Power module, power equipment and power system

Abstract

The utility model provides a power module, power equipment and an electric power system, and relates to the technical field of semiconductors. The power module comprises a circuit board, a chip unit and at least one conductive connection interface used for being electrically connected with an external driving board, the chip unit is installed on the circuit board, and the conductive connection interface is electrically connected with the chip unit; wherein the at least one conductive connection interface is used for being connected with the driving board through an external cable, and / or the at least one conductive connection interface is used for being connected with the driving board in an inserting mode, and the inserting direction of the conductive connection interface connected with the driving board in an inserting mode is perpendicular to the thickness direction of the circuit board. According to the technical scheme, the area of the attached part of the circuit board of the power module and the driving board is greatly reduced and even does not need to be attached, heat dissipation of the power module is facilitated, arrangement of a heat dissipation structure of the power module is facilitated, the space occupied by the power module for the driving board can be reduced, and therefore the miniaturization design of the driving board can be promoted.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a power module, a power device and a power system. Background Art

[0002] The power module generally packages power semiconductor devices (such as IGBT, MOSFET, thyristor, etc.) and other auxiliary components together to form an independent functional unit, which is mainly used to achieve high-efficiency power conversion. When installing the power module, the large surface of the power module is usually attached to the external circuit board such as the driver board, and the power module is fixedly connected to the driver board through pins. This connection method can achieve reliable fixation of the power module on the circuit board, and the power module can dissipate heat through the circuit board to a certain extent.

[0003] However, in some cases, the heat dissipation performance of the power module is still insufficient. In particular, the greater the switching frequency of the power switch of the power module, the greater the heat generated by the power module. If the heat dissipation performance of the power module is insufficient, it will affect the performance of the power module and the performance of the power device. Utility Model Content

[0004] The utility model aims to solve the problem of how to improve the performance of the power module, especially the heat dissipation performance, in the related art to a certain extent.

[0005] In order to solve at least one aspect of the above problems to at least a certain extent, in a first aspect, the utility model provides a power module, the power module comprising a circuit board, a chip unit and at least one conductive connection interface for electrically connecting to an external circuit board, the chip unit being mounted on the circuit board, and the conductive connection interface being electrically connected to the chip unit;

[0006] Among them, at least one of the conductive connection interfaces is used for plugging and connecting with the external circuit board, and the plugging direction of the conductive connection interface plugging and connecting with the external circuit board is set at a preset angle with the thickness direction of the circuit board, and / or, at least one of the conductive connection interfaces is used for connecting with the external circuit board via an external cable.

[0007] Optionally, the conductive connection interface connected to the cable is a plug-in interface.

[0008] Optionally, a plugging direction of the conductive connection interface plug-connected to the cable is arranged at a preset angle with a thickness direction of the circuit board.

[0009] Optionally, at least one of the conductive connection interfaces is arranged corresponding to a circumferential edge of the circuit board.

[0010] Optionally, all of the conductive connection interfaces include at least one of a signal interface and a power interface.

[0011] Optionally, there are multiple circuit boards, the multiple circuit boards include a first circuit board and a second circuit board, the chip unit is arranged between the first circuit board and the second circuit board, and the chip unit is installed on the first circuit board;

[0012] At least a portion of the power circuit of the power module and / or at least a portion of the signal circuit of the power module is formed on the first circuit board, and at least a portion of the power circuit of the power module and / or at least a portion of the signal circuit of the power module is formed on the second circuit board, and at least one of the first circuit board and the second circuit board is correspondingly connected to the conductive connection interface.

[0013] Optionally, the power module further includes a thermistor; all the conductive connection interfaces include a thermistor signal interface, and at least part of the conductive line between the thermistor and the thermistor signal interface is formed on one or more of the first circuit board and the second circuit board.

[0014] Optionally, the power module further includes a detection circuit, and the detection circuit is at least partially disposed on the second circuit board, and a detection element is correspondingly disposed on the portion of the detection circuit disposed on the second circuit board.

[0015] Optionally, the detection element is arranged on a side of the second circuit board away from the first circuit board;

[0016] And / or, the detection circuit includes at least one of a current detection circuit and a voltage detection circuit.

[0017] Optionally, at least one of the first circuit board and the second circuit board is a flexible board.

[0018] Optionally, the power module also includes a packaging unit, which includes an annular shell and a cover structure, the annular shell forming a accommodating cavity, the annular shell surrounding the chip unit and accommodating the chip unit and at least a portion of the second circuit board through the accommodating cavity, in the thickness direction of the first circuit board, one end of the annular shell is connected to the substrate of the first circuit board, and the other end is connected to the cover structure, and silicone gel is filled between the cover structure and the substrate in the accommodating cavity.

[0019] Optionally, the sealing structure is formed by any one of a cover plate and epoxy resin, and a surface of the cover plate facing the first circuit board abuts against the annular shell;

[0020] And / or, the second circuit board is a flexible board, the flexible board includes a first board portion and a second board portion formed by bending, the first board portion is arranged corresponding to the chip unit, in the thickness direction of the first circuit board, the distance from the second board portion to the first circuit board is greater than the distance from the first board portion to the first circuit board, the annular shell is provided with an embedding groove, the position of the embedding groove corresponds to the position of the second board portion, the second board portion is accommodated in the embedding groove, and the depth of the embedding groove is consistent with the thickness of the second board portion;

[0021] And / or, in the thickness direction of the first circuit board, the distance from the surface of the silicone gel away from the first circuit board to the first circuit board is greater than or equal to the distance from the first board portion of the second circuit board to the first circuit board, and the first board portion is arranged corresponding to the chip unit.

[0022] Optionally, at least one of the conductive connection interfaces is embedded in the annular housing;

[0023] And / or, at least one of the first circuit board and the second circuit board has a setting portion exposed from the packaging unit, and at least one of the conductive connection interfaces is arranged at the setting portion.

[0024] In a second aspect, the utility model provides a power device, comprising the power module as described in the first aspect above.

[0025] In a third aspect, the utility model provides a power system, comprising the power device as described in the second aspect above.

[0026] Compared with the related prior art, in the power module, power device and power system of the utility model, the chip unit of the power module is installed on the circuit board, and the conductive connection interface is electrically connected to the chip unit, so that the power module can realize the electrical connection between the chip unit and the circuit structure outside the power module through the conductive connection interface, specifically, the electrical connection between the chip unit and the external circuit board can be realized. At least one conductive connection interface is set to be plug-in connected with the external circuit board, and the plug-in direction of the conductive connection interface plug-in connected with the external circuit board is set at a preset angle, such as a right angle, to facilitate the assembly and disassembly of the power module with the external circuit board through plug-in, and the large surface of the power module is not limited to being in contact with the external circuit board, which is convenient for arranging the heat dissipation structure of the power module; and / or, at least one conductive connection interface is set to be connected to the external circuit board via an external cable, so that the position restriction of the conductive connection interface relative to the external circuit board can be reduced, so that the arrangement position of the power module can be more flexible, and it is not limited to the large surface of the power module being in contact with the external circuit board, which is convenient for arranging the heat dissipation structure of the power module. In the utility model, the area of ​​the part where the power module is bonded to the external circuit board (for example, the circuit board is directly bonded or indirectly bonded via components such as a chip unit) will be greatly reduced or even unnecessary to bond, which is convenient for the heat dissipation of the power module and the arrangement of the heat dissipation structure of the power module. For example, heat dissipation and heat-conducting structures can be arranged on both sides of the power module in the thickness direction of the circuit board to improve the performance of the power module. In addition, the space occupied by the power module on the external circuit board can be reduced, thereby promoting the miniaturization design of the external circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the power module in the first embodiment of the utility model;

