Capacitor chip assembling device
By designing a capacitor chip assembly device, the combination of vibration disk, material duct, support and push blocks is used to solve the problems of chip assembly irregularities and biases, achieving a more efficient assembly process and a lower defect rate.
Patent Information
- Application Number
- CN202421331107.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-06-11
AI Technical Summary
In existing capacitor production equipment, when the robot assembles the chip to the clamping part, the chip is prone to deviating and the assembly position is not correct, causing the chip to fall off, reducing assembly efficiency and increasing the defect rate.
A capacitor chip assembly device is designed, including a vibrating disk, a material passage, a support member, a feeding seat and a push block. The chip is conveyed through the vibration disk, so that it is arranged uniformly in the material passage. The support member elastically deforms the clamping part, and the push block pushes the chip into the clamping part to clamp the chip.
It effectively reduces the problems of chip assembly improper and bias, reduces the chip shedding rate, improves assembly efficiency and reduces the defect rate.
Smart Images

Figure CN222867454U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of capacitor production equipment, in particular to a capacitor chip assembly device. Background Art
[0002] Some capacitor production steps include lead forming, chip assembly and welding. Specifically, the lead wire is punched into a U-shaped clamping part by a stamping die, and then the chip is implanted and assembled into the U-shaped clamping part by a robot. Finally, the chip with the lead wire is welded and fixed by a welding machine to prevent the chip from falling off.
[0003] However, the conventional method of assembling the chip to the clamping part using a robot may easily cause the chip to be offset and the assembly position to be incorrect, resulting in the chip falling off the clamping part, resulting in low assembly efficiency and high defect rate. Utility Model Content
[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a capacitor chip assembly device, which can reduce the problem of improper chip assembly, thereby reducing the problem of chip falling off.
[0005] According to the first aspect of the utility model, a capacitor chip assembly device includes: a conveying mechanism for conveying a braid, wherein the braid is provided with a plurality of lead wires along its length direction, wherein the lead wires include two clamping parts arranged opposite to each other, and the two clamping parts are used to clamp the chip; a feeding mechanism including a vibration plate for conveying the chip and a material channel for accommodating the chip to pass through, wherein the material channel receives the chip from the vibration plate, and wherein the material channel extends along the conveying direction of the conveying mechanism; an opening mechanism including an opening member and a first power component for driving the opening member to rise and fall, wherein the opening member can be inserted between the two clamping parts, wherein the opening member is used to elastically deform the two clamping parts to increase the distance between the two clamping parts; an assembly mechanism including a material receiving seat, a push block horizontally slidably arranged on the material receiving seat, and a second power component for driving the push block to slide, wherein the material receiving seat is used to receive the chip at the end of the material channel, wherein the lead wires move through the top of the material receiving seat, and wherein the push block is used to push the chip between the two clamping parts so that the two clamping parts clamp the chip.
[0006] A capacitor chip assembly device according to an embodiment of the utility model has at least the following beneficial effects:
[0007] The utility model provides a vibration plate and a material channel, utilizes the vibration plate to transport chips, makes the chips arranged in sequence in the material channel, and each chip has the same direction in the material channel, ensures that each chip can be clamped by the clamping part, at the same time, by providing a support member and a first power component, utilizes the first power component to drive the support member to rise and fall, the support member can be inserted between the two clamping parts when it descends, makes the two clamping parts elastically deform, so as to increase the distance between the two clamping parts, which is beneficial for the chip to enter the gap between the two clamping parts, furthermore, by providing a material receiving seat, a push block and a second power component, the material receiving seat can receive a chip, utilizes the second power component to drive the push block to slide horizontally, makes the push block able to be pushed between the two clamping parts, the support block rises, the two clamping parts restore elastic deformation, and the two clamping parts clamp the chip, thereby avoiding the method of assembling the chip by a robot, reducing the problem of incorrect and offset chip assembly, and reducing the problem of chip falling off, thereby improving assembly efficiency and reducing the defective rate of assembly.
[0008] According to some embodiments of the utility model, the push block includes a baffle portion and a push head connected to the baffle portion, the baffle is used to block the movement of the chip at the end of the material channel, and the push head is used to push the chip of the material receiving seat into between the two clamping portions.
[0009] According to some embodiments of the present invention, the pusher head includes a first slat and a second slat, the first slat and the second slat are connected to form an L shape, and the first slat is located on a side of the second slat away from the material channel.
[0010] According to some embodiments of the present invention, the bottom of the support member is gradually tapered to form a cone, and the cone is used to elastically deform the two clamping parts.
[0011] According to some embodiments of the utility model, the conveying mechanism includes a support bar and a conveying component that drives the braid to move along the length direction of the support bar, and the conveying component includes an upper conveying roller, a lower conveying roller, and a motor that drives the upper conveying roller or the lower conveying roller to rotate.
