Silicon carbide chip wafer cutting machine facilitating feeding

Abstract

The utility model discloses a silicon carbide chip wafer cutting machine convenient to feed, which comprises a bottom box body, a laser cutting head is arranged at the bottom end of a longitudinal servo displacement mechanism, and a feeding assembly convenient to feed is arranged below the laser cutting head. According to the silicon carbide chip wafer cutting machine convenient to feed, through the arrangement of the steel groove body, the servo motor, the transverse movable table, the wafer containing groove and the limiting rod, when the silicon carbide chip wafer cutting machine convenient to feed is used, a wafer is placed on the wafer containing disc after the surface of the wafer is cleaned, and the wafer containing groove in the wafer containing disc can limit the position of the wafer; and then the servo motor drives the external thread driving rod to rotate reversely, the transverse movable table moves leftwards along the transverse sliding rod to the position below the laser cutting head, the laser cutting head can cut longitudinal and transverse lines on the surface of the wafer, the function of facilitating feeding, feeding and discharging is achieved, and the problem that the device does not have the function of facilitating feeding, feeding and discharging is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a silicon carbide chip wafer cutting machine which is convenient for feeding. Background Art

[0002] As a crystalline material, high-purity silicon carbide single crystals can be used to manufacture semiconductors and silicon carbide fibers. They are widely used in chip processing, photovoltaic industry and other fields.

[0003] Silicon carbide wafers cut from crystal rods are the main raw material for processing chips. After cleaning, the silicon carbide wafers are sent to the wafer cutting machine. The wafer cutting machine uses laser cutting to implicitly cut multiple vertical and horizontal lines on the surface of the wafer to form the prototype of the chip blank. There are some functional deficiencies in actual use and there is room for improvement. For example, when the current silicon carbide chip wafer cutting machine is cutting, the bottom of the laser head is generally equipped with a set of bases that can be displaced in both horizontal and vertical directions to cooperate with the laser cutting head for cutting. The base itself has a small stroke and is at a low height from the laser cutting head. The loading mechanism has a narrow operating space when loading, and it is easy to cause contact with the laser cutting head during loading and unloading, affecting its cutting accuracy. It does not have the function of facilitating feeding, loading and unloading.

[0004] Now, a new type of silicon carbide chip wafer cutting machine with easy feeding is proposed to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a silicon carbide chip wafer cutting machine which is convenient for feeding materials, so as to solve the problem that the above-mentioned background technology does not have the function of convenient feeding, loading and unloading materials.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon carbide chip wafer cutting machine that is easy to feed, comprising a bottom box body, a control box is fixedly connected to the front end of one side of the top of the bottom box body, a main support frame is fixedly connected to one side of the control box, a lower traction frame is fixedly connected to the top of the main support frame, a longitudinal servo displacement mechanism is installed at the bottom end of the lower traction frame, a laser cutting head is installed at the bottom end of the longitudinal servo displacement mechanism, and a loading assembly that is easy to feed is arranged below the laser cutting head.

[0007] The loading assembly includes a steel trough body, which is transversely installed on the top of the bottom box body, two groups of transverse sliding rods are transversely fixedly connected between the two sides inside the steel trough body, an externally threaded driving rod is transversely movably connected between the middle positions of the two sides inside the bottom box body, a servo motor is installed at the middle position of one side of the bottom box body, the outside of the transverse sliding rod and the externally threaded driving rod is sleeved with a transverse movable table, a limiting groove is provided on the top of the transverse movable table, and limiting holes are respectively provided at the four corners of the bottom end of the limiting groove, a wafer placing plate is horizontally placed inside the limiting groove, a wafer placing groove is provided on the top of the wafer placing plate, and limiting rods are respectively provided at the four corners of the bottom end of the wafer placing plate.

[0008] Preferably, the threads on the outside of the externally threaded driving rod match the threads on the inside of the transverse movable platform, and the transverse movable platform can be displaced left and right along the outside of the transverse sliding rod and the externally threaded driving rod.

[0009] Preferably, the output end of the servo motor is connected to one side of the externally threaded driving rod, and the top end of the horizontal movable platform is higher than the top end of the steel trough body.

