Surface mounting device and surface mounting machine
By designing a patch device that integrates lifting and moving dispensing components and patchers, and is equipped with reset parts, the problems of complex equipment, low degree of automation and equipment decline in power outage in the prior art are solved, and an efficient and stable patch process is achieved.
Patent Information
- Application Number
- CN202421686476.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing patch technology requires the continuous lifting and lowering of multiple devices, resulting in complex equipment and low automation. In the event of a sudden power outage, the problem of rapid decline in the dispensing assembly and patch device are prone to occur.
A patch device that integrates dispensing assembly and patcher that can simultaneously lift and lower movement is designed, and is equipped with a reset to control the height of the main bracket to ensure that rapid slides are prevented in the event of power failure.
It realizes the completion of multiple patch processes on the same device, which improves the degree of automation, reduces noise, ensures performance stability, reduces the collision of electronic components, and improves the yield rate.
Smart Images
Figure CN222869159U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic product production, in particular to a patch device and a patch mounting machine. Background Art
[0002] SMT is the abbreviation of a series of processing processes on printed circuit boards. It is currently the most popular technology and process in the electronic product assembly industry. SMT generally includes the following steps: locating the installation position of electronic components on the substrate; applying glue to the installation position of electronic components on the substrate; grabbing electronic components and installing them to the corresponding installation position; and detecting whether the installation position of electronic components is accurate. It can be seen that SMT involves multiple process steps, which require different equipment to continuously lift and lower to complete the work in collaboration. Utility Model Content
[0003] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art and provide a patch device.
[0004] The utility model is realized by the following technical solutions:
[0005] A patch device, comprising:
[0006] A mounting bracket, used for mounting the patch device on a placement machine;
[0007] A main bracket, mounted on the mounting bracket and capable of lifting and moving relative thereto;
[0008] A glue dispensing component, mounted on the main bracket and used for dispensing glue on the object to be patched;
[0009] A mounter, mounted on the main support and used to mount electronic components on an object to be mounted;
[0010] A reset member is connected between the mounting bracket and the main bracket to control the height of the main bracket relative to the mounting bracket.
[0011] Compared with the prior art, the patch device of the utility model integrates a dispensing component and a patch mounter that can be lifted and moved at the same time, and can complete multiple patch processes on the same device. In addition, a reset member is provided to control the lifting distance of the dispensing component and the patch mounter, which can prevent the dispensing component and the patch mounter from sliding down quickly and the main bracket from falling off from the mounting bracket when the power is suddenly cut off, ensuring that the main bracket is at a safe height.
[0012] Furthermore, the reset member is a magnetic spring, the stator of which is fixed on the mounting bracket, and the mover of which is fixed on the main bracket, which has the advantages of noise reduction, stable performance, and no need for electricity to work.
[0013] Furthermore, the glue dispensing assembly includes a glue dispenser, a slider, a glue dispensing guide rail and a driving component; the glue dispensing guide rail and the driving component are fixed on the main bracket; the slider is engaged with the glue dispensing guide rail and can be lifted and lowered along the glue dispensing guide rail; the glue dispenser is fixedly connected to the slider, so that there is a certain height difference between the patch device and the glue dispensing assembly in the patch, thereby preventing the glue dispensing assembly from colliding with other components.
[0014] Furthermore, it also includes a height gauge, which is installed on the main bracket and is located on the side of the dispensing component away from the mounter. Before dispensing, the height of the object to be mounted can be measured to determine the lifting height, ensure the fitting pressure, and improve the yield and stability of the product.
[0015] Furthermore, the altimeter is a laser rangefinder with high measurement accuracy and fast speed.
[0016] Furthermore, it also includes a visual detector, which is installed on the main bracket and located between the dispensing component and the mounter, so as to facilitate the photography, positioning and monitoring of the dispensing and mounting results during the mounting process.
[0017] Furthermore, it also includes a lifting component, which is connected between the mounting bracket and the main bracket and drives the main bracket to move up and down to achieve relative movement between the mounting bracket and the main bracket.
