Electrochemical polishing device applying sub-aperture polishing

Abstract

The utility model discloses an electrochemical polishing device applying sub-aperture polishing, and belongs to the technical field of polishing devices.The electrochemical polishing device comprises a liquid storage tank, a bearing mechanism and a polishing mechanism, the bearing mechanism is arranged in the liquid storage tank and comprises a base, a metal block and a fixing assembly, the metal block is installed on the base, and the fixing assembly is arranged on the metal block; the fixing assembly is arranged at the top of the metal block and used for fixing a to-be-polished workpiece, the polishing mechanism comprises a main shaft and a polishing head, and the polishing head is installed on the main shaft and used for polishing the to-be-polished workpiece. The polishing device has the effect of conveniently achieving comprehensive polishing treatment on the workpiece.

Description

Technical Field

[0001] The present application relates to the field of polishing devices, and in particular to an electrochemical polishing device using sub-aperture polishing. Background Art

[0002] Silicon carbide (SiC) is an important inorganic compound with a series of excellent physical and chemical properties. It has broad application prospects in the industrial and scientific fields. With the continuous advancement of science and technology, the application field of silicon carbide will be further expanded.

[0003] Since SiC single crystals have very high hardness and are chemically inert, they hardly react with acid or alkaline solutions. Therefore, the operation of polishing SiC single crystals is usually performed by electrochemical mechanical polishing. Compared with traditional metal chemical mechanical polishing, electrochemical mechanical polishing uses an external circuit to oxidize the material surface, thereby achieving low pressure, high controllability and improved material removal efficiency.

[0004] In the prior art, the polishing device used for polishing hard and brittle materials such as SiC single crystals usually adopts full-aperture polishing, which specifically includes a base, a liquid reservoir, a spindle and a polishing head, wherein the polishing head is installed at the bottom of the spindle, and after the workpiece is placed on the base, the liquid reservoir is arranged on the top of the workpiece, an electrolyte is arranged in the liquid reservoir and an opening is opened at the bottom of the liquid reservoir. During the polishing process, the negative pole of the power supply is connected to the polishing head and the positive pole of the power supply is connected to the base, so that the polishing head can polish the workpiece through the opening at the bottom of the liquid reservoir.

[0005] With respect to the above-mentioned prior art, the polishing device performs polishing processing on the workpiece only on the opening area at the bottom of the liquid storage tank, rather than on the entire surface of the workpiece, which makes it difficult to achieve comprehensive polishing processing on the workpiece. Utility Model Content

[0006] In order to facilitate the comprehensive polishing of the workpiece, the present application provides an electrochemical polishing device using sub-aperture polishing.

[0007] The present application provides an electrochemical polishing device using sub-aperture polishing, which adopts the following technical solution:

[0008] An electrochemical polishing device using sub-aperture polishing includes a liquid storage tank, a bearing mechanism and a polishing mechanism, wherein the bearing mechanism is arranged in the liquid storage tank, the bearing mechanism includes a base, a metal block and a fixing component, the metal block is installed on the base, the fixing component is arranged on the top of the metal block and is used to fix the workpiece to be polished, and the polishing mechanism includes a spindle and a polishing head, the polishing head is installed on the spindle and is used to polish the workpiece to be polished.

[0009] By adopting the above technical scheme, when polishing the workpiece to be polished, the workpiece to be polished is placed on the top of the metal block, and the position of the workpiece to be polished is fixed by a fixing component. After the electrolyte is placed in the liquid storage tank, the negative electrode of the power supply is connected to the polishing head through a wire, and the positive electrode of the power supply is connected to the metal block through a wire. When the power is on, an electrolytic reaction will occur on the surface of the workpiece to be polished, and chemical reactions will occur at the two electrodes at the same time. After the surface of the workpiece to be polished loses electrons, oxides with significantly reduced hardness will be generated on the surface. At this time, the oxides are quickly removed by the rotation of the polishing head after contact with the surface of the component, thereby obtaining a smooth and clean surface. Polishing the workpiece in the liquid storage tank by a polishing head with a smaller diameter facilitates comprehensive polishing of the workpiece to be polished, and has strong applicability.

[0010] Optionally, a placement groove matching the shape of the metal block is provided on the top of the base, the metal block is located in the placement groove, and the top of the metal block is flush with the top of the base.

