Adjustable integrated circuit chip test board

Abstract

The utility model provides an adjustable integrated circuit chip testboard, which comprises a test rack, a stamping part fixed at one end of the test rack and an adjusting support assembly, and the adjusting support assembly comprises a mounting seat, a movable plate, a cross rod, a sliding support seat and a driving part used for driving the movable plate to move transversely. The mounting seat is fixedly mounted on the test rack and provided with a guide sliding rail for the movable plate to slide, the driving part is fixedly mounted at the top of the movable plate, the tail end of the driving part is hinged to the inner side wall of the supporting seat, the sliding supporting seat is slidably mounted on the outer surface of the cross rod, and one end of the sliding supporting seat is provided with a mounting clamp; a driving rod is arranged at the top of the sliding supporting seat, the movable plate is driven by the driving piece to slide in the direction of the guide sliding rail, the sliding supporting seat is driven by the driving rod to transversely move along the transverse rod through movement of the driving chute, and then the position of the integrated circuit chip on the mounting clamp is driven to change; and hardness stamping tests can be conveniently carried out on different positions of the integrated circuit chip.

Description

Technical Field

[0001] The utility model relates to the field of test benches, in particular to an adjustable integrated circuit chip test bench. Background Art

[0002] An integrated circuit chip is an electronic component that includes a silicon substrate, circuit, fixed sealing ring, grounding ring and protective ring. The integrated circuit chip needs to be subjected to a stamping resistance test before use to determine whether the hardness of the integrated circuit chip can be used normally.

[0003] The existing chip hardness test bench includes a stamping tube, an impact hammer, a chip carrier, and a test bench. The chip carrier is fixed on the test bench, and the chip to be tested is placed in the chip carrier. The stamping tube is lifted and pressed to drive the impact hammer to squeeze the chip to perform a hardness test on the chip. However, since the position of each stamping is fixed during the lifting and pressing of the stamping tube, it is inconvenient to test the hardness of the chip at different positions. Only the hardness of fixed points of the chip can be tested, which is troublesome to use.

[0004] Therefore, it is necessary to provide a new adjustable integrated circuit chip test bench to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides an adjustable integrated circuit chip test bench.

[0006] The adjustable integrated circuit chip test bench provided by the utility model comprises a test frame, a stamping part fixed at one end of the test frame, and an adjustment support assembly for adjusting the stamping position of the integrated circuit chip;

[0007] The adjustment support assembly includes a mounting seat, a movable plate, a cross bar, a sliding support seat and a driving member for driving the movable plate to move laterally. The mounting seat is fixedly mounted on the test frame, and a guide slide rail is provided on the mounting seat for the movable plate to slide. The driving member is fixedly mounted on the top of the movable plate, and the end of the driving member is hinged to the inner side wall of the support seat. The two ends of the cross bar are respectively fixed on both sides of the mounting seat, and the sliding support seat is slidably mounted on the outer surface of the cross bar, and one end of the sliding support seat is provided with a mounting fixture for fixing an integrated circuit chip, a driving rod is provided on the top of the sliding support seat, and a driving inclined groove is provided on the top of the movable plate for the driving rod to slide.

[0008] Furthermore, the mounting fixture includes a fixed seat, a fixed clamp and a movable clamp, the fixed seat is fixedly mounted on one end of the sliding support seat, the fixed clamp is fixedly mounted on one side of the fixed seat, and the movable clamp is slidably mounted on the other side of the fixed seat, the fixed clamp and the movable clamp are provided with two opposite support plates, and there is a gap between the two support plates and the fixed seat, and the fixed seat is also provided with a driving mechanism for driving the movable clamp to move laterally.

[0009] Furthermore, the driving mechanism includes an adjusting rod and a guide rod, one end of the adjusting rod is rotatably connected to the fixed seat, and the adjusting rod is threadedly connected to the movable clamping plate, the guide rod is fixedly mounted on the fixed seat, and the guide rod is slidably connected to the movable clamping plate.

[0010] Furthermore, the driving member comprises a telescopic cylinder, the telescopic cylinder is fixedly mounted on the movable plate, and an output end of the telescopic cylinder is hinged to an inner side wall of the mounting seat.

[0011] Furthermore, the stamping part includes a mounting frame, a pressing block and a telescopic rod for driving the pressing block to rise and fall, the mounting frame is fixedly mounted on one side of the test frame, the telescopic rod is fixedly mounted on the mounting frame, and the output end of the telescopic rod is fixedly connected to the pressing block.

[0012] Furthermore, the telescopic rod comprises a telescopic electric cylinder, the telescopic electric cylinder is fixedly mounted on the mounting frame, and the movable end of the telescopic electric cylinder is fixedly connected to the top of the pressing block.