[0028] Figure 2 for Figure 1 The schematic diagram of the structure of the power module after the cover plate is disassembled is shown;

[0029] Figure 3 for Figure 2 A schematic diagram of the exploded structure of the power module after the second circuit board is separated from the chip unit;

[0030] Figure 4 It is a structural schematic diagram of the annular housing and the first circuit board being separated in the first embodiment of the utility model;

[0031] Figure 5 This is a schematic diagram of a state in which the power interface is separated from the first circuit board in the first embodiment of the utility model;

[0032] Figure 6An equivalent circuit diagram of a power module in the first embodiment of the utility model;

[0033] Figure 7 This is a simplified circuit diagram corresponding to the power module in the first embodiment of the utility model;

[0034] Figure 8 It is a structural schematic diagram of a second circuit segment corresponding to a high-voltage power interface formed by a second bonding wire in a second embodiment of the present utility model;

[0035] Fig. 9 It is a structural schematic diagram of a second line section corresponding to the high-voltage power interface in the third embodiment of the utility model formed by a third metal connecting sheet;

[0036] Fig.10 It is a schematic structural diagram of a fourth embodiment of the present utility model in which the upper surface of the silicone gel is flush with the upper surface of the first part of the second circuit board;

[0037] Fig.11 It is a schematic structural diagram of a power module after a sealing structure is formed by epoxy resin in the fourth embodiment of the present utility model.

[0038] Description of reference numerals:

[0039] 1-circuit board; 11-first circuit board; 111-substrate; 112-substrate; 1121-first metal layer; 1122-first insulating layer; 1123-second metal layer; 1121A-first conductive area; 1121B-second conductive area; 1121C-third conductive area; 1121D-fourth conductive area; 12-second circuit board; 121-first board portion; 122-second board portion; 2-chip unit; 21-upper bridge arm chip unit; 211-upper bridge arm power switch chip; 212-upper bridge arm diode chip; 22-lower bridge arm chip unit; 221-lower bridge arm power switch chip; 222-lower bridge arm diode chip; 201-upper metal connection layer; 202-chip body; 203-lower metal connection layer; 3-conductive connection interface; 31-signal interface; 311-signal terminal; 31A-thermal signal interface; 32-power rate interface; 321-first type power interface; 322-second type power interface; 3211-high voltage positive electrode interface; 3212-high voltage negative electrode interface; 3221-high voltage output interface; 301-high voltage positive terminal; 302-high voltage negative terminal; 303-high voltage output terminal; 304-shell portion; 41-first conductive circuit; 42-second conductive circuit; 43-third conductive circuit; 431-first circuit segment; 432-second circuit segment; 4321-second metal connecting piece; 4322-second bonding wire; 4333-third metal connecting piece; 44-fourth conductive circuit; 441-fourth metal connecting piece; 45-fifth conductive circuit; 451-first conductive block; 5-packaging unit; 51-annular shell; 511-accommodating cavity; 512-embedded groove; 52-cover plate; 53-epoxy resin; 6-thermistor; 7-silicone gel; 8-detection element. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.

[0043] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0044] In the accompanying drawings, the Z axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis (that is, the direction of the arrow of the Z axis) represents the up, and the negative direction of the Z axis represents the down; the X axis in the accompanying drawings represents the front and back position, and the positive direction of the X axis (that is, the direction of the arrow of the X axis) represents the front side, and the negative direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the horizontal direction and is designated as the left and right position, and the positive direction of the Y axis (that is, the direction of the arrow of the Y axis) represents the right side, and the negative direction of the Y axis represents the left side; it should be noted that the aforementioned Z axis, Y axis and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0045] like Figure 1 and Figure 2 As shown, in the first aspect, the utility model provides a power module, the power module includes a circuit board 1, a chip unit 2 and at least one conductive connection interface 3 for electrically connecting to an external circuit board, the chip unit 2 is mounted on the circuit board 1, and the conductive connection interface 3 is electrically connected to the chip unit 2;

[0046] Among them, at least one conductive connection interface 3 is used for plugging and connecting with an external circuit board, and the plugging direction of the conductive connection interface 3 plugging and connecting with the external circuit board is set at a preset angle with the thickness direction of the circuit board 1, and / or, at least one conductive connection interface 3 is used for connecting with an external circuit board via an external cable.

[0047] The circuit board 1 is an electronic component support and interconnection platform made according to a pre-designed circuit pattern. Its main function is to provide a stable physical structure for the power module, realize the electrical connection between electronic components, and provide a path for the transmission of current and signals. The circuit board 1 is formed with at least part of the circuit (or circuit pattern) for connecting with the chip unit 2, which will be explained in conjunction with a specific embodiment later.

[0048] The conductive connection interface 3 includes a conductive connection terminal. When the conductive connection interface 3 is electrically connected to an external circuit board, such as a driving board (the driving board is used to output a driving signal to the power module and control the operation of the power module), conduction is achieved through the conductive connection terminal. The manner in which the conductive connection terminal is electrically connected to the chip unit 2 is not limited and will be exemplified later.

[0049] When the conductive connection interface 3 is connected to the external circuit board via an external cable, the limitation of the position of the conductive connection interface 3 of the power module relative to the external circuit board will be greatly reduced. For example, all the conductive connection interfaces 3 can be set to be spaced apart from the external circuit board so that there is a gap between the power module and the external circuit board, thereby avoiding the power module and the external circuit board from being adhered to each other, for example, the large surface of the circuit board 1 (the large surface is the surface perpendicular to the thickness direction of the circuit board 1) is adhered to the external circuit board, which is not conducive to the arrangement of the heat dissipation and heat conductive structure of the power module and affects the heat dissipation performance of the power module.

[0050] When the conductive connection interface 3 is used for plugging and connecting with an external circuit board (in this case, a plug-in mating interface plug-connected with the conductive connection interface 3 is provided on the external circuit board), and the plug-in direction of the conductive connection interface 3 plug-connected with the external circuit board is set at a preset angle with the thickness direction of the circuit board 1, the large surface of the circuit board 1 of the power module can be exposed, so that a heat dissipation and heat-conducting structure can be arranged at the large surface position of the circuit board 1 as needed, which is beneficial to the heat dissipation of the power module.

[0051] It should be noted that the setting of the preset angle mainly makes the plug-in direction different from the direction parallel to the circuit board 1. On this basis, the preset angle can be approximately vertical. For example, the preset angle can be 70°-90°. In order to reduce the space occupied by the power module in the thickness direction of the circuit board 1, the preset angle can be set to 90°.

[0052] In some cases, the power module may include both a conductive connection interface 3 plug-connected to an external circuit board and a conductive connection interface 3 connected to an external circuit board via an external cable (not shown in the diagram of this solution).

