Novel compensation etching machine

Abstract

The utility model relates to a novel compensation etching machine, relates to the technical field of etching processing, and is used for solving the defects that a spraying position is not accurate enough and an upper plate surface still has a pool effect in a spraying process in the existing compensation etching process. The novel compensation etching machine comprises a compensation etching mechanism and an etching mechanism, the compensation etching mechanism comprises a machine body, and the machine body is provided with an etching groove; the machine body is provided with a feeding assembly, the feeding assembly is used for conveying a circuit board, the machine body is further provided with a spraying assembly, the spraying assembly is used for spraying liquid medicine on the surface of the circuit board, the machine body is further provided with a vacuum assembly, the vacuum assembly is used for sucking the liquid medicine on the upper surface of the circuit board, and the etching mechanism is arranged on the discharging side of the compensation etching mechanism. And the etching mechanism is used for etching the circuit board processed by the compensation etching mechanism.

Description

Technical Field

[0001] The present application relates to the technical field of etching processing, and in particular to a novel compensation etching machine. Background Art

[0002] With the development of science and technology, the line width and line spacing of circuit boards are getting smaller and smaller, and the difficulty of production is increasing. There are differences in the copper thickness of the production board during the production process, which leads to differences in the circuit etching process. The existing compensation etching spray position is not accurate enough, and there is still a pool effect problem on the upper board surface during the spraying process.

[0003] With respect to the above-mentioned related technologies, the existing compensation etching has the defects that the spraying position is not accurate enough and there is still a pool effect problem on the upper plate surface during the spraying process. Utility Model Content

[0004] The present application provides a new type of compensation etching machine to solve the defects of the existing compensation etching, such as the spray position is not accurate enough and there is still a pool effect on the upper plate surface during the spraying process.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a new type of compensating etching machine, characterized in that the new type of compensating etching machine comprises:

[0006] The compensation etching mechanism comprises a machine body, on which a feeding assembly is arranged, and the feeding assembly is used to transfer the circuit board. The machine body is also provided with a spray assembly, and the spray assembly is used to spray medicine on the surface of the circuit board. The machine body is also provided with a vacuum assembly, and the vacuum assembly is used to absorb the medicine on the upper surface of the circuit board.

[0007] The etching mechanism is arranged on the unloading side of the compensating etching mechanism and is used for etching the circuit board processed by the compensating etching mechanism.

[0008] By adopting the above technical solution and arranging the compensating etching mechanism before the etching mechanism process, the problem of inaccurate compensating etching position after the circuit board is shifted during transportation on the etching mechanism is reduced.

[0009] Preferably, the feeding assembly comprises:

[0010] An upper conveying roller is arranged on one side of the machine body for rotation at intervals;

[0011] The lower conveying roller is rotatably arranged at one side of the machine body and is arranged opposite to the upper conveying roller at an interval. The upper conveying roller and the lower conveying roller are used to cooperate with each other to transport the circuit board.

[0012] By adopting the above technical solution, the above-mentioned feeding roller and the lower conveying roller cooperate with each other and simultaneously rotate to transport the circuit board backwards.

[0013] Preferably, the spray assembly comprises:

[0014] An upper spray pipe is arranged at a distance on a side of the upper conveying roller away from the lower conveying roller, and the upper spray pipe is used to spray the liquid medicine onto the first surface of the circuit board.

[0015] By adopting the above technical solution and setting the upper spray pipe, the liquid medicine is sprayed on the first surface of the circuit board, thereby performing etching processing on the first surface of the circuit board.

[0016] Preferably, the spray assembly comprises:

[0017] A lower spray pipe is arranged at intervals on a side of the lower conveying roller away from the upper conveying roller, and the lower spray pipe is used to spray the liquid medicine onto the second surface of the circuit board.

[0018] By adopting the above technical solution, through the setting of the lower nozzle, the liquid medicine is sprayed on the second surface of the circuit board, so as to perform etching on the second surface of the circuit board. After spraying, the residual liquid medicine on the second surface of the circuit board will automatically separate from the second surface of the circuit board due to gravity.