[0012] According to some embodiments of the utility model, a limiting strip is arranged above the supporting strip, and a limiting channel is formed between the limiting strip and the supporting strip, and the limiting channel accommodates the braid to pass through.
[0013] According to some embodiments of the utility model, the feeding mechanism also includes a linear vibrator and a connecting plate arranged on the top of the linear vibrator, the material channel is arranged on the connecting plate, and the linear vibrator is used to drive the chip to move along the length direction of the material channel.
[0014] According to some embodiments of the utility model, a corrector is also included, which includes an upper limit plate, a lower limit plate, and a side limit plate connecting the upper limit plate and the lower limit plate, and a correction channel is formed between the upper limit plate, the lower limit plate and the side limit plate, and the correction channel accommodates the clamping part to pass through.
[0015] According to some embodiments of the utility model, the corrector is connected to a flow guide cover, the inner cavity of the flow guide cover gradually shrinks in a direction approaching the corrector, and the flow guide cover accommodates the clamping portion to pass through.
[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0018] Figure 1 This is a structural schematic diagram of a capacitor chip assembly device according to an embodiment of the utility model;
[0019] Figure 2 for Figure 1 A schematic side view of a capacitor chip assembly device is shown;
[0020] Figure 3 for Figure 1 A schematic diagram of the structure of an opening mechanism of a capacitor chip assembly device is shown;
[0021] Figure 4 for Figure 1 A partial structural schematic diagram of a capacitor chip assembly device is shown;
[0022] Figure 5 for Figure 1 A schematic diagram of the structure of a corrector for a capacitor chip assembly device is shown;
[0023] Figure 6 for Figure 1 A schematic structural diagram of a corrector of a capacitor chip assembly device from another perspective is shown;
[0024] Figure 7 for Figure 1 A schematic structural diagram of a conveying mechanism of a capacitor chip assembly device is shown.
[0025] Figure markings: 100-braid, 110-pin line, 120-clamping part, 130-chip, 140-vibration disk, 150-material channel, 160-opening piece, 170-material receiving seat, 180-push block, 190-baffle part, 200-push head, 210-first slat, 220-second slat, 230-cone, 240-support bar, 250-upper conveying roller, 260-lower conveying roller, 270-motor, 280-limiting bar, 290-limiting channel, 300-linear vibrator, 310-connecting plate, 320-corrector, 330-upper limit plate, 340-lower limit plate, 350-side limit plate, 360-correction channel, 370-air guide cover. DETAILED DESCRIPTION
[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0027] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0028] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] A capacitor chip assembly device according to an embodiment of the utility model is described below in conjunction with the accompanying drawings.
[0031] Reference Figure 1 A capacitor chip 130 assembly device according to an embodiment of the utility model includes a conveying mechanism, a feeding mechanism, an opening mechanism and an assembly mechanism.
[0032] The conveying mechanism is used to convey the braid 100 . The braid 100 is provided with a plurality of lead wires 110 along its length direction. The lead wires 110 include two clamping parts 120 arranged opposite to each other. The two clamping parts 120 are used to clamp the chip 130 .
[0033] Specifically, refer to Figure 7 The conveying mechanism includes a support bar 240, a conveying component that drives the braid 100 to move along the length direction of the support bar 240, and the conveying component includes an upper conveying roller 250, a lower conveying roller 260, and a motor 270 that drives the upper conveying roller 250 or the lower conveying roller 260 to rotate.
[0034] It can be understood that the motor 270 drives the lower conveyor roller 260 to rotate through the transmission chain, so that the upper conveyor roller 250 and the lower conveyor roller 260 clamp the conveyor tape 100, and the tape 100 moves along the length direction of the support bar 240. In addition, the support bar 240 can support the tape 100 so that the tape 100 is in a flat and straight state, thereby conveying the clamping part 120 to the assembly position.
[0035] In some embodiments of the present invention, referring to Figure 2 A limiting strip 280 is disposed above the supporting strip 240 , and a limiting channel 290 is formed between the limiting strip 280 and the supporting strip 240 , and the limiting channel 290 accommodates the braid 100 to pass through.
[0036] Therefore, when the braid 100 is in the limiting channel 290 , the limiting strip 280 can limit the position of the braid 100 , thereby ensuring that the clamping portion 120 is in a horizontal state and preventing the clamping portion 120 from tilting.
[0037] The loading mechanism includes a vibration plate 140 for conveying the chips 130 and a material channel 150 for accommodating the chips 130 to pass through. The material channel 150 receives the chips 130 from the vibration plate 140 , and the material channel 150 extends along the conveying direction of the conveying mechanism.