[0053] For example, a set end of the circuit board 1 is provided with a conductive connection interface 3 for plugging with an external circuit board, but the space at the set end of the circuit board 1 is insufficient to arrange all of the conductive connection interfaces 3, so that the power module is also provided with a conductive connection interface 3 at a position other than the set end of the circuit board 1 that is connected to the external circuit board via a cable.

[0054] This arrangement can avoid all the conductive connection interfaces 3 being arranged too concentratedly at the set end of the circuit board 1, and facilitates the position arrangement of all the conductive connection interfaces 3. For example, a shorter wiring path can be selected based on meeting the corresponding conductive requirements, which is beneficial to reducing the energy consumption of the power module and reducing the heat generation of the power module. In addition, it can also avoid the distance between the conductive connection interfaces 3 being too small, which increases the difficulty of assembling the power module and the external circuit board.

[0055] In this embodiment, the chip unit 2 of the power module is mounted on the circuit board 1, and the conductive connection interface 3 is electrically connected to the chip unit 2, so that the power module can realize the electrical connection between the chip unit 2 and the circuit structure outside the power module through the conductive connection interface 3, specifically, the electrical connection between the chip unit 2 and the external circuit board can be realized. At least one conductive connection interface 3 is set to be plug-in connected with the external circuit board, and the plug-in direction of the conductive connection interface 3 plug-in connected with the external circuit board is set at a preset angle, such as a right angle, to facilitate the disassembly and assembly of the power module with the external circuit board through plug-in, and the large surface of the power module is not limited to being attached to the external circuit board, which is convenient for arranging the heat dissipation structure of the power module; and / or, at least one conductive connection interface 3 is set to be connected to the external circuit board via an external cable, so that the position restriction of the conductive connection interface 3 relative to the external circuit board can be reduced, so that the arrangement position of the power module can be more flexible, and it is not limited to the large surface of the power module being attached to the external circuit board, which is convenient for arranging the heat dissipation structure of the power module. In the utility model, the area of ​​the large surface of the power module that does not need to be bonded to the external circuit board (for example, the circuit board 1 is directly bonded or indirectly bonded via components such as the chip unit 2) will be greatly reduced or even unnecessary to bond, which is convenient for the heat dissipation of the power module and the arrangement of the heat dissipation structure of the power module. For example, heat dissipation and heat-conducting structures can be arranged on both sides of the power module in the thickness direction of the circuit board 1 to improve the performance of the power module. In addition, the space occupied by the power module on the external circuit board can be reduced, thereby promoting the miniaturization design of the external circuit board.

[0056] like Figure 1 and Figure 2 As shown, optionally, the conductive connection interface 3 connected to the cable is a plug-in interface.

[0057] Exemplarily, one end of the cable is plug-connected to the corresponding conductive connection interface 3 (plug-in interface) through a plug-in structure, and the other end is plug-connected to the external circuit board through, for example, another plug-in structure (other connection methods may also be used, which is not a limitation).

[0058] It should be understood that the plugging direction of the conductive connection interface 3 connected to the cable is not limited, and it can be parallel to the circuit board 1 or perpendicular to the circuit board 1. The plugging direction is the direction in which the plugging interface is plugged into the plugging structure of the cable.

[0059] When there are multiple plug-in interfaces, the plug-in directions of the multiple plug-in interfaces can be different. For example, the plug-in direction of the conductive connection interface 3 (plug-in interface) plugged into the external circuit board is perpendicular to the circuit board 1, and the plug-in direction of the conductive connection interface 3 (plug-in interface) plugged into the cable is parallel or perpendicular to the circuit board 1.

[0060] In this way, the power module can be connected to the external circuit board via the external cable through the conductive connection interface 3 in the form of the plug interface.

[0061] Furthermore, the plugging direction of the conductive connection interface 3 plug-connected to the cable is arranged at a preset angle with the thickness direction of the circuit board 1 .

[0062] It should be noted that the setting of the preset angle mainly makes the plug-in direction different from the direction parallel to the circuit board 1. On this basis, the preset angle can be approximately vertical. For example, the preset angle can be 70°-90°. In order to reduce the space occupied by the power module in the thickness direction of the circuit board 1, the preset angle can be set to 90°.

[0063] In this way, the plugging direction of the conductive connection interface 3 plugged with the cable can be substantially parallel to the large surface of the circuit board 1 , thereby avoiding the power module from requiring a large installation and connection space in the thickness direction of the circuit board 1 .

[0064] Furthermore, there are multiple conductive connection interfaces 3, all of which are plug-in interfaces and are located on the same side of the circuit board 1 in the thickness direction, and the angles between the plug-in directions corresponding to the conductive connection interfaces 3 and the thickness direction of the circuit board 1 are all preset angles, such as right angles. Thus, the size of the entire power module in the thickness direction of the circuit board 1 is small, the structure is compact, and the space occupied is small.

[0065] Optionally, at least one conductive connection interface 3 is arranged corresponding to a circumferential edge of the circuit board 1 .

[0066] Specifically, within the plane where the circuit board 1 is located, the minimum distance from the outer end point of the conductive connection interface 3 to the circumferential edge of the circuit board 1 (for example, the first circuit board 11 described later) is defined as a first distance. When the projection of the outer end point on the plane just falls on the circumferential edge of the circuit board 1, the first distance is zero. When the projection of the outer end point on the plane falls on the inner side of the circumferential edge of the circuit board 1, the first distance is less than or equal to a first threshold. When the projection of the outer end point on the plane falls on the outer side of the circumferential edge of the circuit board 1, the first distance is less than or equal to a second threshold. The first threshold and the second threshold may be the same or different, and may be determined according to actual needs.

[0067] Thus, the location setting of the conductive connection interface 3 is conducive to the arrangement of the chip unit 2 on the circuit board 1 and is conducive to the connection of the conductive connection interface 3 with a cable or directly with an external circuit board.

[0068] This specification will later use the example that all the conductive connection interfaces 3 are plug-in interfaces to illustrate the content of the utility model, but it should be understood that some of the conductive connection interfaces 3 can be plug-in connected to the external circuit board, and some of the conductive connection interfaces 3 can be plug-in connected to the cable, which is not a limitation. In other words, at this time, the power module is embodied as each conductive connection interface 3 is a plug-in interface, but it does not limit the object to which the plug-in interface is plugged.

[0069] like Figure 1 and Figure 2 As shown, in the above embodiment, all the conductive connection interfaces 3 include at least one of a signal interface 31 and a power interface 32 .

[0070] It should be noted that the signal interface 31 is used for external connection of the signal circuit of the chip unit 2 of the power module to realize external communication of the power module, and the power interface 32 is used for external power transmission connection of the power circuit of the chip unit 2 of the power module.

[0071] It should be understood that, in the above embodiment, the circuit board 1 may only include the first circuit board 11 , and the chip unit 2 is mounted on the first circuit board 11 , which will not be described in detail herein.

[0072] like Figures 1 to 3 As shown, optionally, there are multiple circuit boards 1, the multiple circuit boards 1 include a first circuit board 11 and a second circuit board 12, the chip unit 2 is arranged between the first circuit board 11 and the second circuit board 12, and the chip unit 2 is installed on the first circuit board 11;

[0073] At least a portion of the power circuit of the power module and / or at least a portion of the signal circuit of the power module is formed on the first circuit board 11, and at least a portion of the power circuit of the power module and / or at least a portion of the signal circuit of the power module is formed on the second circuit board 12. At least one of the first circuit board 11 and the second circuit board 12 is correspondingly connected to a conductive connection interface 3.