[0019] Preferably, the spray assembly further includes:

[0020] A transparent observation tube is arranged on the surface of the machine body, and is used to observe the spraying positions of the upper nozzle and the lower nozzle.

[0021] By adopting the above technical solution and providing the transparent observation tube, it is convenient for operators to observe the spraying effects of the upper nozzle and the lower nozzle when performing the compensation etching process.

[0022] Preferably, the spray assembly comprises:

[0023] A spray pump is arranged on one side of the surface of the machine body, and is used to provide power for the upper spray pipe and the lower spray pipe.

[0024] By adopting the above technical solution, the spray pump is set to provide the upper spray pipe and the lower spray pipe with power to spray the medicine, so that the upper spray pipe and the lower spray pipe can continuously spray the medicine.

[0025] Preferably, the vacuum assembly comprises:

[0026] A vacuum suction knife is arranged at intervals on one side of the upper nozzle, and the vacuum suction knife is used to absorb the medicine on the first surface of the circuit board through negative pressure.

[0027] By adopting the above technical solution and setting the vacuum suction knife, the liquid medicine sprayed by the upper nozzle on the first surface of the circuit board is sucked away by vacuum negative pressure, preventing the liquid medicine from forming a pool effect on the first surface of the circuit board and affecting the etching process.

[0028] Preferably, the vacuum assembly comprises:

[0029] A vacuum pump is arranged on one side of the surface of the machine body and is used to provide vacuum negative pressure for the vacuum suction knife.

[0030] By adopting the above technical solution, the vacuum pump is set to provide vacuum negative pressure for the vacuum suction knife, so that the vacuum suction knife can use the vacuum negative pressure to remove the medicine on the first surface of the circuit board, thereby preventing the first surface of the circuit board from being affected by the pool effect and compensating the etching effect.

[0031] Preferably, the vacuum assembly comprises:

[0032] A connecting pipe is arranged on one side of the machine body, and the connecting pipe is also connected to the vacuum suction knife, and is used to transmit the medicine sucked by the vacuum suction knife.

[0033] By adopting the above technical solution and through the setting of the connecting pipe, the medicine sucked by the vacuum suction knife is discharged outward from the connecting pipe.

[0034] Preferably, the vacuum assembly comprises:

[0035] A pressure gauge is arranged on the surface of the machine body, and is used to monitor the pressure in the upper nozzle and the lower nozzle.

[0036] By adopting the above technical solution, the spraying pressure in the upper spray pipe and the lower spray pipe is monitored by the pressure gauge, thereby improving safety.

[0037] The beneficial effects of the present application are as follows: the new compensating etching machine provided by the present application, by arranging the compensating etching mechanism in front of the etching mechanism, reduces the problem of inaccurate etching compensation position after the line is deviated during the transportation process of the etching section, and reduces the influence of the chemical on the circuit board caused by the pool effect through the setting of the vacuum suction knife, thereby improving the yield and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0039] Figure 1 1 is a front view structural schematic diagram of a novel compensating etching machine provided in an embodiment of the present application;

[0040] Figure 2 yes Figure 1 Schematic diagram of the top view of the new compensating etching machine.

[0041] Explanation of the reference numerals: 100, compensation etching mechanism; 101, upper conveying roller; 102, lower conveying roller; 103, upper nozzle; 104, lower nozzle; 105, transparent observation tube; 106, spray pump; 107, vacuum suction knife; 108, vacuum pump; 109, connecting pipe; 110, pressure gauge; 111, etching mechanism. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), such directional indications are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0045] See also Figure 1, Figure 2 As shown, the present application provides a new type of compensating etching machine, characterized in that the new type of compensating etching machine includes a compensating etching mechanism 100 and an etching mechanism 111. The compensating etching mechanism 100 includes a body, a feeding assembly is provided on the body, the feeding assembly is used to transmit the circuit board, a spray assembly is also provided on the body, the spray assembly is used to spray medicine on the surface of the circuit board, a vacuum assembly is also provided on the body, the vacuum assembly is used to absorb the medicine on the surface of the circuit board, the etching mechanism 111 is arranged on the unloading side of the compensating etching mechanism 100, and is used to etch the circuit board processed by the compensating etching mechanism 100. By arranging the compensating etching mechanism 100 before the etching mechanism 111 process, the problem of inaccurate compensating etching position after the circuit board is offset during transportation on the etching mechanism 111 is reduced.

