Semiconductor product high-efficiency testing device

Abstract

The utility model provides an efficient testing device for semiconductor products, which relates to the technical field of semiconductor product testing and comprises a testing table, a material conveying rotary table A is arranged on the top of the testing table close to the left side, and a moving assembly, a testing assembly and a suction and release assembly are sequentially arranged on the top of the testing table and located on the right side of the material conveying rotary table A. The moving assembly comprises a material conveying B rotating disc and a material conveying C rotating disc which are arranged in parallel, the sucking and releasing assembly is used for sucking the semiconductor products on the material conveying B rotating disc to the testing assembly for testing, and after testing, the sucking and releasing assembly sucks and releases the tested semiconductor products to the material conveying C rotating disc; and the material conveying turntable C is used for moving the tested semiconductor products to the material conveying turntable A. According to the utility model, the test efficiency is improved and the space is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor product testing, in particular to a high-efficiency testing device for semiconductor products. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, photovoltaic power generation, lighting, high-power power conversion and other fields.

[0003] In the prior art, semiconductors are widely used in many industries. In the production process of the prior art semiconductors, the produced semiconductors need to be tested. Only after the test is qualified can the next process be entered. However, the prior art has the problems of low testing efficiency and large floor space. Utility Model Content

[0004] In view of the above problems, the utility model provides a semiconductor product high-efficiency testing device which has a simple structure, is convenient to manufacture and improves testing efficiency.

[0005] The technical solution of the utility model is: a semiconductor product high-efficiency testing device, comprising a test bench, a material transport turntable A is arranged near the left side of the top of the test bench, a moving component, a testing component and a suction and release component are arranged in sequence on the top of the test bench, which is located on the right side of the material transport turntable A.

[0006] The moving assembly includes a material transport turntable B and a material transport turntable C arranged in parallel.

[0007] The material transport turntable A is used to absorb and place semiconductor products onto the material transport turntable B, and the material transport turntable B is used to move the semiconductor products to the test assembly.

[0008] The suction and placement component is used to suck the semiconductor products on the transport material B turntable to the test component for testing. After the test, the suction and placement component sucks and places the tested semiconductor products on the transport material C turntable.

[0009] The material transport C turntable is used to move the tested semiconductor products to the material transport A turntable.

[0010] As a preferred solution of the utility model, a material transport turntable A suction nozzle is provided on the periphery of the material transport turntable A, and the material transport turntable A suction nozzle is used for sucking and placing semiconductor products.

[0011] The technical effect of adopting the above further scheme is: through the setting of the suction nozzle of the material transport turntable A, the suction nozzle of the material transport turntable A can suck the semiconductor product of the previous process and place it on the top of the first loading mold.

[0012] As a preferred solution of the utility model, a first material loading mold is provided on the top of the material transport turntable B, and a linear guide rail fixed to the test bench is installed on the bottom of the material transport turntable B and the material transport turntable C, and the material transport turntable B and the material transport turntable C are both slidably connected to the linear guide rail.

[0013] The technical effect of adopting the above further solution is: through the setting of the linear guide rail, the linear guide rail can effectively drive the material transport turntable B and the material transport turntable C to move linearly, thereby completing the testing work.

[0014] As a preferred solution of the utility model, a second loading mold is provided on the top of the material transporting turntable C.

[0015] The test assembly includes a high temperature test socket.

[0016] The suction and placement assembly includes a movable support platform, a movable suction nozzle and a forward and backward movement control cylinder, wherein the forward and backward movement control cylinder is fixedly connected to the test platform and is used to drive the movable support platform to move.

[0017] The movable suction nozzle is movably connected to the movable support platform;

[0018] The movable suction nozzle is located above the high temperature test seat, the material transport B turntable and the material transport C turntable.

[0019] During operation, the utility model absorbs and places semiconductor products on the material transporting turntable B through the material transporting turntable A, the material transporting turntable B moves the semiconductor products to the testing assembly, the absorption and placement assembly absorbs the semiconductor products on the material transporting turntable B to the testing assembly for testing, and after the test, the absorption and placement assembly absorbs and places the tested semiconductor products on the material transporting turntable C, and the material transporting turntable C is used to move the tested semiconductor products to the material transporting turntable A. In this way, the circular layout saves floor space and improves the testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a partial structural schematic diagram of the utility model;

[0022] Figure 3 It is a schematic diagram of the front planar structure of part of the structure of the utility model;

[0023] Figure 4 This is a schematic diagram of the internal planar structure of the heating box of the utility model from the left side;

[0024] Figure 5 It is a three-dimensional structural schematic diagram of the utility model;

