Radiating shell, radiator and electronic equipment

Abstract

The utility model relates to a heat dissipation shell, a radiator and electronic equipment. The heat dissipation shell comprises a shell cover, a first heat dissipation piece and a second heat dissipation piece. The first heat dissipation piece and the second heat dissipation piece are both connected to one face of the shell cover, and the second heat dissipation piece is located on the side face of the first heat dissipation piece. Wherein the second heat dissipation piece comprises a first fin and a second fin, the first fin extends in the first direction, the second fin extends in the second direction, the first direction and the second direction are arranged at an angle, and the first direction and the second direction are both parallel to the shell cover; the first heat dissipation piece comprises a plurality of needle-shaped fins arranged at intervals, the needle-shaped fins extend in the third direction, and the third direction is perpendicular to the shell cover. According to the heat dissipation shell, through cooperation of the first heat dissipation piece and the second heat dissipation piece, heat dissipation can be conducted on a high-heat-quantity area in a targeted mode, and the heat dissipation performance is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation housing, a heat sink and an electronic device. Background Art

[0002] For heat dissipation of electronic equipment, a heat sink with heat dissipation fins is generally used for heat dissipation.

[0003] The heat dissipation fins of the heat sink in the related art are often simply arranged on the heat dissipation housing, which cannot perform targeted heat dissipation, thus affecting the heat dissipation effect of the electronic equipment. Utility Model Content

[0004] The purpose of the present disclosure is to provide a heat dissipation housing, a heat sink and an electronic device to solve the problems in the above-mentioned related technologies.

[0005] In order to achieve the above-mentioned object, one aspect of the present disclosure provides a heat dissipation housing, comprising a housing cover, a first heat dissipation member and a second heat dissipation member;

[0006] The first heat sink and the second heat sink are both connected to one side of the housing cover, and the second heat sink is located on a side of the first heat sink;

[0007] Wherein, the second heat sink comprises a first fin and a second fin, the first fin extends along a first direction, the second fin extends along a second direction, the first direction and the second direction are arranged at an angle, and the first direction and the second direction are both parallel to the shell cover;

[0008] The first heat sink includes a plurality of pin-shaped fins arranged at intervals, and the plurality of pin-shaped fins extend along a third direction, and the third direction is perpendicular to the shell cover.

[0009] Optionally, there are multiple first fins and / or second fins, and the first fins and the second fins are arranged at intervals around the first heat sink.

[0010] Optionally, the angle between the first direction and the second direction is greater than 0° and less than 180°.

[0011] Optionally, the first fin includes one first sheet or at least two first sheets arranged in parallel and spaced apart, and air flows between two adjacent first sheets; and / or,

[0012] The second fin includes one second sheet or at least two second sheets arranged in parallel and spaced apart, and air flows between two adjacent second sheets.

[0013] Optionally, the shell cover includes a plate body and a heat dissipation boss formed on one side of the plate body, the first heat dissipation element is connected to the heat dissipation boss, the second heat dissipation element is connected to the plate body, and one end of the second heat dissipation element close to the first heat dissipation element is connected to the side of the heat dissipation boss.

[0014] Optionally, a heat-conducting boss is disposed on the other side of the plate body, the heat-conducting boss is disposed opposite to the heat-dissipating boss, and the heat-conducting boss is used to be connected to a heat-generating component.

[0015] Optionally, the number of the first heat dissipation element is one or more;

[0016] Wherein, a plurality of the first heat dissipation members are arranged at intervals, and at least one second heat dissipation member is arranged on a side surface of each of the first heat dissipation members.

[0017] Optionally, the heat dissipation housing further comprises a third heat dissipation member, the third heat dissipation member is connected to the housing cover, and is located on the same surface of the housing cover as the first heat dissipation member and the second heat dissipation member;

[0018] The third heat sink is constructed as a third fin, and there are multiple third fins, which are arranged in parallel and spaced apart, and arranged along a fourth direction, which is parallel to the shell cover, and parallel to or at an angle to the first direction or the second direction.

[0019] A second aspect of the present disclosure further provides a heat sink, comprising the above-mentioned heat dissipation housing.

