Novel Micro LED chip laser welding device

Abstract

The utility model belongs to the technical field of semiconductor processing equipment, and particularly relates to a novel Mi cro LED chip laser welding device which comprises a base and further comprises an X-direction main sliding table, an X-direction module arranged on the X-direction main sliding table, a Y-direction module arranged on the X-direction module, a laser processing module arranged on the Y-direction module and a photomask module arranged on the X-direction main sliding table. The laser processing module is positioned above the photomask module; according to the welding device, the linear laser processing module is adopted and emits laser rays instead of laser points, all chips within the range of the laser rays can be processed at the same time, the photomask module and the ultra-white glass similar to a sieve structure are further arranged, no film layer is arranged at the position where laser is allowed to pass through, and otherwise, the film layer is arranged. The damage to places without heating on the printed board is prevented; the thickness of the laser rays can be adjusted, so that the chip can be uniformly heated; compared with the prior art, the utility model is beneficial to improving the welding efficiency, the chip is uniformly heated, and the reject ratio is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a device for simultaneously welding a plurality of chips on a printed circuit board through a line laser processing module on semiconductor processing equipment. Background Art

[0002] At present, in the semiconductor processing process, a huge number of chips need to be transferred to the printed circuit board and some or all of the chips need to be welded on the printed circuit board by laser welding. The number of chips that need to be welded is very large; the current welding equipment uses point laser welding, which can only heat one chip at a time, and the processing efficiency is low, so the welding time is long; secondly, using point laser, the emitted light spot can only cover part of the chip, it is difficult to make the chip evenly heated to achieve a good welding effect, it is easy to produce cold solder joints, and it is not easy to set parameters. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the utility model aims to provide a novel Micro LED chip laser welding device.

[0004] The technical solution is: a new type of Micro LED chip laser welding device, including a base, an X-axis main slide, an X-axis module arranged thereon, a Y-axis module arranged on the X-axis module, a laser processing module arranged on the Y-axis module, and a mask module arranged on the X-axis main slide; the laser processing module is located above the mask module.

[0005] Preferably, the laser processing module adopts a line laser processing module.

[0006] Preferably, the base includes a bottom platform and two mutually parallel support plates arranged on its upper surface; the X-axis main slide is a flat plate fixedly connected to the upper ends of the two support plates and provided with square through holes therein.

[0007] The X-axis module includes two X-axis guide rails arranged on the upper surface of the X-axis main slide, two X-axis sliders movably arranged on each X-axis guide rail, two stators arranged on the X-axis main slide and respectively located on the inner sides of the two X-axis guide rails, two X-axis connecting plates respectively fixedly connected to the X-axis sliders on the two X-axis guide rails, and two movers respectively arranged on the lower surfaces of the two X-axis connecting plates and corresponding to the two stators respectively.

[0008] The Y-axis module includes a Y-axis base arranged on the X-axis module, a linear module arranged thereon, a mounting base movably arranged on the linear module, a mounting plate movably arranged on the mounting base, and a hanging plate arranged on the front surface of the mounting plate for mounting the laser processing module.

[0009] The photomask module includes a pressing frame, ultra-white glass arranged therein, four limit strips arranged in the pressing frame and respectively located on the outside of the four side edges of the ultra-white glass, two fixed blocks arranged on the front and rear surfaces of the pressing frame, a sensor mounting seat arranged on each fixed block and a tension and pressure sensor arranged thereon, and two photomask hanging plates fixedly connected to the bottom surface of the X-axis main slide; each photomask hanging plate is respectively fixedly connected to the upper ends of the two tension and pressure sensors located on the same side; some positions on the ultra-white glass are provided with a film layer to prevent light and heat from penetrating.

[0010] Furthermore, an ion wind rod located on one side of the pressing frame is also provided on the bottom surface of the X-axis main slide; and a plurality of air pipe joints are provided on one side surface of the pressing frame.

[0011] The hanging plate is also provided with a visual module; the visual module comprises a light source frame arranged on the hanging plate, a light source arranged on the light source frame, a lens connected to the light source at the lower end, and a camera arranged at the upper end of the lens.