[0038] In some embodiments of the utility model, the loading mechanism also includes a linear vibrator 300 and a connecting plate 310 arranged on the top of the linear vibrator 300 , the material channel 150 is arranged on the connecting plate 310 , and the linear vibrator 300 is used to drive the chip 130 to move along the length direction of the material channel 150 .
[0039] Therefore, the linear vibrator 300 generates vibration in a linear direction, so that the chips 130 in the channel 150 move, thereby transporting the chips 130 to the assembly position.
[0040] The opening mechanism includes an opening member 160 and a first power assembly that drives the opening member 160 to rise and fall. Figure 2 , Figure 3 and Figure 4 The expansion member 160 can be inserted between the two clamping parts 120 , and the expansion member 160 is used to elastically deform the two clamping parts 120 to increase the distance between the two clamping parts 120 .
[0041] It should be noted that the first power assembly may be a cylinder or other power sources.
[0042] In some embodiments of the present invention, referring to Figure 3 The bottom of the expansion member 160 is gradually reduced to form a cone 230 , and the cone 230 is used to elastically deform the two clamping parts 120 .
[0043] Therefore, driven by the first power assembly, the expansion member 160 descends, and the cone 230 of the expansion member 160 enters the gap between the two clamping parts 120 , and the cone 230 gradually expands the distance between the two clamping parts 120 to prevent the expansion member 160 from damaging the clamping parts 120 .
[0044] Among them, the assembly mechanism includes a material receiving seat 170, a push block 180 horizontally slidably set on the material receiving seat 170, and a second power component that drives the push block 180 to slide. The material receiving seat 170 is used to receive the chip 130 at the end of the material channel 150, and the pin line 110 moves through the top of the material receiving seat 170. The push block 180 is used to push the chip 130 between the two clamping parts 120 so that the two clamping parts 120 clamp the chip 130.
[0045] It should be noted that the second power assembly may be a cylinder or other power sources.
[0046] In some embodiments of the present invention, the push block 180 includes a baffle portion 190 and a push head 200 connected to the baffle portion 190 , the baffle is used to block the movement of the chip 130 at the end of the material channel 150 , and the push head 200 is used to push the chip 130 of the material receiving seat 170 between the two clamping portions 120 .
[0047] Therefore, when the pusher head 200 is used to push the chip 130 , the baffle portion 190 can block the end of the material channel 150 to prevent the chip 130 from being discharged from the material channel 150 , thereby ensuring that the pusher head 200 pushes one chip 130 for assembly each time.
[0048] In some embodiments of the present invention, the pusher head 200 includes a first slat 210 and a second slat 220 , the first slat 210 and the second slat 220 are connected to form an L shape, and the first slat 210 is located on a side of the second slat 220 away from the material channel 150 .
[0049] Therefore, the first strip 210 can limit the position of the chip 130 , and then the second strip 220 pushes the chip 130 into the gap between the two clamping parts 120 , thereby alleviating the problem that the chip 130 cannot enter the gap between the two clamping parts 120 .
[0050] In some embodiments of the present invention, referring to Figure 5 , also includes a corrector 320, the corrector 320 includes an upper limit plate 330, a lower limit plate 340, and a side limit plate 350 connecting the upper limit plate 330 and the lower limit plate 340, and a correction channel 360 is formed between the upper limit plate 330, the lower limit plate 340 and the side limit plate 350, and the correction channel 360 accommodates the clamping part 120 to pass through.
[0051] Therefore, after the chip 130 is loaded into the clamping part 120, under the transportation of the conveying mechanism, the clamping part 120 enters the correction channel 360 of the corrector 320, and the upper limit plate 330, the lower limit plate 340 and the side limit plate 350 can correct the improperly assembled and offset chip 130, ensuring that the two clamping parts 120 can clamp the chip 130 well to prevent the chip 130 from falling off during the transportation process.
[0052] In some embodiments of the present invention, referring to Figure 6 The corrector 320 is connected to a guide cover 370 , the inner cavity of the guide cover 370 gradually shrinks in the direction close to the corrector 320 , and the guide cover 370 accommodates the clamping part 120 to pass through, so that the guide cover 370 is used to ensure that the chip 130 smoothly enters the correction channel 360 .
