Chip aging bearing device

Abstract

The utility model relates to the technical field of chip testing, and discloses a chip aging bearing device which comprises a chip aging bearing plate used for being matched with a chip aging testing device for chip testing, and the end face of the chip aging bearing plate is provided with a passive element and a testing contact disc; the passive element buffers the hard contact between the chip aging bearing plate and the chip aging test device; the test contact disc comprises a first metalized contact disc used for providing a signal of a main power supply, a second metalized contact disc used for providing a grounding signal, and a third metalized contact disc used for providing a signal of an input / output power supply. A first preset distance is arranged between the second metallization contact disc and the first metallization contact disc, and a second preset distance is arranged between the third metallization contact disc and the first metallization contact disc. According to the invention, the test efficiency, accuracy and reliability of the chip aging test are improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip aging bearing device. Background Art

[0002] Chip aging test is a key step to ensure the reliable operation of integrated circuits during their life cycle. During testing, the chip aging test device applies various test signals and electrical stresses to the chip to accelerate its aging process, thereby discovering potential failures in advance.

[0003] However, during the chip aging test, as the components of the chip aging test device age or become abnormal, the upper / lower springs used to connect the gold fingers are easily damaged, causing damage to the chip being tested, resulting in affected test efficiency and accuracy. Utility Model Content

[0004] In view of this, the present application provides a chip aging bearing device to improve the reliability of chip aging testing.

[0005] To achieve the above objectives, the technical solutions adopted are:

[0006] A chip aging bearing device, comprising:

[0007] A chip aging carrier board, used to match a chip aging test device to perform chip testing, wherein the end surface of the chip aging carrier board is provided with passive components and a test contact pad;

[0008] The passive component buffers the hard contact between the chip aging carrier board and the chip aging test device;

[0009] The test contact pads include a first metallized contact pad for providing a signal of a main power supply, a second metallized contact pad for providing a signal of a ground, and a third metallized contact pad for providing a signal of an input / output power supply;

[0010] A first preset distance is set between the second metallized contact pad and the first metallized contact pad, and a second preset distance is set between the third metallized contact pad and the first metallized contact pad.

[0011] The present application is further configured such that: the first metallized contact pad, the second metallized contact pad and the third metallized contact pad are located on the same surface, and the first metallized contact pad, the second metallized contact pad and the third metallized contact pad are located at the same horizontal position.

[0012] The present application is further configured as follows: the first metallized contact pad, the second metallized contact pad and the third metallized contact pad are each provided with a top layer of gold fingers and a bottom layer of gold fingers corresponding to the top layer of gold fingers, and the top layer of gold fingers and the bottom layer of gold fingers are respectively connected to the upper / lower spring sheets of the chip aging test device.

[0013] The present application is further configured as follows: the top-layer gold finger and the bottom-layer gold finger of the first metallized contact pad are both used to provide the main power signal; the top-layer gold finger and the bottom-layer gold finger of the second metallized contact pad are both used to provide the ground signal; the top-layer gold finger and the bottom-layer gold finger of the third metallized contact pad are both used to provide the input / output power signal.

[0014] The present application is further configured such that: the passive component is located on a side of the first metallized contact pad away from the second metallized contact pad, and / or

[0015] The passive component is located on a side of the third metallized contact pad away from the second metallized contact pad.

[0016] The present application is further configured as follows: the passive element includes a buffer spring and a receiving groove, the receiving groove is opened on the end surface of the chip aging carrier board, one end of the buffer spring is connected to the receiving groove, and the other end of the buffer spring is higher than the receiving groove;

[0017] When the first metallized contact pad, the second metallized contact pad and the third metallized contact pad are inserted into the test socket of the chip aging test device, the buffer spring is compressed into the accommodating groove.

[0018] The present application is further configured as follows: the buffer spring piece is designed in a Z-shaped structure, including a first buffer portion, a second buffer portion and a third buffer portion;

[0019] The first buffer portion is connected in the accommodating groove, the third buffer portion is higher than the accommodating groove, and the second buffer portion connects the first buffer portion and the third buffer portion.

[0020] The present application is further configured as follows: the passive element includes an elastic buffer material and a fixing groove, the fixing groove is opened on the end surface of the chip aging carrier board, the first end surface of the elastic buffer material is connected to the fixing groove, and the second end surface of the elastic buffer material is higher than the fixing groove;

[0021] When the first metallized contact pad, the second metallized contact pad, and the third metallized contact pad are inserted into the test socket of the chip aging test device, the elastic buffer material is compressed into the fixing groove.

