Ejector pin device for integrated circuit die bonding process

Abstract

The utility model relates to an integrated circuit die bonding process thimble device in the technical field of integrated circuit die bonding process, which comprises a thimble cap body and a thimble cap top, the thimble cap top is embedded on the thimble cap body, and the external top end of the thimble cap body is provided with a fillet. An external expansion section which is obliquely expanded outwards is arranged at the lower middle part of the outer part of the ejector pin cap body, and a top embedding cavity is formed in the top end of the inner part of the ejector pin cap body. According to the ejector pin device for the integrated circuit die bonding process, the ejector pin cap made of ceramic materials is adopted, the problem that small chips are frequently lost is solved, the ejector pin device has the anti-static characteristic, the production efficiency of the small chips is improved, meanwhile, the design of the new ejector pin cap meets the requirement of a dust-free environment, the ejector pin cap can be in contact with products for use, and the service life of the products is prolonged. The problem of GaAs chip cracks caused by deformation of the metal ejector pin cap is solved, the uniformity of vacuum adsorption is improved by uniformly arranging the ceramic holes in the top of the ejector pin cap, and the stability and reliability of a crystal bonding process are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit die bonding technology, in particular to an ejector pin device for integrated circuit die bonding technology. Background Art

[0002] In the IC die bonding process, when the ASM machine produces small chips (such as MCD and TIS products), the uneven surface of the ejector cap may cause poor peeling of the chip (die) and the tape (tape), which will cause frequent missing die (chip missing) and false alarms of poor recognition in the DB (possibly referring to the detection equipment). In addition, when the ESEC model produces PA products, it uses metal ejector caps. This material is easy to deform and difficult to detect, and there is a hidden danger of chip cracks (die crack). The main function of the ejector cap is to achieve rapid peeling of the chip and the tape through the lifting action of the ejector pin after the tape is sucked. However, the metal ejector cap is subject to processing restrictions on the number of vacuum holes, resulting in the tape not being able to receive vacuum adsorption evenly on the entire plane of the ejector cap, which may affect the efficiency and quality of the die bonding process. Utility Model Content

[0003] The utility model aims to solve the shortcomings in the prior art and proposes an ejector pin device for an integrated circuit die bonding process.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit die bonding process ejector device, comprising an ejector cap body and an ejector cap top, the ejector cap top is embedded in the ejector cap body, the outer top end of the ejector cap body is provided with a rounded corner, the outer middle lower part of the ejector cap body is provided with an outward expansion section that expands obliquely outward, the inner top end of the ejector cap body is provided with a top inlay cavity, a sinking cavity connected to the top inlay cavity is provided below the top inlay cavity, a middle-upper cavity connected to the sinking cavity is provided below the sinking cavity, a middle-lower cavity connected to the middle-upper cavity is provided below the middle-upper cavity, a lower cavity connected to the middle-lower cavity is provided below the middle-lower cavity, and a lower cavity connected to the middle-lower cavity is provided below the middle-lower cavity, and the ejector cap top is provided with evenly arranged ceramic holes.

[0005] As a further description of the above technical solution:

[0006] The overall height of the ejector cap body is 27.3 mm, the distance from the top of the sinking cavity to the bottom of the ejector cap body is 8.7 mm, and the bottom diameter of the ejector cap body is 17.00 mm.

[0007] As a further description of the above technical solution:

[0008] The diameter of the fillet is 14.5 mm, and the depth of the top inlay cavity is 1.00 mm.

[0009] As a further description of the above technical solution:

[0010] The depth of the sinking cavity is 0.50 mm, and the depth of the middle and upper cavity is 1.00 mm.

[0011] As a further description of the above technical solution:

[0012] The diameter of the top of the ejector cap is 10.00 mm, and the thickness of the top of the ejector cap is 1.00 mm.

[0013] As a further description of the above technical solution:

[0014] The diameter of the ceramic hole is 0.40 mm.

[0015] As a further description of the above technical solution:

[0016] The ejector cap body is made of stainless steel.

[0017] As a further description of the above technical solution:

[0018] The top of the ejector cap is made of ceramic material.

[0019] The utility model has the following beneficial effects: the integrated circuit die bonding process ejector device proposed by the utility model solves the problem of frequent chip missing of small chips by adopting an ejector cap made of ceramic material, and has anti-static properties, thereby improving the production efficiency of small chips. At the same time, the new ejector cap design meets the requirements of a dust-free environment and can be used in contact with products, effectively solving the GaAs chip crack problem caused by deformation of the metal ejector cap. In addition, by evenly arranging ceramic holes on the top of the ejector cap, the uniformity of vacuum adsorption is improved, and the stability and reliability of the die bonding process are further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the ejector pin device for the integrated circuit die bonding process proposed by the utility model;

[0021] Figure 2 This is a cross-sectional view of the ejector cap body of the ejector device of the integrated circuit die bonding process proposed by the utility model;

[0022] Figure 3 This is a top view of the ejector pin device for the integrated circuit die bonding process proposed by the utility model;

[0023] Figure 4 The utility model provides a cross-sectional view of the top of the ejector cap of the ejector device of the integrated circuit die bonding process.