[0046] See also Figure 1 As shown, the feeding assembly includes an upper conveying roller 101 and a lower conveying roller 102. The upper conveying roller 101 is rotatably arranged at one side of the machine body at intervals, and the lower conveying roller 102 is rotatably arranged at one side of the machine body at intervals and is arranged opposite to the upper conveying roller 101. The upper conveying roller 101 and the lower conveying roller 102 are used to cooperate in transmitting the circuit board. Through the above-mentioned setting of the conveying roller and the lower conveying roller 102, they work together and turn to transmit the circuit board backward at the same time.

[0047] See also Figure 1 As shown, the spray assembly includes an upper spray pipe 103, which is spaced apart on the side of the upper conveying roller 101 away from the lower conveying roller 102. The upper spray pipe 103 is used to spray chemicals onto the first surface of the circuit board. Through the setting of the upper spray pipe 103, the circuit board is sprayed with chemicals on the first surface of the circuit board, thereby etching the first surface of the circuit board.

[0048] The spray assembly includes a lower spray pipe 104, which is spaced apart on the side of the lower conveying roller 102 away from the upper conveying roller 101. The lower spray pipe 104 is used to spray chemicals onto the second surface of the circuit board. Through the setting of the lower spray pipe 104, the circuit board is sprayed with chemicals on the second surface of the circuit board, thereby etching the second surface of the circuit board. After spraying, the residual chemicals on the second surface of the circuit board will automatically separate from the second surface of the circuit board due to gravity.

[0049] See also Figure 1 As shown, the spray assembly also includes a transparent observation tube 105, which is arranged on the surface of the machine body. The transparent observation tube 105 is used to observe the spraying positions of the upper nozzle 103 and the lower nozzle 104. Through the setting of the transparent observation tube 105, it is convenient for the operator to observe the spraying effects of the upper nozzle 103 and the lower nozzle 104 when performing the compensation etching process.

[0050] See also Figure 2 As shown, the spray assembly includes a spray pump 106, which is arranged on one side of the body surface. The spray pump 106 is used to provide power for the upper nozzle 103 and the lower nozzle 104. The spray pump 106 is set to provide power for the upper nozzle 103 and the lower nozzle 104 to spray the medicine, so that the upper nozzle 103 and the lower nozzle 104 can continuously spray the medicine.

[0051] See also Figure 1 As shown, the vacuum assembly includes a vacuum suction knife 107, and the vacuum suction knife 107 is arranged at a distance on one side of the upper nozzle 103. The vacuum suction knife 107 is used to absorb the liquid medicine on the first surface of the circuit board through negative pressure. Through the setting of the vacuum suction knife 107, the liquid medicine sprayed on the first surface of the circuit board by the upper nozzle 103 is absorbed by the vacuum negative pressure, thereby preventing the liquid medicine from forming a pool effect on the first surface of the circuit board and affecting the etching process.

[0052] See also Figure 2 As shown, the vacuum assembly includes a vacuum pump 108, which is arranged on one side of the body surface and is used to provide vacuum negative pressure for the vacuum suction knife 107. The vacuum pump 108 is set to provide vacuum negative pressure for the vacuum suction knife 107, so that the vacuum suction knife 107 can use the vacuum negative pressure to remove the medicine on the first surface of the circuit board to prevent the first surface of the circuit board from being affected by the pool effect. Compensation etching effect.

[0053] See also Figure 1 As shown, the vacuum component includes a connecting pipe 109, which is arranged on one side of the machine body. The connecting pipe 109 is also connected to the vacuum suction knife 107 and is used to transfer the medicine sucked by the vacuum suction knife 107. Through the setting of the connecting pipe 109, the medicine sucked from the vacuum suction knife 107 is discharged outward from the connecting pipe 109.