[0022] The present application is further configured as follows: the second end surface of the elastic buffer material is provided with at least one of fish scale pattern, wave pattern, spiral groove pattern or dot protrusion.

[0023] The present application is further configured as follows: the chip aging carrier plate is divided into a holding area, and a holding pad is bonded to the holding area.

[0024] In summary, compared with the prior art, the present application discloses a chip aging carrier device, including a chip aging carrier plate for matching to a chip aging test device for chip testing, the end surface of the chip aging carrier plate is provided with a passive component and a test contact pad, wherein the passive component can buffer the hard contact between the chip aging carrier plate and the chip aging test device, and the test contact pad includes a first metallized contact pad for providing a main power signal, a second metallized contact pad for providing a ground signal, and a third metallized contact pad for providing an input / output power signal. Under the limitation that the second metallized contact pad is provided with a first preset distance from the first metallized contact pad, and the third metallized contact pad is provided with a second preset distance from the first metallized contact pad, the same metallized contact pad is avoided from being used to provide both a power signal and a ground signal. That is, through the above-mentioned setting, the present application improves the test efficiency, accuracy and reliability of the chip aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 is a structural schematic diagram of a first chip aging bearing device provided in this embodiment;

[0027] Figure 2 is a structural schematic diagram of a second chip aging supporting device provided in this embodiment;

[0028] Figure 3 is a schematic structural diagram of a first passive component provided in this embodiment;

[0029] Figure 4 is a schematic diagram of the structure of the second passive component provided in this embodiment.

[0030] Figure numerals: 1. Chip aging test device; 11. First test socket; 12. Second test socket; 13. Third test socket; 2. Chip aging carrier board; 21. First metallized contact plate; 22. Second metallized contact plate; 23. Third metallized contact plate; 24. Holding area; 3. Passive component; 31. Buffer spring; 311. First buffer part; 312. Second buffer part; 313. Third buffer part; 32. Accommodating groove; 33. Elastic buffer material; 34. Fixing groove; 4. Holding pad. DETAILED DESCRIPTION

[0031] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0032] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0033] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0035] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0036] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments.

[0037] Please refer to Figure 1 and Figure 2 The chip aging carrier device of this embodiment has a chip aging carrier board 2, and the chip aging carrier board 2 is used to match the chip aging test device 1 to perform chip testing, that is, the test chip can be integrated on the aging carrier board 2 as an integrated circuit board. During the chip testing process, the chip aging carrier board 2 can be inserted into the chip aging test device 1 for performance testing.

[0038] In the specific implementation process, the end face of the chip aging carrier board 2 is provided with a passive component 3 and a test contact plate, wherein the passive component 3 can buffer the hard contact between the chip aging carrier board 2 and the chip aging test device 1, that is, in the process of inserting the chip aging carrier board 2 into the chip aging test device 1, the passive component 3 provides buffering interference to avoid damage to the chip aging carrier board 2 or the chip aging test device 1 due to excessive insertion of the chip aging carrier board 2, thereby improving the test efficiency and reliability of the chip aging test.

[0039] Furthermore, the chip aging carrier board 2 has three test contact pads, including a first metallized contact pad 21 , a second metallized contact pad 22 and a third metallized contact pad 23 .

[0040] Among them, the first metallized contact pad 21 is used to provide the main power signal; the second metallized contact pad 22 is used to provide the ground signal; the third metallized contact pad 23 is used to provide the input / output power signal; at the same time, the second metallized contact pad 22 and the first metallized contact pad 21 are provided with a first preset distance, and the third metallized contact pad 23 and the first metallized contact pad 21 are provided with a second preset distance. Through this setting, it is ensured that the test contact pads of the chip aging carrier board 2 are kept physically separated by a distance, and it is avoided that the same metallized contact pad is used to provide both the power signal and the ground signal at the same time. Then, when the chip aging test device 1 has the risk of direct contact between the upper / lower springs due to aging or internal spring abnormality, the test contact pad of the chip aging carrier board 2 will not have a short circuit abnormality with the chip aging test device 1, thereby improving the accuracy and reliability of the chip aging test.

