The second adhesive layer includes at least two second sub-adhesive layers, and the at least two second sub-adhesive layers are connected to each other to form the second adhesive layer.

10. The dimming device according to claim 1, characterized in that: The edge portion of the dimming component is also provided with a first groove and a second groove, the first groove penetrates the first conductive substrate and the dimming medium layer so that part of the first adhesive layer is bonded to the side of the second conductive substrate close to the dimming medium layer, and the second groove penetrates the second conductive substrate and the dimming medium layer so that part of the second adhesive layer is bonded to the side of the first conductive substrate close to the dimming medium layer.

11. The dimming device according to claim 10, characterized in that: The device further comprises a first bus bar and a second bus bar, wherein at least a portion of the first bus bar is disposed on a side of the second conductive substrate close to the dimming medium layer through the first groove, and at least a portion of the second bus bar is disposed on a side of the first conductive substrate close to the dimming medium layer through the second groove, and The first glue layer covers the first bus bar, and the second glue layer covers the second bus bar.

12. The dimming device according to claim 11, characterized in that: The first bus bar is partially arranged on a side of the first conductive substrate away from the dimming medium layer, the first adhesive layer includes at least two first sub-adhesive layers, the at least two first sub-adhesive layers are interconnected to form the first adhesive layer, and the connection between the at least two first sub-adhesive layers and the first bus bar is staggered; and / or, The second bus bar portion is arranged on a side of the second conductive substrate away from the dimming medium layer, the second adhesive layer includes at least two second sub-adhesive layers, the at least two second sub-adhesive layers are interconnected to form the second adhesive layer, and the connection between the at least two second sub-adhesive layers is staggered with the second bus bar.

13. The dimming device according to claim 1, characterized in that: The first adhesive layer includes at least one arc segment, and / or the second adhesive layer includes at least one arc segment.

14. The dimming device according to claim 13, characterized in that: The minimum radius of the arc segment is R, and the value range of R is R≥200mm.

15. The dimming device according to claim 10 or 11, characterized in that: The first conductive substrate includes a first substrate layer and a first conductive layer, the second conductive substrate includes a second substrate layer and a second conductive layer, a first etching groove is arranged on the circumferential side of the first groove, a second etching groove is arranged on the circumferential side of the second groove, the first etching groove at least penetrates the first conductive layer, and the second etching groove at least penetrates the second conductive layer.

16. The dimming device according to claim 15, characterized in that: The first glue layer covers the first etching groove, and the second glue layer covers the second etching groove.

17. A dimming device, characterized in that: It includes a first substrate layer, a first adhesive layer, a dimming device as described in any one of claims 1 to 16, a second adhesive layer and a second substrate layer stacked in sequence, a seal is provided between the first substrate layer and the second substrate layer, and the seal is located on the peripheral side of the dimming device.

18. A dimming product, characterized in that: It comprises the dimming device according to any one of claims 1 to 16 or the dimming apparatus according to claim 17, wherein the dimming product comprises any one of a vehicle, a curtain wall, an electronic device and glasses.

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