Circuit board packaging structure of compatible power brick

Abstract

The utility model discloses a circuit board packaging structure of a compatible power supply brick in the field of circuit board design, which comprises a first power supply brick area and a second power supply brick area which are arranged on a circuit board, the first power supply brick area and the second power supply brick area are mutually overlapped to form a compatible area, and a hollow heat dissipation area is arranged on the compatible area. According to the utility model, the problems of poor heat dissipation effect and influence on the working efficiency and the stability of the circuit board due to the fact that a wiring prohibition area is arranged at the position, corresponding to the power brick, of the circuit board and when the heating value of the power brick is large are solved, the power bricks of different models can be welded in a compatible manner, the universality and the adaptability are improved, and the cost is reduced. And when the heating value of the power supply brick is large, heat generated by the power supply brick is dissipated through the hollowed heat dissipation area, so that air flows to take away the heat generated by the power supply brick, the heat dissipation efficiency is improved, temperature rise caused by heat accumulation in a local area of the circuit board is avoided, and the working efficiency and stability of the circuit board are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board packaging structure of a compatible power brick. Background Art

[0002] Power brick is an important type of power module. Its emergence is mainly due to the demand for high power of modern electronic devices. Due to its high power characteristics, it is shaped like a brick after modular packaging, so it is also called a brick power supply. In the design and production process of this brick power supply, the space limitations and load-bearing capacity of modern circuit boards are fully considered. The power brick has a strong power output capacity and can meet the energy needs of various high-load electronic devices. Due to its modular packaging form, the brick power supply can be easily integrated into various circuit systems and become a key component to ensure the normal operation of the equipment.

[0003] In circuit board design, we usually encounter some power brick projects. Power bricks will generate heat during use. Power bricks of different models and specifications have different heat generation. Some power bricks generate more heat, while others generate less heat. In order to ensure that the power bricks can work under safe and stable conditions, avoid too dense wire layout, reduce electromagnetic interference, and dissipate heat for the power bricks, a prohibited wiring area is usually set at the position of the circuit board corresponding to the power brick. However, even if the prohibited wiring area is set, when the heat generation of the power brick is large, the heat generated by it may still affect other parts of the circuit board through heat conduction, causing the local temperature of the circuit board to rise, affecting the working efficiency and stability of the circuit board.

[0004] The above defects need to be solved urgently. Utility Model Content

[0005] In order to solve the problem that a prohibited wiring area is set at the position of the circuit board corresponding to the power brick, when the heat generated by the power brick is large, the heat dissipation effect is poor, which affects the working efficiency and stability of the circuit board, the utility model provides a circuit board packaging structure of a compatible power brick.

[0006] The technical solution of the utility model is as follows:

[0007] A circuit board packaging structure of a compatible power brick comprises a first power brick area and a second power brick area arranged on the circuit board, wherein the first power brick area and the second power brick area overlap with each other to form a compatible area, and a hollow heat dissipation area is arranged on the compatible area.

[0008] According to the above solution of the utility model, the orthographic projection area of ​​the first power brick region is larger than the orthographic projection area of ​​the second power brick region.

[0009] According to the above solution of the utility model, the second power brick area is located inside the first power brick area.

[0010] According to the above solution of the utility model, the central axis of the first power brick area coincides with the central axis of the second power brick area.

[0011] According to the above solution of the utility model, the hollowed-out heat dissipation area is located in the middle of the compatible area.

[0012] According to the above solution of the utility model, the orthographic projection area of ​​the hollowed-out heat dissipation area is smaller than the orthographic projection area of ​​the second power brick area.

[0013] According to the above solution of the utility model, the width of the hollowed-out heat dissipation area is greater than the width of the compatible area.

[0014] According to the above solution of the utility model, the length of the hollowed-out heat dissipation area is smaller than the length of the compatible area.

[0015] According to the above solution of the utility model, a plurality of power brick pads are provided in the first power brick area and the second power brick area.

[0016] According to the above scheme of the utility model, the power brick pad includes a welding surface pad and a device surface pad. The welding surface pad coincides with the central axis of the device surface pad, and the orthographic projection area of ​​the welding surface pad is larger than the orthographic projection area of ​​the device surface pad.

