Wandering star wheel for wafer grinding and wafer grinding device

Abstract

The embodiment of the utility model provides a wandering star wheel for wafer grinding and a wafer grinding device, and relates to the technical field of wafer processing. The wandering star wheel for wafer grinding comprises a wandering star wheel body. Wherein the wandering star wheel body is provided with at least two wafer bearing parts, and the wafer bearing parts are used for bearing wafers. The wandering star wheel body is provided with a liquid guide groove, and the liquid guide groove is located between every two adjacent wafer bearing parts and used for guiding grinding liquid to be discharged. According to the wandering star wheel for wafer grinding and the wafer grinding device, the at least two wafer bearing parts are arranged on the wandering star wheel body, so that at least two wafers can be borne, double-sided grinding can be carried out on the at least two wafers at the same time for a single wandering star wheel, and the grinding efficiency is improved. In addition, optionally, the S-shaped liquid guide groove can guide out the grinding liquid when the two adjacent wafers are ground at the same time, the grinding liquid guide-out efficiency and effect are improved, and the wafer grinding effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a planetary wheel for wafer grinding and a wafer grinding device. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] The double-sided grinding process of silicon carbide wafers is to place the wafer into a planetary wheel, which is then placed on a double-sided grinding device. The upper and lower grinding discs clamp the planetary wheel, and the upper grinding disc applies a set pressure. The planetary wheel is driven to rotate by the center teeth and outer gear ring of the device through gear meshing. During grinding, the upper and lower grinding discs rotate relative to each other, thereby grinding the wafer.

[0004] Currently, the planetary wheel used for double-sided grinding of wafers can generally only carry one wafer, with low grinding efficiency and poor grinding effect. Utility Model Content

[0005] The utility model aims to provide a planetary wheel for wafer grinding and a wafer grinding device, which can effectively improve the grinding efficiency and grinding effect of the wafer.

[0006] The embodiment of the utility model is achieved as follows:

[0007] In a first aspect, the utility model provides a planetary wheel for wafer grinding, comprising: a planetary wheel body;

[0008] At least two wafer carrying parts are arranged on the planetary wheel body, and the wafer carrying parts are used to carry the wafer;

[0009] A liquid guiding groove is arranged on the planetary wheel body, and the liquid guiding groove is located between two adjacent wafer bearing parts and is used for guiding the discharge of the grinding liquid.

[0010] Further, in an optional embodiment, the liquid guiding groove is S-shaped.

[0011] Further, in an optional embodiment, the liquid guide groove includes a first groove section and a second groove section provided on the planetary wheel body;

[0012] The first groove section and the second groove section are both semicircular grooves, one end of the first groove section is connected to one end of the second groove section, the first groove section and the second groove section together form an S shape, the other end of the first groove section extends to the outer periphery of the planetary wheel body, and the other end of the second groove section extends to the outer periphery of the planetary wheel body.

[0013] Further, in an optional embodiment, the direction of the arc-shaped opening of the first slot segment is opposite to the direction of the arc-shaped opening of the second slot segment.

[0014] Further, in an optional embodiment, the wafer carrying portion includes a first wafer carrying portion and a second wafer carrying portion, and the liquid guiding groove is located between the first wafer carrying portion and the second wafer carrying portion;

[0015] The first wafer supporting part and the second wafer supporting part are both circular, the circle where the first groove section is located is concentric with the circle where the first wafer supporting part is located, and the circle where the second groove section is located is concentric with the circle where the second wafer supporting part is located.

[0016] Further, in an optional embodiment, two first weight-reducing holes are provided on the planetary wheel body, a line connecting the two first weight-reducing holes passes through the center of the planetary wheel body, and the two first weight-reducing holes are located on both sides of the liquid guide groove.

[0017] Further, in an optional embodiment, two second weight-reducing holes are provided on the planetary wheel body, a line connecting the two second weight-reducing holes passes through the center of the planetary wheel body, and the two second weight-reducing holes are located on both sides of the liquid guide groove;

[0018] The two first weight-reducing holes are circular, the two second weight-reducing holes are fan-shaped, the two first weight-reducing holes and the two second weight-reducing holes correspond one to one, and in the corresponding first weight-reducing holes and the second weight-reducing holes, the center of the first weight-reducing hole is the same as the center of the fan-shaped second weight-reducing hole.

[0019] Further, in an optional embodiment, the wafer carrying portion is a through groove structure that is opened through the planetary wheel body.