[0012] The two X-direction guide rails are respectively located on both sides of the square through-hole. Two stop blocks fixed on the upper surface of the X-direction main slide and arranged in a straight line are respectively arranged on the outer sides of the two X-direction guide rails, and each stop block is provided with a high-strength rubber pad.

[0013] A plurality of photoelectric switches are arranged on one side surface of the installation base, and a sensing sheet corresponding to the photoelectric switches is arranged on one side surface of the installation plate.

[0014] Technical effect: The welding device of the utility model adopts a line laser processing module, which emits a laser line instead of a laser point, and can process all chips within the range of the laser line at the same time. Moreover, in order to prevent some positions that do not need to be heated from being irradiated and damaged by the laser line, a mask module is also provided. Some positions on the ultra-white glass of the mask module are provided with a film layer to prevent light and heat from penetrating, that is, the ultra-white glass has a sieve-like structure, and the position where the laser is allowed to pass is not provided with a film layer, and vice versa, a film layer is provided to prevent the places on the printed circuit board that do not need to be heated from being damaged; and the thickness of the laser line (spot size) can be adjusted to facilitate uniform heating of the chip; compared with existing similar technologies, the utility model is conducive to improving welding efficiency, and the chip is evenly heated, reducing the defective rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view of an embodiment of the utility model;

[0016] Figure 2 A three-dimensional diagram of an embodiment of the utility model;

[0017] Figure 3 A top view of an embodiment of the utility model;

[0018] Figure 4 It is a left side view of an embodiment of the utility model;

[0019] Figure 5 An exploded view of an embodiment of the utility model;

[0020] Figure 5a for Figure 5 A partial enlarged view of

[0021] Figure 6 This is a front view of the ultra-clear glass of an embodiment of the utility model;

[0022] Figure 7 This is a schematic diagram of laser welding according to an embodiment of the present utility model.

[0023] Reference numerals: base 1, bottom platform 101, support plate 102, X-axis main slide 2, square hole 201, X-axis module 3, X-axis guide rail 301, X-axis slider 302, stator 303, X-axis connecting plate 304, mover 305, Y-axis module 4, Y-axis base 401, linear module 402, mounting base 403, mounting plate 404, hanging plate 405, laser processing module 5, Light mask module-6, pressing frame-601, ultra-white glass-602, limit strip-603, fixing block-604, sensor mounting seat-605, tension and pressure sensor-606, light mask hanging plate-607, ion wind rod-7, air pipe connector-8, vision module-9, light source frame-901, light source-902, lens-903, camera-904, stop block-10, high-strength rubber pad-11, photoelectric switch-12, sensor sheet-13. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation methods.

[0025] like Figure 1-2 As shown, the embodiment of the utility model provides a novel Micro LED chip laser welding device, which is used in semiconductor processing equipment to fix a large number of chips on a printed circuit board by laser welding. It includes a base 1, an X-axis main slide 2, an X-axis module 3 arranged thereon, a Y-axis module 4 arranged on the X-axis module, a laser processing module 5 arranged on the Y-axis module, and a mask module 6 arranged on the X-axis main slide 2; when assembled, the laser processing module is located above the mask module, and the workpiece to be processed (printed circuit board) is located below the mask module 6.

[0026] Specifically, in this embodiment, in order to improve the efficiency of welding processing, the laser processing module 5 adopts a line laser processing module, such as Figure 5 shown.

[0027] like Figure 3-5 As shown, specifically, the base 1 includes a bottom platform 101 and two mutually parallel support plates 102 arranged on its upper surface; the X-axis main slide 2 is a flat plate fixedly connected to the upper ends of the two support plates and provided with a square through hole 201 therein.

[0028] like Figure 5 As shown, specifically, the X-direction module 3 includes two X-direction guide rails 301 arranged on the upper surface of the X-direction main slide 2, two X-direction sliders 302 movably arranged on each X-direction guide rail, two stators 303 arranged on the X-direction main slide 2 and respectively located on the inner sides of the two X-direction guide rails, two X-direction connecting plates 304 respectively fixedly connected to the X-direction sliders 302 on the two X-direction guide rails, and two movers 305 respectively arranged on the lower surfaces of the two X-direction connecting plates and respectively corresponding to the two stators 303. During operation, the X-direction connecting plates 304 fixed on the two X-direction sliders 302 on each X-direction guide rail reciprocate on the X-direction guide rail along with the two X-direction sliders.

