Heat dissipation shell structure

Abstract

The utility model discloses a heat dissipation shell structure, and relates to the technical field of heat dissipation equipment, the heat dissipation shell structure comprises a body, the body encloses an accommodating cavity used for accommodating a PCB, the body is also provided with an air hole and an air inlet part which are communicated with the accommodating cavity, the body is also provided with an installation groove, the installation groove is used for installing a fan, and the air inlet part and the installation groove are communicated with the accommodating cavity. The air inlet part is arranged in the mounting groove, the air inlet part and the fan are correspondingly arranged, the fan rotates to enable airflow to flow into the containing cavity from the air inlet part and flow out through the air holes, the body is provided with a first heat dissipation area and a second heat dissipation area, and the first heat dissipation area and the second heat dissipation area are located in different planes. The number of the air holes is multiple, and the first heat dissipation area and the second heat dissipation area are both provided with the air holes. The heat dissipation shell structure provided by the technical scheme of the utility model can improve the heat dissipation efficiency and meet the heat dissipation requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation shell structure. Background Art

[0002] During the operation of electronic products, components will generate a lot of heat. Currently, the heat dissipation of components mainly relies on heat sinks. However, with the increasing demand for electronic products, the power of electronic components is gradually increasing, and the number of electronic components is increasing, which makes the products generate more heat. The traditional heat dissipation structure can no longer meet the heat dissipation requirements. Utility Model Content

[0003] The main purpose of the utility model is to provide a heat dissipation shell structure, aiming to solve the technical problem that the heat dissipation method and structure of current electronic products cannot meet the heat dissipation requirements.

[0004] In order to achieve the above-mentioned purpose, the heat dissipation shell structure proposed by the utility model comprises: a body;

[0005] The body forms a cavity for accommodating a PCB board, and the body is also provided with an air vent and an air inlet connected to the cavity. The body is also provided with a mounting slot, and the mounting slot is used to install a fan. The air inlet is arranged in the mounting slot, and the air inlet is arranged corresponding to the fan. The fan rotates so that air flows from the air inlet into the cavity and flows out through the air vent. The body is provided with a first heat dissipation area and a second heat dissipation area, and the first heat dissipation area and the second heat dissipation area are in different planes. A plurality of air vents are provided, and both the first heat dissipation area and the second heat dissipation area are provided with the air vents.

[0006] In one embodiment, a side of the body facing away from the cavity is a heat dissipation surface, and the heat dissipation surface is provided with heat dissipation fins. A plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins are arranged in parallel and at intervals.

[0007] In one embodiment, the heat dissipation surface and two adjacent heat dissipation fins form a guide channel, and the air holes are arranged in the guide channel.

[0008] In one embodiment, the air inlet portion is hollowed out so that the air inlet portion forms a decorative portion and a plurality of air inlets, and a plurality of the air inlets are provided along the circumferential direction of the decorative portion, and the airflow enters the cavity from the air inlets.

[0009] In one embodiment, the body is provided with a plurality of first connecting columns and a plurality of second connecting columns, the first connecting columns are used to install the PCB board, the second connecting columns are used to install the fan, the fan is arranged between the PCB board and the inner wall of the cavity, the air outlet side of the fan faces the PCB board, the air inlet side of the fan faces the air inlet part, and the first connecting column and the second connecting column are arranged in the cavity.

[0010] In one embodiment, the body includes a main board and a side board, the side board is connected to the edge of the main board, and the side board and the main board enclose the cavity, and the main board and the side board are both provided with the ventilation holes.

[0011] In one embodiment, the heat dissipation shell structure further includes a fixing plate, which is connected to the side plate and is arranged around the edge of the side plate.

[0012] In one embodiment, the fixing plate is provided with a mounting hole.

[0013] In one embodiment, the heat dissipation shell structure is made of aluminum.

[0014] In one embodiment, the main body is provided with a power socket and a component socket.

[0015] The technical solution of the utility model adopts a body to enclose a cavity for installing a PCB board, the body is provided with an air vent and an air inlet, and a fan is installed in the installation slot. The fan rotates so that the outside air enters the cavity from the air inlet and passes through the PCB board, and exchanges heat with the PCB board, takes away the heat generated by the PCB board, and discharges the heat from the cavity through the air vent, so as to achieve the effect of heat dissipation of the PCB board. Specifically, the body is provided with a first heat dissipation zone and a second heat dissipation zone, which can expand the area of ​​the airflow passing through the area. Furthermore, the first heat dissipation zone and the second heat dissipation zone are both provided with air vents, which can improve the efficiency of the airflow discharging from the cavity, significantly improve the heat dissipation effect, and meet the heat dissipation requirements of current electrical components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the heat dissipation structure of an embodiment of the utility model from an angle;

[0018] Figure 2A schematic structural diagram of another angle of an embodiment of the heat dissipation structure provided by the utility model;

[0019] Figure 3 A schematic diagram of a side view of a heat dissipation structure embodiment provided by the utility model;

[0020] Figure 4 This is another side structural schematic diagram of the heat dissipation structure embodiment provided by the utility model.

