Photovoltaic bypass module

Abstract

The utility model discloses a photovoltaic bypass module, which comprises a first conductor, a second conductor, a chip, a jumper wire and a packaging body, and is characterized in that one side, close to the second conductor, of the first conductor is provided with a first lug boss, and one side, close to the first conductor, of the second conductor is provided with two second lug bosses; the first protruding part extends to the position between the two second electric conductors, and an insulation gap is formed between the first electric conductor and the second electric conductors. The lug boss of one of the first electric conductor and the second electric conductor is connected with the lower surface of the chip, the jumper wire is connected with the upper surface of the chip and the other one of the first electric conductor and the second electric conductor, the wiring direction of the jumper wire is a first direction, and the first direction is the extension direction of the first lug boss; the package is configured to package the chip and the jumper. The photovoltaic bypass module provided by the utility model is good in stability and high in reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of solar photovoltaics, in particular to a photovoltaic bypass module. Background Art

[0002] The photovoltaic bypass module is an important component of the photovoltaic module, mainly used to improve the reliability and efficiency of the photovoltaic system. When a cell in the photovoltaic cell string is blocked, damaged or has performance degradation, resulting in current mismatch, the bypass module can provide a low-resistance bypass path for this part of the cell, allowing the current to bypass the faulty cell and continue to flow, thereby reducing the hot spot effect, protecting other normally working cells from damage, and maintaining the power generation efficiency of the entire photovoltaic module.

[0003] These modules usually contain one or more bypass protection modules, which are designed to be turned on under specific conditions to bypass the affected battery cells. In recent years, with the advancement of technology, the design of bypass modules has paid more and more attention to heat dissipation performance and miniaturization to meet the application requirements of high-power photovoltaic modules. At this stage, the structure of the conductor is mostly as published in CN213212157U. The two conductors of the bypass protection module are both rectangular, the diode module is located in the middle of the two conductors, the chip is located on one of the conductors, and the jumpers of the diode module are distributed on the left and right to connect the chip to the other conductor. This structure has a simple process and uniform heat dissipation, but the weak point of the bypass protection module of this structure is at the jumper connection, which makes the jumper easily bent, affecting the performance of the bypass protection module.

[0004] The disclosure of the above background technology content is only used to assist in understanding the concept and technical solution of the utility model. It does not necessarily belong to the prior art of the present application, nor does it necessarily provide technical guidance. In the absence of clear evidence that the above content has been disclosed before the filing date of the present application, the above background technology should not be used to evaluate the novelty and creativity of the present application. Utility Model Content

[0005] The utility model aims to provide a photovoltaic bypass module, which can improve the stability and reliability of the photovoltaic bypass module.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A photovoltaic bypass module comprises a first conductor, a second conductor, a chip, a jumper and a packaging body, wherein:

[0008] A first protrusion is provided on a side of the first conductor close to the second conductor, two second protrusions are provided on a side of the second conductor close to the first conductor, the first protrusion extends between the two second conductors, and an insulating gap is provided between the first conductor and the second conductor;

[0009] The first conductor and the second conductor are two components, wherein a raised portion of one component is connected to the lower surface of the chip, the jumper is connected to the upper surface of the chip and the other component, and the wiring direction of the jumper is a first direction, and the first direction is an extension direction of the first raised portion;

[0010] The package body is configured to package the chip and the jumper wires.

[0011] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the number of the jumper and the number of the chip are both 1, the lower surface of the chip is electrically connected to the upper surface of the first protrusion, one end of the jumper is electrically connected to the upper surface of the chip, and the other end of the jumper is electrically connected to the second conductor; or,

[0012] The number of the jumper wires and the number of the chips are both two, the lower surfaces of the two chips are electrically connected to the upper surface of one of the second protrusions respectively, the upper surface of one of the chips is electrically connected to one end of the jumper wire, and the other end of the jumper wire is electrically connected to the first conductor; or,

[0013] The number of jumpers is 2, the number of chips is 1, and a connector is also included. The upper and lower surfaces of the connector are provided with welding layers and an insulating layer in the middle. The lower surfaces of the chip and the connector are respectively electrically connected to the upper surface of one of the second protrusions, and the upper surfaces of the chip and the connector are respectively electrically connected to one end of the jumper, and the other end of the jumper is electrically connected to the first conductor.