[0010] Preferably, the shape and size of the outer portion of the wafer placement plate are matched with the shape and size of the inner portion of the limiting groove, and the top of the wafer placement plate is flush with the top of the transverse movable table.

[0011] Preferably, a concave frame is fixedly connected to the other side of the top of the bottom box body, two groups of infrared transmitters are installed at the front end of the concave frame, and two groups of infrared receivers are installed at the rear end of the concave frame.

[0012] Preferably, the positions of the infrared transmitter and the infrared receiver correspond one to one, and the bottom end of the position where the infrared transmitter sends out a signal is flush with the top end of the horizontal movable platform.

[0013] Preferably, a support plate is fixedly connected to one side of the main support frame, a PLC logic controller is installed at the middle position of the top of the support plate, an alarm light is fixedly connected to the top of the PLC logic controller, and a CCD camera is installed at the middle position of the bottom end of the support plate.

[0014] Preferably, the bottom end of the CCD camera is higher than the top end of the transverse movable table, and the PLC logic controller, the alarm light, and the CCD camera are electrically connected.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the silicon carbide chip wafer cutting machine that is easy to feed not only realizes the function of convenient feeding, loading and unloading, but also realizes the function of wafer flatness monitoring and wafer surface cleaning detection;

[0016] (1) A steel trough body, a transverse slide bar, an externally threaded driving rod, a servo motor, a transverse movable table, a limiting groove, a limiting hole, a wafer placement plate, a wafer placement groove and a limiting rod are provided. When in use, the servo motor drives the externally threaded driving rod to rotate, so that the transverse movable table is laterally displaced to the rightmost side along the transverse slide bar. Wafers cut from a crystal rod are placed on the wafer placement plate after surface cleaning. The wafer placement groove on the wafer placement plate can limit the position of the wafer. After the wafer is placed in the wafer placement groove, its top end is flush with the top end of the wafer placement plate. The wafer placement plate is clamped by a robot arm as a carrier and placed horizontally on the transverse movable table. The limiting groove, limiting hole and wafer placement plate on the top of the transverse movable table are The placement plate and the limit rod at its bottom are adapted to fix their positions, and then the servo motor drives the external thread drive rod to rotate in the opposite direction, and the horizontal movable table moves to the left along the horizontal slide bar to the bottom of the laser cutting head. The longitudinal servo displacement mechanism controls the longitudinal displacement of the laser cutting head, and the servo motor controls the lateral displacement of the horizontal movable table through the external thread drive rod. The laser cutting head can cut vertical and horizontal lines on the surface of the wafer. After the cutting is completed, the servo motor drives the external thread drive rod to rotate forward, so that the horizontal movable table moves horizontally to the far right along the horizontal slide bar, and the robotic arm takes out and replaces the wafer placement plate together with the cut wafer. The whole operation is far away from the laser cutting head, which realizes the function of convenient feeding, loading and unloading.

[0017] (2) By providing a concave frame, an infrared transmitter and an infrared receiver, when the horizontal movable table carrying the wafer passes under the concave frame, the infrared signals continuously emitted by the two sets of infrared transmitters are continuously received by the infrared receiver. When the wafer is not completely in the wafer placement groove, its edge will be lifted up. When passing between the infrared transmitter and the infrared receiver, the signals of the two will be cut off. The equipment can determine that the wafer is not placed flat, thus realizing the function of wafer flatness monitoring.

[0018] (3) By setting up a support plate, a PLC logic controller, an alarm light and a CCD camera, when the cleaned wafer passes under the support plate, the CCD camera collects image information of the wafer surface and feeds it back to the background terminal. When the background program feeds back that there are foreign matter or impurities on the wafer surface, the PLC logic controller controls the alarm light to flash, reminding the staff to check and clean, thereby realizing the function of wafer surface cleaning detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view structural schematic diagram of the utility model;

[0020] Figure 2 This is a schematic diagram of the top view of the feeding assembly of the utility model;

[0021] Figure 3 It is a schematic diagram of a partial cross-sectional structure of the longitudinal servo displacement mechanism of the utility model in a side view;

[0022] Figure 4 This is a schematic diagram of the structure of the horizontal movable platform of the utility model from a top view;

[0023] Figure 5 This is a schematic diagram of the wafer placement plate of the utility model when viewed from above;

[0024] Figure 6 It is a side view structural schematic diagram of the horizontal movable platform of the utility model;

[0025] Figure 7 This is a schematic diagram of the side structure of the concave frame of the utility model;

[0026] Figure 8 It is a side structural schematic diagram of the supporting plate of the utility model.

