Stacked assembly of semiconductor lead frame

Abstract

The utility model discloses a stacking assembly of a semiconductor lead frame, which relates to the technical field of lead frame storage equipment and comprises a limiting frame, a protective cover, a clamping groove, a limiting frame, a limiting plate, a spring, a sponge pad, a screw rod and a pressing plate. According to the utility model, the pressing plate presses the uppermost limiting plate in the limiting frame downwards, the distance between the two connected limiting plates is gradually reduced, and the sponge pad between the two adjacent limiting plates flexibly clamps the semiconductor lead frame, so that the safety and the stability of the semiconductor lead frame on the inner side of the limiting frame can be effectively ensured; the limiting protection effect on the semiconductor lead frame can be effectively enhanced; the screw rod drives the pressing plate to gradually move upwards, the pressing force of the pressing plate on the limiting plates in the limiting frame is gradually reduced, the spring is gradually rebounded, then the protection cover is taken down from the limiting frame, then the semiconductor lead frame is taken, the distance between every two adjacent limiting plates can be enlarged to the maximum, and the semiconductor lead frame is taken more conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frame storage equipment, in particular to a stacked assembly of a semiconductor lead frame. Background Art

[0002] As the chip carrier of the integrated circuit, the semiconductor lead frame is a key structural component for forming an electrical circuit inside the chip, and it serves as a bridge connecting to external wires.

[0003] The patent (CN217865540U) discloses a semiconductor lead frame stacking device, including a limiting mechanism, wherein the inside of the limiting mechanism respectively limits the protection mechanism and the semiconductor lead frame body, and the top of the limiting mechanism is also clamped with a sealing mechanism, and the limiting mechanism includes a support base, and the center of the support base is provided with an antistatic pad. The semiconductor lead frame stacking device, by providing an antistatic pad inside the support base and fixing two limiting frames on the top of the antistatic pad, limits the semiconductor lead frame body through the gap between the limiting frames, separates multiple semiconductor lead frame bodies through an isolation plate, and uses a pin pad to support and protect the pins of the semiconductor lead frame body, so as to achieve the effect of protecting the semiconductor lead frame body when the semiconductor lead frame body is stacked and stored.

[0004] The semiconductor lead frame stacking device in the above patent document mainly limits the semiconductor lead frame by the gap of the limiting frame, which has poor limiting protection effect on the semiconductor lead frame and is not convenient for taking and placing the semiconductor lead frame. Summary of the invention

[0005] The purpose of the utility model is to provide a stacked assembly of a semiconductor lead frame to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a stacking assembly of a semiconductor lead frame, comprising a limit frame and a protective cover, the outer wall of the limit frame is provided with a slot matching the protective cover, the interior of the limit frame is provided with a movably connected limit frame, the limit frame comprises a plurality of limit plates, a plurality of springs are provided between two connected limit plates, the springs are respectively provided at both ends of the limit plates, sponge pads are symmetrically provided at the top and bottom of the outer wall of the limit plate, a threaded screw is provided at the center of the top of the protective cover, and a rotatably connected pressure plate is provided at the bottom of the screw horizontally on the inner side of the protective cover.

[0007] Furthermore, sliding grooves are symmetrically arranged on both sides of the inner wall of the limiting frame, and sliding blocks matching the sliding grooves are arranged on the outer wall of the limiting plate.

[0008] Furthermore, the outer wall of the limiting plate is provided with a plurality of support blocks, and the support blocks are symmetrically arranged on both sides and ends of the limiting plate, and the height of the support blocks is greater than the sum of the thickness of the limiting plate and the two sponge pads.

[0009] Furthermore, a handle is provided on the top of the screw rod, and the bottom of the screw rod is rotatably connected to the pressure plate via a rotating shaft.

[0010] Furthermore, the inner wall of the limiting frame is provided with a support shaft threadedly connected to the outer side of the slot, the outer wall of the support shaft is sleeved with a limiting disk, and the outer wall of the protective cover is provided with a limiting groove matching the limiting disk.

[0011] Furthermore, the limiting frame has an active cavity inside that matches the limiting disk, the active cavity is connected to the slot, the limiting disk has a fan-shaped cross-section, and one end of the support shaft extends to the outside of the limiting frame and has a turntable.

