Conveying device for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a conveying device for semiconductor processing. Comprising an adjusting device, the adjusting device comprises two supporting plates, the two supporting plates are fixedly connected with a conveying device body, motors are fixedly connected to the sides, away from each other, of the two supporting plates, power rods are fixedly connected to the output ends of the motors, and rotating shafts are fixedly connected to the arc surfaces of the power rods; and a connecting rod is arranged on one side of the motor. According to the conveying device for semiconductor processing provided by the utility model, when a semiconductor is transported and processed through the conveying device, the angle of the semiconductor during transportation on the conveying device can be corrected through the adjusting device, so that the angle of the semiconductor on the conveying device can be corrected through the adjusting device; therefore, the condition that the semiconductor is damaged due to abrasion between the semiconductor and the conveying device caused by angular deviation during transportation of the semiconductor is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a conveying device for semiconductor processing. Background Art

[0002] Semiconductor processing includes steps such as photolithography and cutting. By processing the semiconductor surface, the service life or use effect of the semiconductor can be made stronger and wider.

[0003] The utility model with announcement number CN218087714U discloses a conveying device for semiconductor component processing, and the key points of its technical solution are: it includes a transmission mechanism, a detection frame and a diversion mechanism, the transmission mechanism includes a support frame and a conveyor belt, the conveyor belt is installed at the head of the support frame, and the conveyor belt is fixedly connected to the support frame, the detection frame is installed at the end of the conveyor belt, and the detection frame is fixedly connected to the support frame, the diversion mechanism is installed in the middle of the detection frame, and the diversion mechanism is fixedly connected to the detection frame, and the detection frame is installed at the end of the transmission mechanism, so that the detection frame is used to support and install the diversion mechanism, and the angle of the guide plate is changed by the angle motor, so that the components can be conveyed from different directions on the conveyor belt, thereby achieving the purpose of removing unqualified products, and side panels are installed on the sides of the vertical frame, so that the side panels are used to shield and protect the components on the conveyor belt, so as to ensure that the components can be stably transmitted on the conveyor belt.

[0004] Regarding the above-mentioned related content, the following technical defects exist: when using a conveying device for semiconductor processing to transport semiconductors, it is found that when the semiconductor is placed on the conveying device for semiconductor processing and there is a deviation, the semiconductor will rub against the side wall of the conveying device for semiconductor processing, resulting in wear between the semiconductor and the conveying device, and then causing damage to the surface of the semiconductor. In severe cases, the semiconductor will be directly scrapped, and the transportation safety is low. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings in the prior art that when a semiconductor is placed on a conveying device for semiconductor processing and there is a deviation, the semiconductor will rub against the side wall of the conveying device for semiconductor processing, resulting in wear between the semiconductor and the conveying device, and then causing damage to the surface of the semiconductor. In severe cases, the semiconductor may be directly scrapped and the transportation safety is low.

[0006] To solve the above technical problems, the utility model provides a conveying device for semiconductor processing, comprising: a conveying device body, a supporting device is installed on the lower surface of the conveying device body, a power device is installed on one side of the conveying device body, an adjusting device is provided on the side of the conveying device body away from the supporting device, the adjusting device comprises two supporting plates, both of the two supporting plates are fixedly connected to the conveying device body, both of the two supporting plates are fixedly connected to a motor on the sides away from each other, the output end of the motor is fixedly connected to a power rod, the arc surface of the power rod is fixedly connected to a rotating shaft, a connecting rod is provided on one side of the motor, the connecting rod is fixedly connected to the conveying device body, the end of the connecting rod away from the conveying device body is rotatably connected to the connecting shaft, the connecting shaft and the arc surface of the rotating shaft are transmission-connected with the same belt, the side of the belt away from the support plate is fixedly connected to a plurality of fixing rods, and the end of the fixing rod away from the belt is fixedly connected to a guide block.

[0007] The effect achieved by the above-mentioned components is: by placing the semiconductor on the conveying device body, the conveying device body can be driven by the power device to convey the semiconductor, so as to facilitate the processing of the semiconductor through transportation. The supporting device can support the conveying device body. However, when the semiconductor is transported through the conveying device body, it is found that when the semiconductor is placed on the conveying device body and there is a deviation, the semiconductor will rub against the side wall of the conveying device body, resulting in wear between the semiconductor and the conveying device body, resulting in damage to the semiconductor surface, and causing the semiconductor to be scrapped. At this time, the adjustment device can be used to correct the angle of the semiconductor placed on the conveying device body for transportation to avoid contact between the semiconductor and the conveying device body, thereby improving the stability of the semiconductor transportation through the conveying device body.