[0025] Legend: 1. Test bench; 2. Material transport turntable A; 21. Suction nozzle of material transport turntable A; 3. Material transport turntable B; 31. First material loading mold; 32. First heating tube; 33. Linear guide; 4. Material transport turntable C; 41. Second material loading mold; 42. High-temperature test seat; 43. Moving suction nozzle; 44. Front and rear moving control cylinder; 45. Moving support platform; 5. Thermal insulation box; 6. Lifting mechanism; 7. High-temperature insulation board; 8. Thermal insulation board; 9. Heating box; 91. Second heating tube; 92. Circulating air fan. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0028] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0030] like Figure 1-5 As shown, the utility model provides a technical solution: a semiconductor product efficient testing device, comprising a test bench 1, a material transport A turntable 2 is provided near the left side of the top of the test bench 1, and a moving component, a testing component and a suction and release component are sequentially provided on the top of the test bench 1 and located on the right side of the material transport A turntable 2.

[0031] The moving assembly includes a material transport turntable B 3 and a material transport turntable C 4 arranged in parallel.

[0032] The material transport A turntable 2 is used to absorb and place semiconductor products onto the material transport B turntable 3, and the material transport B turntable 3 is used to move the semiconductor products to the test assembly.

[0033] The suction and placement assembly is used to suck the semiconductor products on the transport B turntable 3 to the test assembly for testing. After the test, the suction and placement assembly sucks and places the tested semiconductor products onto the transport C turntable 4.

[0034] The material transport C turntable 4 is used to move the tested semiconductor products to the material transport A turntable 2 .

[0035] The utility model saves floor space and improves test efficiency through the annular layout.

[0036] In specific applications,

[0037] A heat-insulating box 5 is provided on the top of the test bench 1, and the moving assembly, the testing assembly and the suction and placement assembly are respectively located in the heat-insulating box 5. In application, the cylinder body of the forward and backward moving control cylinder may not be placed in the heat-insulating box 5.

[0038] A lifting mechanism 6 is provided on the top of the thermal insulation box 5, and a high-temperature insulation board 7 is slidably connected to the middle interior of the thermal insulation box 5 and extends to the top, and the top of the high-temperature insulation board 7 is fixedly connected to the lifting mechanism 6. A thermal insulation board 8 is provided on the upper left side of the thermal insulation box 5 to enhance the thermal insulation effect. A heating box 9 is installed on the front of the thermal insulation box 5, and the interior of the heating box 9 is connected to the interior of the thermal insulation box 5.

[0039] The high temperature insulation board 7 facilitates the formation of a high temperature test area, and the operation is reliable. The heat insulation board 8 is arranged on the top for heat preservation, and at the same time, a transfer space for semiconductor products is reserved at the bottom.

[0040] A material transport turntable A suction nozzle 21 is provided on the periphery of the material transport turntable A 2, and the material transport turntable A suction nozzle 21 is used to suck and place semiconductor products. The material transport turntable A suction nozzle 21 can effectively transfer semiconductor products.

[0041] A first loading mold 31 is provided on the top of the material transport turntable B 3, and a first heating tube 32 is wrapped around the periphery of the material transport turntable B 3. A linear guide rail 33 fixedly connected to the test bench 1 is installed at the bottom of the material transport turntable B 3 and the material transport turntable C 4, and the material transport turntable B 3 and the material transport turntable C 4 are both slidably connected to the linear guide rail 33. The linear guide rail 33 can effectively drive the material transport turntable B 3 and the material transport turntable C 4 to transport and test semiconductors.

[0042] Both ends of the linear guide rail 33 are connected to the test bench through a base.

[0043] In specific applications, a motor can be set on the test bench to drive the annular conveyor belt, drive the material transport turntable B 3 and the material transport turntable C to connect the conveyor belt, and then drive the material transport turntable B 3 and the material transport turntable C 4 to move along the linear guide rail.

[0044] A second material loading mold 41 is provided on the top of the material transport C turntable 4. The test assembly includes a high-temperature test seat 42. The high-temperature test seat 42 can fix the semiconductor product to facilitate testing.

[0045] The suction and placement assembly includes a movable support platform 45, a movable suction nozzle 43 and a forward and backward movement control cylinder 44. The forward and backward movement control cylinder 44 is fixedly connected to the test bench 1 and is used to drive the movable support platform 45 to move.

[0046] The movable suction nozzle 43 is movably connected to the movable support platform 45;

[0047] A motor may be provided on the mobile support platform 45 to drive an annular conveyor belt, and a mobile suction nozzle is provided on the conveyor belt, thereby driving the mobile suction nozzle 43 to move.

[0048] The movable suction nozzle 43 is located above the high temperature test seat 42 , the material transport B turntable 3 , and the material transport C turntable 4 .