[0053] Therefore, this embodiment has the following effects:
[0054] The utility model provides a vibration plate 140 and a material channel 150, and uses the vibration plate 140 to transport the chips 130, so that the chips 130 are arranged in sequence in the material channel 150, and the direction of each chip 130 in the material channel 150 is consistent, ensuring that each chip 130 can be clamped by the clamping part 120. At the same time, by providing a propping piece 160 and a first power component, the propping piece 160 is driven to rise and fall by the first power component, and the propping piece 160 descends and can be inserted between the two clamping parts 120, so that the two clamping parts 120 are elastically deformed to increase the distance between the two clamping parts 120, which is conducive to the chip 130 entering the two clamping parts. The gap between the two clamping parts 120 is narrowed, and the gap between the two clamping parts 120 is narrowed. Furthermore, by setting the material receiving seat 170, the pushing block 180 and the second power component, the material receiving seat 170 can receive a chip 130, and the second power component is used to drive the pushing block 180 to slide horizontally, so that the pushing block 180 can be pushed between the two clamping parts 120, the support block rises, and the two clamping parts 120 restore elastic deformation. The two clamping parts 120 clamp the chip 130, thereby avoiding the use of a robot to assemble the chip 130, reducing the problem of improper assembly and offset of the chip 130, and reducing the problem of the chip 130 falling off, thereby improving the assembly efficiency and reducing the defective rate of assembly.
[0055] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0056] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A capacitor chip assembly device, characterized in that: include: A conveying mechanism, used for conveying a braid (100), wherein the braid (100) is provided with a plurality of lead wires (110) along its length direction, wherein the lead wires (110) include two clamping portions (120) arranged opposite to each other, and the two clamping portions (120) are used for clamping a chip (130); A loading mechanism, comprising a vibration plate (140) for conveying chips (130) and a material channel (150) for accommodating the chips (130) to pass through, wherein the material channel (150) receives the chips (130) from the vibration plate (140), and the material channel (150) extends along a conveying direction of the conveying mechanism; The spreading mechanism comprises a spreading member (160) and a first power assembly for driving the spreading member (160) to rise and fall, wherein the spreading member (160) can be inserted between the two clamping parts (120), and the spreading member (160) is used to elastically deform the two clamping parts (120) so as to increase the distance between the two clamping parts (120); The assembly mechanism comprises a material receiving seat (170), a push block (180) horizontally slidably arranged on the material receiving seat (170), and a second power component driving the push block (180) to slide, wherein the material receiving seat (170) is used to receive the chip (130) at the end of the material channel (150), the pin line (110) moves through the top of the material receiving seat (170), and the push block (180) is used to push the chip (130) between the two clamping parts (120) so that the two clamping parts (120) clamp the chip (130).
2. A capacitor chip assembly device according to claim 1, characterized in that: The push block (180) comprises a baffle portion (190) and a push head (200) connected to the baffle portion (190), wherein the baffle is used to block the movement of the chip (130) at the end of the material channel (150), and the push head (200) is used to push the chip (130) of the material receiving seat (170) into between the two clamping portions (120).
3. A capacitor chip assembly device according to claim 2, characterized in that: The pusher head (200) comprises a first slat (210) and a second slat (220), wherein the first slat (210) and the second slat (220) are connected to form an L shape, and the first slat (210) is located on a side of the second slat (220) away from the material channel (150).
4. A capacitor chip assembly device according to claim 1, characterized in that: The bottom of the expansion member (160) is gradually reduced to form a cone (230), and the cone (230) is used to elastically deform the two clamping parts (120).
5. The capacitor chip assembly device according to claim 1, characterized in that: The conveying mechanism includes a support bar (240), a conveying component that drives the braid (100) to move along the length direction of the support bar (240), and the conveying component includes an upper conveying roller (250), a lower conveying roller (260), and a motor (270) that drives the upper conveying roller (250) or the lower conveying roller (260) to rotate.
6. A capacitor chip assembly device according to claim 5, characterized in that: A limiting strip (280) is arranged above the support strip (240), and a limiting channel (290) is formed between the limiting strip (280) and the support strip (240), and the limiting channel (290) accommodates the braid (100) to pass through.
7. A capacitor chip assembly device according to claim 1, characterized in that: The feeding mechanism further comprises a linear vibrator (300) and a connecting plate (310) arranged on the top of the linear vibrator (300); the material channel (150) is arranged on the connecting plate (310); and the linear vibrator (300) is used to drive the chip (130) to move along the length direction of the material channel (150).
8. The capacitor chip assembly device according to claim 1, characterized in that: The invention also includes a corrector (320), wherein the corrector (320) includes an upper limit plate (330), a lower limit plate (340), and a side limit plate (350) connecting the upper limit plate (330) and the lower limit plate (340), wherein a correction channel (360) is formed between the upper limit plate (330), the lower limit plate (340), and the side limit plate (350), and the correction channel (360) accommodates the clamping portion (120) to pass through.
9. A capacitor chip assembly device according to claim 8, characterized in that: The corrector (320) is connected to a flow guide cover (370), the inner cavity of the flow guide cover (370) gradually shrinks in a direction approaching the corrector (320), and the flow guide cover (370) accommodates the clamping portion (120) to pass through.
Citation Information
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