[0021] Description of Figure Numbers:

[0022] 100, body; 110, air vent; 120, air inlet; 121, decorative part; 122, air inlet; 130, first heat dissipation area; 140, second heat dissipation area; 150, main board; 160, side panel;

[0023] 200, mounting slot;

[0024] 300, cooling fins;

[0025] 400, diversion channel;

[0026] 500, first connecting column; 510, second connecting column;

[0027] 600, fixing plate; 610, mounting hole;

[0028] 700, power socket; 710, component socket.

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0033] In the prior art, as the demand for electronic products gradually increases, the power of electronic components gradually increases and the number of electronic components increases, more heat is generated inside the product, and the traditional heat dissipation structure can no longer meet the heat dissipation requirements.

[0034] The utility model provides a heat dissipation shell structure.

[0035] See also Figures 1 to 4 In one embodiment of the utility model, the heat dissipation shell structure includes: a body 100; specifically, the body 100 forms a cavity for accommodating a PCB board, the body 100 is also provided with an air vent 110 and an air inlet 120 connected to the cavity, the body 100 is also provided with a mounting groove 200, the mounting groove 200 is used to install a fan, the air inlet 120 is arranged in the mounting groove 200, the air inlet 120 is arranged corresponding to the fan, the fan rotates so that the air flow flows from the air inlet 120 into the cavity and flows out through the air vent 110, the body 100 is provided with a first heat dissipation area 130 and a second heat dissipation area 140, the first heat dissipation area 130 and the second heat dissipation area 140 are in different planes, a plurality of air vents 110 are provided, and both the first heat dissipation area 130 and the second heat dissipation area 140 are provided with air vents 110.

[0036] It should be noted that the cavity surrounded by the body 100 has an opening, and the PCB board is fixed in the cavity from the opening. The heat of the PCB board is taken away by the airflow flowing through the cavity, so as to achieve the purpose of heat dissipation. Specifically, the air vent 110 and the air inlet 120 are located at different positions of the body 100, and a fan is also installed in the cavity. The fan corresponds to the air inlet 120. The fan blows air toward the PCB board, so that the air pressure on the air outlet side of the fan is reduced, and the outside air enters the air inlet side of the fan from the air inlet 120 to form an airflow. Under the action of the fan, the airflow flows to other positions of the PCB board. At the same time, the air pressure in the cavity increases, so that the airflow is discharged from the cavity from the air vent 110. In this way, the airflow exchanges heat with the components generating heat on the PCB board, takes away the heat, and achieves the purpose of heat dissipation. Specifically, the mounting groove 200 is located in the cavity, and the body 100 is recessed in a direction away from the cavity toward one side of the cavity, so that the outer wall of the body 100 is convex, and then the mounting groove 200 is formed on the side of the body 100 facing the cavity, and the fan is installed in the mounting groove 200.

[0037] Furthermore, the main body 100 has a first heat dissipation zone 130 and a second heat dissipation zone 140 in different planes, so that the airflow velocity of the cavity portion corresponding to the two heat dissipation zones is different, and different airflow flow areas and flow velocities are achieved by the number and distribution positions of the air vents 110 opened in the two heat dissipation zones, thereby achieving different heat dissipation effects, making the heat dissipation targeted, thereby improving the heat dissipation efficiency and meeting the heat dissipation requirements. In the specific implementation process, the plane where the second heat dissipation zone 140 is located is closer to the PCB board than the plane where the first heat dissipation zone 130 is located, so that the heights of the cavities corresponding to the two heat dissipation zones are different. In this way, on the one hand, the components with relatively high height installed on the PCB board are located in the cavity corresponding to the first heat dissipation zone 130, and some components with relatively small height can be located in the cavity corresponding to the second heat dissipation zone 140. Further, the most important heat-generating components are installed at the corresponding position on the fan outlet side, thereby achieving different heat dissipation requirements. On the other hand, the air flow velocity in the cavity position corresponding to the first heat dissipation zone 130 is small relative to that of the second heat dissipation zone 140. The position of the PCB board corresponding to the first heat dissipation zone 130 can be used to install components that generate relatively little heat, thereby meeting different heat dissipation requirements and improving the heat dissipation effect.

