Chip adsorption device

Abstract

The utility model relates to a chip adsorption device, which belongs to the field of suction nozzles and comprises a main body, the bottom of the main body is provided with an adsorption hole, the top of the main body is provided with a connecting hole, the connecting hole is communicated with the adsorption hole, the bottom of the main body is provided with an annular first bulge, and the adsorption hole is positioned on the inner side of the first bulge. According to the utility model, the contact area between the adsorption device and the chip is reduced through the arrangement of the first bulge, so that the probability that the adsorption effect is influenced by impurities is reduced, and the impurities clamped between the first bulge and the chip can be pushed to move away through the arc-shaped bottom of the first bulge, so that the impurities are prevented from influencing the sealing performance between the first bulge and the chip, and the service life of the adsorption device is prolonged. And secondly, impurities are collected through the grooves, and the situation that the impurities stay on the chip when the first protrusions are separated from the chip is avoided.

Description

Technical Field

[0001] The utility model relates to a chip adsorption device, belonging to the field of suction nozzles. Background Art

[0002] The suction nozzle is widely used in semiconductor packaging technology or chip mounting technology. Its function is to suck semiconductor chips or electronic components and transfer them to a specific location. When in use, the suction nozzle is installed on the chip bonding equipment, and under the control of the chip bonding equipment, the suction nozzle is in direct contact with the semiconductor chip or electronic component, and the semiconductor chip or electronic component is sucked by the vacuum principle, and finally a series of actions such as transfer and placement are completed.

[0003] The Chinese utility model patent with announcement number CN203434137U discloses a vacuum suction nozzle, including a pressure head, a suction head is arranged in the pressure head, the front end of the suction head extends to the outside of the pressure head, the front end of the suction head has an adsorption surface, the interior of the suction head has at least one suction hole that penetrates the suction head and is connected to the adsorption surface, and the pressure head has a suction hole that is connected to the suction hole. The vacuum suction nozzle of this utility model will not damage the surface of the chip, and has the advantages of long service life, ability to meet small-size processing, and easy installation and replacement. However, in the prior art, impurities are easily stuck between the adsorption position of the suction nozzle and the chip, and the impurities will affect the sealing between the suction nozzle and the chip, causing the chip to fall off the suction nozzle, affecting the adsorption effect.

[0004] Therefore, a chip adsorption device is needed to improve the adsorption effect. Utility Model Content

[0005] The technical problem to be solved by the utility model is: in order to overcome the deficiencies of the prior art, a chip adsorption device with improved adsorption effect is provided.

[0006] The technical solution adopted by the utility model to solve the above-mentioned problem is: a chip adsorption device, including a main body, a suction hole is arranged at the bottom of the main body, a connecting hole is arranged at the top of the main body, the connecting hole is connected with the adsorption hole, and a first annular protrusion is arranged at the bottom of the main body, and the adsorption hole is located on the inner side of the first protrusion.

[0007] Preferably, the bottom of the first protrusion is arc-shaped.

[0008] Preferably, a second annular protrusion is provided at the bottom of the main body, the second protrusion is located on the inner side of the first protrusion, a gap is provided between the second protrusion and the first protrusion, the adsorption hole is located on the inner side of the second protrusion, and the protrusion height of the second protrusion is smaller than the protrusion height of the first protrusion.

[0009] Preferably, the first protrusion and the second protrusion are both coaxially arranged with the adsorption hole.

[0010] Preferably, the inner diameter of the first protrusion is equal to that of the adsorption hole.

[0011] Preferably, a groove is provided at the bottom of the main body, and the groove is located between the first protrusion and the second protrusion.

[0012] Preferably, a reinforcing rib is connected between the outer peripheral wall of the first protrusion and the bottom of the main body.

[0013] Preferably, the main body comprises a cylindrical section and a truncated cone section, the cylindrical section is arranged vertically, the large diameter end of the truncated cone section is coaxially arranged at the bottom end of the cylindrical section, and the outer diameter of the first protrusion is smaller than the small diameter of the truncated cone section.

[0014] Preferably, an air hole is provided at the top of the cylindrical section, and the air hole extends to the conical surface of the truncated cone section.

[0015] Preferably, the connecting hole is a rectangular hole.