[0014] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, an anti-pull-off structure is provided on the first conductor and / or the second conductor, and the anti-pull-off structure includes a groove structure capable of accommodating the packaging material, and the anti-pull-off structure is encapsulated by the packaging body.

[0015] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the anti-pull-off structure includes a first sawtooth structure arranged along the first direction, and at least one of the front and rear sides of the first conductor is provided with the first sawtooth structure; and / or,

[0016] The anti-pull-off structure includes a second sawtooth structure arranged along the first direction, and at least one of the front and rear sides of the second conductor is provided with the second sawtooth structure.

[0017] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the anti-pull-off structure includes a third sawtooth structure arranged along the first direction, and the third sawtooth structure is arranged on both sides of the first protrusion; and / or,

[0018] The anti-pull-off structure includes a fourth sawtooth structure arranged along the first direction, and the fourth sawtooth structure is arranged at the inner side of the two second protrusions.

[0019] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the anti-pull-off structure includes a plurality of first grooves arranged at the bottom of the first conductor; and / or,

[0020] The anti-pull-off structure includes a plurality of second grooves arranged at the bottom of the second conductor.

[0021] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, a bump is provided on the lower surface of the jumper, and the bump is abutted and connected with the upper surface of the chip;

[0022] The bump is provided with a first through hole, the through hole passes through the jumper, and the through hole is configured to accommodate solder.

[0023] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, a second through hole is arranged on the jumper, and the second through hole is arranged on the outside of the bump and opposite to the side of the chip.

[0024] Further, based on any one of the above technical solutions or a combination of multiple technical solutions, the first end of the jumper is connected to the chip, the second end of the jumper is electrically connected to one of the first conductor and the second conductor, and the first end and the second end are connected through an arc-shaped bending portion;

[0025] The bending portion is provided with one or more third through holes.

[0026] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the inner bottoms of the two second protrusions are provided with a first groove extending at least in a second direction, and the second direction is perpendicular to the first direction; and / or,

[0027] One or more first waterproof grooves are provided on the upper surface and / or the lower surface of the first conductor; and / or,

[0028] One or more second waterproof grooves are formed on the upper surface and / or the lower surface of the second conductor.

[0029] The beneficial effects brought by the technical solution provided by the utility model are as follows:

[0030] a. The utility model sets the opposite side of the first conductor and the second conductor as a concave-convex matching structure, adopts one or two jumpers to cross the concave-convex matching structure, and then encapsulates it with packaging materials, so that there is no weak point part in the packaging structure along the width direction where only the jumper and the packaging material exist. Therefore, the jumper is not easy to bend or break, thereby enhancing the stability and reliability of the photovoltaic bypass module;

[0031] b. The utility model is provided with one or more anti-pull-off structures on the first conductor and the second conductor. The anti-pull-off structure can fill the groove structure of the packaging material, which can increase the resistance between the conductor and the packaging body, prevent the conductor from being pulled off from the packaging body, and further improve the stability and reliability of the photovoltaic bypass module;

[0032] c. The utility model sets a second through hole on the jumper, and the second through hole is arranged opposite to the two sides of the chip. The side of the chip can be seen through the second through hole, which not only facilitates the positioning of the chip under the jumper and the welding quality inspection, but also can be used to drain the packaging colloid during the packaging process. The packaging colloid can flow from the second through hole to the bottom of the jumper, speeding up the glue feeding speed and making the glue feeding more thorough;

[0033] d. The utility model can eliminate the internal stress generated when the jumper is bent by providing a third through hole in the bent portion of the jumper. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 An exploded schematic diagram of a photovoltaic bypass module provided with a jumper at a first angle according to an exemplary embodiment of the utility model;

[0036] Figure 2 A schematic diagram of the structure of a photovoltaic bypass module after packaging provided by an exemplary embodiment of the utility model;

[0037] Figure 3A schematic top view of a photovoltaic bypass module provided with a jumper according to an exemplary embodiment of the present utility model;

[0038] Figure 4 A schematic top view of a photovoltaic bypass module provided with two jumpers provided as an exemplary embodiment of the utility model;

[0039] Figure 5 An exploded schematic diagram of a photovoltaic bypass module provided with a jumper at a second angle according to an exemplary embodiment of the present invention;

[0040] Figure 6 for Figure 5 An enlarged schematic diagram shown at A in the middle.