[0074] The power circuit of the power module is mainly used to realize the conversion and transmission of electric energy. Specifically, it includes the chip unit 2, the part that realizes the electric energy transmission between the chips of the chip unit 2, and the part that realizes the electric energy transmission between the chip and the power terminal of the power interface 32. The power circuit converts the input electric energy into electric energy and then outputs it. The signal circuit of the power module is responsible for processing and transmitting low-voltage and low-current electrical signals such as control, monitoring, and feedback. These signals are usually not directly involved in the conversion of electric energy, but are used to control the working state of the power semiconductor device. The specific structural arrangement of the power circuit and the signal circuit can adopt relevant technologies.

[0075] In this way, the chip unit 2 is arranged between the first circuit board 11 and the second circuit board 12, for example, the second circuit board 12, the chip unit 2 and the first circuit board 11 are arranged in sequence from top to bottom, and the first circuit board 11 can be used to form at least part of the power circuit of the power module and / or at least part of the signal circuit of the power module, and the second circuit board 12 can be used to form at least part of the power circuit of the power module and / or at least part of the signal circuit of the power module. Compared with the circuit board 1 being set as a circuit board 1, for example, only having the first circuit board 11, it is beneficial to set a conductive circuit with a larger cross-sectional area on the first circuit board 11 and / or the second circuit board 12, which can enhance the current capacity of the corresponding conductive circuit, and can avoid excessive current density to a certain extent. The circuit loss is too large, and the heat generation of the power module is reduced. It can also reduce the total length of the bonding wire used in the traditional power module to a certain extent, and reduce the stray inductance of the power module.

[0076] The type and quantity of the chips provided in the chip unit 2 are determined according to specific requirements. This specification will hereinafter take a half-bridge power module as an example to illustrate the contents of the utility model.

[0077] Specifically, Figures 1 to 6 The power module shown can be equivalent to Figure 7 The half-bridge power module shown in Figure 1 is Figure 7As shown, the chip unit 2 includes a bridge arm chip unit, and the bridge arm chip unit includes an upper bridge arm chip unit 21 and a lower bridge arm chip unit 22. The upper bridge arm chip unit 21 may include an upper bridge arm power switch chip 211 and an upper bridge arm diode chip 212, and the lower bridge arm chip unit 22 may include a lower bridge arm power switch chip 221 and a lower bridge arm diode chip 222. The upper bridge arm power switch chip 211 may be an IGBT tube chip (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), a MOS tube chip, etc. (Metal-Oxide-Semiconductor Field-Effect Transistor, metal-oxide-semiconductor field-effect transistor). This specification takes the example that each power switch chip is an IGBT tube chip to illustrate the utility model.

[0078] The power interface 32 of the power module can be set to three, namely, a high-voltage positive electrode interface 3211, a high-voltage negative electrode interface 3212 and a high-voltage output interface 3221 (such as Figure 3 , Figure 6 and Figure 7 ), the conductive connection terminals of the high-voltage positive electrode interface 3211, the high-voltage negative electrode interface 3212 and the high-voltage output interface 3221 are respectively the high-voltage positive electrode terminal 301, the high-voltage positive electrode terminal 302 and the high-voltage output terminal 303 (such as Figure 4 and Figure 5 ).

[0079] like Figure 7 As shown, exemplarily, the collector of the upper bridge arm power switch chip 211 is connected to the high voltage positive electrode interface 3211, the emitter of the upper bridge arm power switch chip 211 is connected to the collector of the lower bridge arm power switch chip 221, and the emitter of the lower bridge arm power switch chip 221 is connected to the high voltage negative electrode interface 3212. After the upper bridge arm power switch chip 211 and the lower bridge arm power switch chip 221 are connected, they are connected to the high voltage output terminal 303 at the common end.

[0080] It should be understood that the power module can be a full-bridge power module in addition to a half-bridge power module. Without violating the design concept of the present invention, it can be an H-bridge module, a basic full-bridge module, a multi-level full-bridge module, a matrix full-bridge module, etc. The full-bridge power module can be provided with a plurality of bridge arm chip units described later as needed, for example, it can include three bridge arm chip units to form a chip unit 2 with a three-phase bridge arm, which will not be described in detail here.

[0081] like Figure 7As shown, optionally, the signal circuit of the power module includes a first conductive circuit 41, all conductive connection interfaces 3 include a signal interface 31, and a signal terminal 311 of the signal interface 31 is connected to the first conductive circuit 41 ( Figure 7 The first conductive line 41 is shown by the thickest solid line in the figure) and is connected to (eg, a control port of) the chip unit 2 , and the second circuit board 12 is formed with the first conductive line 41 .

[0082] Specifically, the control port of the chip unit 2 is arranged on the top surface of the corresponding chip (i.e., the side facing the second circuit board 12), the signal interface 31 is arranged on the side of the second circuit board 12 away from the first circuit board 11, the first end of the first conductive circuit 41 is located on the side of the second circuit board 12 away from the first circuit board 11, the first end of the first conductive circuit 41 is electrically connected to the signal terminal 311 of the signal interface 31, and the second end of the first conductive circuit 41 is located on the side of the second circuit board 12 facing the first circuit board 11 to be electrically connected to the control port of the corresponding chip. Here, the electrical connection method can adopt relevant technology, usually welding connection.

[0083] Taking one of the chips as an example, specifically, taking the upper bridge arm power switch chip 211 as an example, its gate is located at the top of the upper bridge arm power switch chip 211 and constitutes a control port of the chip unit 2, and the second end of the first conductive line 41 is electrically connected to the gate at the top of the upper bridge arm power switch chip 211, for example, welding and forming an upper metal connection layer 201 (constituting an area of ​​the upper metal connection layer 201, the upper metal connection layer 201 is at the top of the upper bridge arm power switch chip 211) Figure 8 , which is located at the upper end of the chip body 202).

[0084] like Figure 7 As shown, the first conductive circuit 41 is schematically shown by the thickest solid line. The number of signal interfaces 31 can be set to multiple, wherein each signal interface 31 can include multiple conductive connection terminals, and the multiple conductive connection terminals constitute multiple signal terminals 311. Each signal terminal 311 can be correspondingly provided with a first conductive circuit 41, and its specific wiring method on the second circuit board 12 can adopt related technologies. The second circuit board 12 can be a hard board or a flexible board.

[0085] In this way, the second circuit board 12 is used to form the first conductive circuit 41, and the signal terminal 311 of the signal interface 31 is connected to the chip unit 2 (for example, the control port) through the first conductive circuit 41, avoiding the use of the first circuit board 11 and bonding wires to form the first conductive circuit 41, which can improve the service life and power cycle number of the power module to a certain extent.

[0086] In an optional solution of the power circuit of the power module, the power circuit of the power module includes a second conductive circuit 42 , and the chips of the chip unit 2 are connected by the second conductive circuit 42 ; the second conductive circuit 42 is formed on the second circuit board 12 .