[0041] It can be understood that in order to perform chip testing, the chip aging test device 1 is provided with at least a first test socket 11, a second test socket 12 and a third test socket 13 that match the test contact pad, and the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 can be matched to the first test socket 11, the second test socket 12 and the third test socket 13 respectively.

[0042] In one embodiment, the chip aging carrier board 2 can be a BIB (Bare Integrated Board) circuit board with integrated chips. The BIB circuit board integrates the chip directly into the circuit board without the need for packaging. While greatly reducing the volume and weight of the circuit, it can also better transfer and dissipate heat, achieve a more compact layout, and thus improve circuit integration.

[0043] The chip aging test device 1 can be a BIOven slot test board, wherein BI (Bare Integrated) means that the chip aging test device 1 is designed for unpackaged bare chip integrated circuits, and Oven means that the chip aging test device 1 can perform heat treatment. Therefore, the chip aging bearing device of this embodiment can be applied to UFS (Universal Flash Storage) BIB Power storage to pass the chip aging test and ensure the high performance and reliability of the UFS storage device. Of course, the chip aging bearing device of this embodiment is not limited to this, and it can also be applied to the testing of other integrated chips, which will not be repeated here.

[0044] In the specific implementation process, in order to make the chip aging carrier plate 2 correspond to the chip aging test device 1, the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 are located on the same surface, and the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 are located at the same horizontal position to improve the test efficiency and accuracy of the chip aging test.

[0045] It should be noted that the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 of the present embodiment are all provided with a top-layer gold finger and a bottom-layer gold finger corresponding to the top-layer gold finger. The top-layer gold finger and the bottom-layer gold finger are respectively connected to the upper / lower spring pieces of the chip aging test device 1. It can be understood that the chip aging test device 1 can be configured with a first test socket 11, a second test socket 12 and a third test socket 13, and the upper / lower spring pieces are correspondingly designed in each test socket, that is, after the chip aging carrier board 2 is inserted into the chip aging test device 1, the top-layer gold finger is electrically connected to the upper spring piece, and the bottom-layer gold finger is electrically connected to the lower spring piece.

[0046] That is, the top-layer gold finger and the bottom-layer gold finger of the first metallized contact pad 21 are both used to provide the main power signal; the top-layer gold finger and the bottom-layer gold finger of the second metallized contact pad 22 are both used to provide the ground signal; the top-layer gold finger and the bottom-layer gold finger of the third metallized contact pad 23 are both used to provide the input / output power signal; through this design, it is avoided that the same metallized contact pad is used to provide the power signal and the ground signal at the same time, and the risk of short-circuit abnormality between the chip aging carrier board 2 and the chip aging test device 1 is avoided, thereby improving the test efficiency, accuracy and reliability of the chip aging test.

[0047] During the specific implementation process, the passive component 3 is located on the side of the first metallized contact pad 21 away from the second metallized contact pad 22, and / or the passive component 3 is located on the side of the third metallized contact pad 23 away from the second metallized contact pad 22, thereby better buffering the hard contact between the chip aging carrier board 2 and the chip aging test device 1.

[0048] Furthermore, the chip aging carrier board 2 is divided into a holding area 24, and a holding pad 4 is bonded to the holding area 24. The holding pad 4 can be operated to insert the chip aging carrier board 2 into the chip aging test device 1 for chip testing to avoid scratching / pressing the chip components on the chip aging carrier board 2.

[0049] The bonded holding pad 4 and the holding area 24 are in a detachable connection relationship, that is, after the chip aging carrier board 2 is inserted into the chip aging test device 1, the holding pad 4 can be torn off.

[0050] In one embodiment, reference Figure 3The passive component 3 may include a buffer spring 31 and a receiving groove 32 , wherein the receiving groove 32 is opened on the end surface of the chip aging carrier board 2 , one end of the buffer spring 31 is connected to the receiving groove 32 , and the other end of the buffer spring 31 is higher than the receiving groove 32 .

[0051] When the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 are inserted into the test socket of the chip aging test device 1, the buffer spring 31 contacts the chip aging test device 1 and is compressed into the accommodating groove 32, thereby buffering the hard contact between the chip aging carrier plate 2 and the chip aging test device 1 and preventing component damage caused by improper force.