[0008] Preferably, two support rods are fixedly connected to one side of the support plate away from the motor, and one end of the two support rods away from the support plate is fixedly connected to the same baffle.

[0009] The effect achieved by the above components is: when the motor drives the belt to rotate, the baffle installed on the support rod can protect the surface of the belt, preventing foreign matter from entering the inside of the belt and affecting the normal working effect of the belt.

[0010] Preferably, a connecting rod is fixedly connected to one side of the support plate away from the motor, and a connecting disk is rotatably connected to one end of the connecting rod away from the support plate.

[0011] The effect achieved by the above components is: when the semiconductor is transported through the conveying device body, the connecting plate installed on the connecting rod can guide the movement of the semiconductor on the conveying device body, enable the semiconductor to contact the guide block smoothly, and improve the stability of the guide block in guiding the semiconductor.

[0012] Preferably, the arc surface of the motor is slidably connected to a protective shell, and two screws are threadedly penetrated through the inner wall of the protective shell, and the two screws are both threadedly connected to the support plate.

[0013] The effect achieved by the above components is: when the motor is in use, the protective shell can be installed on the surface of the motor through a screw, so that the motor can be protected by the protective shell to prevent the motor from being damaged by external collisions and affecting the service life of the motor.

[0014] Preferably, an auxiliary device is provided on the side of the conveying device body close to the supporting device, and the auxiliary device includes two adjusting plates, the two adjusting plates are respectively fixedly connected to the two sides of the inner wall of the supporting device, the inner walls of the adjusting plates are slidably connected with an adjusting block, the side of the adjusting block away from the supporting device is fixedly connected with a sliding block, the side of the sliding block away from the adjusting block is fixedly connected with a positioning rod, the ends of the two positioning rods away from the sliding block are fixedly connected to the same cleaning plate, the inner walls of the two sides of the adjusting block are fixedly connected with springs, and the ends of the two springs away from each other are fixedly connected to limiting blocks.

[0015] The effect achieved by the above-mentioned components is: when the conveying device body is used for a long time, the debris generated by the semiconductor processing will adhere to the conveying device body. At this time, the debris attached to the conveying device body can be removed from the conveying device body through the auxiliary device, thereby preventing the debris from accumulating on the auxiliary device and affecting the subsequent processing effect of the semiconductor.

[0016] Preferably, a telescopic rod is slidably connected to the inner wall of the spring, and two ends of the telescopic rod are fixedly connected to the adjustment block and the limit block respectively.

[0017] The effect achieved by the above components is that when the spring is moving, the telescopic rod installed inside the spring can limit the movement of the spring, and the telescopic rod can effectively prevent the spring from deforming during movement.

[0018] Preferably, two load-bearing rods are fixedly connected to one side of the cleaning plate, and one end of the two load-bearing rods away from the cleaning plate is fixedly connected to the same handle.

[0019] The effect achieved by the above components is: when the angle of the cleaning plate needs to be moved, the handles installed on the two load-bearing rods can be used to move the cleaning plate, and the handles can increase the speed of moving the cleaning plate.

[0020] Compared with the related art, the semiconductor processing conveying device provided by the utility model has the following beneficial effects:

[0021] The utility model provides a conveying device for semiconductor processing. By arranging an adjusting device, when the semiconductor is transported and processed by the conveying device, the adjusting device can be used to correct the angle of the semiconductor during transportation on the conveying device, so that the angle of the semiconductor on the conveying device can be corrected by the adjusting device, so as to avoid angle deviation during semiconductor transportation, which leads to wear between the semiconductor and the conveying device and damage to the semiconductor.