[0020] The third aspect of the present disclosure further provides an electronic device, the electronic device comprising a heat generating element and the above-mentioned heat dissipation housing, wherein a housing cover of the heat dissipation housing is in thermal contact with the heat generating element; or,

[0021] The electronic device comprises a heating element and the above-mentioned radiator, and a shell cover of a heat dissipation shell of the radiator is in thermal contact with the heating element.

[0022] The above technical solution, by setting the first heat sink as a plurality of pin-shaped fins, due to the small size and large surface area of ​​the pin-shaped fins, can be arranged in a centralized manner, thereby increasing the local heat dissipation area, and can specifically improve the heat dissipation effect at the first heat sink, thereby making it possible to set the high-heat area of ​​the heat source corresponding to the first heat sink, and can specifically dissipate heat to the high-heat area, while the second heat sink is set on the side of the first heat sink, the second heat sink can assist in heat dissipation to the outside, the first fin and the second fin of the second heat sink extend in two directions respectively, and can make the heat transfer away from the high-heat area in different directions, because the heat transfer path is from high to low, and at the same time the heat in the air increases, which will cause the air pressure to increase, so that the high-heat area and the external environment have a certain air pressure difference, the air can flow under the guidance of the first fin and the second fin, so that the heat of the high-heat area can be quickly transferred to a distant place, and the temperature of the high-heat area can be quickly reduced. The heat dissipation housing can specifically dissipate heat to the high-heat area through the cooperation of the first heat sink and the second heat sink, improve the heat dissipation performance, and ensure the performance of the corresponding electronic equipment.

[0023] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0025] Figure 1 is a schematic structural diagram of a heat dissipation housing according to an embodiment of the present disclosure;

[0026] Figure 2 is a perspective view of a heat dissipation housing according to an embodiment of the present disclosure;

[0027] Figure 3 It is a stereoscopic view of a heat dissipation housing according to an embodiment of the present disclosure from another perspective.

[0028] Description of Reference Numerals

[0029] 10. Shell cover, 11. Third heat sink, 12. Second heat sink, 121. First fin, 122. Second fin, 13. First heat sink, 14. Heat conduction boss, 15. Heat dissipation boss, P. High heat area. DETAILED DESCRIPTION

[0030] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0031] In the present disclosure, unless otherwise stated, directional words such as "upper, lower, left, right" are usually defined by the direction of the drawing, and "inner" and "outer" refer to the inside and outside of the relevant parts. In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present disclosure, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0033] For the heat dissipation of electronic equipment, a heat sink with heat dissipation fins is generally used for heat dissipation, especially the chip and other structures on the PCB of the electronic equipment, which need to be quickly and centrally cooled.

[0034] However, the heat dissipation fins of the heat sink in the related art are often simply set on the heat dissipation shell, which is a large-area flat-laying method and cannot perform targeted heat dissipation, that is, it is impossible to enhance the heat dissipation capacity at a certain high-heat location, affecting the heat dissipation at the high-heat location, thereby affecting the heat dissipation effect of the electronic equipment.

[0035] like Figure 1-Figure 3 As shown, one aspect of the present disclosure provides a heat dissipation housing, including a housing cover 10 , a first heat dissipation member 13 and a second heat dissipation member 12 .

[0036] The first heat sink 13 and the second heat sink 12 are both connected to one side of the housing cover 10 , and the second heat sink 12 is located on the side of the first heat sink 13 .

[0037] The second heat sink 12 includes a first fin 121 and a second fin 122 . The first fin 121 extends along a first direction, and the second fin 122 extends along a second direction. The first direction and the second direction are arranged at an angle, and both the first direction and the second direction are parallel to the shell cover 10 .

[0038] The first heat sink 13 includes a plurality of pin-shaped fins arranged at intervals. The plurality of pin-shaped fins extend along a third direction, and the third direction is perpendicular to the housing cover 10 .

[0039] The shell cover 10 can conduct heat, that is, transfer heat, and the first heat sink 13 and the second heat sink 12 can both dissipate the heat on the shell cover 10 to the external environment. The plurality of pin-shaped fins are not in contact with each other, and air can flow.

