Internet of Things balance valve Lora communication integrated circuit board

Abstract

The utility model belongs to the field of circuit boards, and particularly relates to an internet of things balance valve Lora communication integrated circuit board which comprises a circuit board, a Lora communication module, a sensor interface, a power supply interface and a chip are arranged on the surface of the circuit board, and a sleeve is fixedly connected to the surface of the circuit board and located on the left side of the Lora communication module. A hexagonal prism is slidably connected to the inner side of the sleeve, a connecting column is fixedly connected to the top of the hexagonal prism, a hollow shell is fixedly connected to the tail end of the connecting column, and a heat conduction block is fixedly connected to the bottom of the hollow shell. The Lora communication module is installed on the circuit board, wireless communication with other devices or systems can be achieved, the Lora communication module is used for transmitting control instructions, receiving data, monitoring reports and the like of the balance valve, the heat conduction block is arranged above the Lora communication module and used for absorbing heat generated when the Lora communication module works, and therefore the heat conduction efficiency of the balance valve is improved. And then heat dissipation is carried out through the micro fan, so that normal operation of the Lora communication module is ensured.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a Lora communication integrated circuit board for an Internet of Things balancing valve. Background Art

[0002] The IoT balancing valve integrated circuit board is a circuit board specially designed for controlling and monitoring balancing valves. It usually contains the following main components and functions:

[0003] Control chip: Integrates a microcontroller or FPGA chip to realize the switch control and status monitoring functions of the balancing valve.

[0004] Sensor interface: used to connect various sensors, such as temperature sensors, pressure sensors, etc., in order to monitor the working status and environmental parameters of the balancing valve in real time.

[0005] Power management circuit: used to provide stable power to various components on the circuit board, usually including functions such as power conversion, battery management and power protection.

[0006] Expansion interface: used to connect other external devices or modules, such as display screens, buttons, memory, etc., to expand the functions and application scenarios of the circuit board.

[0007] PCB circuit board: used to connect and support the above components, provide circuit connection and mechanical support, usually adopts multi-layer board design to reduce size and improve signal transmission stability.

[0008] The IoT balancing valve integrated circuit board can be widely used in building automation, industrial control, energy management and other fields to realize functions such as remote control, intelligent adjustment and energy saving.

[0009] However, most of the integrated circuit boards of the existing IoT balancing valves still use wired communication to connect to the circuit board, which has certain limitations. In addition, the module used for communication needs to rely on its own heat dissipation, and the heat dissipation capacity is insufficient. Therefore, the communication needs to be improved. Summary of the invention

[0010] The purpose of the utility model is to provide a Lora communication integrated circuit board for an Internet of Things balancing valve, which solves the problem that most of the integrated circuit boards of existing Internet of Things balancing valves still use wired communication to connect with the circuit board, which has certain limitations, and the module used for communication needs to rely on its own heat dissipation, and the heat dissipation capacity is insufficient.

[0011] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a Lora communication integrated circuit board for an Internet of Things balancing valve, comprising a circuit board, a Lora communication module, a sensor interface, a power interface and a chip are arranged on the surface of the circuit board, a sleeve is fixedly connected to the surface of the circuit board and located on the left side of the Lora communication module, a hexagonal prism is slidably connected to the inner side of the sleeve, a connecting column is fixedly connected to the top of the hexagonal prism, a hollow shell is fixedly connected to the end of the connecting column, a heat conductive block is fixedly connected to the bottom of the hollow shell, and the heat conductive block is in contact with the Lora communication module, an air duct is fixedly connected to the top of the hollow shell, and a micro fan is arranged on the inner side of the air duct.

[0012] Preferably, the hexagonal prism is a polygonal column made of plastic. The polygonal column-shaped hexagonal prism has the function of preventing rotation.

[0013] Preferably, the connecting column is a rod-shaped and made of plastic. The connection transition between the hexagonal column and the hollow shell is facilitated by the setting of the connecting column.

[0014] Preferably, a filter screen is connected to the inner side of the air duct through a thread, and a limit ring is fixedly connected to the inner side of the air duct and located below the filter screen, and the limit ring contacts the filter screen. The filter screen can filter the air introduced into the air duct by the micro fan.

[0015] Preferably, the heat conducting block is square and made of copper. The heat on the Lora communication module can be absorbed by the heat conducting block.

[0016] Preferably, a plurality of fins are fixedly connected to the top of the heat conducting block, and the plurality of fins are distributed in an array. The heat dissipation capacity of the heat conducting block can be increased by disposing the fins.

[0017] Preferably, a connecting sleeve is installed on the inner bottom of the sleeve via a bearing, and a spring is fixedly connected between the connecting sleeve and the hexagonal prism. By setting the spring, elastic force can be applied to the hexagonal prism.

[0018] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0019] 1. The utility model can realize wireless communication with other devices or systems by installing a Lora communication module on the circuit board, which is used for transmitting control instructions, receiving data and monitoring reports of the balancing valve, etc., and a heat conductive block is arranged above the Lora communication module to absorb the heat when the Lora communication module is working, and then the heat is dissipated by a micro fan, thereby ensuring the normal operation of the Lora communication module.

[0020] 2. The utility model arranges a sleeve, a hexagonal prism, a connecting column, a connecting sleeve and a spring on the side of the Lora communication module, wherein the connecting column is used for the connection transition between the hollow shell and the hexagonal prism. In this way, the hexagonal prism is lifted and then rotated, which facilitates the disassembly and assembly of the Lora communication module in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0022] Figure 2 For the utility model Figure 1 A three-dimensional diagram of the circuit board structure;

[0023] Figure 3 For the utility model Figure 1 A front cross-sectional view of a local structure;

[0024] Figure 4 For the utility model Figure 3 A-section structure enlarged view.