[0022] By setting up an auxiliary device, the auxiliary device can be installed on the conveying device when the conveying device is used for a long time, so that the debris attached to the conveying device can be cleaned by the auxiliary device, thereby improving the stability of the conveying device when transporting semiconductors by cleaning the conveying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a conveying device for semiconductor processing provided by the utility model;

[0024] Figure 2 for Figure 1 The structural diagram below:

[0025] Figure 3 for Figure 1 The structural schematic diagram of the regulating device shown;

[0026] Figure 4 for Figure 3 The enlarged view of point A is shown;

[0027] Figure 5 for Figure 3 The enlarged view of point B is shown;

[0028] Figure 6 for Figure 1 The schematic diagram of the split structure of the regulating device shown;

[0029] Figure 7 for Figure 1 A schematic diagram of the structure of the auxiliary device shown;

[0030] Figure 8 for Figure 7 A schematic diagram of the partial disassembled structure of the auxiliary device is shown.

[0031] Numbers in the figure: 1. Conveying device body; 2. Adjusting device; 201. Support plate; 202. Motor; 203. Power rod; 204. Rotating shaft; 205. Connecting rod; 206. Connecting shaft; 207. Belt; 208. Fixed rod; 209. Guide block; 210. Connecting rod; 211. Connecting plate; 212. Support rod; 213. Baffle; 214. Protective shell; 215. Screw; 3. Auxiliary device; 301. Adjusting plate; 302. Sliding block; 303. Positioning rod; 304. Cleaning plate; 305. Spring; 306. Limiting block; 307. Adjusting block; 308. Telescopic rod; 309. Load-bearing rod; 310. Handle; 4. Supporting device; 5. Power device. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0033] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0034] See also Figures 1 to 8 A conveying device for semiconductor processing provided by an embodiment of the utility model includes: a conveying device body 1, a supporting device 4 is installed on the lower surface of the conveying device body 1, a power device 5 is installed on one side of the conveying device body 1, an adjusting device 2 is provided on the side of the conveying device body 1 away from the supporting device 4, and an auxiliary device 3 is provided on the side of the conveying device body 1 close to the supporting device 4.

[0035] In the embodiments of the present invention, please refer to Figures 3 to 6The adjusting device 2 includes two support plates 201, and the two support plates 201 are fixedly connected to the conveying device body 1. The two support plates 201 are fixedly connected to a motor 202 on one side away from each other. The output end of the motor 202 is fixedly connected to a power rod 203, and the arc surface of the power rod 203 is fixedly connected to a rotating shaft 204. A connecting rod 205 is provided on one side of the motor 202, and the connecting rod 205 is fixedly connected to the conveying device body 1. The end of the connecting rod 205 away from the conveying device body 1 is rotatably connected to a connecting shaft 206, and the connecting shaft 206 and the arc surface of the rotating shaft 204 are transmission-connected with the same belt 207, and a plurality of fixed rods 208 are fixedly connected to the side of the belt 207 away from the support plate 201. The fixed rods 208 are far away from the One end of the belt 207 is fixedly connected with a guide block 209. When the semiconductor is placed on the conveying device body 1, the conveying device body 1 can be driven by the power device 5 to convey the semiconductor, so as to facilitate the processing of the semiconductor through conveying. The support device 4 can support the conveying device body 1. However, when the semiconductor is transported through the conveying device body 1, it is found that when the semiconductor is placed on the conveying device body 1 and there is a deviation, the semiconductor will rub against the side wall of the conveying device body 1, resulting in wear between the semiconductor and the conveying device body 1, resulting in damage to the semiconductor surface, and causing the semiconductor to be scrapped. At this time, the adjustment device 2 can be used to correct the angle of the semiconductor placed on the conveying device body 1 for transportation to avoid the semiconductor being misaligned. The conductor comes into contact with the conveying device body 1, thereby improving the stability of semiconductor transportation through the conveying device body 1. Two support rods 212 are fixedly connected to the side of the support plate 201 away from the motor 202, and the two support rods 212 are fixedly connected to the same baffle 213 at one end away from the support plate 201. When the motor 202 drives the belt 207 to rotate, the baffle 213 installed on the support rod 212 can protect the surface of the belt 207 to prevent foreign matter from entering the inside of the belt 207 and affecting the normal working effect of the belt 207. A connecting rod 210 is fixedly connected to the side of the support plate 201 away from the motor 202, and a connecting plate 211 is rotatably connected to the connecting rod 210 at one end away from the support plate 201. The semiconductor is transported. When the device body 1 is transported, the connecting plate 211 installed on the connecting rod 210 can guide the movement of the semiconductor on the conveying device body 1, so that the semiconductor can smoothly contact the guide block 209, thereby improving the stability of the guide block 209 in guiding the semiconductor. The arc surface of the motor 202 is slidably connected with a protective shell 214, and the inner wall thread of the protective shell 214 is penetrated by two screws 215. The two screws 215 are both threadedly connected to the support plate 201. When the motor 202 is in use, the protective shell 214 can be installed on the surface of the motor 202 through the screw 215, so that the motor 202 can be protected by the protective shell 214 to prevent the motor 202 from being damaged by external collisions, thereby affecting the service life of the motor 202.

