Silicon carbide crystal ingot cooling device

Abstract

The utility model relates to semiconductor manufacturing, and provides a silicon carbide crystal ingot cooling device which comprises a shell, a cavity is formed in the shell, an air inlet is formed in the shell, an air inlet mechanism is installed at the air inlet, a cooling cavity is formed in the shell and used for containing a silicon carbide crystal ingot, and a plurality of air outlets are formed in the cooling cavity and used for containing the silicon carbide crystal ingot. The silicon carbide crystal ingot needing to be cooled is placed in the cooling cavity, the working air inlet mechanism sucks air from the air inlet and exhausts the air from the air outlet, and the crystal ingot is located at the air outlet, so that the effect of cooling the silicon carbide crystal ingot is achieved, the cooling time of the silicon carbide crystal ingot is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to semiconductor manufacturing, and more particularly to a silicon carbide ingot cooling device. Background Art

[0002] With the rapid development of information technology, the innovation of semiconductor technology plays an increasingly important role. Semiconductors represented by silicon carbide and gallium nitride are the third generation of semiconductors after silicon and gallium arsenide. Silicon carbide has great advantages in operating temperature, breakdown voltage, radiation resistance and other performance.

[0003] The manufacturing process of silicon carbide is complicated and involves many processing steps. During the rough processing process, the crystal ingot needs to be bonded to the jig of the corresponding process many times and then removed. The AB glue used to bond the jig needs to be heated and removed during the subsequent operation after the crystal ingot is removed. The crystal ingot needs to be cooled. In order to avoid stress problems in the silicon carbide ingot, water cooling cannot be used to cool it. However, the cooling time of the silicon carbide ingot is long through natural cooling, which leads to reduced production efficiency. Utility Model Content

[0004] A technical problem to be solved by the present disclosure is to provide a silicon carbide ingot cooling device, which uses air cooling to assist in cooling the silicon carbide ingot, shortens the ingot cooling time, and improves production efficiency.

[0005] To solve the above technical problems, the present invention provides a silicon carbide ingot cooling device, including a shell, the shell forming a chamber; an air inlet arranged on the shell, and an air inlet mechanism installed at the air inlet; a cooling cavity, the cooling cavity is arranged on the shell and is used to place the silicon carbide ingot; and multiple air outlets, the air outlets are arranged on the cooling cavity.

[0006] In some embodiments, the air inlet mechanism includes blades and a driving device for rotating the blades.

[0007] In some embodiments, a filter is provided at the air inlet.

[0008] In some embodiments, the filter screen is disposed on both sides of the air inlet mechanism; or the filter screen is disposed on the outside of the air inlet mechanism.

[0009] In some embodiments, a flow channel is formed in the chamber, the flow channel connects the air inlet and the cooling chamber, and an opening of the flow channel close to one end of the cooling chamber is disposed on the peripheral side of the cooling chamber.

[0010] In some embodiments, the air outlet is disposed at the bottom of the cooling cavity; and / or the air outlet is disposed on the side wall of the cooling cavity.

[0011] In some embodiments, the air outlets are arranged in a ring along the side wall and / or bottom of the cooling cavity.

[0012] In some embodiments, the outer contour of each air outlet located on the side wall of the cooling cavity protrudes in a direction away from the side wall of the cooling cavity.

[0013] In some embodiments, a thermal insulation coating is provided around and on the bottom of the cooling chamber.

[0014] In some embodiments, a plurality of protrusions are provided at the bottom of the cooling cavity, and a cross section of a single protrusion is formed into a semicircular or truncated cone structure.

[0015] Through the above technical scheme, the present invention provides a silicon carbide ingot cooling device, including a shell, the shell forms a chamber, the shell is provided with an air inlet, an air inlet mechanism is installed at the air inlet, a cooling cavity is provided on the shell for placing the silicon carbide ingot, a plurality of air outlets are provided on the cooling cavity, the silicon carbide ingot to be cooled is placed in the cooling cavity, the working air inlet mechanism sucks air through the air inlet and discharges it from the air outlet, the ingot is located at the air outlet, the airflow takes away the heat, thereby achieving the effect of cooling the silicon carbide ingot, shortening the cooling time of the silicon carbide ingot, and being beneficial to improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 is a schematic structural diagram of a silicon carbide ingot cooling device disclosed in an embodiment of the present disclosure;

[0018] Figure 2 It is a schematic diagram of the chamber structure of the silicon carbide ingot cooling device disclosed in the embodiment of the present disclosure;

[0019] Figure 3 yes Figure 1 main view.