[0012] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0013] 1. The utility model is provided with a limit frame, a protective cover, a card slot, a limit frame, a limit plate, a spring, a sponge pad, a screw and a pressure plate. When in use, the semiconductor lead frame is placed in the gap between two adjacent limit plates of the limit frame, the screw pushes the pressure plate downward during rotation, the pressure plate moves downward, and the pressure plate presses the uppermost limit plate in the limit frame downward, the distance between the two adjacent limit plates is gradually reduced, and the sponge pad between the two adjacent limit plates flexibly clamps the semiconductor lead frame, which can effectively ensure that the semiconductor lead frame is inside the limit frame. The safety and stability of the device can be effectively enhanced, and the limiting protection effect of the semiconductor lead frame can be effectively enhanced; after the screw is adjusted, the protective cover and the limiting frame can be taken away as a whole to realize the overall transfer of the semiconductor lead frame; the screw drives the pressure plate to gradually move upward, and the pressing force of the pressure plate on the limiting plate in the limiting frame gradually decreases, and the spring gradually rebounds, and then the protective cover is removed from the limiting frame, and then the semiconductor lead frame can be taken away, and the distance between two adjacent limiting plates can be expanded to the maximum, and the operation of taking the semiconductor lead frame is more convenient.

[0014] 2. In the utility model, after the protective cover is inserted into the card slot of the limit frame, the adjustment dial is rotated, the dial drives the support shaft to rotate, the limit plate rotates with the support shaft, the limit plate moves out of the active cavity and enters the limit slot of the protective cover, so as to realize the limit locking of the protective cover, and the support shaft and the limit frame are connected by a threaded connection, so that the support shaft is in a threaded locking state after rotation and adjustment, which can effectively prevent the locking relationship between the protective cover and the limit frame from being accidentally released; when it is necessary to unlock the limit lock of the protective cover and the limit frame, the dial is rotated in the opposite direction, the dial rotates the support shaft in the opposite direction, the limit plate rotates in the opposite direction with the support shaft, the limit plate moves out of the limit slot and enters the active cavity, the limit lock of the protective cover is released, and then the protective cover is lifted up to realize the separation of the protective cover and the limit frame, which is convenient and quick to operate; the cross section of the limit plate is designed to be a fan-shaped structure, so that after the rotation movement of the limit plate enters the active cavity, it is ensured that the protective cover is normally inserted and withdrawn from the card slot, which is convenient and quick to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is the front view of the utility model as a whole;

[0017] Figure 2 It is a front cross-sectional view of the utility model as a whole;

[0018] Figure 3 This utility model Figure 2 The enlarged schematic diagram of point A in the middle;

[0019] Figure 4 This utility model Figure 2 The enlarged schematic diagram of point B in the middle;

[0020] Figure 5 It is a front cross-sectional view of the limit frame of the utility model;

[0021] Figure 6 It is a front cross-sectional view of the protective cover of the utility model;

[0022] Figure 7 This is the front view of the limit frame of the utility model;

[0023] In the figure: 1. limit frame; 2. protective cover; 3. slot; 4. limit frame; 5. limit plate; 6. spring; 7. sponge pad; 8. screw; 9. pressure plate; 10. slide groove; 11. turntable; 12. support block; 13. handle; 14. support shaft; 15. limit plate; 16. limit slot; 17. movable cavity. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 7 The utility model provides a technical solution: a stacking assembly of a semiconductor lead frame, comprising a limit frame 1 and a protective cover 2, wherein the outer wall of the limit frame 1 is provided with a card slot 3 matching the protective cover 2, and the inner part of the limit frame 1 is provided with a movable limit frame 4, wherein the limit frame 4 comprises a plurality of limit plates 5, and a plurality of springs 6 are provided between two connected limit plates 5, and the springs 6 are respectively provided at both ends of the limit plates 5, and sponge pads 7 are symmetrically provided at the top and bottom of the outer wall of the limit plate 5, and a threaded screw 8 is provided at the top center of the protective cover 2, A rotatably connected pressure plate 9 is horizontally provided at the bottom of the screw rod 8 on the inner side of the protective cover 2; a threaded support shaft 14 is provided on the inner wall of the limit frame 1 on the outer side of the slot 3, a limit plate 15 is sleeved on the outer wall of the support shaft 14, and a limit groove 16 matching the limit plate 15 is provided on the outer wall of the protective cover 2; an active cavity 17 matching the limit plate 15 is provided inside the limit frame 1, the active cavity 17 is connected with the slot 3, the cross section of the limit plate 15 is a fan-shaped structure, and a turntable 11 is provided at one end of the support shaft 14 extending to the outer side of the limit frame 1.