[0016] Compared with the prior art, the advantages of the utility model are:

[0017] The utility model discloses a chip adsorption device. By setting a first protrusion, the contact area between the adsorption device and the chip is reduced, thereby reducing the probability of impurities affecting the adsorption effect. Moreover, the impurities stuck between the first protrusion and the chip can be pushed away through the arc-shaped bottom of the first protrusion, so as to avoid the impurities affecting the sealing between the first protrusion and the chip and improve the adsorption effect. Secondly, the impurities are collected by the groove, so as to avoid the impurities staying on the chip when the first protrusion is separated from the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional diagram of a chip adsorption device of the utility model;

[0019] Figure 2 This is a front view of a chip adsorption device of the utility model;

[0020] Figure 3 This is a left view of a chip adsorption device of the utility model;

[0021] Figure 4 This is a top view of a chip adsorption device of the utility model;

[0022] Figure 5 This is a bottom view of a chip adsorption device of the utility model;

[0023] Figure 6 for Figure 2 AA cross-sectional view.

[0024] in:

[0025] Main body 1, adsorption hole 2, connection hole 3, first protrusion 4, second protrusion 5, groove 6, reinforcing rib 7, air hole 8;

[0026] The cylindrical section 11 and the truncated cone section 12. DETAILED DESCRIPTION

[0027] like Figure 1-6 As shown, a chip adsorption device in this embodiment includes a main body 1, a suction hole 2 is provided at the bottom of the main body 1, a connecting hole 3 is provided at the top of the main body 1, the connecting hole 3 is a rectangular hole, the connecting hole 3 is connected with the adsorption hole 2, and a ring-shaped first protrusion 4 is provided at the bottom of the main body 1, and the adsorption hole 2 is located on the inner side of the first protrusion 4. During use, the main body 1 is installed on the moving arm of the chip bonding device through the connecting hole 3, wherein a vacuum system is provided on the moving arm, and when the bottom of the first protrusion 4 is made to fit with the upper surface of the chip through the moving arm, vacuum suction reduces the air pressure in the adsorption hole 2, that is, the first protrusion 4 is formed. The air pressure in the annular hole of the first protrusion 4 is reduced, so that the chip is adsorbed on the bottom of the first protrusion 4. Then, as the moving arm moves and drives the chip to the chip-adhering position, the vacuum system stops working, and the first protrusion 4 stops adsorbing the chip. Then, the first protrusion 4 is separated from the chip by the moving arm again, and the adsorption action of the next chip is performed. Here, in fact, the surface area of ​​the bottom of the first protrusion 4 is smaller than the surface area of ​​the bottom of the main body 1. Compared with the direct bonding of the bottom of the main body 1 with the chip, the bonding of the first protrusion 4 with the chip reduces the probability of impurities being stuck between the first protrusion 4 and the chip when the chip is adsorbed, thereby improving the reliability of the adsorption of the chip.

[0028] The bottom of the first protrusion 4 is arc-shaped. When the bottom of the first protrusion 4 is attached to the chip, the bottom of the first protrusion 4 can push away the impurities stuck between the first protrusion 4 and the chip, so as to prevent the impurities from affecting the sealing between the first protrusion 4 and the chip and improve the adsorption effect.

[0029] The bottom of the main body 1 is provided with an annular second protrusion 5, which is located on the inner side of the first protrusion 4, and a gap is provided between the second protrusion 5 and the first protrusion 4. The adsorption hole 2 is located on the inner side of the second protrusion 5, and the protrusion height of the second protrusion 5 is smaller than the protrusion height of the first protrusion 4. When the first protrusion 4 pushes the impurities between the first protrusion 4 and the chip to move toward the inner side of the first protrusion 4, the second protrusion 5 blocks the impurities, so that the impurities stay between the first protrusion 4 and the second protrusion 5, thereby preventing the impurities from entering the adsorption hole 2 and causing the adsorption hole 2 to be blocked.

