Multi-laser-head wafer scribing machine

Abstract

The utility model relates to the field of laser processing, and discloses a multi-laser-head wafer scribing machine which can divide a wafer into two times, rough processing is carried out to form a cutting channel preliminarily, finish processing is carried out to finish the cutting channel, and the processing precision is effectively improved. The device comprises a rough machining mechanism, the rough machining mechanism comprises a first laser generating module and a first laser adjusting module, the first laser generating module emits a first laser towards at least two directions respectively, and the first laser adjusting module is arranged on a light path of the first laser to enable the first laser to enter at an angle perpendicular to a machining plane; and the finish machining mechanism comprises a second laser generating module and a second laser adjusting module, the second laser generating module emits at least two paths of second laser in at least two directions, and the second laser adjusting module is arranged on the light path of the second laser so that the second laser can be emitted in at an angle perpendicular to the machining plane.

Description

Technical Field

[0001] The utility model relates to the field of laser processing, in particular to a multi-laser head wafer scribing machine. Background Art

[0002] Wafer scribing is a precision process that involves cutting a complete wafer into many individual chips. This process usually occurs after all semiconductor manufacturing processes on the wafer are completed, so that these chips can smoothly enter the subsequent packaging and testing stages. Slicing technology mainly includes two methods: mechanical scribing and laser scribing. Laser scribing is further subdivided into laser hidden scribing and laser full scribing technology. The criss-crossing cutting lanes on the wafer mark the boundaries that separate the chips, and the slicing operation is carried out along these cutting lanes.

[0003] However, existing wafer dicing machines face a technical challenge when operating: the energy of the laser needs to be precisely controlled. If the laser energy is too high, it may cause unnecessary damage to the cutting edge of the wafer; conversely, if the energy is insufficient, effective cutting cannot be achieved. This balance is crucial to ensuring chip quality and production efficiency. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a multi-laser head wafer dicing machine, which can divide the wafer into two steps, rough processing to initially form a cutting path, and fine processing to fine-tune the cutting path, effectively improving the processing accuracy.

[0005] A multi-laser head wafer scribing machine according to an embodiment of the utility model comprises:

[0006] The rough processing mechanism comprises a first laser generating module and a first laser adjusting module, wherein the first laser generating module respectively emits a first laser in at least two directions, and the first laser adjusting module is arranged on the optical path of the first laser so that the first laser is incident at an angle perpendicular to the processing plane;

[0007] The finishing mechanism includes a second laser generating module and a second laser adjusting module. The second laser generating module emits at least two second lasers in at least two directions respectively. The second laser adjusting module is arranged on the optical path of the second laser so that the second laser is injected at an angle perpendicular to the processing plane.

[0008] According to some embodiments of the present invention, the first laser adjustment module and the second laser adjustment module are one of a lens, a combined lens or a prism.

[0009] According to some embodiments of the present invention, the height of the fine machining mechanism is smaller than the height of the rough machining mechanism.

[0010] According to some embodiments of the present invention, a bracket is further included, and the rough processing mechanism and the fine processing mechanism are both arranged on the bracket.

[0011] According to some embodiments of the present invention, a moving mechanism is also included.

[0012] The embodiment of the utility model has at least the following beneficial effects: the laser generating module is used to emit laser, and the laser generating module is oriented at least in two directions to form at least two optical paths, so that at least two grooves can be formed on the wafer; the laser regulating module can adjust the emission angle of the focused laser beam by adjusting the optical sheet, so that the focused laser beam is incident at an angle perpendicular to the processing plane, which can avoid the problem of poor processing quality caused by the impact angle of the focused laser beam incident on the processing plane being too large, and can also avoid the focus shift phenomenon of the focused laser beam, and effectively improve the processing accuracy; the rough processing mechanism emits a first laser in at least two directions respectively, so that at least two relatively rough grooves can be initially formed on the wafer; the fine processing mechanism emits multiple second lasers in the two directions of the rough processing mechanism respectively, and can perform fine processing again based on the relatively rough grooves, and adopts multiple laser beams for processing to reduce the energy of a single beam of light, which can reduce the damage to the cutting edge, form multiple relatively smooth grooves, and improve the processing quality.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1 This is a schematic diagram of the overall structure of a multi-laser head wafer scribing machine according to an embodiment of the utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of a laser emitting component of a multi-laser head wafer scribing machine is shown;

[0017] Figure 3 for Figure 1 The schematic diagram of the optical path of the rough processing mechanism of the multi-laser head wafer scribing machine is shown, wherein the optical path indicates the direction of the optical path, and does not indicate the width of the laser;

[0018] Figure 4 for Figure 1 Schematic diagram of the finishing mechanism of a multi-laser head wafer scribing machine, where the optical path indicates the direction of the optical path, not the width of the laser

[0019] Figure 5 For Figure 1 A schematic diagram showing a comparison of the widths of a first laser and multiple second lasers of a multi-laser head wafer scribing machine is shown.