[0013] Compared with the related art, the adjustable integrated circuit chip test bench provided by the utility model has the following beneficial effects:

[0014] The movable plate is driven to slide along the guide rail by the driving member, and the movement of the inclined groove is driven at the same time so that the driving rod drives the sliding support seat to move laterally along the cross bar, thereby driving the position of the integrated circuit chip on the mounting fixture to change, which is convenient for hardness stamping tests at different positions of the integrated circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The overall structure of the adjustable integrated circuit chip test bench provided by the utility model is shown in FIG. Figure 1 ;

[0016] Figure 2 The overall structure of the adjustable integrated circuit chip test bench provided by the utility model is shown in FIG. Figure 2 ;

[0017] Figure 3 for Figure 2 The enlarged structural schematic diagram of A shown;

[0018] Figure 4 The structure diagram of the adjustable support assembly provided by the utility model Figure 1 ;

[0019] Figure 5 The structure diagram of the adjustable support assembly provided by the utility model Figure 2 .

[0020] Numbers in the figure: 1. test frame; 2. mounting seat; 3. movable plate; 4. cross bar; 5. sliding support seat; 6. guide rail; 7. driving rod; 8. driving inclined groove; 9. fixed seat; 10. fixed splint; 11. movable splint; 12. support plate; 13. adjusting rod; 14. guide rod; 15. telescopic cylinder; 16. mounting frame; 17. pressure block; 18. telescopic rod. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0022] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 ,in, Figure 1 The overall structure of the adjustable integrated circuit chip test bench provided by the utility model is shown in FIG. Figure 1 ; Figure 2 The overall structure of the adjustable integrated circuit chip test bench provided by the utility model is shown in FIG. Figure 2 ; Figure 3 for Figure 2 The enlarged structural schematic diagram of A shown; Figure 4 The structure diagram of the adjustable support assembly provided by the utility model Figure 1 ; Figure 5 The structure diagram of the adjustable support assembly provided by the utility model Figure 2 .

[0023] In the specific implementation process, Figure 1-Figure 5 As shown, the adjustable integrated circuit chip test bench includes a test frame 1, a stamping part fixed to one end of the test frame 1, and an adjustment support assembly for adjusting the stamping position of the integrated circuit chip;

[0024] The adjustment support assembly includes a mounting seat 2, a movable plate 3, a cross bar 4, a sliding support seat 5 and a driving member for driving the movable plate 3 to move horizontally. The mounting seat 2 is fixedly installed on the test frame 1, and a guide slide rail 6 for the movable plate 3 to slide is provided on the mounting seat 2. The driving member is fixedly installed on the top of the movable plate 3, and the end of the driving member is hinged to the inner wall of the support seat. The two ends of the cross bar 4 are respectively fixed on both sides of the mounting seat 2. The sliding support seat 5 is slidably installed on the outer surface of the cross bar 4, and one end of the sliding support seat 5 is provided with a mounting fixture for fixing the integrated circuit chip, and a driving rod 7 is provided on the top of the sliding support seat 5. The top of the movable plate 3 is provided with a driving inclined groove 8 for the driving rod 7 to slide.

[0025] It should be noted that the driving component includes a telescopic cylinder 15, which is fixedly mounted on the movable plate 3. The output end of the telescopic cylinder 15 is hinged to the inner wall of the mounting seat 2. The movable plate 3 is driven to slide along the guide rail 6 through the movement of the telescopic cylinder 15. At the same time, the movement of the inclined groove 8 is driven so that the driving rod 7 drives the sliding support seat 5 to move laterally along the cross bar 4, thereby driving the position of the integrated circuit chip on the mounting fixture to change, which is convenient for hardness stamping tests at different positions of the integrated circuit chip.

[0026] refer to Figure 4-Figure 5 As shown, the mounting fixture includes a fixed seat 9, a fixed splint 10 and a movable splint 11. The fixed seat 9 is fixedly mounted on one end of the sliding support seat 5, the fixed splint 10 is fixedly mounted on one side of the fixed seat 9, and the movable splint 11 is slidably mounted on the other side of the fixed seat 9. The fixed splint 10 and the movable splint 11 are provided with two opposite support plates 12. There is a gap between the two support plates 12 and the fixed seat 9, and the gap on the support plate 12 is to provide a stamping space for the integrated circuit chip. The fixed seat 9 is also provided with a driving mechanism for driving the movable splint 11 to move horizontally.

[0027] The driving mechanism includes an adjusting rod 13 and a guide rod 14. One end of the adjusting rod 13 is rotatably connected to the fixed seat 9, and the adjusting rod 13 is threadedly connected to the movable clamping plate 11. The guide rod 14 is fixedly installed on the fixed seat 9. The guide rod 14 is slidably connected to the movable clamping plate 11. By screwing the adjusting rod 13, the movable clamping plate 11 is driven to move toward the fixed clamping plate 10, and the integrated circuit chip is fixed by the cooperation between the fixed clamping plate 10 and the movable clamping plate 11.