[0020] Description of reference numerals:

[0021] 1. Shell; 2. Air inlet; 3. Cooling chamber; 4. Air outlet; 5. Air inlet mechanism; 6. Chamber. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0023] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0024] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0025] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0026] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0027] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0028] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0029] refer to Figure 1 and Figure 2 The present disclosure provides a silicon carbide ingot cooling device, including a shell 1, the shell 1 is formed with a chamber 6; an air inlet 2 is arranged on the shell 1, and an air inlet mechanism 5 is installed at the air inlet 2; a cooling cavity 3, the cooling cavity 3 is arranged on the shell 1, and is used to place the silicon carbide ingot; a plurality of air outlets 4, the air outlets 4 are arranged on the cooling cavity 3, the shell 1 serves as the basic structure of the entire device, the cooling cavity 3 provides a stable cooling space, which is conducive to reducing the influence of external temperature fluctuations on the cooling of the ingot, and the size of the cooling cavity 3 should be customized according to the specifications of the silicon carbide ingot to ensure that the ingot can be placed in or taken out of the cooling cavity 3, while leaving enough space for the airflow of the air outlet 4 to be uniform The air inlet mechanism 5 of the air inlet 2 is the air inlet control system of the device, such as a fan, a blower or a more sophisticated airflow control system, which is used to introduce external air or pre-treated cold air (such as air cooled by a refrigeration device) into the chamber 6, and the air inlet volume and air inlet speed are adjustable to meet the actual cooling needs of the silicon carbide ingot. The silicon carbide ingot to be cooled is placed in the cooling chamber 3, and the working air inlet mechanism 5 sucks air from the air inlet 2 and discharges it from the air outlet 4. The ingot is located at the air outlet 4, and the airflow takes away the heat, thereby achieving the effect of cooling the silicon carbide ingot, shortening the cooling time of the silicon carbide ingot, and is beneficial to improving production efficiency.

[0030] In some embodiments, the air intake mechanism 5 includes blades and a driving device for rotating the blades. The blades are components of the air intake mechanism 5 and are made of lightweight and high-strength materials, such as aluminum alloys, composite materials, etc., to ensure that they have sufficient strength under high-speed rotation and can drive the operating resistance of the device. The shape and inclination angle of the blades can optimize the suction efficiency and guidance of the airflow. The number, length and spacing of the blades are determined based on the cooling requirements and wind pressure loss calculations to achieve the best airflow dynamics performance. The driving device is responsible for rotating the blades, such as an electric motor, a hydraulic motor, etc. The specific selection depends on the system's requirements for power, response speed, energy consumption and maintenance cost. The driving device has a speed regulation function and can adjust the speed through electronic control devices such as frequency converters. In order to accurately control the air intake volume and wind speed, the air intake mechanism 5 is integrated with sensors and control systems. The sensors monitor parameters such as air intake volume, wind pressure or temperature, and feed back data to the control system. The latter adjusts the output of the driving device according to a preset program or real-time requirements to achieve control of the cooling efficiency. The air intake mechanism 5 also includes overload protection, dust and water proofing and other components, which are conducive to ensuring the operation of the device and improving production efficiency.

[0031] In some embodiments, see Figure 1 and Figure 3 The air inlet 2 is provided with a filter, which can block foreign objects such as dust, impurities, insects, etc. in the outside air from entering the chamber 6, preventing these substances from being deposited in the chamber 6 and on the blades or other components, and at the same time preventing these particles from adhering to the surface of the silicon carbide ingot or the cooling chamber 3 through the air outlet 4, thereby ensuring smooth airflow at the air outlet 4, which is conducive to maintaining efficient heat exchange efficiency.

[0032] In some embodiments, the filter is arranged on both sides of the air inlet mechanism 5 or the filter is arranged on the outside of the air inlet mechanism 5. Compared with the filter in a single position, the filters arranged on both sides can provide a larger filtering area, which helps to improve the filtering efficiency and prevent these particles from adhering to the surface of the silicon carbide ingot or the cooling chamber 3 through the air outlet 4. In order to save costs, the filter can also be arranged only on the outside of the air inlet mechanism 5.

[0033] In some embodiments, a flow channel is formed in the chamber 6, the flow channel connects the air inlet 2 and the cooling chamber 3, and the opening of the flow channel near one end of the cooling chamber 3 is provided on the peripheral side of the cooling chamber 3. The flow channel can guide the cooling airflow entering from the air inlet 2 to reach the cooling chamber 3 along a predetermined path, ensuring that the airflow can cover the entire surface of the silicon carbide ingot through the air outlet 4, thereby improving the cooling efficiency. By arranging the outlet of the flow channel on the peripheral side of the cooling chamber 3, the airflow diffuses along the periphery of the silicon carbide ingot when entering the cooling chamber 3, reducing the phenomenon of local airflow concentration, and the airflow is uniformly introduced from all sides of the cooling chamber 3, which helps to form a circulation effect, strengthen the airflow circulation inside the cooling chamber 3, make the cooling process more stable, ensure that all parts of the ingot can be effectively cooled, and at the same time avoid the airflow directly impacting the surface of the ingot, avoid eddies and dead corners caused by the airflow impact, which is conducive to improving the cooling efficiency.