[0052] Furthermore, the buffer spring 31 can be designed in a Z-shaped structure, including a first buffer portion 311, a second buffer portion 312 and a third buffer portion 313, wherein the first buffer portion 311 is connected to the accommodating groove 32, the third buffer portion 313 is higher than the accommodating groove 32, and the second buffer portion 312 connects the first buffer portion 311 and the third buffer portion 313. When the first metallized contact plate 21, the second metallized contact plate 22 and the third metallized contact plate 23 are inserted into the test socket of the chip aging test device 1, the third buffer portion 313 contacts the chip aging test device 1 and forces the second buffer portion 312 to deform, causing the second buffer portion 312 and the third buffer portion 313 to be compressed into the accommodating groove 32, thereby buffering the hard contact between the chip aging carrier plate 2 and the chip aging test device 1.

[0053] It should be noted that the buffer spring 31 is made of elastic metal material.

[0054] In one embodiment, reference Figure 4 The passive component 3 includes an elastic buffer material 33 and a fixing groove 34 , wherein the fixing groove 34 is opened on the end surface of the chip aging carrier board 2 , the first end surface of the elastic buffer material 33 is connected to the fixing groove 34 , and the second end surface of the elastic buffer material 33 is higher than the fixing groove 34 .

[0055] When the first metallized contact pad 21 , the second metallized contact pad 22 and the third metallized contact pad 23 are inserted into the test socket of the chip aging test device 1 , the elastic buffer material 33 is compressed into the fixing groove 34 .

[0056] The second end surface of the elastic buffer material 33 is provided with at least one of fish scale pattern, wave pattern, spiral groove pattern or dot protrusion, so as to improve the friction force when the elastic buffer material 33 contacts the chip aging test device 1 .

[0057] The elastic buffer material 33 includes at least one of silicone, rubber or polyurethane foam.

[0058] In one embodiment, the elastic buffer material 33 is a buffer rubber block made of rubber material. When the first metallized contact plate 21, the second metallized contact plate 22 and the third metallized contact plate 23 are inserted into the test seat of the chip aging test device 1, the buffer rubber block is compressed into the fixing groove 34, thereby buffering the hard contact between the chip aging carrier plate 2 and the chip aging test device 1, thereby improving the reliability of the chip aging test.

[0059] In the specific implementation process, the top-layer gold finger and the bottom-layer gold finger of the first metallized contact pad 21 are both used to provide the main power signal, that is, the top-layer gold finger and the bottom-layer gold finger of the first metallized contact pad 21 are VCC gold fingers, the top-layer gold finger and the bottom-layer gold finger of the second metallized contact pad 22 are both used to provide the ground signal, that is, the top-layer gold finger and the bottom-layer gold finger of the second metallized contact pad 22 are GND gold fingers, and the top-layer gold finger and the bottom-layer gold finger of the third metallized contact pad 23 are both used to provide the input / output power signal, that is, the top-layer gold finger and the bottom-layer gold finger of the third metallized contact pad 23 are VCCQ gold fingers, wherein the VCC gold finger of the main power signal and the VCCQ gold finger 33 of the input / output power signal of this embodiment are different in design of the power supply voltage. Specifically, in terms of the power supply voltage, the VCC gold finger transmits the main power voltage, which includes 3.3V or 5V, and the VCCQ gold finger transmits the input / output power voltage, which includes 1.2V or 1.8V.

[0060] In one embodiment, the passive component 3 may also include a pressure sensor, and the passive component 3 is used to detect the connection status of the chip aging carrier board 2 during the insertion of the chip aging test device 1. Specifically, the chip aging carrier board 2 is provided with a preset signal value. When the first metallized contact pad 21, the second metallized contact pad 22 and the third metallized contact pad 23 are inserted into the test socket of the chip aging test device 1, the pressure sensor generates a detection signal value. If the detection signal value does not reach the preset signal value, the pressure sensor sends an abnormal signal to ensure the accuracy of the chip aging test.

[0061] Furthermore, the chip aging carrier board 2 is provided with a controller (not shown), which is used to receive abnormal signals. After receiving the abnormal signals, the controller can turn on the alarm circuit of the chip aging carrier board 2 and generate an alarm signal, thereby improving the test efficiency and accuracy of the chip aging test through the alarm function.