[0041] Among them, the figure marks include: 1-first conductor, 11-first protrusion, 12-first waterproof groove, 13-first serrated structure, 14-first slot point, 15-first welding area, 16-first threading hole, 2-second conductor, 21-second protrusion, 22-second waterproof groove, 23-second serrated structure, 24-second slot point, 25-second welding area, 26-second threading hole, 27-first groove, 3-chip, 4-jumper, 41-bump, 411-first through hole, 42-second through hole, 43-first end, 44-second end, 45-bending portion, 451-third through hole, 5-package. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, device, product or equipment that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0044] In one embodiment of the present invention, a photovoltaic bypass module is provided. Figures 1 to 5 , which includes a first conductor 1, a second conductor 2, a chip 3, a jumper 4 and a package 5, wherein:

[0045] A first protrusion 11 is provided on one side of the first conductor 1 close to the second conductor 2, and two second protrusions 21 are provided on one side of the second conductor 2 close to the first conductor 1. The first protrusion 11 extends between the two second conductors 2, and an insulating gap is provided between the first conductor 1 and the second conductor 2.

[0046] The first conductor 1 and the second conductor 2 are two components, the protrusion of one component is connected to the lower surface of the chip 3, the jumper 4 is connected to the upper surface of the chip 3 and the other component, the wiring direction of the jumper 4 is the first direction, and the first direction is the extension direction of the first protrusion 11. Specifically, the first direction is Figure 1 The length direction of the photovoltaic bypass module is shown;

[0047] The package body 5 is configured to encapsulate the chip 3 , the jumper 4 , and a portion of the first conductor 1 and a portion of the second conductor 2 . The material of the package body 5 is preferably epoxy resin.

[0048] Specifically, the first conductor 1 includes a first packaging portion, which is the portion of the first conductor 1 packaged by the packaging body 5, and the second conductor 2 includes a second packaging portion, which is the portion of the second conductor 2 packaged by the packaging body 5. The first packaging portion and the second packaging portion are arranged opposite to each other, that is, the first protrusion 11 is arranged on the first packaging portion, and the second conductor 2 is arranged on the second packaging portion.

[0049] A first welding area 15 and a first threading hole 16 are provided in the non-packaged area of ​​the first conductor 1, and a second welding area 25 and a second threading hole 26 are provided in the non-packaged area of ​​the second conductor 2. The first threading hole 16 and the second threading hole 26 are configured to allow the busbar to pass through, and the first welding area 15 and the second welding area 25 are configured to weld the busbar.

[0050] In one embodiment of the present invention, see Figures 1 to 3 , the number of the jumper 4 is 1. In this embodiment, the jumper 4 is arranged in the middle of the width direction of the photovoltaic bypass module and along the length direction of the width of the photovoltaic bypass module, that is, Figure 3Specifically, the upper surface of the first protrusion 11 of the first conductor 1 is connected to the lower surface of the chip 3 , and the jumper 4 connects the upper surface of the chip 3 and the second conductor 2 .

[0051] In another embodiment of the present invention, see Figure 4 , the number of the jumpers 4 is 2. In this embodiment, the two jumpers 4 are distributed on both sides of the photovoltaic bypass module, and the two jumpers 4 are along the length direction of the width of the photovoltaic bypass module, that is, Figure 4 Left-right wiring as shown.