[0030] The first protrusion 4 and the second protrusion 5 are both coaxially arranged with the adsorption hole 2, and the inner diameter of the first protrusion 4 is equal to that of the adsorption hole 2;

[0031] The bottom of the main body 1 is provided with a plurality of grooves 6, which are uniformly distributed between the first protrusion 4 and the second protrusion 5 in the circumferential direction with the second protrusion 5 as the center, and impurities staying between the first protrusion 4 and the second protrusion 5 are stuck in the grooves 6 to collect the impurities, thereby preventing the impurities from staying on the chip when the first protrusion 4 is separated from the chip;

[0032] A reinforcing rib 7 is connected between the outer peripheral wall of the first protrusion 4 and the bottom of the main body 1;

[0033] The main body 1 includes a cylindrical section 11 and a truncated cone section 12, the cylindrical section 11 is arranged vertically, the large diameter end of the truncated cone section 12 is coaxially arranged at the bottom end of the cylindrical section 11, and the outer diameter of the first protrusion 4 is smaller than the small diameter of the truncated cone section 12;

[0034] The top of the cylindrical section 11 is provided with a plurality of air holes 8, and the air holes 8 extend to the conical surface of the truncated cone section 12. During operation, in fact, an air filling system is provided on the movable arm, and the air filling system is connected to the top of the air hole 8. During the bonding process between the first protrusion 4 and the chip, the air filling system exhausts the air and delivers it into the air hole 8. The air in the air hole 8 is discharged from the bottom of the air hole 8 and acts on the chip. Under the action of the air flow, the impurities on the chip are blown away. When the first protrusion 4 absorbs the chip and moves, the air filling system stops exhausting the air.

[0035] In summary, by providing the first protrusion 4, the contact area between the adsorption device and the chip is reduced, thereby reducing the probability of impurities affecting the adsorption effect. Moreover, the impurities stuck between the first protrusion 4 and the chip can be pushed away through the arc-shaped bottom of the first protrusion 4, avoiding the impurities from affecting the sealing between the first protrusion 4 and the chip, thereby improving the adsorption effect. Secondly, impurities are collected through the groove 6 to avoid impurities staying on the chip when the first protrusion 4 is separated from the chip.

[0036] In addition to the above embodiments, the present invention also includes other implementation modes. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims

1. A chip adsorption device, comprising a main body (1), a bottom of the main body (1) is provided with an adsorption hole (2), a top of the main body (1) is provided with a connecting hole (3), the connecting hole (3) is connected to the adsorption hole (2), and is characterized in that: The bottom of the main body (1) is provided with an annular first protrusion (4), and the adsorption hole (2) is located on the inner side of the first protrusion (4).

2. A chip adsorption device according to claim 1, characterized in that: The bottom of the first protrusion (4) is arc-shaped.

3. The chip adsorption device according to claim 1, characterized in that: The bottom of the main body (1) is provided with an annular second protrusion (5), the second protrusion (5) is located on the inner side of the first protrusion (4), a gap is provided between the second protrusion (5) and the first protrusion (4), the adsorption hole (2) is located on the inner side of the second protrusion (5), and the protrusion height of the second protrusion (5) is smaller than the protrusion height of the first protrusion (4).

4. The chip adsorption device according to claim 3, characterized in that: The first protrusion (4) and the second protrusion (5) are both arranged coaxially with the adsorption hole (2).

5. The chip adsorption device according to claim 4, characterized in that: The inner diameter of the first protrusion (4) is equal to that of the adsorption hole (2).

6. The chip adsorption device according to claim 4, characterized in that: The bottom of the main body (1) is provided with a groove (6), and the groove (6) is located between the first protrusion (4) and the second protrusion (5).

7. The chip adsorption device according to claim 1, characterized in that: A reinforcing rib (7) is connected between the outer peripheral wall of the first protrusion (4) and the bottom of the main body (1).

8. The chip adsorption device according to claim 1, characterized in that: The main body (1) comprises a cylindrical section (11) and a truncated cone section (12); the cylindrical section (11) is arranged vertically; the large diameter end of the truncated cone section (12) is coaxially arranged at the bottom end of the cylindrical section (11); and the outer diameter of the first protrusion (4) is smaller than the small diameter of the truncated cone section (12).

9. The chip adsorption device according to claim 8, characterized in that: The top of the cylindrical section (11) is provided with an air hole (8), and the air hole (8) extends to the conical surface of the truncated cone section (12).

10. The chip adsorption device according to claim 1, characterized in that: The connecting hole (3) is a rectangular hole.

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