[0027] In the figure: 1. bottom box; 2. steel trough; 3. horizontal slide rod; 4. external thread drive rod; 5. servo motor; 6. horizontal movable table; 7. limit groove; 8. limit hole; 9. wafer placement plate; 10. wafer placement groove; 11. limit rod; 12. control box; 13. main support frame; 14. lower traction frame; 15. longitudinal servo displacement mechanism; 16. laser cutting head; 17. concave frame; 18. infrared transmitter; 19. infrared receiver; 20. support plate; 21. PLC logic controller; 22. alarm light; 23. CCD camera. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Example 1: Please refer to Figure 1-8 A silicon carbide chip wafer cutting machine convenient for feeding includes a bottom box body 1, a control box 12 is fixedly connected to the front end of the top side of the bottom box body 1, a main support frame 13 is fixedly connected to one side of the control box 12, a lower traction frame 14 is fixedly connected to the top of the main support frame 13, a longitudinal servo displacement mechanism 15 is installed at the bottom end of the lower traction frame 14, a laser cutting head 16 is installed at the bottom end of the longitudinal servo displacement mechanism 15, and a feeding assembly convenient for feeding is arranged below the laser cutting head 16;

[0030] See also Figure 1-8, a silicon carbide chip wafer cutting machine that is convenient for feeding also includes a loading component, which includes a steel trough body 2, which is transversely installed on the top of the bottom box body 1, and two groups of transverse sliding rods 3 are transversely fixedly connected between the two sides inside the steel trough body 2, and an external thread driving rod 4 is transversely movably connected between the middle positions of the two sides inside the bottom box body 1. A servo motor 5 is installed at the middle position of one side of the bottom box body 1, and the outer parts of the transverse sliding rod 3 and the external thread driving rod 4 are sleeved with a transverse movable platform 6. A limiting groove 7 is arranged on the top of the transverse movable platform 6, and limiting holes 8 are respectively arranged at the four corners of the bottom end of the limiting groove 7. A wafer placing plate 9 is horizontally placed inside the limiting groove 7, and a wafer placing groove 10 is arranged on the top of the wafer placing plate 9. Limiting rods 11 are respectively arranged at the four corners of the bottom end of the wafer placing plate 9;

[0031] The threads on the outside of the external thread drive rod 4 match the threads on the inside of the horizontal movable platform 6. The horizontal movable platform 6 can move left and right along the outside of the horizontal slide bar 3 and the external thread drive rod 4. The output end of the servo motor 5 is connected to one side of the external thread drive rod 4. The top of the horizontal movable platform 6 is higher than the top of the steel tank body 2. The shape and size of the outside of the wafer placement plate 9 match the shape and size of the inside of the limit groove 7. The top of the wafer placement plate 9 is flush with the top of the horizontal movable platform 6. By moving the loading and unloading positions outward, the difficulty of operation can be reduced to prevent the laser head from being touched and damaged.

[0032] Specifically, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the wafer placement groove 10 on the wafer placement plate 9 can limit the position of the wafer. After the wafer is placed in the wafer placement groove 10, its top is flush with the top of the wafer placement plate 9. The wafer placement plate 9 is clamped by the robot arm as a carrier and placed horizontally on the horizontal movable table 6. The limit groove 7 and limit hole 8 on the top of the horizontal movable table 6 are adapted to the wafer placement plate 9 and the limit rod 11 at the bottom to fix their position. Then the servo motor 5 drives the external thread drive rod 4 to rotate in the opposite direction, and the horizontal movable table 6 moves to the left along the horizontal slide bar 3 to the bottom of the laser cutting head 16. The longitudinal servo displacement mechanism 15 controls the longitudinal displacement of the laser cutting head 16. The servo motor 5 controls the lateral displacement of the horizontal movable table 6 through the external thread drive rod 4, and the laser cutting head 16 can cut vertical and horizontal lines on the surface of the wafer.