[0038] The technical solution of the utility model adopts a body 100 to enclose a cavity for installing a PCB board. The body 100 is provided with an air vent 110 and an air inlet 120, and a fan is installed in the installation slot 200. The fan rotates so that the outside air enters the cavity from the air inlet 120 and passes through the PCB board, and performs heat exchange with the PCB board, takes away the heat generated by the PCB board, and discharges the heat from the cavity through the air vent 110, so as to achieve the effect of heat dissipation of the PCB board. Specifically, the body 100 is provided with a first heat dissipation zone 130 and a second heat dissipation zone 140, which can expand the area of ​​the airflow passing through. Furthermore, the first heat dissipation zone 130 and the second heat dissipation zone 140 are both provided with air vents 110, which can improve the efficiency of the airflow discharging from the cavity, and the heat dissipation effect is significantly improved, meeting the heat dissipation requirements of current electrical components.

[0039] In one embodiment, the side of the body 100 facing away from the cavity is a heat dissipation surface, and the heat dissipation surface is provided with heat dissipation fins 300, and a plurality of heat dissipation fins 300 are provided, and the plurality of heat dissipation fins 300 are arranged in parallel and at intervals. In the specific implementation process, it can be understood that the outer wall surface of the body 100 is the heat dissipation surface, and correspondingly, the inner wall surface of the body 100, that is, the side of the body 100 facing the cavity is the heating surface, and the heating surface exchanges heat with the heat dissipation airflow in the cavity, so that the heat will also be dissipated through the body 100. Specifically, the heat dissipation fins 300 protrude from the heat dissipation surface, and a plurality of heat dissipation fins 300 are arranged in parallel and at intervals, which increases the contact area between the body 100 and the outside air and improves the heat dissipation effect. In addition, the outside air flow will also flow along the space between two adjacent heat dissipation fins 300, and the heat dissipation fins 300 also play a role of guiding, increasing the air flow rate, quickly taking away the heat from the heat dissipation surface, and improving the heat dissipation effect.

[0040] Further, the heat dissipation surface and two adjacent heat dissipation fins 300 form a guide channel 400, and the air vents 110 are arranged in the guide channel 400. The heat dissipation airflow in the cavity is discharged through the air vents 110 and quickly flows along the guide channel 400, thereby improving the heat dissipation efficiency. In the present embodiment, a plurality of air vents 110 are provided, and the plurality of air vents 110 are dispersedly arranged. In the specific implementation process, the body 100 is provided with air vents 110 at positions corresponding to the components that need heat dissipation on the PCB board, so that the heat dissipation airflow can quickly discharge the heat of the components through the air vents 110, reduce the time that the heat is retained in the cavity, and improve the heat dissipation efficiency. Further, in order to improve the heat dissipation efficiency, the heat dissipation shell structure is made of aluminum. In addition, in order to ensure the aesthetics of the outer wall of the body 100, the air vents 110 are arranged in parallel, and the plurality of air vents 110 that are close to each other are arranged in parallel and arranged in a certain arrangement, so that the aesthetics of the body 100 can be improved while improving the heat dissipation effect.

[0041] In one embodiment, the air inlet 120 is hollowed out so that the air inlet 120 forms a decorative portion 121 and a plurality of air inlets 122. A plurality of air inlets 122 are provided along the circumferential direction of the decorative portion 121, and the airflow enters the cavity from the air inlets 122. In the specific implementation process, the air inlet 120 is opposite to the fan, and the air inlet 120 is hollowed out to form the air inlet 122 and the decorative portion 121. It can be understood that the decorative portion 121 is arranged relative to the center position of the fan, and the decorative portion 121 is not connected to the cavity, and no airflow passes through. The decorative portion 121 is used to paste labels or logos, etc. The plurality of air inlets 122 are distributed around the decorative portion 121, and the air inlet 122 is connected to the cavity. The rotation of the fan allows the external airflow to enter the cavity through the air inlet 122.

[0042] In one embodiment, the main body 100 is provided with a plurality of first connecting columns 500 and a plurality of second connecting columns 510, the first connecting columns 500 are used to install the PCB board, and the second connecting columns 510 are used to install the fan, the fan is arranged between the PCB board and the inner wall of the cavity, the air outlet side of the fan faces the PCB board, and the air inlet side of the fan faces the air inlet part 120, and the first connecting columns 500 and the second connecting columns 510 are arranged in the cavity.

[0043] In the specific implementation process, the first connecting column 500 and the second connecting column 510 are located in the cavity, and the first connecting column 500 and the second connecting column 510 are respectively provided with threaded holes along their own axis directions, the PCB board is mounted on the first connecting column 500 by screws, the fan is mounted on the second connecting column 510 by screws, and the fan is located between the PCB board and the inner wall of the cavity to blow air toward the PCB board. It can be understood that the components on the PCB board that urgently need heat dissipation, such as chips, are arranged opposite to the fan, and the fan blows directly toward the chip for heat dissipation.