[0026] The inner wall of the limit frame 1 is symmetrically provided with slide grooves 10, and the outer wall of the limit plate 5 is provided with a slider matching the slide grooves 10. The slide grooves 10 provide an up and down sliding guide for the slider, which can effectively ensure the safety and stability of the up and down movement of the limit plate 5.

[0027] The outer wall of the limiting plate 5 is provided with a plurality of support blocks 12, and the support blocks 12 are symmetrically arranged on both sides and both ends of the limiting plate 5, and the height of the support blocks 12 is greater than the sum of the thicknesses of the limiting plate 5 and the two sponge pads 7. The support blocks 12 support the outside of the limiting plate 5. When the limiting plate 5 moves downward under the pressure of the pressure plate 9 above, the support blocks 12 on the limiting plate 5 contact and support each other, so that a certain gap is always retained between two adjacent limiting plates 5 to ensure that a placement space is provided for the semiconductor lead frame, and the limiting plate 5 is prevented from causing compression damage to the semiconductor lead frame. At the same time, the support blocks 12 contact and resist each other up and down to seal the gap between the two adjacent limiting plates 5, which can effectively prevent the semiconductor lead frame from falling off or displacing from between the limiting plates 5, and prevent the semiconductor lead frame from colliding with the inner wall of the protective cover 2, which can effectively enhance the safety of the semiconductor lead frame.

[0028] A handle 13 is provided at the top of the screw rod 8, and the bottom of the screw rod 8 is rotatably connected to the pressing plate 9 via a rotating shaft. The handle 13 facilitates rotation adjustment of the screw rod 8, and the rotation of the screw rod 8 drives the pressing plate 9 to move up and down.

[0029] The working principle of this utility model:

[0030] Refer to the instruction manual Figure 1-Figure 7The utility model is provided with a limit frame 1, a protective cover 2, a card slot 3, a limit frame 4, a limit plate 5, a spring 6, a sponge pad 7, a screw 8 and a pressure plate 9. The limit frame 1 supports the limit frame 4. When in use, the semiconductor lead frame is placed in the gap between two adjacent limit plates 5 of the limit frame 4. The sponge pad 7 on the top of the limit plate 5 performs flexible buffering support on the bottom of the semiconductor lead frame. After the gap between two adjacent limit plates 5 in the limit frame 4 is filled with the semiconductor lead frame, the protective cover 2 is covered above the limit frame 1, the protective cover 2 is inserted into the card slot 3, and then rotated. The adjusting screw rod 8 is turned and screwed downward. The screw rod 8 will push the pressing plate 9 downward during the rotation. The pressing plate 9 moves downward. The pressing plate 9 presses the uppermost limiting plate 5 in the limiting frame 4 downward. The limiting plate 5 at the uppermost moves downward under the action of the downward pressure. The limiting plate 5 presses the spring 6 downward and compresses and deforms. As the pressing plate 9 is gradually pressed downward, the distance between the two connected limiting plates 5 is gradually reduced. The sponge pad 7 between the two adjacent limiting plates 5 flexibly clamps the semiconductor lead frame, which can effectively ensure the safety and stability of the semiconductor lead frame on the inner side of the limiting frame 4, and can effectively strengthen the protection of the semiconductor lead frame. The limit protection effect of the lead frame is achieved by marking and setting the length of the downward movement of the screw rod 8, so that the limit plate 5 can be prevented from causing compression damage to the semiconductor lead frame due to the screw rod 8 moving downward too far; after the screw rod 8 is adjusted, the protective cover 2 and the limit frame 1 are taken together to realize the overall transfer of the semiconductor lead frame; when it is necessary to take the semiconductor lead frame inside the limit frame 1, the screw rod 8 is first screwed upward, and the screw rod 8 drives the pressure plate 9 to gradually move upward, and the pressing force of the pressure plate 9 on the limit plate 5 in the limit frame 4 is gradually reduced, and the spring 6 gradually rebounds, The distance between the two limit plates 5 is gradually enlarged, and the limit frame 4 releases the limit lock on the semiconductor lead frame. The semiconductor lead frame is placed flat between the two adjacent limit plates 5. When the pressure plate 9 is adjusted to the uppermost part of the inner wall of the protective cover 2, the pressure plate 9 no longer presses down the limit frame 4. The limit frame 4 rebounds and resets under the support of the spring 6. At this time, the distance between the two adjacent limit plates 5 is enlarged to the maximum, and then the protective cover 2 is removed from the limit frame 1, and then the semiconductor lead frame can be taken. The distance between the two adjacent limit plates 5 is enlarged to the maximum, and the operation of taking the semiconductor lead frame is more convenient.