[0033] Embodiment 2: A concave frame 17 is fixedly connected to the other side of the top of the bottom box 1, two groups of infrared transmitters 18 are installed at the front end of the concave frame 17, and two groups of infrared receivers 19 are installed at the rear end of the concave frame 17. The positions of the infrared transmitters 18 and the infrared receivers 19 correspond to each other. The bottom end of the signal sending position of the infrared transmitter 18 is flush with the top end of the horizontal movable table 6. Through infrared detection, unevenly placed wafers can be found in time to avoid deviation and scrapping caused by cutting;

[0034] Specifically, Figure 1 and Figure 7 As shown, the infrared signals continuously emitted by the two groups of infrared transmitters 18 are continuously received by the infrared receiver 19. When the wafer is not completely in the wafer placement slot 10, its edge will be lifted up. When passing between the infrared transmitter 18 and the infrared receiver 19, the signals of the two will be cut off, and the equipment can determine that the wafer is not placed flat.

[0035] Embodiment 3: A support plate 20 is fixedly connected to one side of the main support frame 13, a PLC logic controller 21 is installed at the middle position of the top of the support plate 20, an alarm light 22 is fixedly connected to the top of the PLC logic controller 21, a CCD camera 23 is installed at the middle position of the bottom of the support plate 20, the bottom of the CCD camera 23 is higher than the top of the horizontal movable table 6, the PLC logic controller 21, the alarm light 22, and the CCD camera 23 are electrically connected, and timely feedback can be given when there is foreign matter on the wafer surface;

[0036] Specifically, Figure 1 and Figure 8 As shown, the CCD camera 23 collects image information of the wafer surface and feeds it back to the background terminal. When the background program feeds back that there are foreign matter impurities on the wafer surface, the PLC logic controller 21 controls the alarm light 22 to flash, reminding the staff to check and clean it.

[0037] Working principle: When the utility model is in use, first, the servo motor 5 drives the external thread driving rod 4 to rotate, so that the horizontal movable table 6 is laterally displaced to the rightmost side along the horizontal sliding rod 3, and the wafer cut from the crystal rod is placed on the wafer placement plate 9 after the surface is cleaned. The wafer placement groove 10 on the wafer placement plate 9 can limit the position of the wafer. After the wafer is placed in the wafer placement groove 10, its top end is flush with the top end of the wafer placement plate 9. The wafer placement plate 9 is clamped by the robot arm as a carrier and placed horizontally on the horizontal movable table 6. The limiting groove 7 and the limiting hole 8 on the top of the horizontal movable table 6 are adapted to the wafer placement plate 9 and the limiting rod 11 at the bottom thereof to fix its position. The servo motor 5 then drives the external thread drive rod 4 to rotate in the opposite direction, and the horizontal movable table 6 moves to the left along the horizontal slide bar 3 to the bottom of the laser cutting head 16. The longitudinal servo displacement mechanism 15 controls the longitudinal displacement of the laser cutting head 16. The servo motor 5 controls the lateral displacement of the horizontal movable table 6 through the external thread drive rod 4. The laser cutting head 16 can cut vertical and horizontal lines on the surface of the wafer. After the cutting is completed, the servo motor 5 drives the external thread drive rod 4 to rotate forward, so that the horizontal movable table 6 moves to the rightmost side along the horizontal slide bar 3. The wafer placement plate 9 is taken out and replaced together with the cut wafer by the robotic arm. The whole operation is far away from the laser cutting head 16. When the horizontal movable table 6 carrying the wafer passes under the concave frame 17, the infrared signals continuously emitted by the two groups of infrared transmitters 18 are continuously received by the infrared receiver 19. When the wafer is not completely in the wafer placement groove 10, its edge will be lifted. When passing between the infrared transmitter 18 and the infrared receiver 19, the signals of the two will be cut off, and the equipment can determine that the wafer is not placed flat. When the cleaned wafer passes under the support plate 20, the CCD camera 23 collects image information of the wafer surface and feeds it back to the background terminal. When the background program feeds back that there are foreign matter or impurities on the wafer surface, the PLC logic controller 21 controls the alarm light 22 to flash, reminding the staff to check and clean.