[0024] Legend:

[0025] 1. Ejector cap body; 11. Fillet; 12. Outward expansion section; 13. Top inlay cavity; 14. Sinking cavity; 15. Middle and upper cavity; 16. Middle and lower cavity; 17. Lower cavity; 2. Ejector cap top; 21. Ceramic hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Reference Figure 1-4 The utility model provides an embodiment: an integrated circuit die bonding process ejector device, comprising an ejector cap body 1 and an ejector cap top 2, the ejector cap top 2 is embedded in the ejector cap body 1, the outer top of the ejector cap body 1 is provided with a rounded corner 11, the rounded corner 11 helps to reduce the risk of the ejector cap causing damage to the chip during operation, an outer middle lower portion of the ejector cap body 1 is provided with an outer expansion section 12 that expands obliquely outward, the inner top of the ejector cap body 1 is provided with a top embedding cavity 13, and the ejector cap top 2 is embedded in the needle cap body through the top embedding cavity 13.

[0028] A sinking cavity 14 connected to the top inlaid cavity 13 is provided below the top inlaid cavity 13, a middle-upper cavity 15 connected to the sinking cavity 14 is provided below the sinking cavity 14, a middle-lower cavity 16 connected to the middle-upper cavity 15 is provided below the middle-upper cavity 15, a lower cavity 17 connected to the middle-lower cavity 16 is provided below the middle-lower cavity 16, and evenly arranged ceramic holes 21 are provided on the top 2 of the thimble cap.

[0029] The overall height of the ejector cap body 1 is 27.3 mm, the distance from the top of the sinking cavity 14 to the bottom of the ejector cap body 1 is 8.7 mm, and the bottom diameter of the ejector cap body 1 is 17.00 mm.

[0030] The diameter of the fillet 11 is 14.5 mm, and the depth of the top inlay cavity 13 is 1.00 mm.

[0031] The depth of the sinking cavity 14 is 0.50 mm, the depth of the middle and upper cavity 15 is 1.00 mm, and the diameter of the top 2 of the ejector cap is 10.00 mm.

[0032] The thickness of the top 2 of the ejector cap is 1.00 mm, and the diameter of the ceramic hole 21 is 0.40 mm.

[0033] The thimble cap body 1 is made of stainless steel.

[0034] The top 2 of the ejector cap is made of ceramic material, which has good wear resistance and anti-static properties.

[0035] Working principle:

[0036] When the die bonding process begins, the ejector pin device descends above the chip, and the ceramic hole 21 on the top 2 of the ejector pin cap generates an adsorption force through the vacuum system to evenly absorb the tape.

[0037] As the ejector device further descends, the rounded corner 11 of the ejector cap body 1 is designed to contact the chip first, thereby reducing damage to the chip.

[0038] The ejector pin continues to descend, separating the chip from the tape. Due to the cavity structure design inside the ejector pin cap, the chip can be better supported during the process of being separated from the tape, reducing chip damage caused by uneven adsorption or deformation of the ejector pin cap.

[0039] The ejector device rises and takes the chip away from the tape, completing the die bonding process. The top 2 of the ejector cap made of ceramic material not only provides good anti-static performance, but also improves the service life and reliability of the ejector cap due to its hardness and wear resistance.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ejector pin device for an integrated circuit die bonding process, comprising an ejector pin cap body (1) and an ejector pin cap top (2), characterized in that: The top of the thimble cap (2) is embedded in the thimble cap body (1); the top of the outer side of the thimble cap body (1) is provided with a rounded corner (11); the middle and lower part of the outer side of the thimble cap body (1) is provided with an outward expansion section (12) that expands obliquely outward; the top of the inner side of the thimble cap body (1) is provided with a top inlay cavity (13); below the top inlay cavity (13) is provided with a sinking cavity (14) connected to the top inlay cavity (13); below the sinking cavity (14) is provided with a middle-upper cavity (15) connected to the sinking cavity (14); below the middle-upper cavity (15) is provided with a middle-lower cavity (16) connected to the middle-upper cavity (15); below the middle-lower cavity (16) is provided with a lower cavity (17) connected to the middle-lower cavity (16); and the top of the thimble cap (2) is provided with uniformly arranged ceramic holes (21).

2. The integrated circuit die bonding process ejector device according to claim 1, characterized in that: The overall height of the ejector cap body (1) is 27.3 mm, the distance from the top of the sinking cavity (14) to the bottom of the ejector cap body (1) is 8.7 mm, and the bottom diameter of the ejector cap body (1) is 17.00 mm.

3. The integrated circuit die bonding process ejector device according to claim 2, characterized in that: The diameter of the fillet (11) is 14.5 mm, and the depth of the top inlay cavity (13) is 1.00 mm.

4. The integrated circuit die bonding process ejector device according to claim 3, characterized in that: The depth of the sinking cavity (14) is 0.50 mm, and the depth of the middle and upper cavity (15) is 1.00 mm.

5. The integrated circuit die bonding process ejector device according to claim 4, characterized in that: The diameter of the top of the thimble cap (2) is 10.00 mm, and the thickness of the top of the thimble cap (2) is 1.00 mm.

6. The integrated circuit die bonding process ejector device according to claim 5, characterized in that: The diameter of the ceramic hole (21) is 0.40 mm.

7. The integrated circuit die bonding process ejector device according to claim 6, characterized in that: The ejector cap body (1) is made of stainless steel.

8. The integrated circuit die bonding process ejector pin device according to claim 7, characterized in that: The top (2) of the ejector cap is made of ceramic material.

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