[0040] In the above technical solution, by setting the first heat sink 13 as a plurality of pin-shaped fins, the pin-shaped fins are small in size and large in surface area and can be arranged in a concentrated manner, thereby increasing the local heat dissipation area and improving the heat dissipation effect at the first heat sink 13 in a targeted manner, so that the high-heat area of ​​the heating element can be set correspondingly to the first heat sink 13, and the high-heat area can be dissipated in a targeted manner. At the same time, the second heat sink 12 is set on the side of the first heat sink 13, and the second heat sink 12 can assist in the heat dissipation to the outside. The first fin 121 and the second fin 122 of the second heat sink 12 extend in two directions respectively, so that the heat can be transferred in different directions away from the high-heat area. Since the heat transfer path is from high to low, and the heat in the air increases, the air pressure will increase, so that a certain air pressure difference is generated between the high-heat area and the external environment, and the air can flow under the guidance of the first fin 121 and the second fin 122, so the heat in the high-heat area can be quickly transferred to a distant place, and the temperature of the high-heat area can be quickly reduced. The heat dissipation housing can dissipate heat in a targeted manner at a high-heat area by cooperating with the first heat dissipation element 13 and the second heat dissipation element 12, thereby improving the heat dissipation performance and ensuring the performance of the corresponding electronic equipment.

[0041] Optionally, in one embodiment of the present disclosure, there are multiple first fins 121 and / or second fins 122, and the first fins 121 and the second fins 122 are arranged at intervals around the first heat sink 13. By such an arrangement, the heat in the high heat area can be better transferred to the surroundings, thereby improving the heat dissipation effect.

[0042] In some examples, there are two first fins 121 and one second fin 122, that is, the second fin 122 is located between two first fins 121. Of course, the opposite can also be true, that is, there is one first fin 121 and two second fins 122, and the first fin 121 is located between two second fins 122.

[0043] In other examples, the number of the first fin 121 and the second fin 122 can be multiple, that is, the number of the first fin 121 and the second fin 122 can be two, and they can be arranged at intervals, so that the second heat sink 12 is configured into a cross structure. Of course, the number of the first fin 121 and the second fin 122 can also be three, so that the second heat sink 12 is configured into a cross-shaped structure. In addition, the number of the first fin 121 and the second fin 122 can also be more, and the second heat sink 12 can form a radial structure.

[0044] Optionally, in one embodiment of the present disclosure, the angle between the first direction and the second direction is greater than 0° and less than 180°. By setting it in this way, the first fin 121 and the second fin 122 are not parallel, but at a certain angle, so that heat can be directed to more directions, and heat can be better transferred to the external environment.

[0045] In some examples, when the second heat sink 12 is configured as a cross structure, the angle between the first fin 121 and the second fin 122 may be 90 degrees. When the second heat sink 12 is configured as a cross structure, the angle between the first fin 121 and the second fin 122 may be 45 degrees. It should be noted that the angle between the first fin 121 and the second fin 122, that is, the angle between the first direction and the second direction, can be selected according to actual setting requirements, and no excessive restrictions are imposed here.

[0046] In order to solve the problem of blocking the air flow caused by laying a single heat dissipation fin over a large area, optionally, in one embodiment of the present disclosure, the first fin 121 includes a first sheet or at least two first sheets arranged in parallel and spaced apart, and air flows between two adjacent first sheets. By setting the first fin 121 as a first sheet, heat can be transferred to a distant place, which can save costs. When the first fin 121 is set as a plurality of first sheets arranged in parallel and spaced apart, air can flow along the first direction, so that the heat emitted by the first heat sink 13 can be carried away by the air flowing in the first direction, so that the heat on the first heat sink 13 can be quickly dissipated outwards, thereby improving the heat dissipation effect.

[0047] Optionally, in one embodiment of the present disclosure, the second fin 122 includes a second sheet or at least two second sheets arranged in parallel and spaced apart, and air flows between two adjacent second sheets. By setting the second fin 122 as a second sheet, heat can be transferred to a distant place, which can save costs. When the second fin 122 is set as a plurality of second sheets arranged in parallel and spaced apart, air can flow along the second direction, so that the heat emitted by the first heat sink 13 can be carried away by the air flowing in the second direction, so that the heat on the first heat sink 13 can be quickly dissipated outwards, thereby improving the heat dissipation effect.