[0034] In some embodiments, the air outlet 4 is arranged at the bottom of the cooling chamber 3; and / or the air outlet 4 is arranged on the side wall of the cooling chamber 3. The air outlet 4 is arranged at the bottom of the cooling chamber 3. By utilizing the natural convection principle of rising hot air, the air outlet 4 at the bottom can more directly extract the heat accumulated at the bottom of the silicon carbide ingot. The air outlet 4 at the bottom helps to maintain the temperature uniformity in the entire cooling chamber 3 and avoid the heat island effect. The air outlet 4 is arranged on the side wall of the cooling chamber 3. The air outlet 4 on the side wall can act more directly on the side of the ingot, which helps to reduce the stress caused by uneven cooling on the side. According to actual needs, the position and number of the air outlet 4 are used to control the direction and intensity of the air flow to adapt to the cooling of different areas on the surface of the ingot, thereby improving the pertinence and efficiency of the cooling.

[0035] In some embodiments, the air outlet 4 is arranged in a ring along the side wall and / or bottom of the cooling chamber 3. The air outlet 4 is distributed around the cooling chamber 3. The evenly distributed layout can ensure that the airflow fully covers the surface of the ingot, effectively takes away the heat, helps to reduce the cooling blind area, thereby shortening the cooling time of the silicon carbide ingot and improving work efficiency.

[0036] Regarding the position of the air outlet 4, it should be noted that the arrangement of the air outlet 4 can be adjusted at different stages or according to the cooling requirements of different ingots. For example, in the early stage of rapid cooling, the air outlet 4 at the bottom can be mainly used to quickly reduce the temperature; in the later stage of pursuing cooling uniformity, the air outlet 4 on the side wall can more finely adjust the local cooling effect to ensure uniform cooling of the entire ingot, maximize cooling efficiency, and ensure the quality of the ingot. In this process, a windshield can be set in the cooling chamber 3 to control the closure of the air outlet 4 or the opening area of ​​the air outlet 4.

[0037] In some embodiments, the outer contour of each air outlet 4 located on the side wall of the cooling chamber 3 protrudes in the direction away from the side wall of the cooling chamber 3. The protruding design of the outer contour of the air outlet 4 effectively expands the working space of the operator's hands or clamps. When the processing gap is small and the picking is inconvenient, the placement and removal of the ingot are greatly facilitated, and the operating difficulty or potential risk of damage to the ingot is reduced. Compared with the traditional upper and lower straight air outlet design, the air outlet 4 structure protruding outward can widen the airflow channel and improve the smoothness of the airflow without increasing the volume of the device. At the same time, the protruding air outlet 4 avoids the restriction range of the cooling chamber 3 on the ingot size.

[0038] In some embodiments, a plurality of cooling chambers 3 are also provided on the housing 1. The plurality of cooling chambers 3 are arranged at intervals, and more silicon carbide ingots can be placed, thereby improving work efficiency. Compared with a single large-capacity cooling chamber 3, a plurality of small cooling chambers 3 facilitates the control of the temperature of each silicon carbide ingot. During the production process, the ingots are not produced at the same time, and there is a time difference between the ingots. Therefore, they are placed in each cooling chamber 3 in the order of the production line, which is conducive to reducing energy waste and improving work efficiency. In addition, each cooling chamber 3 can be provided with a corresponding flow channel to connect the cooling chamber 3 according to actual needs.

[0039] In some embodiments, a heat-insulating coating is provided around and on the bottom of the cooling cavity 3 to prevent heat from being transferred between the cooling cavities 3 and affecting the cooling effect.

[0040] In some embodiments, the bottom of the cooling chamber 3 is provided with a plurality of protrusions, and the cross-section of a single protrusion is formed into a semicircular or truncated cone structure, so that there is a certain gap between the bottom of the cooling chamber 3 and the silicon carbide ingot, which facilitates the circulation of air at the bottom air outlet 4 and improves the cooling effect.

[0041] In order to better understand the technical solution of the present disclosure, the following is an explanation in combination with relatively preferred technical features.