[0038] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A silicon carbide chip wafer cutting machine that is convenient for feeding, comprising a bottom box (1), characterized in that: A control box (12) is fixedly connected to the front end of one side of the top of the bottom box body (1), a main support frame (13) is fixedly connected to one side of the control box (12), a lower traction frame (14) is fixedly connected to the top of the main support frame (13), a longitudinal servo displacement mechanism (15) is installed at the bottom end of the lower traction frame (14), a laser cutting head (16) is installed at the bottom end of the longitudinal servo displacement mechanism (15), and a feeding assembly for feeding is arranged below the laser cutting head (16); The loading assembly comprises a steel trough (2), wherein the steel trough (2) is transversely mounted on the top of the bottom box (1), two groups of transverse sliding rods (3) are transversely fixedly connected between the two sides inside the steel trough (2), an externally threaded driving rod (4) is transversely movably connected between the middle positions of the two sides inside the bottom box (1), a servo motor (5) is mounted at the middle position of one side of the bottom box (1), a transverse movable platform (6) is sleeved on the outside of the transverse sliding rod (3) and the externally threaded driving rod (4), a limiting groove (7) is arranged at the top of the transverse movable platform (6), and limiting holes (8) are respectively arranged at the four corners of the bottom end of the limiting groove (7), a wafer placement plate (9) is horizontally placed inside the limiting groove (7), a wafer placement groove (10) is arranged at the top of the wafer placement plate (9), and limiting rods (11) are respectively arranged at the four corners of the bottom end of the wafer placement plate (9).

2. The silicon carbide chip wafer cutting machine that is easy to feed according to claim 1 is characterized in that: The threads on the outside of the externally threaded driving rod (4) match the threads on the inside of the transverse movable platform (6), and the transverse movable platform (6) can move left and right along the outside of the transverse sliding rod (3) and the externally threaded driving rod (4).

3. The silicon carbide chip wafer cutting machine that is easy to feed according to claim 1 is characterized in that: The output end of the servo motor (5) is connected to one side of the external threaded driving rod (4), and the top end of the horizontal movable platform (6) is higher than the top end of the steel trough body (2).

4. The silicon carbide chip wafer cutting machine that is easy to feed according to claim 1 is characterized in that: The shape and size of the outside of the wafer placement plate (9) match the shape and size of the inside of the limiting groove (7), and the top of the wafer placement plate (9) is flush with the top of the horizontal movable platform (6).

5. The silicon carbide chip wafer cutting machine that is easy to feed according to claim 1, characterized in that: A concave frame (17) is fixedly connected to the other side of the top of the bottom box (1), two groups of infrared transmitters (18) are installed at the front end of the concave frame (17), and two groups of infrared receivers (19) are installed at the rear end of the concave frame (17).

6. The silicon carbide chip wafer cutting machine for easy feeding according to claim 5, characterized in that: The positions of the infrared transmitter (18) and the infrared receiver (19) correspond one to one, and the bottom end of the signal sending position of the infrared transmitter (18) is flush with the top end of the horizontal movable platform (6).

7. The silicon carbide chip wafer cutting machine for easy feeding according to claim 1, characterized in that: A support plate (20) is fixedly connected to one side of the main support frame (13); a PLC logic controller (21) is installed at the middle position of the top end of the support plate (20); an alarm light (22) is fixedly connected to the top end of the PLC logic controller (21); and a CCD camera (23) is installed at the middle position of the bottom end of the support plate (20).

8. The silicon carbide chip wafer cutting machine for easy feeding according to claim 7, characterized in that: The bottom end of the CCD camera (23) is higher than the top end of the horizontal movable platform (6), and the PLC logic controller (21), the alarm light (22), and the CCD camera (23) are electrically connected.

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