[0031] After the protective cover 2 is inserted into the card slot 3 of the limiting frame 1, the adjusting dial 11 is rotated, and the dial 11 drives the support shaft 14 to rotate. The limiting plate 15 rotates with the support shaft 14, and the limiting plate 15 moves out of the active cavity 17 and enters the limiting groove 16 of the protective cover 2 to achieve the limiting locking of the protective cover 2. The support shaft 14 and the limiting frame 1 are connected by a thread, so that the support shaft 14 is in a threaded locking state after rotation and adjustment, which can effectively prevent the locking relationship between the protective cover 2 and the limiting frame 1 from being accidentally released; when the limiting locking relationship between the protective cover 2 and the limiting frame 1 needs to be When unlocking, the turntable 11 is rotated in the opposite direction, and the turntable 11 rotates the supporting shaft 14 in the opposite direction. The limiting plate 15 rotates in the opposite direction along with the supporting shaft 14, and the limiting plate 15 moves out of the limiting groove 16 and enters the movable cavity 17, releasing the limiting lock on the protective cover 2, and then the protective cover 2 can be lifted upward to separate the protective cover 2 from the limiting frame 1, which is convenient and quick to operate; the cross-section of the limiting plate 15 is designed to be a fan-shaped structure, so that after the limiting plate 15 rotates and enters the movable cavity 17, it is ensured that the protective cover 2 can be normally inserted and withdrawn from the card slot 3, and the operation is convenient and quick.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A stacked assembly of a semiconductor lead frame, comprising a limiting frame (1) and a protective cover (2), characterized in that: The outer wall of the limit frame (1) is provided with a slot (3) matching the protective cover (2); the inner part of the limit frame (1) is provided with a movably connected limit frame (4); the limit frame (4) comprises a plurality of limit plates (5); a plurality of springs (6) are provided between two of the limit plates (5); the springs (6) are respectively provided at both ends of the limit plates (5); sponge pads (7) are symmetrically provided at the top and bottom of the outer wall of the limit plates (5); a threaded screw (8) is provided at the center of the top of the protective cover (2); and a rotatably connected pressure plate (9) is provided at the bottom of the screw (8) horizontally on the inner side of the protective cover (2).

2. The stacked assembly of semiconductor lead frames according to claim 1, characterized in that: Slide grooves (10) are symmetrically arranged on both sides of the inner wall of the limiting frame (1), and sliding blocks matching the slide grooves (10) are arranged on the outer wall of the limiting plate (5).

3. The semiconductor lead frame stacking assembly according to claim 1, characterized in that: The outer wall of the limiting plate (5) is provided with a plurality of support blocks (12), the support blocks (12) being symmetrically arranged on both sides and both ends of the limiting plate (5), and the height of the support blocks (12) being greater than the sum of the thicknesses of the limiting plate (5) and the two sponge pads (7).

4. The semiconductor lead frame stacking assembly according to claim 1, characterized in that: A handle (13) is provided at the top of the screw rod (8), and the bottom of the screw rod (8) is rotatably connected to the pressing plate (9) via a rotating shaft.

5. The semiconductor lead frame stacking assembly according to claim 1, characterized in that: The inner wall of the limit frame (1) is provided with a support shaft (14) threadedly connected to the outside of the slot (3), the outer wall of the support shaft (14) is sleeved with a limit plate (15), and the outer wall of the protective cover (2) is provided with a limit groove (16) matching the limit plate (15).

6. The semiconductor lead frame stacking assembly according to claim 5, characterized in that: The limiting frame (1) is provided with an active cavity (17) matching the limiting disk (15) inside, the active cavity (17) is connected to the clamping slot (3), the limiting disk (15) has a cross-section of a fan-shaped structure, and one end of the support shaft (14) extends to the outside of the limiting frame (1) and is provided with a rotating disk (11).

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