[0029] Specifically, Figure 5 As shown, during installation, the two X-direction guide rails 301 are respectively located on both sides of the square through-hole 201, and two stop blocks 10 are respectively provided on the outer sides of the two X-direction guide rails 301, which are fixed to the upper surface of the X-direction main slide 2 and arranged in a straight line. Each stop block is provided with a high-strength rubber pad 11, which is respectively used to limit the two X-direction connecting plates 304.

[0030] Specifically, Figure 5 As shown, the Y-axis module 4 includes a Y-axis base 401 arranged on the X-axis module. In fact, the Y-axis base here is fixedly connected to the upper surfaces of the two X-axis connecting plates 304; a linear module 402 arranged on the Y-axis base, a mounting base 403 movably arranged on the linear module, a mounting plate 404 movably arranged on the mounting base, and a hanging plate 405 arranged on the front surface of the mounting plate for mounting the laser processing module 5. The linear module 402 here is a commercially available standard module. Driven by the linear module 402, the mounting base 403 can reciprocate along the Y direction on it, and the mounting plate 404 can move up and down on the mounting base, that is, the mounting base 403 here also adopts a commercially available standard module; a plurality of photoelectric switches 12 are arranged on one side surface of the mounting base 403, and a sensing sheet 13 corresponding to the photoelectric switch is arranged on one side surface of the mounting plate 404. When the mounting plate moves up and down, the sensing sheet passes through the photoelectric switch 12.

[0031] like Figure 2 As shown, during installation, the laser processing module 5 is fixed on the hanging plate 405, and the laser processing module adopts a commercially available standard module.

[0032] like Figure 5-7As shown, specifically, the photomask module 6 includes a pressing frame 601, an ultra-white glass 602 arranged therein, four limit strips 603 arranged in the pressing frame and respectively located outside the four side edges of the ultra-white glass, two fixed blocks 604 arranged on the front and rear surfaces of the pressing frame, a sensor mounting seat 605 arranged on each fixed block and a tension and pressure sensor 606 arranged thereon (sensor mounting seat), and two photomask hanging plates 607 fixedly connected to the bottom surface of the X-axis main slide 2; each of the photomask hanging plates is fixedly connected to the upper ends of the two tension and pressure sensors 606 located on the same side; a film layer is provided at some positions on the ultra-white glass 602 to prevent light and heat from penetrating, that is, the ultra-white glass is similar to a sieve structure, and a film layer is not provided at the position where the laser is allowed to pass, and a film layer is provided otherwise. The laser processing module 5 extends into the square perforation 201.

[0033] With the above structure, during operation, the X-direction connecting plate 304 fixed on the two X-direction sliders 302 on each X-direction guide rail reciprocates on the X-direction guide rail along with the two X-direction sliders; the Y-direction base 401 and the linear module 402 fixedly connected to the upper surfaces of the two X-direction connecting plates 304 move in the X-direction accordingly, and the mounting base 403 movably arranged on the linear module and the mounting plate 404 and the hanging plate 405 movably arranged on the mounting base move in the Y-direction under the drive of the linear module. At the same time, the mounting plate 404 and the hanging plate 405 can also move up and down along the Z-direction (vertical direction) on the mounting base 403, and the laser processing module 5 is fixed on the hanging plate 405. Therefore, the laser processing module 5 can move in the XYZ directions and move its own position according to the situation of the workpiece.

[0034] like Figure 1 , Figure 5 As shown, an ion wind rod 7 located on one side of the pressing frame 601 is also provided on the bottom surface of the X-axis main slide 2; and a plurality of air pipe joints 8 are provided on one side surface of the pressing frame 601.

[0035] like Figure 5 As shown, a visual module 9 is also provided on the hanging plate 405; the visual module includes a light source frame 901 provided on the hanging plate, a light source 902 provided on the light source frame, a lens 903 connected to the light source at the lower end, and a camera 904 provided on the upper end of the lens.

[0036] Compared with the existing similar technologies, the structure of the embodiment of the utility model is beneficial to improving the welding efficiency, and the chip is evenly heated, thereby reducing the defective rate.