[0052] In this embodiment, the number of the chips 3 is 1 or 2, which is specifically set according to actual needs. If the number of the chips 3 is 2, the upper surfaces of the two second protrusions 21 are electrically connected to the lower surface of one chip 3, and the upper surface of each chip 3 is electrically connected to the lower surface of one jumper 4, and the lower surface of the other end of the jumper 4 is electrically connected to the first conductor 1. If the number of the chip 3 is 1, the photovoltaic bypass module also includes a connector with upper and lower welding surfaces and an insulating layer in the middle, which is used to replace another chip 3 in the embodiment of the two chips 3. In this embodiment, the chip 3 is arranged on one of the second protrusions 21, and the connector is arranged on another of the second protrusions 21. The connection mode of the chip 3, the connector, the jumper 4, the first conductor 1 and the second conductor 2 is the same as the embodiment of the two chips 3, which will not be repeated. Setting two jumpers can be applicable to the two cases where the number of chips is 1 or 2, and on the other hand, it can also improve the reliability of the connection between the jumper and the chip and the conductor.

[0053] At present, in the photovoltaic bypass module using left and right jumpers, the opposite side of the first conductor 1 and the second conductor 2 is a planar structure, and an insulating gap of a certain width needs to be set between the two. Therefore, in the width direction of the photovoltaic bypass module, there is a part with only jumpers and packaging materials, and the part where the jumper crosses the insulating gap is the weak point of the photovoltaic bypass module, which makes the jumper easy to bend or even break, affecting the performance of the bypass protection module. The utility model sets the opposite side of the first conductor 1 and the second conductor 2 as a concave-convex matching structure, uses one or two jumpers 4 to cross the concave-convex matching structure, and then encapsulates it with packaging materials, so that there is no weak point part with only jumpers and packaging materials in the width direction inside the packaging structure, and the jumper is not easy to bend or break, thereby enhancing the stability and reliability of the photovoltaic bypass module.

[0054] In one embodiment of the utility model, an anti-pull-off structure is provided on the first conductor 1 and / or the second conductor 2, and the anti-pull-off structure includes a groove structure capable of accommodating packaging materials, wherein the groove in the groove structure extends in at least one of a second direction and a third direction, wherein the second direction is perpendicular to the first direction, and the third direction is perpendicular to both the first direction and the second direction. The anti-pull-off structure is encapsulated by the packaging body 5, i.e., the groove structure is filled with packaging materials, which increases the resistance and pulling force on the packaging materials (epoxy resin), and can effectively achieve the anti-pull-off effect, further enhancing the stability and reliability of the photovoltaic bypass module.

[0055] The anti-pull-off structure proposed in this application has multiple configurations, which are described below.

[0056] In the first setting, Figure 3 and Figure 4 As shown, the anti-pull-off structure includes a first sawtooth structure 13 arranged along the first direction, and the front and rear sides ( Figure 3 and Figure 4 The first sawtooth structure 13 is provided on at least one of the upper and lower sides (shown in the figure); the anti-pull-off structure may also include a second sawtooth structure 23 arranged along the first direction, and at least one of the front and rear sides of the second conductor 2 is provided with the second sawtooth structure 23. The extending direction of the tooth grooves and protruding teeth in the first sawtooth structure 13 and the second sawtooth structure 23 is the second direction. Preferably, the first sawtooth 13 extending along the first direction is provided on both the front and rear sides of the first conductor 1; and the second sawtooth 23 extending along the first direction is also provided on both the front and rear sides of the first conductor 2.

[0057] In the second arrangement, the anti-pull-off structure includes a third sawtooth structure arranged along the first direction, and the third sawtooth structure is arranged on both sides of the first protrusion 11; the anti-pull-off structure also includes a fourth sawtooth structure arranged along the first direction, and the fourth sawtooth structure is arranged on the inner side of the two second protrusions 21. Preferably, the third sawtooth is arranged on both sides of the first protrusion 11, and the fourth sawtooth is arranged on the inner side of the second protrusion 21, and the protruding teeth in the third sawtooth are arranged correspondingly to the tooth grooves in the fourth sawtooth, and the protruding teeth in the fourth sawtooth are also arranged correspondingly to the tooth grooves in the third sawtooth.