[0018] In addition, the utility model also provides a mounting machine, and its technical solution is as follows:
[0019] A placement machine, comprising a placement device and a conveying device, wherein the placement device is located above the conveying device, and the placement device comprises:
[0020] A mounting bracket, used for fixing the patch device to the placement machine;
[0021] A main bracket, mounted on the mounting bracket and capable of lifting and moving relative thereto;
[0022] A glue dispensing component, mounted on the main bracket and used for dispensing glue on the object to be patched;
[0023] A mounter, mounted on the main support and used to mount electronic components on an object to be mounted;
[0024] A reset member is connected between the mounting bracket and the main bracket to control the height of the main bracket relative to the mounting bracket.
[0025] Compared with the prior art, the mounter of the utility model integrates a dispensing component and a mounter that can be lifted and moved at the same time, and can complete multiple mount processes on the same device. In addition, a reset part is provided to control the lifting distance of the dispensing component and the mounter, which can prevent the dispensing component and the mounter from sliding down quickly and the main bracket from falling off from the mounting bracket when the power is suddenly cut off, thereby ensuring the safe height of the main bracket.
[0026] Furthermore, the patch device further comprises:
[0027] A height gauge, which is mounted on the main bracket and is located on a side of the dispensing component away from the mounter;
[0028] A visual detector, the visual detector is mounted on the main support and is located between the dispensing component and the mounter;
[0029] A lifting component is connected between the mounting bracket and the main bracket, and drives the main bracket to move up and down to further meet the requirements of various patch processes.
[0030] Furthermore, it also includes a controller; the controller is electrically connected to the dispensing component, the mounter, the altimeter, the visual detector and the lifting component respectively to control the operation of the dispensing component and the mounter according to the detection results of the altimeter and the visual detector, thereby realizing automated production.
[0031] In order to better understand and implement the present invention, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 It is a schematic diagram of the overall structure of the patch device in the utility model in one viewing angle direction;
[0033] Figure 2 It is a schematic diagram of the overall structure of the patch device in the utility model in another viewing direction;
[0034] Figure 3 This is a front view of the patch device in the utility model;
[0035] Figure 4 for Figure 2 A partial enlarged view of Figure A;
[0036] Figure 5 It is a schematic diagram of the partial structure of a lifting assembly in one embodiment of the utility model. DETAILED DESCRIPTION
[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
[0038] The chip mounting device and mounting machine of the utility model support a plurality of devices such as a chip mounter and a glue dispensing component through a main bracket that moves upward and downward, and multiple chip packaging processes are compatible on the same device.
[0039] For details, please refer to Figure 1 and Figure 2 , taking the substrate as the object to be mounted and the chip packaged on the substrate as an example, the mounting machine of the utility model includes a mounting device 1, a conveying device (not shown) and a controller (not shown). The mounting device 1 is installed above the conveying device for conveying the substrate, and the controller is electrically connected to the mounting device 1 and the conveying device respectively to control the operation of the mounting device 1 and the conveying device. In this embodiment, the conveying substrate may be provided with a conveyor belt in the prior art, and the substrate is located on the conveyor belt, and the conveyor belt is driven by a motor to perform linear motion in the front, back, left, and right directions. During operation, under the control of the controller, the conveying device transports the substrate to the bottom of the mounting device 1, so that the substrate can move in the front, back, left, and right directions relative to the mounting device 1, so as to move to different stations of the mounting device 1 for processing, so as to facilitate the positioning, dispensing and mounting of the substrate by the mounting device 1.
[0040] The patch device 1 includes a mounting bracket 10, a main bracket 20, a lifting assembly 30, a patch device 40, a dispensing assembly 50, a visual detector 60, a height gauge 70 and a reset member 80. The mounting bracket 10 is mounted on other equipment of the placement machine, such as a bracket, a lift, etc. The main bracket 20 and the lifting assembly 30 are mounted on the mounting bracket 10, and the lifting assembly 30 is connected between the main bracket 20 and the mounting bracket 10, and drives the main bracket 20 to perform lifting and lowering motion relative to the mounting bracket 10 to approach or move away from the substrate. The patch device 40, the dispensing assembly 50, the visual detector 60 and the height gauge 70 are mounted on the main bracket 20 and move up and down with the main bracket 20. The reset member 80 is connected between the mounting bracket 10 and the main bracket 20, and the reset member 80 controls the distance that the main bracket 20 rises or falls on the mounting bracket 10 to prevent the main bracket 20 from falling quickly from the mounting bracket 10 when the power is suddenly cut off.