[0028] The stamping part includes a mounting frame 16, a pressing block 17, and a telescopic rod 18 for driving the pressing block 17 to move up and down. The mounting frame 16 is fixedly mounted on one side of the test frame 1, and the telescopic rod 18 is fixedly mounted on the mounting frame 16. The output end of the telescopic rod 18 is fixedly connected to the pressing block 17. The pressing block 17 is driven to move up and down by the telescopic rod 18 to squeeze the circuit chip on the mounting fixture.

[0029] It should be noted that the telescopic rod 18 includes a telescopic electric cylinder, which is fixedly mounted on the mounting frame 16. The movable end of the telescopic electric cylinder is fixedly connected to the top of the pressure block 17. The telescopic electric cylinder can accurately control the downward pressing position, which is conducive to hardness testing of circuit chips under different impacts.

[0030] The working principle provided by the utility model is as follows: when the device is used, the movable splint 11 is driven to move toward the fixed splint 10 by twisting the adjusting rod 13, and the integrated circuit chip is fixed by the cooperation between the fixed splint 10 and the movable splint 11, and the movable plate 3 is driven to slide along the guide rail 6 by the movement of the telescopic cylinder 15, and at the same time, the movement of the inclined groove 8 is driven so that the driving rod 7 drives the sliding support seat 5 to move laterally along the cross bar 4, thereby driving the position of the integrated circuit chip on the installation fixture to change, so as to facilitate the hardness stamping test of different positions of the integrated circuit chip, and the movable end of the telescopic electric cylinder is fixedly connected to the top of the pressure block 17, and the telescopic electric cylinder can accurately control the downward pressing position, which is conducive to the hardness test of the circuit chip under different impacts.

[0031] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0032] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An adjustable integrated circuit chip test bench, characterized in that: It comprises a test frame (1), a stamping part fixed to one end of the test frame (1), and an adjustment support assembly for adjusting the stamping position of an integrated circuit chip; The adjustment support assembly comprises a mounting seat (2), a movable plate (3), a cross bar (4), a sliding support seat (5) and a driving member for driving the movable plate (3) to move laterally, the mounting seat (2) is fixedly mounted on the test frame (1), the mounting seat (2) is provided with a guide rail (6) for the movable plate (3) to slide, the driving member is fixedly mounted on the top of the movable plate (3), the end of the driving member is hinged to the inner wall of the support seat, the two ends of the cross bar (4) are respectively fixed to the two sides of the mounting seat (2), the sliding support seat (5) is slidably mounted on the outer surface of the cross bar (4), and one end of the sliding support seat (5) is provided with a mounting fixture for fixing an integrated circuit chip, the top of the sliding support seat (5) is provided with a driving rod (7), and the top of the movable plate (3) is provided with a driving inclined groove (8) for the driving rod (7) to slide.

2. The adjustable integrated circuit chip test bench according to claim 1, characterized in that: The mounting fixture comprises a fixed seat (9), a fixed clamp (10) and a movable clamp (11); the fixed seat (9) is fixedly mounted on one end of the sliding support seat (5); the fixed clamp (10) is fixedly mounted on one side of the fixed seat (9); the movable clamp (11) is slidably mounted on the other side of the fixed seat (9); the fixed clamp (10) and the movable clamp (11) are provided with two opposite support plates (12); a gap is provided between the two support plates (12) and the fixed seat (9); and a driving mechanism for driving the movable clamp (11) to move laterally is also provided on the fixed seat (9).

3. The adjustable integrated circuit chip test bench according to claim 2, characterized in that: The driving mechanism comprises an adjusting rod (13) and a guiding rod (14); one end of the adjusting rod (13) is rotatably connected to the fixing seat (9), and the adjusting rod (13) is threadedly connected to the movable clamping plate (11); the guiding rod (14) is fixedly mounted on the fixing seat (9), and the guiding rod (14) is slidably connected to the movable clamping plate (11).

4. The adjustable integrated circuit chip test bench according to claim 3, characterized in that: The driving member comprises a telescopic cylinder (15), the telescopic cylinder (15) is fixedly mounted on the movable plate (3), and the output end of the telescopic cylinder (15) is hinged to the inner side wall of the mounting seat (2).

5. The adjustable integrated circuit chip test bench according to claim 4, characterized in that: The stamping part comprises a mounting frame (16), a pressing block (17), and a telescopic rod (18) for driving the pressing block (17) to rise and fall; the mounting frame (16) is fixedly mounted on one side of the test frame (1); the telescopic rod (18) is fixedly mounted on the mounting frame (16); and the output end of the telescopic rod (18) is fixedly connected to the pressing block (17).

6. The adjustable integrated circuit chip test bench according to claim 5, characterized in that: The telescopic rod (18) comprises a telescopic electric cylinder, which is fixedly mounted on the mounting frame (16), and the movable end of the telescopic electric cylinder is fixedly connected to the top of the pressing block (17).

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