[0058] In the third setting, if Figure 5As shown, the anti-pull-off structure includes a plurality of first grooves 14 arranged at the bottom of the first conductor 1, and a plurality of second grooves 24 arranged at the bottom of the second conductor 2. During packaging, the first grooves and the second grooves will be filled with packaging materials, thereby increasing the resistance between the conductor and the package body, and preventing the conductor from being pulled off from the package body.

[0059] In the fourth setting method, if Figure 1 and Figure 4 As shown, the anti-pull-off structure includes a first groove 27 arranged at the bottom of the inner side of the two second protrusions 21, and the first groove 27 is recessed in at least a second direction ( Figure 4 The first groove 27 is preferably recessed in both the first direction and the second direction. Figure 1 and Figure 4 The arc-shaped through-hole structure shown has low processing cost and can ensure structural strength.

[0060] It should be noted that the above four anti-pull-off structure settings can be arbitrarily combined and applied in one embodiment.

[0061] In one embodiment of the present invention, see Figure 5 The first end 43 of the jumper wire 4 is connected to the chip 3, and the second end 44 of the jumper wire 4 is electrically connected to one of the first conductor 1 and the second conductor 2. The first end 43 and the second end 44 are connected through an arc-shaped bending portion 45; one or more third through holes 451 are provided on the bending portion 45. The third through holes 451 can eliminate the internal stress generated by the jumper wire 4 during bending.

[0062] The lower surface of the jumper 4, specifically the lower surface of the first end 43, is provided with a bump 41, and the bump 41 is butted against the upper surface of the chip 3. The bump 41 is provided with a first through hole 411, which passes through the jumper 4, and is configured to accommodate solder. During the welding process of the bump 41 and the chip 3, the design of the through hole 411 allows the excess solder paste between the two to overflow and be welded to the through hole 411, thereby enhancing the connection firmness between the chip 3 and the bump 41 and improving the product reliability.

[0063] A second through hole 42 is disposed on the first end portion 43 of the jumper wire 4 . The second through hole 42 is disposed outside the bump 41 and opposite to the side edge of the chip 3 .

[0064] Preferably, if Figure 3As shown, the number of the second through holes 42 is two, and the two second through holes 42 are arranged on two sides of the chip 3 and are opposite to each other, that is, the second through holes 42 are configured as observation windows, and the side of the chip 3 can be seen through the second through holes 42 .

[0065] The design of the second through hole 42 can not only facilitate the positioning of the chip 3 under the jumper 4 and the inspection of the welding quality, but also can be used to drain the packaging colloid during the packaging process, helping the packaging colloid to flow from the second through hole 42 to the bottom of the jumper 4, speeding up the glue injection speed and making the glue injection more thorough, so that the entire chip 3 is completely wrapped and fixed by the colloid, thereby completing the packaging.

[0066] In one embodiment of the utility model, one or more first waterproof grooves 12 are formed on the upper surface and / or the lower surface of the first conductor 1; and / or one or more second waterproof grooves 22 are formed on the upper surface and / or the lower surface of the second conductor 2. Preferably, the cross-sections of the plurality of first waterproof grooves 12 are sawtooth or wavy, and the cross-sections of the plurality of second waterproof grooves 22 are also sawtooth or wavy.

[0067] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0068] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A photovoltaic bypass module, characterized in that: It comprises a first conductor (1), a second conductor (2), a chip (3), a jumper (4) and a packaging body (5), wherein: A first protrusion (11) is provided on a side of the first conductor (1) close to the second conductor (2), two second protrusions (21) are provided on a side of the second conductor (2) close to the first conductor (1), the first protrusion (11) extends between the two second conductors (2), and an insulating gap is provided between the first conductor (1) and the second conductor (2); The first conductor (1) and the second conductor (2) are two components, wherein a raised portion of one component is connected to the lower surface of the chip (3), the jumper (4) is connected to the upper surface of the chip (3) and the other component, and the wiring direction of the jumper (4) is a first direction, and the first direction is the extension direction of the first raised portion (11); The package body (5) is configured to package the chip (3) and the jumper (4).