[0054] See also Figure 1 As shown, the vacuum assembly includes a pressure gauge 110, which is arranged on the surface of the machine body. The pressure gauge 110 is used to monitor the pressure in the upper nozzle 103 and the lower nozzle 104. The spraying pressure in the upper nozzle 103 and the lower nozzle 104 is monitored by the pressure gauge 110 to improve safety.

[0055] To sum up, the new compensating etching machine provided in the present application, by setting the compensating etching mechanism 100 in front of the etching mechanism 111, reduces the problem of inaccurate etching compensation position after the line is deviated during the transportation process of the etching section, and reduces the influence of the chemical on the circuit board caused by the pool effect through the setting of the vacuum suction knife 107, thereby improving the yield and processing efficiency.

[0056] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A new type of compensation etching machine, characterized in that: The novel compensation etching machine comprises: A compensating etching mechanism (100) comprises a machine body, the machine body being provided with a feeding assembly, the feeding assembly being used to transfer a circuit board, the machine body being further provided with a spraying assembly, the spraying assembly being used to spray liquid medicine on the surface of the circuit board, the machine body being further provided with a vacuum assembly, the vacuum assembly being used to absorb the liquid medicine on the surface of the circuit board; The etching mechanism (111) is arranged on the unloading side of the compensating etching mechanism (100) and is used to perform etching processing on the circuit board processed by the compensating etching mechanism (100).

2. The new compensating etching machine according to claim 1 is characterized in that: The feeding assembly comprises: An upper conveying roller (101) is rotatably arranged at one side of the machine body at intervals; The lower conveying roller (102) is rotatably arranged at one side of the machine body and is arranged opposite to the upper conveying roller (101) at an interval. The upper conveying roller (101) and the lower conveying roller (102) are used to cooperate with each other to transport the circuit board.

3. The new compensating etching machine according to claim 2 is characterized in that: The spray assembly comprises: An upper spray pipe (103) is arranged at a distance from the upper conveying roller (101) on a side away from the lower conveying roller (102), and the upper spray pipe (103) is used to spray the liquid medicine onto the first surface of the circuit board.

4. The new compensating etching machine according to claim 3 is characterized in that: The spray assembly comprises: A lower spray pipe (104) is arranged at a distance from the lower conveying roller (102) on a side away from the upper conveying roller (101), and the lower spray pipe (104) is used to spray the liquid medicine onto the second surface of the circuit board.

5. The new compensating etching machine according to claim 4 is characterized in that: The spray assembly also includes: A transparent observation tube (105) is arranged on the surface of the machine body, and the transparent observation tube (105) is used to observe the spraying positions of the upper spray pipe (103) and the lower spray pipe (104).

6. The new compensating etching machine according to claim 5 is characterized in that: The spray assembly comprises: A spray pump (106) is arranged on one side of the surface of the machine body, and the spray pump (106) is used to provide power for the upper spray pipe (103) and the lower spray pipe (104).

7. The new compensating etching machine according to claim 6 is characterized in that: The vacuum assembly comprises: A vacuum suction knife (107) is arranged at a distance from one side of the upper nozzle (103), and the vacuum suction knife (107) is used to absorb the liquid medicine on the first surface of the circuit board through negative pressure.

8. The new type of compensating etching machine according to claim 7 is characterized in that: The vacuum assembly comprises: A vacuum pump (108) is arranged on one side of the surface of the machine body and is used to provide vacuum negative pressure for the vacuum suction knife (107).

9. The new compensating etching machine according to claim 8 is characterized in that: The vacuum assembly comprises: A connecting pipe (109) is arranged on one side of the machine body, and the connecting pipe (109) is also connected to the vacuum suction knife (107) and is used to transmit the medicine sucked by the vacuum suction knife (107).

10. The new compensating etching machine according to claim 8 is characterized in that: The vacuum assembly comprises: A pressure gauge (110) is arranged on the surface of the machine body, and the pressure gauge (110) is used to monitor the pressure in the upper nozzle (103) and the lower nozzle (104).

Images