[0087] It should be understood that, depending on the specific structure of the power module, the second conductive line 42 may include a plurality of line segments, and each of the line segments is used to achieve connection between chips.

[0088] like Figure 7 As shown, exemplarily, the chip unit 2 includes a bridge arm chip unit, the bridge arm chip unit includes an upper bridge arm chip unit 21 and a lower bridge arm chip unit 22, the upper bridge arm chip unit 21 and the lower bridge arm chip unit 22 are connected through a second conductive line 42; the second conductive line 42 is formed on the second circuit board 12. The second conductive line 42 is used to realize the power transmission between the upper bridge arm chip unit 21 and the lower bridge arm chip unit 22.

[0089] Figure 7 The second conductive line 42 is schematically shown by a medium-thick solid line, and the power end at the top of the upper bridge arm power switch chip 211 and the power end of the lower bridge arm power switch chip 221 are connected through the second conductive line 42. Specifically, the emitter of the upper bridge arm power switch chip 211 and the collector of the lower bridge arm power switch chip 221 are both located at the top, and the second conductive line 42 is electrically connected to the emitter at the top of the upper bridge arm power switch chip 211, for example, by welding and forming an upper metal connection layer 201 (constituting another region of the upper metal connection layer 201) at the top of the upper bridge arm power switch chip 211, and the second conductive line 42 is electrically connected to the collector and emitter at the top of the lower bridge arm power switch chip 221, for example, by welding.

[0090] In this way, the power circuit of the power module includes a second conductive circuit 42 formed by the second circuit board 12, and the chips of the chip unit 2 are connected through the second conductive circuit 42, which is beneficial to reducing the use length of the bonding wire in the power module and reducing stray inductance. It is also beneficial to quickly realize the connection between chips through the connection between the second circuit board 12 and the chip unit 2, thereby improving the modularity of the power module and further improving the assembly efficiency of the power module.

[0091] Of course, it should be understood that, unlike the above-mentioned implementation in which the second conductive circuit 42 is formed on the second circuit board 12, the second conductive circuit 42 includes at least one of a first bonding wire and a first metal connecting sheet. For example, the connection requirements between the corresponding chips are met by a plurality of first bonding wires, or the connection requirements between the corresponding chips are met by a plurality of first metal connecting sheets. The cross-sectional area of ​​the first metal connecting sheet is generally larger than the cross-sectional area of ​​the first bonding wire, which is conducive to enhancing the current carrying capacity of the second conductive circuit 42, which is not shown in the diagram of this scheme and will not be described in detail here.

[0092] In an optional scheme of the power circuit of the power module, the power circuit of the power module includes a third conductive circuit 43, all conductive connection interfaces 3 include a power interface 32, all power interfaces 32 include a first type power interface 321, and the power terminal of the first type power interface 321 is connected to the chip unit 2 through the third conductive circuit 43.

[0093] The third conductive circuit 43 includes a first circuit segment 431 and a second circuit segment 432. The first circuit segment 431 is formed on the first circuit board 11. The power terminal of the first type power interface 321, the second circuit segment 432, the first circuit segment 431 and one end of at least one chip of the chip unit 2 facing the first circuit board 11 are connected. That is, they are connected to the bottom end of at least one chip of the chip unit 2.

[0094] like Figures 2 to 7 As shown, the high-voltage positive electrode interface 3211 and the high-voltage negative electrode interface 3212 are both first-type power interfaces 321 , and the power terminals of the high-voltage positive electrode interface 3211 and the high-voltage negative electrode interface 3212 are the high-voltage positive electrode terminal 301 and the high-voltage negative electrode terminal 302 , respectively.

[0095] like Figure 5 As shown, in an optional solution of the third conductive circuit 43 , a second circuit segment 432 corresponding to at least one power interface 32 is formed by a second metal connecting sheet 4321 .

[0096] The high-voltage positive terminal 301 and the high-voltage negative terminal 302 are respectively connected to the second metal connecting plate 4321. Taking the high-voltage positive terminal 301 as an example, one end of the second metal connecting plate 4321 is connected to the high-voltage positive terminal 301, and the other end is connected to the end of the first line segment 431 on the first circuit board 11 away from the chip unit 2.

[0097] The first line segment 431 of the third conductive line 43 is formed on the first metal layer 1121 of the substrate 112 of the first circuit board 11. The first line segment 431 may be Figure 5 The first conductive region 1121A is shown. Exemplarily, the lower end of the upper bridge arm power switch chip 211 is connected to the first conductive region 1121A, for example, by welding to form a lower metal connection layer 203 (refer to Figure 8 ) to achieve electrical connection between the collector of the upper bridge arm power switch chip 211 and the first conductive region 1121A.

[0098] like Figure 8As shown, the first metal layer 1121 is usually the top layer of the substrate 112, and the substrate 112 is usually fixed on the base plate 111 of the first circuit board 11, for example, by welding the second metal layer 1123 of the substrate 112 to the base plate 111, and the second metal layer 1123 and the base plate 111 can be welded to form a solder layer, which is usually a metal layer. The first metal layer 1121 and the second metal layer 1123 should be insulated, for example, by the first insulating layer 1122.

[0099] The emitter of the lower bridge arm power switch chip 221 is arranged at the lower end, and the lower end of the lower bridge arm power switch chip 221 is connected to the power terminal (i.e., the high voltage negative terminal 302) of the high voltage negative electrode interface 3212 through another third conductive line 43. The first line segment 431 of the other third conductive line 43 is formed on the first metal layer 1121 of the substrate 112 of the first circuit board 11, and the first line segment 431 can be Figure 5 The second conductive region 1121B is shown.

[0100] like Figure 8 As shown, in an optional solution of the third conductive line 43, at least one second line segment 432 corresponding to the first type power interface 321 is formed by a second bonding wire 4322. The second bonding wire 4322 is arranged in a similar manner to the second metal connecting sheet 4321, and will not be described in detail here.

[0101] In an optional solution of the third conductive circuit 43 , at least one second circuit segment 432 corresponding to the first type power interface 321 is formed on the second circuit board 12 , and the power terminal is connected to the second circuit board 12 .

[0102] Taking the high-voltage positive interface 3211 as an example, its high-voltage positive terminal 301 is connected to the first end of the second circuit segment 432 on the second circuit board 12, the second end of the second circuit segment 432 is connected to the first conductive circuit 41 formed by the first conductive area 1121A, and the lower end of the upper bridge arm power switch chip 211 is connected to the first conductive circuit 41 formed by the first conductive area 1121A, thereby realizing the conductive connection between the high-voltage positive interface 3211 and the upper bridge arm power switch chip 211, which is not shown in this scheme diagram and will not be described in detail here.

[0103] In an optional solution of the third conductive line 43, at least one second line segment 432 corresponding to the first type power interface 321 includes a first part and a second part, the first part is formed on the second circuit board 12, the second part is respectively connected to the first part and the power terminal, and the second part includes a third bonding wire and a third metal connecting sheet 4333 (reference Fig. 9 )

[0104] Taking the high-voltage positive interface 3211 as an example, its high-voltage positive terminal 301 is connected to the lower end of the upper bridge arm power switch chip 211 through the second part of the second circuit segment 432 (the third bonding wire or the third metal connecting plate 4333), the first part of the second circuit segment 432 (formed on the second circuit board 12), and the first circuit segment 431 formed by the first conductive area 1121A on the first circuit board 11, thereby realizing the conductive connection between the high-voltage positive interface 3211 and the upper bridge arm power switch chip 211.