2. The photovoltaic bypass module according to claim 1, characterized in that: The number of the jumper (4) and the number of the chip (3) are both one, the lower surface of the chip (3) is electrically connected to the upper surface of the first protrusion (11), one end of the jumper (4) is electrically connected to the upper surface of the chip (3), and the other end of the jumper (4) is electrically connected to the second conductor (2); or, The number of the jumper wires (4) and the number of the chips (3) are both two, the lower surfaces of the two chips (3) are respectively electrically connected to the upper surface of one of the second protruding portions (21), the upper surface of one of the chips (3) is electrically connected to one end of the jumper wire (4), and the other end of the jumper wire (4) is electrically connected to the first conductor (1); or, The number of the jumpers (4) is two, the number of the chip (3) is one, and a connector is further included. The upper and lower surfaces of the connector are provided with welding layers, and the middle is an insulating layer. The lower surfaces of the chip (3) and the connector are respectively electrically connected to the upper surface of one of the second protruding portions (21). The upper surfaces of the chip (3) and the connector are respectively electrically connected to one end of the jumper (4), and the other end of the jumper (4) is electrically connected to the first conductor (1).

3. The photovoltaic bypass module according to claim 1, characterized in that: The first conductor (1) and / or the second conductor (2) is provided with an anti-pull-off structure, the anti-pull-off structure comprising a groove structure capable of accommodating packaging material, and the anti-pull-off structure is encapsulated by the packaging body (5).

4. The photovoltaic bypass module according to claim 3, characterized in that: The anti-pull-off structure comprises a first sawtooth structure (13) arranged along the first direction, and at least one of the front and rear sides of the first conductor (1) is provided with the first sawtooth structure (13); and / or, The anti-pull-off structure comprises a second sawtooth structure (23) arranged along the first direction, and at least one of the front and rear sides of the second conductor (2) is provided with the second sawtooth structure (23).

5. The photovoltaic bypass module according to claim 3, characterized in that: The anti-pull-off structure comprises a third sawtooth structure arranged along the first direction, and the third sawtooth structure is arranged on both sides of the first protrusion (11); and / or, The anti-pull-off structure comprises a fourth sawtooth structure arranged along the first direction, and the fourth sawtooth structure is arranged on the inner side of the two second protrusions (21).

6. The photovoltaic bypass module according to claim 3, characterized in that: The anti-pull-off structure comprises a plurality of first grooves (14) arranged at the bottom of the first conductor (1); and / or, The anti-pull-off structure comprises a plurality of second groove points (24) arranged at the bottom of the second conductor (2).

7. The photovoltaic bypass module according to claim 1, characterized in that: The lower surface of the jumper (4) is provided with a bump (41), and the bump (41) is butted against and connected to the upper surface of the chip (3); The bump (41) is provided with a first through hole (411), the first through hole (411) passes through the jumper (4), and the first through hole (411) is configured to accommodate solder.

8. The photovoltaic bypass module according to claim 7, characterized in that: The jumper (4) is provided with a second through hole (42), and the second through hole (42) is arranged outside the bump (41) and opposite to the side of the chip (3).

9. The photovoltaic bypass module according to claim 1, characterized in that: The first end (43) of the jumper (4) is connected to the chip (3), the second end (44) of the jumper (4) is electrically connected to one of the first conductor (1) and the second conductor (2), and the first end (43) and the second end (44) are connected via an arc-shaped bending portion (45); One or more third through holes (451) are provided on the bending portion (45).

10. The photovoltaic bypass module according to claim 1, characterized in that: The inner bottoms of the two second protrusions (21) are provided with first grooves (27) extending at least in a second direction, the second direction being perpendicular to the first direction; and / or, One or more first waterproof grooves (12) are provided on the upper surface and / or the lower surface of the first conductor (1); and / or, One or more second waterproof grooves (22) are provided on the upper surface and / or the lower surface of the second conductor (2).

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