[0025] In the figure: 1. Circuit board; 2. Lora communication module; 3. Sensor interface; 4. Power interface; 5. Sleeve; 6. Hexagonal prism; 7. Connecting column; 8. Hollow shell; 9. Heat transfer block; 91. Fin; 10. Air duct; 11. Micro fan; 12. Limiting ring; 13. Filter; 14. Connecting sleeve; 15. Spring; 16. Chip. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-4, An Internet of Things balance valve Lora communication integrated circuit board, including a circuit board 1, on the surface of the circuit board 1 are provided with a Lora communication module 2, a sensor interface 3, a power interface 4 and a chip 16. On the surface of the circuit board 1 and to the left of the Lora communication module 2 is fixedly connected a sleeve 5. Inside the sleeve 5 is slidably connected a hexagonal prism 6. At the bottom inside the sleeve 5 is installed a connecting sleeve 14 through a bearing. Between the connecting sleeve 14 and the hexagonal prism 6 is fixedly connected a spring 15. Through the setting of the spring 15, elastic force can act on the hexagonal prism 6. The hexagonal prism 6 is a polygonal column and is made of plastic. Through the polygonal column-shaped hexagonal prism 6, it has the function of preventing self-rotation. The connecting column 7 is in the shape of a U-shaped rod and is made of plastic. Through the setting of the connecting column 7, it is convenient for the connection transition between the hexagonal prism 6 and the hollow shell 8.

[0028] Please refer to Figure 3 , at the top of the hexagonal prism 6 is fixedly connected a connecting column 7. At the end of the connecting column 7 is fixedly connected a hollow shell 8. At the bottom of the hollow shell 8 is fixedly connected a heat conducting block 9, and the heat conducting block 9 is in contact with the Lora communication module 2. At the top of the hollow shell 8 is fixedly connected an air duct 10. Inside the air duct 10 is provided a micro fan 11. Inside the air duct 10 is threadedly connected a filter net 13. Inside the air duct 10 and below the filter net 13 is fixedly connected a limiting ring 12, and the limiting ring 12 is in contact with the filter net 13. Through the setting of the filter net 13, it has a filtering effect on the air introduced into the air duct 10 by the micro fan 11.

[0029] Please refer to Figure 3 , the heat conducting block 9 is square and made of copper. Through the setting of the heat conducting block 9, the heat on the Lora communication module 2 can be absorbed. At the top of the heat conducting block 9 are fixedly connected a plurality of fins 91, and the plurality of fins 91 are arranged in an array. Through the setting of the fins 91, the heat dissipation capacity of the heat conducting block 9 can be increased.

[0030] The specific implementation process of the present utility model is as follows: When in use, first install the Lora communication module 2 and other electronic components such as the sensor interface 3, the power interface 4 and the chip 16 on the circuit board 1 normally. Then pull up the hexagonal prism 6 upwards. The hexagonal prism 6 will stretch the spring 15 until the hexagonal prism 6 is completely pulled out of the sleeve 5. Subsequently, rotate the hexagonal prism 6. The hexagonal prism 6 drives the hollow shell 8 and the components on the hollow shell 8 to rotate synchronously through the connecting column 7 until the hollow shell 8 is completely located directly above the Lora communication module 2. Subsequently, insert the hexagonal prism 6 into the sleeve 5. At this time, the heat conducting block 9 on the hollow shell 8 fits on the Lora communication module 2. In this way, the heat generated when the Lora communication module 2 operates is conducted to the heat conducting block 9. Subsequently, the micro fan 11 blows air on the heat conducting block 9 and takes away the heat, achieving the purpose of dissipating heat from the Lora communication module 2, thereby ensuring the normal operation of the Lora communication module 2.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An Internet of Things balancing valve Lora communication integrated circuit board, comprising a circuit board (1), characterized in that: The surface of the circuit board (1) is provided with a Lora communication module (2), a sensor interface (3), a power interface (4) and a chip (16). A sleeve (5) is fixedly connected to the surface of the circuit board (1) and on the left side of the Lora communication module (2). A hexagonal prism (6) is slidably connected to the inside of the sleeve (5). A connecting column (7) is fixedly connected to the top of the hexagonal prism (6). The end of the connecting column (7) is fixedly connected to a hollow shell (8). A heat conducting block (9) is fixedly connected to the bottom of the hollow shell (8), and the heat conducting block (9) is in contact with the Lora communication module (2). A wind duct (10) is fixedly connected to the top of the hollow shell (8). A micro fan (11) is arranged inside the wind duct (10).

2. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized in that: The hexagonal prism (6) is a polygonal column and is made of plastic material.

3. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized in that: The connecting column (7) is a U-shaped rod and is made of plastic material.

4. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized in that: A filter screen (13) is threadedly connected to the inside of the wind duct (10). A limiting ring (12) is fixedly connected to the inside of the wind duct (10) and below the filter screen (13), and the limiting ring (12) is in contact with the filter screen (13).

5. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized in that: The heat conducting block (9) is square and is made of copper.

6. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized in that: A plurality of fins (91) are fixedly connected to the top of the heat conducting block (9), and the plurality of fins (91) are arranged in an array.

7. The Lora communication integrated circuit board for an Internet of Things balancing valve according to claim 1 is characterized by: A connecting sleeve (14) is installed at the inner bottom of the sleeve (5) through a bearing, and a spring (15) is fixedly connected between the connecting sleeve (14) and the hexagonal prism (6).

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