[0048] It should be noted that when the first fin 121 is set as a first sheet, the second fin 122 can be set as a second sheet or multiple second sheets, and when the first fin 121 is set as multiple first sheets, the second fin 122 can also be set as a second sheet or multiple second sheets. By setting multiple first sheets and second sheets, air can flow to the first heat sink 13 along the first direction and the second direction, realizing multi-directional air flow, reducing the resistance of air flow, and allowing the heat emitted by the first heat sink 13 to be quickly taken away, thereby improving the heat dissipation effect.

[0049] Optionally, the distance between two adjacent pin-shaped fins may be smaller than the distance between two adjacent first sheets or two adjacent second sheets.

[0050] Optionally, in one embodiment of the present disclosure, the shell cover 10 includes a plate body and a heat dissipation boss 15 formed on one side of the plate body, the first heat dissipation member 13 is connected to the heat dissipation boss 15, the second heat dissipation member 12 is connected to the plate body, and one end of the second heat dissipation member 12 close to the first heat dissipation member 13 is connected to the side of the heat dissipation boss 15. The heat dissipation boss 15 provided can facilitate targeted heat conduction, that is, the heat is concentratedly transferred to the first heat dissipation member 13 and the second heat dissipation member 12. The first heat dissipation member 13 can concentrate on dissipating the heat on the heat dissipation boss 15 to the outside, and the second heat dissipation member 12 can also dissipate the heat on the heat dissipation boss 15, and transfer the heat around the first heat dissipation member 13 to the surroundings, thereby improving the heat dissipation effect. Among them, the second heat dissipation member 12 is connected to the heat dissipation boss 15, which can also increase the heat conduction area, reduce the thermal resistance, and improve the heat dissipation effect. At the same time, the second heat dissipation member 12 is also connected to the plate body, and heat dissipation can also be achieved at other positions of the plate body.

[0051] Optionally, in one embodiment of the present disclosure, a heat-conducting boss 14 is provided on the other side of the plate body, and the heat-conducting boss 14 is arranged opposite to the heat-dissipating boss 15, and the heat-conducting boss 14 is used to connect with the heating element. By setting the heat-conducting boss 14 to be opposite to the heat-dissipating boss 15, the heat-conducting boss 14 can contact the high-heat area and absorb heat in a concentrated manner, and transfer the heat to the heat-dissipating boss 15, and quickly dissipate the heat through the first heat dissipating element 13 and the second heat dissipating element 12, thereby improving the local heat dissipation performance in a targeted manner.

[0052] Optionally, in one embodiment of the present disclosure, the number of the first heat sink 13 is one or more, wherein the plurality of first heat sinks 13 are arranged at intervals, and at least one second heat sink 12 is arranged on the side of each first heat sink 13. By such an arrangement, the first heat sink 13 can perform targeted heat dissipation for one or more high heat dissipation areas, thereby improving the overall heat dissipation effect.

[0053] Optionally, in an embodiment of the present disclosure, the heat dissipation housing further includes a third heat dissipation element 11 , which is connected to the shell cover 10 and is located on the same surface of the shell cover 10 as the first heat dissipation element 13 and the second heat dissipation element 12 .

[0054] The third heat sink 11 is constructed as a third fin. There are multiple third fins, which are arranged in parallel and spaced apart. The multiple third fins are arranged along a fourth direction, which is parallel to the shell cover 10 and parallel to or at an angle to the first direction or the second direction.

[0055] Among them, the third heat sink 11 can be set at a position of the plate body of the shell cover 10 where the heat dissipation boss 15 is not set, so that the third heat sink 11 can evenly dissipate heat at other positions of the plate body, ensure the heat dissipation balance of the entire shell cover 10, and improve the heat dissipation effect of the entire shell cover 10. The third fin can be set in parallel with the first fin 121 or the second fin 122. Of course, the third fin can also be set at an angle to the first fin 121 or the second fin 122. It should be noted that the number of third fins and the spacing between two adjacent third fins can be set according to the heating condition of the heating element and the heat dissipation requirements to be achieved.