[0020] Further, in an optional embodiment, the cross-section of the liquid-conducting groove is arc-shaped, V-shaped or trapezoidal.

[0021] In a second aspect, the utility model provides a wafer grinding device, comprising a planetary wheel for wafer grinding as described in any one of the aforementioned embodiments. The planetary wheel for wafer grinding comprises a planetary wheel body. At least two wafer bearing parts are provided on the planetary wheel body, and the wafer bearing parts are used to bear the wafers. A liquid guide groove is provided on the planetary wheel body, and the liquid guide groove is located between two adjacent wafer bearing parts, and is used to guide the discharge of the grinding liquid.

[0022] The beneficial effects of the planetary wheel for wafer grinding and the wafer grinding device provided by the embodiment of the utility model include:

[0023] The planetary wheel and wafer grinding device provided by the embodiment of the utility model can carry at least two wafers by providing at least two wafer bearing parts on the planetary wheel body, and a single planetary wheel can also perform double-sided grinding on at least two wafers at the same time, thereby improving the grinding efficiency. In addition, since a liquid guide groove is provided between two adjacent wafer bearing parts, the grinding liquid can be discharged quickly and effectively, further improving the grinding effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic structural diagram of a planetary wheel for wafer grinding provided in an embodiment of the utility model.

[0026] icon:

[0027] 10-planetary wheel for wafer grinding; 100-planetary wheel body; 110-wafer carrying part; 111-first wafer carrying part; 112-second wafer carrying part; 120-liquid guide groove; 121-first groove section; 122-second groove section; 130-first weight reduction hole; 140-second weight reduction hole. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] See also Figure 1The planetary wheel 10 for wafer grinding provided by the embodiment of the utility model is applied to a wafer grinding device (not shown) for double-sided grinding of wafers, especially double-sided grinding of silicon carbide wafers. The wafer grinding device includes an upper grinding disc (not shown), a lower grinding disc (not shown) and the above-mentioned planetary wheel 10 for wafer grinding. Among them, the planetary wheel 10 for wafer grinding is arranged between the upper grinding disc and the lower grinding disc. The use of the planetary wheel 10 for wafer grinding can effectively improve the grinding efficiency and grinding effect of the wafer.

[0035] The planetary wheel 10 for wafer grinding includes a planetary wheel body 100. The planetary wheel body 100 is provided with at least two wafer bearing parts 110, and the wafer bearing parts 110 are used to bear wafers. The planetary wheel body 100 is provided with a liquid guide groove 120, which is located between two adjacent wafer bearing parts 110 and is used to guide the discharge of the grinding liquid. The outer periphery of the planetary wheel body 100 is provided with external teeth for meshing with the inner gear ring of the wafer grinding device.

[0036] The planetary wheel 10 for wafer grinding and the wafer grinding device can carry at least two wafers by providing at least two wafer bearing parts 110 on the planetary wheel body 100. A single planetary wheel can also perform double-sided grinding on at least two wafers at the same time, thereby improving the grinding efficiency. In addition, since a liquid guide groove 120 is provided between two adjacent wafer bearing parts 110, the grinding liquid can be quickly and effectively discharged, further improving the grinding effect of the wafer.

[0037] In an optional embodiment, the liquid guiding groove 120 is S-shaped.

[0038] It should be understood that the liquid guide groove 120 is S-shaped, so that two adjacent wafer supporting parts 110 of at least two wafer supporting parts 110 are arranged on both sides of the S-shaped liquid guide groove 120. In this way, an S-shaped liquid guide groove 120 can simultaneously guide the grinding liquid of two adjacent wafers during grinding, thereby improving the efficiency and effect of guiding the grinding liquid, thereby improving the effect of double-sided grinding of the wafer.

[0039] In an optional embodiment, the liquid guide groove 120 includes a first groove section 121 and a second groove section 122 disposed on the planetary wheel body 100. The first groove section 121 and the second groove section 122 are both semicircular grooves, one end of the first groove section 121 is connected to one end of the second groove section 122, the first groove section 121 and the second groove section 122 together form an S shape, the other end of the first groove section 121 extends to the outer periphery of the planetary wheel body 100, and the other end of the second groove section 122 extends to the outer periphery of the planetary wheel body 100.

[0040] It should be understood that the first groove section 121 and the second groove section 122 are connected to each other, and the connection point can be the center of the planetary wheel body 100. The first groove section 121 and the second groove section 122 together form an S-shaped liquid guide groove 120, so as to guide the grinding liquid to the outer periphery of the planetary wheel body 100 and discharge it.