[0049] The control cylinder 44 can be moved forward and backward to drive the mobile suction nozzle 43 to transfer the semiconductor product, so as to transfer the semiconductor product from the material transport turntable B to the high temperature test seat. The mobile suction nozzle 43 is movably connected to the mobile support platform 45, so as to transfer the semiconductor product from the material transport turntable B to the material transport turntable C.

[0050] A second heating tube 91 is provided inside the heating box 9 near the front, and a circulating air fan 92 is symmetrically provided up and down inside the heating box 9 near the back, which can balance the temperature inside the heat-insulating box 5.

[0051] During operation, the utility model is first installed on a set production line, and then the suction nozzle 21 of the material transport A turntable sucks the semiconductor product of the previous process. After sucking, the material transport A turntable 2 rotates to transport the semiconductor product to the first loading mold 31 on the top of the heated material transport B turntable 3 (at this time, the first heating tube 32 is turned on). After completion, under the action of the linear guide 33, the material transport B turntable 3 is moved to the inside of the heat preservation and insulation box 5. At this time, the lifting mechanism 6 puts down the high-temperature insulation board 7 to close the heat preservation and insulation box 5. At this time, the second heating tube 91 is turned on, and the circulating air fan 92 is turned on at the same time. When the temperature inside the heat preservation and insulation box 5 reaches the set temperature, the heat preservation and insulation box 5 is heated to a high temperature. After the value is set and stabilized, the moving suction nozzle 43 sucks the semiconductor product on the first material loading mold 31 and places it on the high-temperature test seat 42 for electrical testing. After the test is completed, under the action of the linear guide 33, the material transport C turntable 4 moves to the far right. At this time, the moving suction nozzle 43 is actuated to transfer the semiconductor product on the high-temperature test seat 42 to the second material loading mold 41 on the top of the material transport C turntable 4. Then the lifting mechanism 6 drives the high-temperature insulation board 7 to rise. At the same time, under the action of the linear guide 33, the material transport C turntable 4 moves to the bottom of the material transport A turntable suction nozzle 21, and the semiconductor product is sucked by the material transport A turntable suction nozzle 21 and transported to the next test station. The utility model can effectively keep the heat when performing high-temperature testing on semiconductors, and the insulation effect is good, thereby avoiding heat loss and large temperature fluctuations that cause distortion of test data.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor product high-efficiency testing device, comprising a test bench (1), characterized in that: A material transport turntable A (2) is provided on the top of the test bench (1) near the left side. The top of the test bench (1) is located on the right side of the material transport turntable A (2), and is provided with a moving component, a testing component and a suction and release component in sequence. The moving assembly comprises a material transport turntable B (3) and a material transport turntable C (4) arranged in parallel. The material transport A turntable (2) is used to absorb and place semiconductor products onto the material transport B turntable (3), and the material transport B turntable (3) is used to move the semiconductor products to the test assembly. The suction and placement component is used to suction the semiconductor products on the material transport turntable B (3) to the test component for testing. After the test, the suction and placement component suctions and places the tested semiconductor products on the material transport turntable C (4). The material transport C turntable (4) is used to move the tested semiconductor products to the material transport A turntable (2).

2. The semiconductor product high-efficiency testing device according to claim 1, characterized in that: A material transporting turntable A suction nozzle (21) is provided on the periphery of the material transporting turntable A (2), and the material transporting turntable A suction nozzle (21) is used for sucking and placing semiconductor products.

3. The semiconductor product high-efficiency testing device according to claim 1, characterized in that: A first material loading mold (31) is provided on the top of the material transport B turntable (3), and a linear guide rail (33) fixedly connected to the test bench (1) is installed on the bottom of the material transport B turntable (3) and the material transport C turntable (4), and the material transport B turntable (3) and the material transport C turntable (4) are both slidably connected to the linear guide rail (33).

4. The semiconductor product high-efficiency testing device according to claim 1, characterized in that: A second material loading mold (41) is provided on the top of the material transport C turntable (4).

5. The semiconductor product high-efficiency testing device according to claim 1, characterized in that: The test assembly comprises a high temperature test seat (42).

6. The semiconductor product high-efficiency testing device according to claim 5, characterized in that: The suction and placement assembly comprises a movable support platform (45), a movable suction nozzle (43) and a forward and backward movement control cylinder (44), wherein the forward and backward movement control cylinder (44) is fixedly connected to the test bench (1), and the forward and backward movement control cylinder (44) is used to drive the movable support platform (45) to move. The movable suction nozzle (43) is movably connected to the movable support platform (45); The movable suction nozzle (43) is located above the high temperature test seat (42), the material transport B turntable (3) and the material transport C turntable (4).

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