[0020] Reference numerals:

[0021]

[0022] DETAILED DESCRIPTION

[0023] The following content will describe several embodiments of the present utility model, including embodiments corresponding to the drawings. It can be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present utility model, and should not be understood as limiting the scope of protection of the present utility model.

[0024] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the utility model, so as to fully understand the purpose, scheme and effect of the utility model. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0025] It should be noted that, unless otherwise clearly defined, when a feature is referred to as "fixed", "connected" or "installed" on another feature, it can be directly fixed or connected to another feature, or it can be indirectly fixed or connected to another feature. The words "fixed", "connected" or "installed" should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meaning of the above words in this utility model in combination with the specific content of the technical solution.

[0026] It should be noted that the descriptions of the directions or positional relationships indicated by up, down, left, right, top, bottom, front, back, inside, and outside used in the present invention are based on the directions or positional relationships in the drawings or embodiments and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0027] It should be noted that the term "and / or" used in the present utility model includes any combination of one or more related listed items, "above", "below", "within", etc. are understood to include the number itself.

[0028] It should be noted that the description of first and second in the utility model is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] It should be noted that, unless otherwise clearly defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments, not for limiting the present invention.

[0030] Reference Figure 1-Figure 5 The basic embodiment of the first aspect of the utility model provides a multi-laser head wafer scribing machine, comprising:

[0031] The rough processing mechanism 100 includes a first laser generating module 110 and a first laser adjusting module 120. The first laser generating module 110 emits a first laser 130 in at least two directions respectively. The first laser adjusting module 120 is arranged on the optical path of the first laser 130 so that the first laser 130 is incident at an angle perpendicular to the processing plane.

[0032] The finishing mechanism 200 includes a second laser generating module 210 and a second laser adjusting module 220. The second laser generating module 210 emits at least two second lasers 230 in at least two directions respectively. The second laser adjusting module 220 is arranged on the optical path of the second laser 230 so that the second laser 230 is incident at an angle perpendicular to the processing plane.

[0033] According to the embodiment of the utility model, by such arrangement, at least the following effects can be achieved: the laser generating module is used to emit laser, and the laser generating module is at least in two directions to form at least two optical paths, so that at least two grooves can be formed on the wafer; the laser adjusting module can adjust the emission angle of the focused laser beam by adjusting the optical sheet, so that the focused laser beam is incident at an angle perpendicular to the processing plane, which can avoid the problem of poor processing quality caused by the impact angle of the focused laser beam incident on the processing plane being too large, and can also avoid the focus shift phenomenon of the focused laser beam, and effectively improve the processing accuracy; the rough processing mechanism 100 emits a first laser 130 in at least two directions, so that at least two relatively rough grooves can be initially formed on the wafer; the fine processing mechanism 200 emits multiple second lasers 230 in two directions of the rough processing mechanism 100, respectively, and can perform fine processing again based on the relatively rough grooves. The use of multiple laser beams for processing can reduce the energy of a single beam of light, which can reduce the damage to the cutting edge, form multiple relatively smooth grooves, and improve the processing quality.

[0034] It can be understood that the two directions emitted by the first laser 130 module correspond one to one with the two directions emitted by the second laser module.

[0035] It is understandable that the laser generating module can disperse the laser into multiple lasers emitted in different directions under the processing of the diffraction mirror. The principle of the diffraction lens is mainly based on the working mechanism of the diffraction optical element. These elements achieve specific optical effects by precisely controlling the diffraction path of the light. The diffraction lens is usually engraved with uniform radial or parallel lines on the surface. These line structures can affect the light passing through the lens, causing it to produce diffraction dispersion under specific conditions. The direction of the laser is determined by the structure of the diffraction mirror. By designing a diffraction mirror with a corresponding structure, a laser can be dispersed into multiple lasers; in addition, the laser generating module can also change the direction of the laser by setting multiple laser heads in combination with mirror reflection, so that the laser can extend along a predetermined direction to form multiple lasers extending in at least two directions.

[0036] It can be understood that the description of the laser adjustment module is based on the application number 202222398234.9, and the name is a patent for a laser processing device. The corresponding structure is a laser module and an adjustment light sheet. It describes a variety of ways to adjust the laser incident angle. It is a prior art in this field, so it will not be described in subsequent documents.

[0037] In some embodiments, the first laser adjustment module 120 and the second laser adjustment module 220 are one of a lens, a combined lens or a prism. The laser adjustment module is one of a lens, a combined lens or a prism, and the adjustment light sheet adopts a lens; the adjustment light sheet adopts a combined lens, and the combined lens is a lens composed of more than two single lenses. The laser adjustment module adopts a prism; combined with conventional technical means of those skilled in the art, a corresponding light sheet can be used, so that the focused laser beams at different angles can be incident at an angle perpendicular to the processing plane.

[0038] In some embodiments, a support 300 is further included, and the rough machining mechanism 100 and the fine machining mechanism 200 are both disposed on the support 300. The support 300 can be used to place the rough machining mechanism 100 and the fine machining mechanism 200 on the support 300, so as to facilitate fixing the rough machining mechanism 100 and the fine machining mechanism 200.