[0041] In an optional embodiment, the direction of the arc-shaped opening of the first slot segment 121 is opposite to the direction of the arc-shaped opening of the second slot segment 122 .

[0042] It should be noted that the first groove section 121 and the second groove section 122 are both semicircular grooves, and the direction of the arc-shaped opening of the first groove section 121 is opposite to the direction of the arc-shaped opening of the second groove section 122. That is to say, if the arc formed by the first groove section 121 is opened to the left, then the arc formed by the second groove section 122 is set to open to the right, thereby forming an S-shaped liquid guide groove 120 to improve the liquid guide efficiency and effect.

[0043] In an optional embodiment, the wafer supporting part 110 includes a first wafer supporting part 111 and a second wafer supporting part 112, and the liquid guiding groove 120 is located between the first wafer supporting part 111 and the second wafer supporting part 112. The first wafer supporting part 111 and the second wafer supporting part 112 are both circular, and the circle where the first groove section 121 is located is concentric with the circle where the first wafer supporting part 111 is located, and the circle where the second groove section 122 is located is concentric with the circle where the second wafer supporting part 112 is located.

[0044] It should be understood that the first wafer supporting part 111 and the second wafer supporting part 112 are both circular. The circle where the first slot section 121 is located is concentric with the circle where the first wafer supporting part 111 is located, and the first slot section 121 is surrounded outside the first wafer supporting part 111, that is, the radius of the circle where the first slot section 121 is located is greater than the radius of the circle where the first wafer supporting part 111 is located; similarly, the circle where the second slot section 122 is located is concentric with the circle where the second wafer supporting part 112 is located, and the second slot section 122 is surrounded outside the second wafer supporting part 112, that is, the radius of the circle where the second slot section 122 is located is greater than the radius of the circle where the second wafer supporting part 112 is located. In this way, when double-sided grinding is performed on the wafers in the first wafer supporting part 111 and the second wafer supporting part 112, the grinding liquid radiates outward from the wafer, and the first groove section 121 and the second groove section 122 can receive the grinding liquid more evenly, and guide and discharge the grinding liquid toward the outer periphery of the planetary wheel body 100, thereby improving the effect of grinding liquid discharge and improving the effect of wafer grinding.

[0045] In an optional embodiment, two first weight-reducing holes 130 are provided on the planetary wheel body 100 , and a line connecting the two first weight-reducing holes 130 passes through the center of the planetary wheel body 100 . The two first weight-reducing holes 130 are located on both sides of the liquid guiding groove 120 .

[0046] By providing the two first weight-reducing holes 130 , the weight of the portion of the planetary wheel body 100 where the wafer is not ground can be reduced.

[0047] In an optional embodiment, two second weight-reducing holes 140 are provided on the planetary body 100, the connecting line of the two second weight-reducing holes 140 passes through the center of the planetary body 100, and the two second weight-reducing holes 140 are located on both sides of the liquid guide groove 120. Among them, the two first weight-reducing holes 130 are circular, the two second weight-reducing holes 140 are fan-shaped, the two first weight-reducing holes 130 and the two second weight-reducing holes 140 correspond one to one, and in the corresponding first weight-reducing holes 130 and second weight-reducing holes 140, the center of the first weight-reducing hole 130 is the same as the center of the fan-shaped second weight-reducing hole 140.

[0048] By setting the second weight-reducing hole 140, and the first weight-reducing hole 130 is circular, the second weight-reducing hole 140 is fan-shaped, and the center of the first weight-reducing hole 130 is the same as the center of the fan-shaped second weight-reducing hole 140, the weight-reducing effect of the first weight-reducing hole 130 and the second weight-reducing hole 140 on the part of the planetary wheel body 100 where the wafer is not ground is more uniform, so that the planetary wheel body 100 can rotate more smoothly.

[0049] In an optional embodiment, the wafer carrying portion 110 is a through-slot structure that is penetrated through the planetary wheel body 100 .

[0050] By setting the wafer carrying part 110 as a through slot structure penetrating the planetary wheel body 100, it is convenient to load the wafer into the wafer carrying part 110 for double-sided grinding. It should be understood that in this embodiment, the first wafer carrying part 111 and the second wafer carrying part 112 are both through slot structures penetrating the planetary wheel body 100.