[0011] By adopting the above technical solution, the arrangement of the placement groove facilitates limiting the position of the metal block, thereby facilitating ensuring the stability of the position of the metal block when the workpiece is polished.

[0012] Optionally, the supporting mechanism further includes an insulating washer, which is installed on the outer peripheral surface of the workpiece to be polished, and the insulating washer covers the metal block.

[0013] By adopting the above technical solution, the setting of the insulating gasket makes it difficult for the fixing component to affect the polishing process of the workpiece after fixing the workpiece, and it is convenient for the metal block to stably electrolyze the workpiece, which is beneficial to further ensure the polishing quality of the workpiece after polishing.

[0014] Optionally, the fixing assembly includes a fixing seat and a fixing screw, wherein a plurality of the fixing seats are circumferentially distributed around the axis of the base, a plurality of the fixing screws are provided and correspond one-to-one with the fixing seats, and each of the fixing seats is fixed to the base by a fixing screw.

[0015] By adopting the above technical solution, the arrangement of the fixing screws and the fixing seat makes the structure of fixing the workpiece and the base simple, and the operation is convenient and fast.

[0016] Optionally, the fixing seat is provided with an adjustment hole extending along its length direction, and the fixing screw is threadably engaged with the base and slidably engaged in the adjustment hole.

[0017] By adopting the above technical solution, after the fixing screw is screwed to release the fixation of the fixing seat, the fixing seat is moved so that the fixing seat moves to a state where the workpiece to be polished is fixed, and then the fixing screw is screwed to fix the fixing seat. This is convenient for quickly fixing workpieces of different sizes and has strong applicability.

[0018] Optionally, the fixing seat includes an adjusting portion and a fixing portion fixedly connected to one end of the adjusting portion close to the axis of the base, and a longitudinal cross-sectional dimension of the fixing portion is larger than a longitudinal cross-sectional dimension of the adjusting portion.

[0019] By adopting the above technical solution, the fixing part with a larger size can more stably achieve the pressing and fixing of the workpiece while saving materials, thereby ensuring the stability of the position of the workpiece when it is fixed.

[0020] Optionally, the polishing mechanism further comprises a platinum sheet, the platinum sheet is mounted on the bottom of the main shaft, and the polishing head abuts against the platinum sheet.

[0021] By adopting the above technical solution, when polishing the workpiece, the electrolyte in the liquid storage tank is submerged over the platinum sheet and then the workpiece is polished. At this time, the platinum sheet and the workpiece form a counter electrode to protect the circuit, which is beneficial to further ensure the stability of the electrolytic reaction on the workpiece surface when the power is on.

[0022] Optionally, scale lines are provided on the inner wall of the liquid storage tank.

[0023] By adopting the above technical solution, the setting of the scale lines makes it easy for the staff to intuitively observe the electrolyte capacity in the liquid storage tank, so as to quickly adjust the electrolyte capacity in the liquid storage tank according to actual needs.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The oxides are quickly removed by the rotation of the polishing head after it contacts the surface of the component, thereby obtaining a smooth and clean surface. The polishing process of the workpiece in the liquid storage tank is carried out by a polishing head with a smaller diameter, which facilitates the comprehensive polishing of the workpiece to be polished and has strong applicability.

[0026] 2. The placement groove is provided to limit the position of the metal block, thereby facilitating the stability of the position of the metal block when the workpiece is polished.

[0027] 3. The setting of the insulating gasket makes it difficult for the fixing component to affect the polishing of the workpiece after fixing the workpiece, and facilitates the metal block to stably realize the electrolysis of the workpiece, which is beneficial to further ensure the polishing quality of the workpiece after polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0029] Figure 2 It is a cross-sectional schematic diagram of the base and the main shaft in the embodiment of the present application.

[0030] Description of reference numerals:

[0031] 1. Liquid storage tank; 2. Liquid storage cavity; 3. Scale line; 4. Base; 5. Metal block; 6. Insulating gasket; 7. Placement slot; 8. Wire hole; 9. Fixed seat; 901, Adjustment part; 902, Fixed part; 10. Fixing screw; 11. Adjustment hole; 12. Spindle; 13. Platinum sheet; 14. Polishing head. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-2 This application is described in further detail.