[0042] The present invention provides a silicon carbide ingot cooling device, comprising a shell 1, wherein the shell 1 is formed with a chamber 6, wherein a flow channel is formed in the chamber 6, wherein the flow channel connects an air inlet 2 and a cooling chamber 3, wherein an opening of the flow channel close to one end of the cooling chamber 3 is disposed on the peripheral side of the cooling chamber 3, wherein an air inlet 2 is disposed on the shell 1, wherein an air inlet mechanism 5 is installed at the air inlet 2, wherein the air inlet mechanism 5 comprises blades and a driving device for rotating the blades, wherein a filter screen is disposed at both sides of the blades, wherein a heat insulation coating is disposed around and at the bottom of the cooling chamber 3, wherein the cooling chamber 3 is used for placing the silicon carbide ingot, wherein a plurality of convex points are disposed at the bottom of the cooling chamber 3, wherein the cross section of a single convex point is formed into a semicircular or truncated cone structure, such that the silicon carbide crystal is at a certain distance from the bottom of the cooling chamber 3, wherein the air outlet 4 is disposed on the bottom and side wall of the cooling chamber 3, and is arranged in a ring shape along the side wall and the bottom thereof, wherein the outer contour of each air outlet 4 located on the side wall of the cooling chamber 3 protrudes in a direction away from the side wall of the cooling chamber 3.

[0043] In summary, in the rough processing process of silicon carbide crystal ingot, a surface grinder is needed to bond the silicon carbide crystal ingot to the jig through AB glue first, and then process it after bonding. After processing, the silicon carbide crystal ingot and the jig need to be heated together to melt the AB glue and remove the silicon carbide crystal ingot. Then, the silicon carbide crystal ingot still needs to be bonded to the jig required by the cylindrical grinder equipment for external cylindrical processing. During this process, the silicon carbide crystal ingot is placed in the cooling chamber 3, the air inlet mechanism 5 is turned on, the blades suck air from the air inlet 2 and then discharge it from the air outlet 4, and the formed airflow gradually cools the silicon carbide crystal ingot placed at the air outlet 4. However, after cooling is completed, the silicon carbide ingot is bonded to the jig required for external cylindrical grinding machine processing for external cylindrical processing. After processing is completed, the silicon carbide ingot needs to be heated together with the jig to melt the AB glue, and the silicon carbide ingot is removed. Then the silicon carbide ingot still needs to be bonded to the jig required for wire cutting processing. At this time, because the AB glue needs to be melted, heating operation is still required. After removing the silicon carbide ingot, it is placed in the cooling chamber 3 again for cooling. After the silicon carbide ingot is completely cooled, the bonding operation required for wire cutting processing is performed. The use of this device reduces the cooling time of the silicon carbide ingot and improves work efficiency.

[0044] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0045] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A silicon carbide ingot cooling device, characterized in that: include: A housing (1), wherein the housing (1) is formed with a chamber (6); An air inlet (2) is provided on the housing (1), and an air inlet mechanism (5) is installed at the air inlet (2); A cooling chamber (3), the cooling chamber (3) being arranged on the housing (1) and being used for placing a silicon carbide ingot; A plurality of air outlets (4), wherein the air outlets (4) are arranged on the cooling cavity (3).

2. The silicon carbide ingot cooling device according to claim 1, characterized in that: The air inlet mechanism (5) comprises blades and a driving device for rotating the blades.

3. The silicon carbide ingot cooling device according to claim 1, characterized in that: The air inlet (2) is provided with a filter.

4. The silicon carbide ingot cooling device according to claim 3, characterized in that: The filter screen is arranged on both sides of the air inlet mechanism (5); or The filter screen is arranged on the outside of the air inlet mechanism (5).

5. The silicon carbide ingot cooling device according to claim 1, characterized in that: A flow channel is formed in the chamber (6), the flow channel connecting the air inlet (2) and the cooling chamber (3), and an opening of the flow channel close to one end of the cooling chamber (3) is arranged on the peripheral side of the cooling chamber (3).

6. The silicon carbide ingot cooling device according to any one of claims 1 to 5, characterized in that: The air outlet (4) is arranged at the bottom of the cooling chamber (3); and / or The air outlet (4) is arranged on the side wall of the cooling cavity (3).

7. The silicon carbide ingot cooling device according to claim 6, characterized in that: The air outlets (4) are arranged in a ring shape along the side wall and / or the bottom of the cooling chamber (3).

8. The silicon carbide ingot cooling device according to claim 6, characterized in that: The outer contour of each of the air outlets (4) located on the side wall of the cooling cavity (3) protrudes in a direction away from the side wall of the cooling cavity (3).

9. The silicon carbide ingot cooling device according to any one of claims 1 to 5, characterized in that: The cooling chamber (3) is provided with a heat insulation coating around its periphery and bottom.

10. The silicon carbide ingot cooling device according to any one of claims 1 to 5, characterized in that: The bottom of the cooling cavity (3) is provided with a plurality of convex points, and the cross section of a single convex point is formed into a semicircular or truncated cone structure.

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