[0017] The utility model according to the above scheme has the following beneficial effects:

[0018] In the circuit board packaging structure of the compatible power brick, the first power brick area and the second power brick area overlap to form a compatible area, which can be compatible with welding power bricks of different models, improve versatility and adaptability, and improve the space utilization of the circuit board. In addition, a hollow heat dissipation area is provided on the compatible area. When the heat generated by the power brick is large, the heat generated by the power brick is dissipated through the hollow heat dissipation area, so that the air flow takes away the heat generated by the power brick, thereby improving the heat dissipation efficiency, thereby avoiding the accumulation of heat in a local area of ​​the circuit board and causing the temperature to rise, and improving the working efficiency and stability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the application of the utility model in the circuit;

[0021] Figure 2 It is a structural schematic diagram of the utility model.

[0022] In the figure, 1, circuit board; 11, first power brick area; 12, second power brick area; 13, first silk screen line; 14, second silk screen line; 15, hollow heat dissipation area; 16, first power brick pad; 161, welding surface pad; 162, device surface pad; 17, second power brick pad. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0024] like Figure 1 As shown, the utility model provides a circuit board packaging structure of a compatible power brick, including a first power brick area 11 and a second power brick area 12 arranged on a circuit board 1. The first power brick area 11 and the second power brick area 12 overlap with each other to form a compatible area, which can be compatible with welding power bricks of different models. The circuit board 1 can flexibly adapt to different models of power bricks, thereby improving versatility and adaptability. In actual design, the first power brick area 11 or the second power brick area 12 can be selected to weld the power brick according to the specific model and size of the power brick to meet different design and performance requirements. In addition, since the circuit board 1 can adapt to a variety of power bricks, the designer can reduce the dependence on a specific power brick model when designing the circuit board 1, thereby simplifying the design process and reducing the design complexity. In addition, the first power brick area 11 and the second power brick area 12 overlap with each other, and the circuit board 1 can integrate more functions in a limited space, which can improve the space utilization of the circuit board 1.

[0025] like Figure 2 As shown, in this embodiment, the orthographic projection area of ​​the first power brick area 11 is larger than the orthographic projection area of ​​the second power brick area 12. The first power brick area 11 can be welded with a larger power brick, while the second power brick area 12 can be welded with a smaller power brick, thereby providing greater flexibility to adapt to power bricks of different sizes and meet the welding requirements of different power bricks, thereby enhancing the compatibility of the circuit board 1 with different models of power bricks.

[0026] like Figure 2As shown, in this embodiment, the second power brick area 12 is located inside the first power brick area 11. By placing the smaller second power brick area 12 inside the larger first power brick area 11, the design maximizes the use of the available space of the circuit board 1 and improves space efficiency. In addition, since the circuit board 1 can adapt to power bricks of different sizes, the need to replace the circuit board 1 due to size mismatch is reduced, thereby reducing long-term operating costs. In addition, the central axis of the first power brick area 11 coincides with the central axis of the second power brick area 12, ensuring the precise alignment of different power brick areas and helping to improve welding accuracy.

[0027] like Figure 2 As shown, in this embodiment, a first silk screen line 13 is set at the edge of the first power brick area 11, and a second silk screen line 14 is set at the edge of the second power brick area 12. The second silk screen line 14 is set inside the first silk screen line 13, which is convenient for identifying the positions of the first power brick area 11 and the second power brick area 12, thereby facilitating the rapid welding of the power bricks in the first power brick area 11 or the second power brick area 12, thereby improving welding efficiency.

[0028] like Figure 2 As shown, in this embodiment, a hollowed-out heat dissipation area 15 is provided on the compatible area, and the hollowed-out heat dissipation area 15 provides additional space, allowing air to flow away the heat generated by the power brick, thereby improving the heat dissipation efficiency. In addition, through the hollowed-out area, the heat can be more evenly distributed on the circuit board 1, reducing the generation of local hot spots, which helps to maintain the stable operation of the circuit board 1. In addition, the hollowed-out heat dissipation area 15 can be adjusted according to the heat generated by the power brick and the heat dissipation requirements of the circuit board 1, providing a flexible heat dissipation solution.

[0029] like Figure 2 As shown, in this embodiment, the hollowed-out heat dissipation area 15 is located in the middle of the compatible area, which helps to achieve a symmetrical heat dissipation layout, can more evenly disperse the heat generated by the power brick, and at the same time can increase air flow and improve heat dissipation efficiency, so that heat can be more directly transferred from the high-temperature area to the air flow path, thereby improving the heat dissipation effect of the power brick.