[0105] It should be noted that the power module may have only one optional solution of the third conductive circuit 43 , or may have multiple optional solutions of the third conductive circuit 43 , which will not be described in detail here.

[0106] refer to Figure 7 As shown, optionally, all conductive connection interfaces 3 include a second type power interface 322, the power circuit of the power module includes a fourth conductive circuit 44, and the power terminal of the second type power interface 322 is connected to one end of at least one chip of the chip unit 2 facing the second circuit board 12 via the fourth conductive circuit 44.

[0107] In this embodiment, the high-voltage output interface 3221 is a second-type power interface 322, and its corresponding power terminal is a high-voltage output terminal 303 (such as Figure 4 and Figure 5 As shown in FIG. 1 , the high voltage output terminal 303 is connected to the common connection end of the upper bridge arm chip unit 21 and the lower bridge arm chip unit 22 through the fourth conductive line 44. Specifically, the fourth conductive line 44 is connected to the upper end (e.g., emitter) of the upper bridge arm power switch chip 211 and the upper end (e.g., collector) of the lower bridge arm power switch chip 221.

[0108] In the first optional solution of the fourth conductive circuit 44 , the fourth conductive circuit 44 corresponding to at least one second-type power interface 322 is formed on the second circuit board 12 .

[0109] At this time, the high voltage output terminal 303 of the high voltage output interface 3221 is connected to one end of the fourth conductive line 44 on the second circuit board 12, and the other end of the fourth conductive line 44 is connected to the upper end of the corresponding chip. Figure 7 As shown, in this case, the fourth conductive trace 44 can utilize a partial trace section of the second conductive trace 42 .

[0110] In optional scheme 2 of the fourth conductive circuit 44, at least one fourth conductive circuit 44 includes a third circuit segment and a fourth circuit segment, the third circuit segment is formed on the second circuit board 12, and the fourth circuit segment is at least partially formed on the first circuit board 11, and the power terminal, the fourth circuit segment, the third circuit segment and the chip unit 2 are connected in sequence.

[0111] In an optional solution of this embodiment, the fourth line segment can be formed entirely on the first circuit board 11. In this case, the high voltage output terminal 303 of the high voltage output interface 3221 is directly connected to the fourth line segment on the first circuit board 11. This solution is not shown in the figure and will not be described in detail later.

[0112] refer to Figure 5 As shown, in an optional scheme of this embodiment, the fourth circuit segment can be partially formed on the first circuit board 11. Exemplarily, the fourth circuit segment includes a third conductive area 1121C and a fourth metal connecting plate 441 formed on the first metal layer 1121 of the first circuit board 11. The high-voltage output terminal 303 of the high-voltage output interface 3221 is connected to the chip unit 2 via the fourth metal connecting plate 441, the third conductive area 1121C, and the third circuit segment (not shown in the figure) formed on the second circuit board 12.

[0113] It should be understood that the third conductive region 1121C can be set to multiple as needed, the fourth metal connecting plate 441 can also be replaced by a fourth bonding wire, and the second conductive block can be selectively used when the third conductive region 1121C is connected to the second circuit board 12. The second conductive block is similar to the first conductive block 451 described later and will not be described in detail here.

[0114] In this way, the second circuit board 12 can be used to form at least a partial connection circuit connecting the second type of power interface 322 with the chip unit 2, which can reduce the use length of the bonding wires in the power circuit and reduce stray inductance. It is also beneficial to quickly realize the connection of the power circuits between chips through the connection between the second circuit board 12 and the chip unit 2.

[0115] In the above embodiment, optionally, at least one of the first circuit board 11 and the second circuit board 12 is a flexible board.

[0116] In this embodiment, the first circuit board 11 is a hard board, and the second circuit board 12 is a flexible board. However, without violating the design concept of the present invention, the first circuit board 11 may also be a flexible board.

[0117] The flexible board is made of a flexible insulating substrate (such as a polyimide film). It is bendable and foldable, can adapt to the wiring requirements of three-dimensional space, is convenient for the structural arrangement of the circuit board 1 in the power module, and is conducive to the lightweight and miniaturized design of the power module. The flexible board can be provided with multiple conductive wiring layers as needed, which will not be described in detail here.

[0118] like Figure 8 As shown, in the above embodiment, optionally, the power module further includes a thermistor 6; all the conductive connection interfaces 3 include a thermistor signal interface (31A) (refer to Figure 3), at least part of the conductive line between the thermistor 6 and the thermistor signal interface (31A) is formed on one or more of the first circuit board 11 and the second circuit board 12.

[0119] Specifically, the signal circuit of the power module includes a fifth conductive circuit 45, and the signal ends of the thermistor 6 are respectively provided with fifth conductive circuits 45, and the signal ends of the thermistor 6 are connected to the signal terminals 311 of the thermistor signal interface 31A through the corresponding fifth conductive circuits 45; the fifth conductive circuits 45 are formed on one or more of the first circuit board 11 and the second circuit board 12.

[0120] Thermistor 6 is usually located near the heating area of ​​chip unit 2, for example, the distance between thermistor 6 and one of the power switch chips is less than or equal to a preset distance. Thermistor 6 can be set to one or more as needed, which will not be described in detail here.

[0121] The fifth conductive circuit 45 is determined according to the location of the circuit board 1 where the thermistor 6 is located and the location of the thermistor signal interface 31A, which will be exemplarily described in conjunction with embodiments below.

[0122] In this way, the power module includes the thermistor 6 and can output detection information of the thermistor 6 to the outside through the thermistor signal interface 31A.

[0123] Optionally, the fifth conductive circuit 45 includes a fifth circuit segment and a sixth circuit segment, the fifth circuit segment is arranged on the first circuit board 11, the sixth circuit segment is arranged on the second circuit board 12, the thermistor 6 is arranged on the first circuit board 11, and the signal end of the thermistor 6, the fifth circuit segment, the sixth circuit segment and the signal terminal 311 of the thermistor signal interface 31A are connected in sequence.

[0124] like Figure 8 As shown, specifically, the two fifth line segments respectively include two fourth conductive areas 1121D and a first conductive block 451 arranged in the fourth conductive area 1121D, and are connected to the sixth line segment (not shown in the figure) on the second circuit board 12 through the first conductive block 451. The two fourth conductive areas 1121D are both formed in the first metal layer 1121 of the substrate 112 of the first circuit board 11.

[0125] With this arrangement, the thermistor 6 can be arranged on the first circuit board 11, and both the thermistor 6 and the power chip are connected to the first circuit board 11, which is beneficial for the resistance change of the thermistor 6 to adapt to the temperature of the power chip. In addition, the thermistor signal interface 31A can be arranged on the second circuit board 12, which is beneficial for the position arrangement of the thermistor signal interface 31A and the spatial position arrangement of all conductive connection interfaces 3.

[0126] Of course, it should be understood that in other embodiments, the second line segment 432 may be provided only on the first circuit board 11 . In this case, the signal end of the thermistor signal interface 31A is directly connected to the first circuit board 11 , which will not be described in detail here.