[0062] To summarize, the chip aging carrier device of the present embodiment includes a chip aging carrier plate 2 for matching to a chip aging test device 1 for chip testing, and a passive component 3 and a test contact pad are provided on the end surface of the chip aging carrier plate 2, wherein the passive component 3 can buffer the hard contact between the chip aging carrier plate and the chip aging test device, and the test contact pad includes a first metallized contact pad 21 for providing a main power signal, a second metallized contact pad 22 for providing a ground signal, and a third metallized contact pad 23 for providing an input / output power signal. Under the limitation that the second metallized contact pad 22 and the first metallized contact pad 21 are provided with a first preset distance, and the third metallized contact pad 23 and the first metallized contact pad 21 are provided with a second preset distance, it is avoided that the same metallized contact pad is used to provide both a power signal and a ground signal, thereby improving the test efficiency, accuracy and reliability of the chip aging test.

[0063] The above is a detailed introduction to the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A chip aging bearing device, characterized in that: include: A chip aging carrier board, used to match a chip aging test device to perform chip testing, wherein the end surface of the chip aging carrier board is provided with passive components and a test contact pad; The passive component buffers the hard contact between the chip aging carrier board and the chip aging test device; The test contact pads include a first metallized contact pad for providing a signal of a main power supply, a second metallized contact pad for providing a signal of a ground, and a third metallized contact pad for providing a signal of an input / output power supply; A first preset distance is set between the second metallized contact pad and the first metallized contact pad, and a second preset distance is set between the third metallized contact pad and the first metallized contact pad.

2. A chip aging bearing device as claimed in claim 1, characterized in that: The first metallized contact pad, the second metallized contact pad and the third metallized contact pad are located on the same surface, and the first metallized contact pad, the second metallized contact pad and the third metallized contact pad are located at the same horizontal position.

3. A chip aging bearing device as claimed in claim 1, characterized in that: The first metallized contact pad, the second metallized contact pad and the third metallized contact pad are all provided with a top layer gold finger and a bottom layer gold finger corresponding to the top layer gold finger, and the top layer gold finger and the bottom layer gold finger are respectively connected to the upper / lower spring pieces of the chip aging test device.

4. A chip aging carrying device as claimed in claim 3, characterized in that: The top-layer gold finger and the bottom-layer gold finger of the first metallized contact pad are both used to provide the main power signal; the top-layer gold finger and the bottom-layer gold finger of the second metallized contact pad are both used to provide the ground signal; the top-layer gold finger and the bottom-layer gold finger of the third metallized contact pad are both used to provide the input / output power signal.

5. The chip aging bearing device according to claim 1, characterized in that: The passive component is located on a side of the first metallized contact pad away from the second metallized contact pad, and / or The passive component is located on a side of the third metallized contact pad away from the second metallized contact pad.

6. A chip aging bearing device as claimed in claim 1, characterized in that: The passive element includes a buffer spring and a receiving groove, wherein the receiving groove is provided on the end surface of the chip aging carrier board, one end of the buffer spring is connected to the receiving groove, and the other end of the buffer spring is higher than the receiving groove; When the first metallized contact pad, the second metallized contact pad, and the third metallized contact pad are inserted into the test socket of the chip aging test device, the buffer spring is compressed into the accommodating groove.

7. A chip aging bearing device as claimed in claim 6, characterized in that: The buffer spring is designed in a Z-shaped structure, including a first buffer portion, a second buffer portion and a third buffer portion; The first buffer portion is connected in the accommodating groove, the third buffer portion is higher than the accommodating groove, and the second buffer portion connects the first buffer portion and the third buffer portion.

8. The chip aging bearing device according to claim 1, characterized in that: The passive element comprises an elastic buffer material and a fixing groove, wherein the fixing groove is provided on the end surface of the chip aging carrier board, the first end surface of the elastic buffer material is connected to the fixing groove, and the second end surface of the elastic buffer material is higher than the fixing groove; When the first metallized contact pad, the second metallized contact pad, and the third metallized contact pad are inserted into the test socket of the chip aging test device, the elastic buffer material is compressed into the fixing groove.

9. A chip aging bearing device as claimed in claim 8, characterized in that: The second end surface of the elastic buffer material is provided with at least one of fish scale pattern, wave pattern, spiral groove pattern or dot protrusion.

10. The chip aging bearing device according to claim 1, characterized in that: The chip aging support plate is divided into a holding area, and a holding pad is bonded to the holding area.

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