[0030] like Figure 2 As shown, in this embodiment, the orthographic projection area of ​​the hollowed-out heat dissipation area 15 is smaller than the orthographic projection area of ​​the second power brick area 12, which can maximize the layout and wiring of other components within the limited space of the circuit board 1, thereby improving space utilization. In addition, the width of the hollowed-out heat dissipation area 15 is greater than the width of the compatible area, and the length of the hollowed-out heat dissipation area 15 is less than the length of the compatible area, which facilitates air flow to carry away the heat generated by the power brick, thereby helping to improve the heat dissipation effect of the power brick.

[0031] like Figure 2As shown, in this embodiment, a plurality of power brick pads are provided in the first power brick area 11 and the second power brick area 12, and the solder legs of the power bricks are soldered on the corresponding power brick pads. In addition, two columns of first power brick pads 16 are provided in the first power brick area 11, and the number of first power brick pads 16 in each column is three. Two columns of second power brick pads 17 are provided in the second power brick area 12, and the two columns of second power brick pads 17 are provided between the two columns of first power brick pads 16, wherein the number of second power brick pads 17 in one column is five, and the number of second power brick pads 17 in the other column is three. Of course, in actual design, the number of first power brick pads 16 and the number of second power brick pads 17 can be designed according to actual needs.

[0032] like Figure 2 As shown, in this embodiment, the power brick pad includes a welding surface pad 161 and a device surface pad 162. The central axis of the welding surface pad 161 coincides with the central axis of the device surface pad 162, and the orthographic projection area of ​​the welding surface pad 161 is larger than the orthographic projection area of ​​the device surface pad 162, thereby increasing the amount of solder on the power brick pad, thereby improving the welding stability of the power brick and preventing the power brick from falling off the circuit board 1.

[0033] In this embodiment, the first power brick area 11 and the second power brick area 12 overlap to form a compatible area, which can be compatible with welding power bricks of different models, improve versatility and adaptability, and at the same time improve the space utilization of the circuit board 1. In addition, a hollow heat dissipation area 15 is provided on the compatible area. When the heat generated by the power brick is large, the heat generated by the power brick is dissipated through the hollow heat dissipation area 15, so that the air flow takes away the heat generated by the power brick, thereby improving the heat dissipation efficiency, thereby avoiding the accumulation of heat in a local area of ​​the circuit board 1 and causing the temperature to rise, and improving the working efficiency and stability of the circuit board 1.

[0034] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the application product is usually placed when used, or is the orientation or position relationship commonly understood by technical personnel in this field, or is the orientation or position relationship in which the application product is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0035] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0036] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A circuit board packaging structure of a compatible power brick, characterized in that: It comprises a first power brick area and a second power brick area arranged on a circuit board. The first power brick area and the second power brick area overlap each other to form a compatible area, and a hollowed-out heat dissipation area is arranged on the compatible area.

2. The circuit board packaging structure of the compatible power brick according to claim 1, characterized in that: The orthographic projection area of ​​the first power brick region is greater than the orthographic projection area of ​​the second power brick region.

3. The circuit board packaging structure of the compatible power brick according to claim 1, characterized in that: The second power brick area is located inside the first power brick area.

4. The circuit board packaging structure of the compatible power brick according to claim 1, characterized in that: The central axes of the first power brick area coincide with the central axes of the second power brick area.

5. The circuit board packaging structure of the compatible power brick according to claim 4, characterized in that: The hollowed-out heat dissipation area is located in the middle of the compatible area.

6. The circuit board packaging structure of the compatible power brick according to claim 1, characterized in that: The orthographic projection area of ​​the hollowed-out heat dissipation region is smaller than the orthographic projection area of ​​the second power brick region.

7. The circuit board packaging structure of the compatible power brick according to claim 6, characterized in that: The width of the hollowed-out heat dissipation area is greater than the width of the compatible area.

8. The circuit board packaging structure of the compatible power brick according to claim 6, characterized in that: The length of the hollowed-out heat dissipation area is smaller than the length of the compatible area.

9. The circuit board packaging structure of the compatible power brick according to claim 1, characterized in that: A plurality of power brick pads are disposed in the first power brick area and the second power brick area.

10. The circuit board packaging structure of the compatible power brick according to claim 9, characterized in that: The power brick pads include welding surface pads and device surface pads. The welding surface pads coincide with the central axis of the device surface pads, and the orthographic projection area of ​​the welding surface pads is larger than the orthographic projection area of ​​the device surface pads.

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