[0044] In one embodiment, the body 100 includes a main board 150 and a side panel 160, the side panel 160 is connected to the edge of the main board 150, and the side panel 160 and the main board 150 enclose a cavity, and the main board 150 and the side panel 160 are both provided with air holes 110. In this embodiment, the connection between the side panel 160 and the main board 150 also opens an air hole 110, and the air hole 110 extends in the direction of the side panel 160 and the main board 150, and the heat dissipation airflow in the cavity can be discharged through the side panel 160 or the junction of the side panel 160 and the main board 150, thereby increasing the channel for airflow circulation, so that the airflow can be discharged from the cavity in time. It can be understood that installing multiple components on the PCB board will hinder the circulation of airflow, and air holes 110 are respectively opened at multiple positions on the side panel 160 and the main board 150, so that part of the heat dissipation airflow can be discharged in time, thereby improving the heat dissipation effect.

[0045] In one embodiment, the heat dissipation shell structure further includes a fixing plate 600, which is connected to the side plate 160 and is disposed around the edge of the side plate 160. The fixing plate 600 is connected around the edge of the side plate 160 and extends in a direction away from the cavity and the side plate 160. Furthermore, the fixing plate 600 is provided with a mounting hole 610, and screws are passed through the mounting hole 610 to fix and install the heat dissipation shell structure.

[0046] In the specific implementation process, the body 100 is provided with a power socket 700 and a component socket 710. Among them, the power socket 700 corresponds to the power interface on the PCB board and is used to power the device. The component socket 710 includes an optical fiber audio interface, a radio antenna interface, a GPS positioning antenna interface, etc., and corresponds to the corresponding position on the PCB board. It can be understood that the heat dissipation shell structure proposed by the utility model can not only realize the installation and heat dissipation of the PCB board, but also protect the components from collision damage by adopting aluminum material while improving the heat dissipation efficiency.

[0047] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation shell structure, characterized in that: include: ontology; The body forms a cavity for accommodating a PCB board, and the body is also provided with an air vent and an air inlet connected to the cavity. The body is also provided with a mounting slot, and the mounting slot is used to install a fan. The air inlet is arranged in the mounting slot, and the air inlet is arranged corresponding to the fan. The fan rotates so that air flows from the air inlet into the cavity and flows out through the air vent. The body is provided with a first heat dissipation area and a second heat dissipation area, and the first heat dissipation area and the second heat dissipation area are in different planes. A plurality of air vents are provided, and both the first heat dissipation area and the second heat dissipation area are provided with the air vents.

2. The heat dissipation shell structure according to claim 1, characterized in that: A side of the body facing away from the cavity is a heat dissipation surface, and the heat dissipation surface is provided with heat dissipation fins. A plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins are arranged in parallel and at intervals.

3. The heat dissipation shell structure according to claim 2, characterized in that: The heat dissipation surface and two adjacent heat dissipation fins form a guide channel, and the air holes are arranged in the guide channel.

4. The heat dissipation shell structure according to claim 1, characterized in that: The air inlet portion is hollowed out so that the air inlet portion forms a decorative portion and a plurality of air inlets. A plurality of the air inlets are provided along the circumferential direction of the decorative portion, and air flows into the cavity from the air inlets.

5. The heat dissipation shell structure according to claim 1, characterized in that: The body is provided with a plurality of first connecting columns and a plurality of second connecting columns, the first connecting columns are used for installing the PCB board, the second connecting columns are used for installing the fan, the fan is arranged between the PCB board and the inner wall of the cavity, the air outlet side of the fan faces the PCB board, the air inlet side of the fan faces the air inlet part, and the first connecting columns and the second connecting columns are arranged in the cavity.

6. The heat dissipation shell structure according to claim 1, characterized in that: The main body comprises a main board and a side board, wherein the side board is connected to the edge of the main board, and the side board and the main board enclose the cavity, and the main board and the side board are both provided with the air holes.

7. The heat dissipation shell structure according to claim 6, characterized in that: The heat dissipation shell structure also includes a fixing plate, which is connected to the side plate and is arranged around the edge of the side plate.

8. The heat dissipation shell structure according to claim 7, characterized in that: The fixing plate is provided with a mounting hole.

9. The heat dissipation shell structure according to claim 1, characterized in that: The heat dissipation shell structure is made of aluminum.

10. The heat dissipation shell structure according to any one of claims 1 to 9, characterized in that: The main body is provided with a power socket and a component socket.

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