[0051] Further, in an optional embodiment, the cross section of the liquid guiding groove 120 is arc-shaped, V-shaped or trapezoidal. In other words, the liquid guiding groove 120 can be an arc-shaped groove, a V-shaped groove or a trapezoidal groove, etc., so as to carry, guide and discharge the grinding liquid.

[0052] In summary, the planetary wheel 10 for wafer grinding and the wafer grinding device provided by the embodiment of the utility model can carry at least two wafers by providing at least two wafer bearing parts 110 on the planetary wheel body 100. For a single planetary wheel, at least two wafers can be double-sided ground at the same time, thereby improving the grinding efficiency. In addition, since the liquid guide groove 120 is provided between two adjacent wafer bearing parts 110, the grinding liquid can be discharged quickly and effectively, further improving the grinding effect of the wafer.

[0053] Furthermore, the S-shaped liquid guiding groove 120 can simultaneously guide the grinding liquid from two adjacent wafers during grinding, thereby improving the efficiency and effect of guiding the grinding liquid, thereby improving the effect of double-sided grinding of the wafers.

[0054] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A planetary wheel for wafer grinding, characterized in that: include: Star wheel body (100); At least two wafer carrying parts (110) are arranged on the planetary wheel body (100), and the wafer carrying parts (110) are used to carry the wafers; The planetary wheel body (100) is provided with a liquid guiding groove (120), and the liquid guiding groove (120) is located between two adjacent wafer bearing parts (110) and is used to guide the discharge of the grinding liquid.

2. The wafer grinding planetary wheel according to claim 1, characterized in that: The liquid guiding groove (120) is S-shaped.

3. The wafer grinding planetary wheel according to claim 2, characterized in that: The liquid-conducting groove (120) comprises a first groove section (121) and a second groove section (122) which are arranged on the planetary wheel body (100); The first groove section (121) and the second groove section (122) are both semicircular grooves, one end of the first groove section (121) is connected to one end of the second groove section (122), the first groove section (121) and the second groove section (122) together form an S-shape, the other end of the first groove section (121) extends to the outer periphery of the planetary wheel body (100), and the other end of the second groove section (122) extends to the outer periphery of the planetary wheel body (100).

4. The wafer grinding planetary wheel according to claim 3, characterized in that: The direction of the arc-shaped opening of the first slot section (121) is opposite to the direction of the arc-shaped opening of the second slot section (122).

5. The wafer grinding planetary wheel according to claim 4, characterized in that: The wafer carrying part (110) comprises a first wafer carrying part (111) and a second wafer carrying part (112), and the liquid guide groove (120) is located between the first wafer carrying part (111) and the second wafer carrying part (112); The first wafer supporting part (111) and the second wafer supporting part (112) are both circular, the circle where the first slot section (121) is located is concentric with the circle where the first wafer supporting part (111) is located, and the circle where the second slot section (122) is located is concentric with the circle where the second wafer supporting part (112) is located.

6. The planetary wheel for wafer grinding according to any one of claims 1 to 5, characterized in that: The planetary wheel body (100) is provided with two first weight-reducing holes (130), a line connecting the two first weight-reducing holes (130) passes through the center of the planetary wheel body (100), and the two first weight-reducing holes (130) are located on both sides of the liquid guide groove (120).

7. The wafer grinding planetary wheel according to claim 6, characterized in that: The planetary wheel body (100) is provided with two second weight-reducing holes (140), the connecting line of the two second weight-reducing holes (140) passes through the center of the planetary wheel body (100), and the two second weight-reducing holes (140) are located on both sides of the liquid guide groove (120); The two first weight-reducing holes (130) are circular, the two second weight-reducing holes (140) are fan-shaped, the two first weight-reducing holes (130) and the two second weight-reducing holes (140) correspond one to one, and in the corresponding first weight-reducing holes (130) and the second weight-reducing holes (140), the center of the first weight-reducing hole (130) is the same as the center of the fan-shaped second weight-reducing hole (140).

8. The planetary wheel for wafer grinding according to any one of claims 1 to 5, characterized in that: The wafer carrying portion (110) is a through-slot structure that is penetrated and opened on the planetary wheel body (100).

9. The planetary wheel for wafer grinding according to any one of claims 1 to 5, characterized in that: The cross section of the liquid-conducting groove (120) is arc-shaped, V-shaped or trapezoidal.

10. A wafer grinding device, characterized in that: It comprises a planetary wheel (10) for wafer grinding as claimed in any one of claims 1 to 9.

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