[0036] In the embodiments of the present invention, please refer to Figure 7 and Figure 8 The auxiliary device 3 includes two adjustment plates 301, and the two adjustment plates 301 are fixedly connected to the two sides of the inner wall of the supporting device 4 respectively. The inner wall of the adjustment plate 301 is slidably connected with an adjustment block 307, and the side of the adjustment block 307 away from the supporting device 4 is fixedly connected with a sliding block 302, and the side of the sliding block 302 away from the adjustment block 307 is fixedly connected with a positioning rod 303, and the ends of the two positioning rods 303 away from the sliding block 302 are fixedly connected to the same cleaning plate 304, and the inner walls of both sides of the adjustment block 307 are fixedly connected with springs 305, and the ends of the two springs 305 away from each other are fixedly connected with limit blocks 306. When the conveying device body 1 is used for a long time, the debris generated by the semiconductor processing will adhere to the conveying device body 1. At this time, the auxiliary device 3 can be used to remove the debris attached to the conveying device body 1 from the conveying device body 1, so that the auxiliary device The auxiliary device 3 is used to prevent debris from accumulating on the auxiliary device 3 and affecting the subsequent processing effect of the semiconductor. The inner wall of the spring 305 is slidably connected with a telescopic rod 308, and the two ends of the telescopic rod 308 are fixedly connected to the adjustment block 307 and the limit block 306 respectively. When the spring 305 moves, the telescopic rod 308 installed inside the spring 305 can limit the movement of the spring 305, and the telescopic rod 308 can effectively prevent the spring 305 from deforming during movement. One side of the cleaning plate 304 is fixedly connected to two load-bearing rods 309, and the ends of the two load-bearing rods 309 away from the cleaning plate 304 are fixedly connected with the same handle 310. When the angle of the cleaning plate 304 needs to be moved, the handles 310 installed on the two load-bearing rods 309 can be used, and the cleaning plate 304 can be moved by the handles 310, and the handles 310 can increase the speed of moving the cleaning plate 304.

[0037] The working principle of a conveying device for semiconductor processing provided by the utility model is as follows: when it is necessary to correct the angle of the semiconductor during transportation through the adjusting device 2, the motor 202 installed on the support plate 201 is started, and the movement of the motor 202 will drive the power rod 203 to rotate through the output end, and the rotation of the power rod 203 will drive the belt 207 to rotate on the connecting shaft 206 through the rotating shaft 204, and the rotation of the connecting shaft 206 will rotate on the connecting rod 205. When the belt 207 moves, the belt 207 will drive the guide block 209 to rotate through the fixed rod 208, and the semiconductor will be placed on the conveying device body 1. The guide block 209 will contact the semiconductor placed on the conveying device body 1 under the drive of the motor 202, so that the guide block 209 can contact the semiconductor to correct the semiconductor during transportation. When the motor 202 drives the belt 207 to rotate, the baffle 213 installed on the support rod 212 can protect the surface of the belt 207 to prevent foreign matter from entering the inside of the belt 207 and affecting the normal working effect of the belt 207. When the semiconductor is transported through the conveying device body 1, the connecting plate 211 installed on the connecting rod 210 can guide the movement of the semiconductor on the conveying device body 1, so that the semiconductor can smoothly contact the guide block 209, thereby improving the stability of the guide block 209 guiding the semiconductor. When the motor 202 is in use, the protective shell 214 can be installed on the surface of the motor 202 through the screw 215, so that the motor 202 can be protected by the protective shell 214 to prevent the motor 202 from being damaged by external collisions and affecting the service life of the motor 202.