[0041] In this embodiment, if Figure 5 As shown, the lifting assembly 30 includes a motor 31 fixed to the mounting bracket 10, two pulleys 32, and a belt 33 connected between the two pulleys. The two pulleys 32 are arranged in the up-down direction, and the motor 31 drives one of the pulleys 32 to rotate. The belt surface of the belt 33 is parallel to the lifting direction, and is lifted and moved between the two pulleys 32. The main bracket 20 is fixedly connected to the belt 33 facing outward, and is lifted and moved accordingly. In addition, the motor 31 can also drive the main bracket 20 to lift and move through transmission parts such as gears.
[0042] The mounting bracket 10 is located on one side of the main bracket 20, the mounter 40 and the dispensing assembly 50 are installed on the other side of the main bracket 20, and the visual detector 60 is located between the mounter 40 and the dispensing assembly 50, so as to take pictures when dispensing and placing electronic components to determine whether the work position is correct. The visual detector 60 can be a camera, a camera, etc. in the prior art, which takes pictures and sends them to a computer for analysis and judgment. The mounter 40 is a mounter in the prior art that has the function of grabbing the chip and moving it up and placing the chip to the corresponding position, and can control the grabbing force according to the size of the chip and rotate the chip around an axis parallel to the lifting direction to adjust the strength of the chip and the direction of the chip during the patch.
[0043] The dispensing assembly 50 includes a dispensing device 51, a slider 52, a dispensing guide rail 53 and a driving member 54. The dispensing guide rail 53 and the driving member 54 are installed on the main bracket 20, and the dispensing guide rail 53 extends in the lifting direction. The slider 52 is engaged with the dispensing guide rail 53 and slides along it. The driving member 54 pushes the slider 52 to move up and down. The driving member 54 can be a cylinder or a motor in the prior art, which drives the slider 52 to move up and down through a piston or a gear. The dispensing device 51 is fixed to the slider 52 through a bracket, etc., and the slider 52 drives the dispensing device 51 to move up and down relative to the main bracket 20. By arranging the glue dispenser 51 to be able to rise and fall and slide relative to the main bracket 20, the glue dispenser component 50 and the lowest end of the mounter 40 can have different heights during the mounting process, so that they can work at their workstations at the same time, avoiding the glue dispenser 51 or the glue dispenser component 50 from colliding due to the height difference between the chip and the object to be mounted, and the main bracket 20 is unable to take into account the required height of both.
[0044] The altimeter 70 is disposed on the side of the dispensing assembly 50 away from the mounter 40, and can be a laser rangefinder or a total station in the prior art. The altimeter 70 is used to detect the height of the substrate on the conveying device to determine the descending height of the dispensing assembly 51 and the mounter 40.
[0045] In this embodiment, the reset member 80 is a magnetic spring in the prior art, and is provided with a stator (not shown) and a mover (not shown) that can move relative to each other. The stator is fixedly connected to the mounting bracket 10, and the mover is connected to the main bracket 20. As the main bracket 20 moves up and down relative to the mounting bracket 10, the mover and the stator move relative to each other. When the main bracket 20 moves upward to a certain distance, the stator generates a downward attraction force on the mover to prevent the main bracket 20 from detaching from the mounting bracket 10; when the main bracket 20 moves downward to a certain distance, the stator generates an upward repulsive force on the mover to prevent the main bracket 20 from sliding down quickly when the power is off, causing damage to the patch device 40 and the like on the main bracket 20. In addition, the reset member 80 can also be connected to a mechanical spring between the mounting bracket 10 and the main bracket 20, one end of which is connected to the mounting bracket 10 and the other end is connected to the main bracket 20. When the main bracket 20 moves upward to a certain distance, the reset member 80 is stretched and generates a downward pulling force on the main bracket 20; when the main bracket 20 moves downward to a certain distance, the reset member 80 is compressed and generates an upward thrust on the main bracket 20, thereby ensuring that the main bracket 20 is located at a safe height.