[0033] The present application embodiment discloses an electrochemical polishing device using sub-aperture polishing. Figure 1 The electrochemical polishing device using sub-aperture polishing includes a liquid reservoir 1, a supporting mechanism and a polishing mechanism, wherein the liquid reservoir 1 is in the shape of a trapezoidal funnel, and has a liquid reservoir chamber 2 for accommodating and placing an electrolyte, and the opening of the liquid reservoir chamber 2 extends to the top of the liquid reservoir 1, and the inner wall of the liquid reservoir 1, that is, the cavity wall of the liquid reservoir chamber 2, is provided with a scale line 3 extending in a vertical direction, so that the staff can intuitively observe the electrolyte capacity in the liquid reservoir 1 and quickly adjust the electrolyte capacity in the liquid reservoir 1 according to actual needs.

[0034] Reference Figure 1 and Figure 2 The bearing mechanism includes a base 4, a metal block 5, an insulating gasket 6 and a fixing component, wherein the cross-section of the metal block 5 of the base 4 in the embodiment of the present application is circular, the base 4 is fixedly installed on the bottom wall of the liquid storage chamber 2, and a placement groove 7 is provided on the top of the base 4, the placement groove 7 is adapted to the outer dimensions of the metal block 5, the metal block 5 is located in the placement groove 7, and the top of the metal block 5 is flush with the top of the base 4 to ensure the position stability of the metal block 5, and a wire hole 8 connected to the placement groove 7 is provided on one side of the base 4, so that the metal block 5 can be electrically connected to the negative pole of the power supply through a wire passing through the wire hole 8.

[0035] Reference Figure 2 The top of the base 4 is used to place the workpiece to be polished. The insulating gasket 6 is fixed to the outer peripheral surface of the workpiece to be polished by epoxy resin. The cross-sectional dimension of the insulating gasket 6 is larger than the cross-sectional dimension of the metal block 5, so that when the workpiece to be polished is placed on the top of the base 4, the metal block 5 is located in the area surrounded by the outer dimensions of the insulating gasket 6, that is, the insulating gasket 6 covers the metal block 5. The provision of the insulating gasket 6 facilitates the subsequent stable electrolysis of the workpiece by the metal block 5, thereby facilitating the full guarantee of the polishing quality of the workpiece after polishing.

[0036] Reference Figure 1 and Figure 2The fixing assembly includes a fixing seat 9 and a fixing screw 10, and four fixing seats 9 and fixing screws 10 are evenly distributed around the axis of the base 4, wherein the fixing screw 10 is threadedly engaged with the top of the base 4, and the fixing seat 9 includes an adjusting portion 901 and a fixing portion 902, wherein the fixing portion 902 is integrally fixedly connected to one end of the adjusting portion 901 close to the axis of the base 4, and the longitudinal section dimension of the fixing portion 902 is larger than the longitudinal section dimension of the adjusting portion 901, so that the fixing portion 902 can press the workpiece to be polished more stably to achieve the fixation of the position of the workpiece during polishing while saving materials.

[0037] Reference Figure 1 The adjusting portion 901 is provided with an adjusting hole 11 extending along its own length direction, that is, radially extending from the base 4. The fixing screw 10 is slidably fitted in the adjusting hole 11. When fixing workpieces to be polished of different sizes, after screwing the fixing screw 10 to release the fixation of the fixing seat 9, the fixing seat 9 is moved so that the fixing seat 9 is moved to a state where the workpiece to be polished is fixed, that is, the insulating gasket 6 outside the workpiece to be polished is pressed against the state, and then the fixing screw 10 is screwed to fix the fixing seat 9. It is convenient and fast, and has strong applicability.

[0038] Reference Figure 1 and Figure 2 The polishing mechanism includes a main shaft 12, a platinum sheet 13 and a polishing head 14, wherein the platinum sheet 13 is embedded and installed at the bottom of the main shaft 12, the polishing head 14 is coaxially fixedly installed on the main shaft 12, and the free end of the polishing head 14 close to the main shaft 12 abuts against the platinum sheet 13, and the end of the polishing head 14 away from the main shaft 12 is used to polish the workpiece to be polished. The arrangement of the platinum sheet 13 allows the platinum sheet 13 to form a counter electrode with the workpiece when the workpiece is being polished and the electrolyte in the liquid storage tank 1 is submerged at the location of the platinum sheet 13, thereby protecting the circuit, which is conducive to fully ensuring the stability of the electrolytic reaction on the surface of the workpiece when the power is on.