[0037] In the above description, it should be noted that the terms "installed", "connected", "connected" and other corresponding terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two components; "provided in" should be understood as "installed in, set in", including fixed installation, movable installation and other installation methods.

[0038] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. The preferred embodiments of the utility model are given in the drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Any equivalent structure made by using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also within the scope of protection of the utility model patent.

Claims

1. A novel Micro LED chip laser welding device, comprising a base (1), characterized in that: It also includes an X-axis main slide (2), an X-axis module (3) arranged thereon, a Y-axis module (4) arranged on the X-axis module, a laser processing module (5) arranged on the Y-axis module, and a photomask module (6) arranged on the X-axis main slide (2); the laser processing module is located above the photomask module. The laser processing module (5) adopts a line laser processing module.

2. A novel Micro LED chip laser welding device as claimed in claim 1, characterized in that: The base (1) comprises a bottom platform (101) and two mutually parallel support plates (102) arranged on its upper surface; the X-axis main slide (2) is a flat plate fixedly connected to the upper ends of the two support plates and provided with a square through hole (201) therein.

3. A novel Micro LED chip laser welding device as claimed in claim 2, characterized in that: The X-direction module (3) comprises two X-direction guide rails (301) arranged on the upper surface of the X-direction main slide (2), two X-direction sliders (302) movably arranged on each X-direction guide rail, two stators (303) arranged on the X-direction main slide (2) and respectively located on the inner sides of the two X-direction guide rails, two X-direction connecting plates (304) respectively fixedly connected to the X-direction sliders (302) on the two X-direction guide rails, and two movers (305) respectively arranged on the lower surfaces of the two X-direction connecting plates and respectively corresponding to the two stators (303).

4. A novel Micro LED chip laser welding device as claimed in claim 2, characterized in that: The Y-axis module (4) comprises a Y-axis base (401) arranged on the X-axis module, a linear module (402) arranged thereon, a mounting base (403) movably arranged on the linear module, a mounting plate (404) movably arranged on the mounting base, and a hanging plate (405) arranged on the front surface of the mounting plate for mounting the laser processing module (5).

5. A novel Micro LED chip laser welding device as claimed in claim 2, characterized in that: The photomask module (6) comprises a pressing frame (601), ultra-white glass (602) arranged therein, four limit strips (603) arranged in the pressing frame and respectively located outside the four side edges of the ultra-white glass, two fixed blocks (604) arranged on the front and rear surfaces of the pressing frame, a sensor mounting seat (605) arranged on each fixed block and a tension and pressure sensor (606) arranged thereon, and two photomask hanging plates (607) fixedly connected to the bottom surface of the X-axis main slide (2); each of the photomask hanging plates is fixedly connected to the upper ends of the two tension and pressure sensors (606) located on the same side; and a film layer is provided at some positions on the ultra-white glass to prevent light and heat from penetrating.

6. A novel Micro LED chip laser welding device as claimed in claim 5, characterized in that: An ion wind rod (7) located on one side of the pressing frame (601) is also provided on the bottom surface of the X-axis main slide (2); and a plurality of air pipe joints (8) are provided on one side surface of the pressing frame (601).

7. A novel Micro LED chip laser welding device as claimed in claim 4, characterized in that: The hanging plate (405) is also provided with a visual module (9); the visual module comprises a light source frame (901) provided on the hanging plate, a light source (902) provided on the light source frame, a lens (903) connected to the light source at the lower end, and a camera (904) provided at the upper end of the lens.

8. A novel Micro LED chip laser welding device as claimed in claim 3, characterized in that: The two X-direction guide rails (301) are respectively located on both sides of the square through hole (201), and two stop blocks (10) are fixedly mounted on the upper surface of the X-direction main slide (2) and arranged in a straight line are respectively arranged on the outer sides of the two X-direction guide rails (301), and each stop block is provided with a high-strength rubber pad (11).

9. A novel Micro LED chip laser welding device as claimed in claim 4, characterized in that: A plurality of photoelectric switches (12) are provided on one side surface of the mounting base (403), and a sensing sheet (13) corresponding to the photoelectric switches is provided on one side surface of the mounting plate (404).

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