[0046] Based on the above structure, the patch process is described in detail below, including the following contents:
[0047] During chip placement, under the control of the controller, the substrate is first sent to the bottom of the altimeter 70 by the conveying device, and the altimeter 70 measures the height of the substrate and sends the data to the controller to determine the descending height of the dispensing component 50 and the mounter 40. Then the conveying device conveys the substrate to the bottom of the dispensing component 50, and according to the data detected by the altimeter 70, moves the main support 20 downward, thereby driving the dispensing component 50 to move downward for dispensing, and then resets the dispensing component 50. Then the conveying device conveys the substrate to the bottom of the visual detector 60, and the visual detector 60 takes a photo of it to detect the dispensing situation and locates the chip placement position. Then the conveying device conveys the substrate to the bottom of the mounter 40, and the mounter 40 that has grabbed the chip moves downward with the main support 20, and at the same time, the driving member 54 drives the dispensing device 51 to move upward to prevent the dispensing device 51 from colliding with the substrate and other electronic components installed on the substrate as the main support 20 moves downward. Finally, the main support 20 moves upward, and the visual detector 60 camera detects the chip mounting condition. If there is no defect, the substrate mounting is completed.
[0048] Compared with the prior art, the patch device and placement machine of the utility model have the following advantages:
[0049] 1. Able to complete multiple patch processes on the same equipment with high degree of automation;
[0050] 2. In the event of a sudden power outage, the dispensing components and mounters will not slide down quickly;
[0051] 3. Low noise and stable performance;
[0052] 4. Reduce the collision of electronic components and increase the yield rate.
[0053] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.
Claims
1. A patch device, characterized in that: include: A mounting bracket, used for mounting the patch device on a placement machine; A main bracket, mounted on the mounting bracket and capable of lifting and moving relative thereto; A glue dispensing component, mounted on the main bracket and used for dispensing glue on the object to be patched; A mounter, mounted on the main support and used to mount electronic components on an object to be mounted; A reset member is connected between the mounting bracket and the main bracket to control the height of the main bracket relative to the mounting bracket.
2. The patch device according to claim 1, characterized in that: The reset member is a magnetic spring, a stator of which is fixed on the mounting bracket, and a mover of which is fixed on the main bracket.
3. The patch device according to claim 1, characterized in that: The glue dispensing assembly includes a glue dispenser, a slider, a glue dispensing guide rail and a driving component; the glue dispensing guide rail and the driving component are fixed on the main bracket; the slider is engaged with the glue dispensing guide rail and can be lifted and moved along the glue dispensing guide rail; the glue dispenser is fixedly connected to the slider.
4. The patch device according to claim 1, characterized in that: It also includes a height gauge, which is installed on the main bracket and is located on a side of the dispensing component away from the mounter.
5. The patch device according to claim 4, characterized in that: The altimeter is a laser rangefinder.
6. The patch device according to claim 1, characterized in that: It also includes a visual detector, which is installed on the main bracket and located between the dispensing component and the mounter.
7. The patch device according to claim 1, characterized in that: It also includes a lifting component, which is connected between the mounting bracket and the main bracket and drives the main bracket to move up and down.
8. A placement machine, comprising a placement device and a conveying device, wherein the placement device is located above the conveying device, and is characterized in that: The patch device comprises: A mounting bracket, used for mounting the patch device on the placement machine; A main bracket, mounted on the mounting bracket and capable of lifting and moving relative thereto; A glue dispensing component, mounted on the main bracket and used for dispensing glue on the object to be patched; A mounter, mounted on the main support and used to mount electronic components on an object to be mounted; A reset member is connected to the mounting bracket and the main bracket to control the height of the main bracket relative to the mounting bracket.
9. The placement machine according to claim 8, characterized in that: The patch device also includes: A height gauge, which is mounted on the main bracket and is located on a side of the dispensing component away from the mounter; A visual detector, the visual detector is mounted on the main support and is located between the dispensing component and the mounter; A lifting component is connected between the mounting bracket and the main bracket, and drives the main bracket to move up and down.
10. The placement machine according to claim 9, characterized in that: It also includes a controller; the controller is electrically connected to the dispensing component, the mounter, the altimeter, the visual detector and the lifting component respectively to control the operation of the dispensing component and the mounter according to the detection results of the altimeter and the visual detector.