[0039] The implementation principle of an electrochemical polishing device using sub-aperture polishing in an embodiment of the present application is as follows: when it is necessary to polish a workpiece to be polished, first place the workpiece to be polished on top of the metal block 5, and move each fixing seat 9 so that the fixing portion 902 presses against the insulating gasket 6 on the outside of the workpiece to be polished, then fix the position of the fixing seat 9 by the fixing screw 10, so as to ensure the stability of the position of the workpiece to be polished, and then place the electrolyte in the liquid reservoir 1 and then connect the negative pole of the power supply to the polishing head 14 through a wire, and connect the positive pole of the power supply to the metal block 5 through a wire. When the power is on, an electrolytic reaction will occur on the surface of the workpiece to be polished, and chemical reactions will occur at the same time. After the surface of the workpiece to be polished loses electrons, oxides with significantly reduced hardness will be generated on the surface. At this time, the oxides are quickly removed by the rotation of the polishing head 14 after contacting the surface of the component, so as to obtain a smooth and clean surface. Polishing the workpiece in the liquid reservoir 1 by the polishing head 14 with a smaller diameter facilitates the comprehensive polishing of the workpiece to be polished, and has strong applicability.

[0040] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electrochemical polishing device using sub-aperture polishing, characterized in that: The invention comprises a liquid storage tank (1), a bearing mechanism and a polishing mechanism, wherein the bearing mechanism is arranged in the liquid storage tank (1), the bearing mechanism comprises a base (4), a metal block (5) and a fixing component, the metal block (5) is mounted on the base (4), the fixing component is arranged on the top of the metal block (5) and is used to fix a workpiece to be polished, and the polishing mechanism comprises a main shaft (12) and a polishing head (14), the polishing head (14) is mounted on the main shaft (12) and is used to polish the workpiece to be polished.

2. The electrochemical polishing device using sub-aperture polishing according to claim 1, characterized in that: The top of the base (4) is provided with a placement groove (7) that matches the shape of the metal block (5); the metal block (5) is located in the placement groove (7); and the top of the metal block (5) is flush with the top of the base (4).

3. The electrochemical polishing device using sub-aperture polishing according to claim 2, characterized in that: The bearing mechanism further comprises an insulating washer (6), wherein the insulating washer (6) is mounted on the outer peripheral surface of the workpiece to be polished, and the insulating washer (6) covers the metal block (5).

4. The electrochemical polishing device using sub-aperture polishing according to claim 1, characterized in that: The fixing assembly comprises a fixing seat (9) and fixing screws (10), wherein a plurality of the fixing seats (9) are circumferentially distributed around the axis of the base (4), a plurality of the fixing screws (10) are provided and correspond one to one with the fixing seats (9), and each of the fixing seats (9) is fixed to the base (4) by means of each fixing screw (10).

5. The electrochemical polishing device using sub-aperture polishing according to claim 4, characterized in that: The fixing seat (9) is provided with an adjustment hole (11) extending along its length direction, and the fixing screw (10) is threadedly engaged with the base (4) and slidably engaged in the adjustment hole (11).

6. The electrochemical polishing device using sub-aperture polishing according to claim 5, characterized in that: The fixing seat (9) comprises an adjusting portion (901) and a fixing portion (902) fixedly connected to one end of the adjusting portion (901) close to the axis of the base (4), and the longitudinal section size of the fixing portion (902) is larger than the longitudinal section size of the adjusting portion (901).

7. The electrochemical polishing device using sub-aperture polishing according to claim 1, characterized in that: The polishing mechanism also includes a platinum sheet (13), the platinum sheet (13) is installed at the bottom of the main shaft (12), and the polishing head (14) is in contact with the platinum sheet (13).

8. The electrochemical polishing device using sub-aperture polishing according to claim 1, characterized in that: The inner wall of the liquid storage tank (1) is provided with scale lines (3).

Images