[0038] When the auxiliary device 3 needs to be installed on the conveying device body 1, the limit block 306 is pressed in the direction of the spring 305. At this time, the spring 305 is in a rolled-up state, and then the adjustment block 307 is slid into the adjustment plate 301. The sliding block 302 will drive the adjustment block 307 to slide along the inner wall of the adjustment plate 301. When the limit block 306 coincides with the inner wall of the other side of the adjustment plate 301, the spring 305 resets and drives the limit block 306 to pop out from the adjustment plate 301, so that the positioning rod 303 and the cleaning plate 304 can be popped out from the adjustment plate 301 through the limit block 306. It is fixed on one side of the conveying device body 1, so that the conveying device body 1 can be cleaned through the cleaning plate 304. When the spring 305 moves, the telescopic rod 308 installed inside the spring 305 can limit the movement of the spring 305. The telescopic rod 308 can effectively prevent the spring 305 from deforming during movement. When the angle of the cleaning plate 304 needs to be moved, the handle 310 installed on the two load-bearing rods 309 can be used. The cleaning plate 304 can be moved by the handle 310, and the handle 310 can increase the speed of moving the cleaning plate 304.

[0039] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0040] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A conveying device for semiconductor processing, characterized in that: include: A conveying device body (1), a supporting device (4) is installed on the lower surface of the conveying device body (1), a power device (5) is installed on one side of the conveying device body (1), an adjusting device (2) is provided on the side of the conveying device body (1) away from the supporting device (4), the adjusting device (2) comprises two supporting plates (201), the two supporting plates (201) are fixedly connected to the conveying device body (1), the two supporting plates (201) are fixedly connected to the sides away from each other with a motor (202), the output end of the motor (202) is fixedly connected to a power rod (203), the circular shape of the power rod (203) The arc surface is fixedly connected to a rotating shaft (204); a connecting rod (205) is provided on one side of the motor (202); the connecting rod (205) is fixedly connected to the conveying device body (1); one end of the connecting rod (205) away from the conveying device body (1) is rotatably connected to a connecting shaft (206); the connecting shaft (206) and the arc surface of the rotating shaft (204) are transmission-connected by a same belt (207); a side of the belt (207) away from the support plate (201) is fixedly connected to a plurality of fixed rods (208); and one end of the fixed rod (208) away from the belt (207) is fixedly connected to a guide block (209).

2. A semiconductor processing conveying device according to claim 1, characterized in that: Two support rods (212) are fixedly connected to one side of the support plate (201) away from the motor (202), and one end of the two support rods (212) away from the support plate (201) is fixedly connected to the same baffle (213).

3. A semiconductor processing conveying device according to claim 1, characterized in that: A connecting rod (210) is fixedly connected to one side of the support plate (201) away from the motor (202), and a connecting plate (211) is rotatably connected to one end of the connecting rod (210) away from the support plate (201).

4. A semiconductor processing conveying device according to claim 1, characterized in that: The arc surface of the motor (202) is slidably connected to a protective shell (214), and two screw rods (215) are threadedly penetrated through the inner wall of the protective shell (214), and the two screw rods (215) are both threadedly connected to the support plate (201).

5. A semiconductor processing conveying device according to claim 1, characterized in that: An auxiliary device (3) is provided on a side of the conveying device body (1) close to the supporting device (4), and the auxiliary device (3) comprises two adjustment plates (301), the two adjustment plates (301) are respectively fixedly connected to the two sides of the inner wall of the supporting device (4), the inner wall of the adjustment plate (301) is slidably connected with an adjustment block (307), the side of the adjustment block (307) away from the supporting device (4) is fixedly connected with a sliding block (302), the side of the sliding block (302) away from the adjustment block (307) is fixedly connected with a positioning rod (303), one end of the two positioning rods (303) away from the sliding block (302) is fixedly connected to the same cleaning plate (304), the inner walls of both sides of the adjustment block (307) are fixedly connected with springs (305), and the ends of the two springs (305) away from each other are fixedly connected to a limiting block (306).

6. A semiconductor processing conveying device according to claim 5, characterized in that: The inner wall of the spring (305) is slidably connected with a telescopic rod (308), and two ends of the telescopic rod (308) are respectively fixedly connected to the adjustment block (307) and the limit block (306).

7. A semiconductor processing conveying device according to claim 5, characterized in that: Two load-bearing rods (309) are fixedly connected to one side of the cleaning plate (304), and one end of the two load-bearing rods (309) away from the cleaning plate (304) is fixedly connected to the same handle (310).

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