[0127] like Figure 2 As shown, in the above embodiment, optionally, the power module further includes a detection circuit, and the detection circuit is at least partially disposed on the second circuit board 12 , and the detection element 8 is correspondingly disposed on the portion of the detection circuit disposed on the second circuit board 12 .

[0128] Specifically, the detection circuit is used to detect the parameters of the chip unit 2, and different detection elements 8 can be set according to different detection items.

[0129] In this embodiment, at least part of the detection circuit is disposed on the second circuit board 12, and the part disposed on the second circuit board 12 is used to arrange the detection element 8, thereby facilitating the arrangement of the detection circuit and the corresponding detection element 8, avoiding setting the detection element 8 on the first circuit board 11 and causing the components on the first circuit board 11 to be too crowded, avoiding causing the cross-sectional area of ​​the conductive circuit thereon to be too small, thereby affecting its performance, such as overcurrent performance.

[0130] like Figure 2 As shown, in a further optional solution of the detection circuit, the detection element 8 is arranged on a side of the second circuit board 12 facing away from the first circuit board 11 .

[0131] In this way, the detection element 8 on the second circuit board 12 can be prevented from interfering with the chip unit 2 on the first circuit board 11 , and the structural layout is reasonable.

[0132] In a further optional solution of the detection circuit, the detection circuit includes at least one of a current detection circuit and a voltage detection circuit.

[0133] The voltage detection circuit may include one or more of an input voltage detection circuit and an output voltage detection circuit. The current detection circuit and the voltage detection circuit may adopt related technologies, which will not be described in detail here.

[0134] In this way, the corresponding current detection requirement can be met by the current detection circuit, and the corresponding voltage detection requirement can be met by the voltage detection circuit.

[0135] In the above embodiment, optionally, the power module further includes a packaging unit 5, the packaging unit 5 includes an annular shell 51 and a cover structure, the annular shell 51 is formed with a receiving cavity 511, the annular shell 51 surrounds the chip unit 2 and receives at least part of the chip unit 2 and the second circuit board 12 through the receiving cavity 511, in the thickness direction of the first circuit board 11, one end of the annular shell 51 is connected to the substrate 111 of the first circuit board 11, and the other end is connected to the cover structure, and the space between the cover structure and the substrate 111 in the receiving cavity 511 is filled with silicone gel 7 (refer to Fig.10 ).

[0136] It should be noted that after the power module is packaged, the relative positions of the substrate 111 of the first circuit board 11, the annular shell 51 and the cover structure should remain fixed, and the annular shell 51 and the substrate 111 of the first circuit board 11 can be fixed by, for example, bonding.

[0137] In this way, the packaging reliability of the power module can be ensured by the packaging unit 5 , and the waterproof and dustproof performance of the chip unit 2 can be ensured.

[0138] like Figures 1 to 4 As shown, in an optional solution of the packaging unit 5 , the cover structure is formed by a cover plate 52 , and the surface of the cover plate 52 facing the first circuit board 11 abuts against the annular shell 51 .

[0139] In this embodiment, the cover plate 52 and the annular housing 51 can be bonded, snap-fitted or connected by fasteners. At this time, there is usually a gap between the surface of the cover plate 52 facing the first circuit board 11 and the main part of the second circuit board 12, such as the first plate part 121 described later, for example, the gap between the chip units 2 and the gap are filled with silicone gel 7. This ensures the waterproof, dustproof and heat conductive requirements for the main part of the second circuit board 12 and the chip unit 2. Figures 1 to 4 The silicone gel 7 is not shown.

[0140] like Fig.11 As shown, in an alternative solution of the packaging unit 5 , the cover structure is formed by epoxy resin 53 .

[0141] Specifically, the epoxy resin 53 is filled on the side of the second circuit board 12 in the accommodating cavity 511 that is away from the first circuit board 11 , and the cured epoxy resin 53 is used to ensure the structural performance of the power module.

[0142] As Fig. 9As shown, in the above embodiment, optionally, the second circuit board 12 is a flexible board, and the flexible board includes a first plate portion 121 and a second plate portion 122 formed by bending. The first plate portion 121 is arranged corresponding to the chip unit 2, and in the thickness direction of the first circuit board 11, the distance from the second plate portion 122 to the first circuit board 11 is greater than the distance from the first plate portion 121 to the first circuit board 11, and the second plate portion 122 abuts against the annular shell 51 in the thickness direction of the first circuit board 11.

[0143] like Fig.10 and Fig.11 As shown, further, an embedding groove 512 is provided on the annular shell 51 , and the position of the embedding groove 512 corresponds to the position of the second plate portion 122 , and the second plate portion 122 is accommodated in the embedding groove 512 .

[0144] Specifically, the depth of the embedding groove 512 is consistent with the thickness of the second plate portion 122. The second plate portion 122 is located at the edge of the flexible board, and the second circuit board 12 has the second plate portion 122 at both ends in the X-axis direction. The first plate portion 121 is lower than the second plate portion 122 in the up-down direction. When the second plate portion 122 is accommodated in the embedding groove 512, the upper surface of the second circuit board 12 at the second plate portion 122 is flush with the top surface of the annular shell 51.

[0145] At this time, in an optional solution, the second plate portion 122 is pressed tightly into the embedding groove 512 using the cover plate 52, and then the silicone gel 7 is filled by, for example, glue pouring.

[0146] In another optional solution, a covering structure is formed using epoxy resin 53, the upper surface of the covering structure is flush with the top surface of the annular shell 51, the covering structure is fixed in position using the bonding force between the covering structure and the inner wall of the annular shell 51, and the covering structure is used to press down, for example, the first plate portion 121 of the second circuit board 12.

[0147] In the above embodiment, optionally, in the thickness direction of the first circuit board 11, the distance from the surface of the silicone gel 7 away from the first circuit board 11 to the first circuit board 11 is greater than or equal to the distance from the first board portion 121 of the second circuit board 12 to the first circuit board 11, and the first board portion 121 is arranged corresponding to the chip unit 2.

[0148] Specifically, when the covering structure is formed by the cover plate 52, in order to prevent the cover plate 52 from crushing the second circuit board 12, it is preferred to set the surface of the cover plate 52 facing the first circuit board 11 to be spaced apart from the first plate portion 121 of the second circuit board 12, so that the distance from the surface of the silicone gel 7 away from the first circuit board 11 to the first circuit board 11 is generally greater than the distance from the first plate portion 121 of the second circuit board 12 to the first circuit board 11.

[0149] When the cover structure is formed by epoxy resin 53, the silicone gel 7 is generally filled first, and then the epoxy resin 53 is filled. At this time, the distance from the surface of the silicone gel 7 away from the first circuit board 11 to the first circuit board 11 is preferably equal to the distance from the first board portion 121 of the second circuit board 12 to the first circuit board 11, that is, the upper surface of the filled silicone gel 7 is preferably flush with the upper surface of the first board portion 121 of the second circuit board 12. Therefore, on the basis of ensuring the filling of the silicone gel 7 between the chips of the chip unit 2, the fixing performance of the second circuit board 12 can be ensured by the cured epoxy resin 53.