[0039] In some embodiments, the height of the fine processing mechanism 200 is less than the height of the rough processing mechanism 100. The focal length of laser processing will affect the focusing effect and energy distribution of laser processing, and thus affect the processing quality. A focal length that is too small will result in a processing area that is too small, and a focal length that is too large will result in a processing area that is too large. The rough processing mechanism 100 has a large height and a large area, and the laser intensity is small, so the processing is relatively rough. The fine processing mechanism 200 has a small height and a small processing area, and the processing accuracy is relatively high.

[0040] In some embodiments, a moving mechanism 400 is further included, and the moving mechanism 400 is disposed below the rough processing mechanism 100 and the fine processing mechanism 200, and the moving mechanism 400 is used to move the wafer. The wafer is disposed on the moving mechanism 400, which can drive the wafer to move in a horizontal direction, which is conducive to forming crisscross grooves on the wafer.

[0041] In some embodiments, the plurality of second lasers 230 are located in the same plane, and the plurality of first lasers 130 are located in the same plane. The second lasers 230 and the first lasers 130 are both located in the same plane, which can facilitate the control of the position of laser processing.

[0042] In some embodiments, the output energy of the first laser 130 is greater than the output energy of the second laser 230. The fine processing mechanism 200 emits multiple second lasers 230 in two directions of the rough processing mechanism 100, and can perform fine processing again on the relatively rough grooves. The use of multiple laser beams for processing can reduce the energy of a single beam, reduce damage to the cutting edge, form multiple relatively smooth grooves, and improve processing quality.

[0043] Reference Figure 5 In some embodiments, a plurality of second lasers 230 are arranged side by side and a combined width of the plurality of second lasers 230 is less than or equal to a width of a first laser 130 .

[0044] It can be understood that the emission directions of multiple second lasers 230 in the same direction have a small deviation, so that the second lasers 230 will not overlap, and thus the second lasers 230 can be arranged side by side; multiple second lasers 230 are arranged side by side, and multiple second lasers 230 are arranged along the same straight line and adjacent lasers are connected to each other.

[0045] It can be understood that the width of the multiple second lasers 230 after merging, i.e., L1, the multiple second lasers 230 are respectively second laser No. 2301, second laser No. 2302 to second laser No. 230n, and the width of the multiple second lasers 230 after merging refers to the distance from the end of the second laser No. 2301 to the end of the second laser No. 230n; L2 is the width of the first laser.

[0046] It should be noted that in this specification, terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment" etc. may be used to describe several embodiments of the utility model. The specific features, structures, materials or characteristics in the several embodiments may be combined in accordance with the principles and purposes of the utility model.

[0047] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above embodiments. As long as the technical effects of the present invention are achieved by the same or equivalent means, any changes, modifications, equivalent substitutions and equivalent variations of these embodiments within the spirit and principles disclosed in the present invention and without departing from the principles and purpose of the present invention should be included in the scope of protection disclosed in the present invention and should be deemed to fall within the scope of protection of the present invention.

Claims

1. A multi-laser head wafer scribing machine, characterized in that: include: The rough processing mechanism (100) comprises a first laser generating module (110) and a first laser adjusting module (120), wherein the first laser generating module (110) respectively emits a first laser (130) in at least two directions, and the first laser adjusting module (120) is arranged on the optical path of the first laser (130) so that the first laser (130) is incident at an angle perpendicular to a processing plane; The finishing mechanism (200) comprises a second laser generating module (210) and a second laser adjusting module (220), wherein the second laser generating module (210) respectively emits at least two second lasers (230) in at least two directions, and the second laser adjusting module (220) is arranged on the optical path of the second laser (230) so that the second laser (230) is incident at an angle perpendicular to the processing plane.

2. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The first laser adjustment module (120) and the second laser adjustment module (220) are one of a lens, a combined lens or a prism.

3. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The height of the fine processing mechanism (200) is smaller than the height of the rough processing mechanism (100).

4. The multi-laser head wafer scribing machine according to claim 1, characterized in that: It also includes a support (300), and the rough processing mechanism (100) and the fine processing mechanism (200) are both arranged on the support (300).

5. The multi-laser head wafer scribing machine according to claim 1, characterized in that: It also comprises a moving mechanism (400), wherein the moving mechanism (400) is arranged below the rough processing mechanism (100) and the fine processing mechanism (200), and the moving mechanism (400) is used for transporting wafers.

6. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The plurality of second lasers (230) are located in the same plane.

7. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The plurality of first lasers (130) are located in the same plane.

8. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The output energy of the first laser (130) is greater than the output energy of the second laser (230).

9. The multi-laser head wafer scribing machine according to claim 1, characterized in that: The plurality of second lasers (230) are arranged side by side, and the width of the plurality of second lasers (230) after merging is less than or equal to the width of the first laser (130).

Images