[0056] Optionally, in one embodiment of the present disclosure, the first fin 121, the second fin 122 and the third fin may be plate fins, the cross-section of which may be rectangular or trapezoidal, etc., the cross-section of the pin-shaped fin may be rectangular or circular, etc., and the length of the pin-shaped fin in the third direction may be greater than or less than the length of the first fin 121, the second fin 122 and the third fin in the third direction, and there is no specific limitation. Among them, the shell cover 10 may be aluminum alloy, and the first heat sink 13, the second heat sink 12 and the third heat sink 11 may also be aluminum alloy.

[0057] A second aspect of the present disclosure further provides a heat sink, comprising the above-mentioned heat dissipation housing.

[0058] The third aspect of the present disclosure also provides an electronic device, the electronic device includes a heating element and the above-mentioned heat dissipation housing, and the shell cover 10 of the heat dissipation housing is in thermal contact with the heating element. Alternatively, the electronic device includes a heating element and the above-mentioned radiator, and the shell cover 10 of the heat dissipation housing of the radiator is in thermal contact with the heating element. The heating element may be a circuit board, and the high heat area may be the location where a chip is installed on the circuit board.

[0059] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0060] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0061] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A heat dissipation housing, characterized in that: comprising a housing cover, a first heat sink and a second heat sink; The first heat sink and the second heat sink are both connected to one side of the housing cover, and the second heat sink is located on a side of the first heat sink; Wherein, the second heat sink comprises a first fin and a second fin, the first fin extends along a first direction, the second fin extends along a second direction, the first direction and the second direction are arranged at an angle, and the first direction and the second direction are both parallel to the shell cover; The first heat sink includes a plurality of pin-shaped fins arranged at intervals, and the plurality of pin-shaped fins extend along a third direction, and the third direction is perpendicular to the shell cover.

2. The heat dissipation housing according to claim 1, characterized in that: The number of the first fins and / or the second fins is plural, and the first fins and the second fins are arranged at intervals around the first heat sink.

3. The heat dissipation housing according to claim 1, characterized in that: The angle between the first direction and the second direction is greater than 0° and less than 180°.

4. The heat dissipation housing according to claim 1, characterized in that: The first fin includes a first sheet or at least two first sheets arranged in parallel and spaced apart, and air flows between two adjacent first sheets; and / or, The second fin includes one second sheet or at least two second sheets arranged in parallel and spaced apart, and air flows between two adjacent second sheets.

5. The heat dissipation housing according to claim 1, characterized in that: The shell cover includes a plate body and a heat dissipation boss formed on one side of the plate body, the first heat dissipation element is connected to the heat dissipation boss, the second heat dissipation element is connected to the plate body, and one end of the second heat dissipation element close to the first heat dissipation element is connected to the side of the heat dissipation boss.

6. The heat dissipation housing according to claim 5, characterized in that: A heat-conducting boss is disposed on the other side of the plate body. The heat-conducting boss is disposed opposite to the heat-dissipating boss and is used to be connected to a heat-generating component.

7. The heat dissipation housing according to claim 1, characterized in that: The number of the first heat dissipation elements is one or more; Wherein, a plurality of the first heat dissipation members are arranged at intervals, and at least one second heat dissipation member is arranged on a side surface of each of the first heat dissipation members.

8. The heat dissipation housing according to any one of claims 1 to 7, characterized in that: The heat dissipation housing further comprises a third heat dissipation member, the third heat dissipation member is connected to the housing cover and is located on the same surface of the housing cover as the first heat dissipation member and the second heat dissipation member; The third heat sink is constructed as a third fin, and there are multiple third fins, which are arranged in parallel and spaced apart, and arranged along a fourth direction, which is parallel to the shell cover, and parallel to or at an angle to the first direction or the second direction.

9. A radiator, characterized in that: It comprises the heat dissipation housing as claimed in any one of claims 1 to 8.

10. An electronic device, characterized in that: The electronic device comprises a heating element and a heat dissipation housing as claimed in any one of claims 1 to 8, wherein a housing cover of the heat dissipation housing is in thermal contact with the heating element; or, The electronic device comprises a heat generating element and the heat sink as claimed in claim 9, wherein a shell cover of a heat dissipation housing of the heat sink is in thermal contact with the heat generating element.

Images