[0150] In the above embodiment, optionally, at least one conductive connection interface 3 is embedded in the annular shell 51 .

[0151] Specifically, Figures 1 to 5 FIG. 5 shows a case where the power interfaces 32 are all embedded in the annular housing 51. Figure 4 As shown, exemplarily, the high-voltage positive electrode interface 3211 includes a shell portion 304 and a high-voltage positive terminal 301, wherein the shell portion 304 is integrally connected to the annular shell 51, and the high-voltage positive terminal 301 is disposed in the shell portion 304. When the high-voltage positive electrode interface 3211 is plugged in and connected to, for example, an external cable, the high-voltage positive terminal 301 and the cable conduct electricity through contact.

[0152] In this way, the space occupied by the annular shell 51 is used to arrange the conductive connection interface 3 , such as the power interface 32 , so that the position stability of the power interface 32 can be ensured and the position arrangement of the power interface 32 is facilitated.

[0153] In the above embodiment, optionally, at least one of the first circuit board 11 and the second circuit board 12 has a setting portion exposed from the packaging unit 5 , and at least one conductive connection interface 3 is disposed in the setting portion.

[0154] Specifically, the setting part includes the second board portion 122 of the second circuit board 12 in the above embodiment, and the second board portion 122 is provided with a conductive connection interface 3. For example, the second board portion 122 is provided with a signal interface 31.

[0155] In this way, there is no need to utilize the limited space occupied by the packaging unit 5, especially the annular shell 51, to arrange all the conductive connection interfaces 3, which facilitates the spatial arrangement of the conductive connection interfaces 3 in the power module. For example, the annular space of the annular shell 51 can be utilized to arrange part of the conductive connection interfaces 3, and the outer space of the annular shell 51 in the thickness direction of the first circuit board 11 can also be utilized to arrange part of the conductive connection interfaces 3, thereby avoiding the problem of difficulty in assembly and wiring caused by excessive concentration of the conductive connection interfaces 3.

[0156] In a second aspect, the utility model provides a power device, which includes the power module of the above embodiment.

[0157] It should be understood that the power module may be at least one of a half-bridge power module and a full-bridge power module. The power device may be an inverter, a converter, and the like.

[0158] In the third aspect, the utility model provides a power system, which includes the power device of the above embodiment. For example, the power system can be a photovoltaic system, an energy storage system, etc. No detailed description is given here.

[0159] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A power module, characterized in that: The power module comprises a circuit board (1), a chip unit (2) and at least one conductive connection interface (3) for electrically connecting to an external circuit board, wherein the chip unit (2) is mounted on the circuit board (1), and the conductive connection interface (3) is electrically connected to the chip unit (2); Wherein, at least one of the conductive connection interfaces (3) is used for plugging and connecting with the external circuit board, and the plugging direction of the conductive connection interface (3) plugging and connecting with the external circuit board is arranged at a preset angle with the thickness direction of the circuit board (1), and / or at least one of the conductive connection interfaces (3) is used for connecting with the external circuit board via an external cable.

2. The power module according to claim 1, characterized in that: The conductive connection interface (3) connected to the cable is a plug-in interface.

3. The power module according to claim 2, characterized in that: The plugging direction of the conductive connection interface (3) plug-connected to the cable is arranged at a preset angle with the thickness direction of the circuit board (1).

4. The power module according to claim 1, characterized in that: At least one of the conductive connection interfaces (3) is arranged corresponding to a circumferential edge of the circuit board (1).

5. The power module according to claim 1, characterized in that: All of the conductive connection interfaces (3) include at least one of a signal interface (31) and a power interface (32).

6. The power module according to claim 1, characterized in that: The number of the circuit boards (1) is multiple, the multiple circuit boards (1) include a first circuit board (11) and a second circuit board (12), the chip unit (2) is arranged between the first circuit board (11) and the second circuit board (12), and the chip unit (2) is mounted on the first circuit board (11); At least part of the power circuit of the power module and / or at least part of the signal circuit of the power module are formed on the first circuit board (11), and at least part of the power circuit of the power module and / or at least part of the signal circuit of the power module are formed on the second circuit board (12), and at least one of the first circuit board (11) and the second circuit board (12) is correspondingly connected to the conductive connection interface (3).

7. The power module according to claim 6, characterized in that: The power module further comprises a thermistor (6); all the conductive connection interfaces (3) comprise a thermistor signal interface (31A), and at least part of the conductive line between the thermistor (6) and the thermistor signal interface (31A) is formed on one or more of the first circuit board (11) and the second circuit board (12).

8. The power module according to claim 6, characterized in that: The power module further comprises a detection circuit, wherein at least part of the detection circuit is arranged on the second circuit board (12), and a detection element (8) is arranged corresponding to the part of the detection circuit arranged on the second circuit board (12).

9. The power module according to claim 8, characterized in that: The detection element (8) is arranged on a side of the second circuit board (12) facing away from the first circuit board (11); And / or, the detection circuit includes at least one of a current detection circuit and a voltage detection circuit.

10. The power module according to any one of claims 6 to 9, characterized in that: At least one of the first circuit board (11) and the second circuit board (12) is a flexible board.

11. The power module according to any one of claims 6 to 9, characterized in that: The power module further comprises a packaging unit (5), the packaging unit (5) comprising an annular shell (51) and a sealing structure, the annular shell (51) forming a receiving cavity (511), the annular shell (51) surrounding the chip unit (2) and accommodating the chip unit (2) and at least part of the second circuit board (12) through the receiving cavity (511), one end of the annular shell (51) being connected to the substrate (111) of the first circuit board (11) in the thickness direction of the first circuit board (11), and the other end being connected to the sealing structure, and the space between the sealing structure and the substrate (111) in the receiving cavity (511) being filled with silicone gel (7).

12. The power module according to claim 11, characterized in that: The sealing structure is formed by any one of a cover plate (52) and an epoxy resin (53), and the surface of the cover plate (52) facing the first circuit board (11) abuts against the annular shell (51); And / or, the second circuit board (12) is a flexible board, the flexible board comprises a first board portion (121) and a second board portion (122) formed by bending, the first board portion (121) is arranged corresponding to the chip unit (2), in the thickness direction of the first circuit board (11), the distance between the second board portion (122) and the first circuit board (11) is greater than the distance between the first board portion (121) and the first circuit board (11), the annular shell (51) is provided with an embedding groove (512), the position of the embedding groove (512) corresponds to the position of the second board portion (122), and the second board portion (122) is accommodated in the embedding groove (512); And / or, in the thickness direction of the first circuit board (11), the distance from the surface of the silicone gel (7) away from the first circuit board (11) to the first circuit board (11) is greater than or equal to the distance from the first board portion (121) of the second circuit board (12) to the first circuit board (11), and the first board portion (121) is arranged corresponding to the chip unit (2).

13. The power module according to claim 11, characterized in that: At least one of the conductive connection interfaces (3) is embedded in the annular housing (51); And / or, at least one of the first circuit board (11) and the second circuit board (12) has a setting portion exposed outside the packaging unit (5), and at least one of the conductive connection interfaces (3) is arranged on the setting portion.

14. A power device, characterized in that: Comprising a power module as claimed in any one of claims 1 to 13.

15. A power system, characterized in that: Comprising the power device of claim 14.

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