Integrated heat dissipation power module
By integrating the rate components, capacitor components and electrical connection components on the motor controller's radiator, the problem of poor heat dissipation effect of existing motor controllers is solved, and more efficient heat dissipation and a more compact module design are achieved.
Patent Information
- Application Number
- CN202421570836.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-04
AI Technical Summary
The existing motor controllers have poor heat dissipation effects, especially the heat dissipation of non-power components such as capacitors is not fully considered, resulting in poor overall heat dissipation effects.
An integrated heat dissipation power module is designed, and by setting power components, capacitor components and electrical connection components on different groups of opposite surfaces of the radiator, each heating component is arranged around the radiator, so that the heat dissipation of all heating components by a single heat dissipation component.
It achieves better heat dissipation effect, ensures uniform heat dissipation of each component, reduces the volume of the overall module, and improves power density.
Smart Images
Figure CN222869258U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of automobile technology, and in particular to an integrated heat dissipation power module. Background Art
[0002] With the development of science and technology and the improvement of people's environmental awareness, the number of new energy vehicles is increasing. As the power conversion unit connecting the battery and the motor in new energy vehicles, the motor controller is the core of the motor drive and control system.
[0003] Motor controllers often contain a large number of heat sources, such as power components, capacitor components, etc. During operation, each component needs to be cooled, otherwise it may directly affect the normal operation of the motor controller. At present, most motor controllers only cool the power components without considering the heat dissipation of other components such as capacitors, resulting in poor overall heat dissipation of the motor controller. In the related art, there are also structures for cooling other components such as capacitors, but generally there are problems such as poor heat dissipation and large size. Utility Model Content
[0004] Based on this, the utility model provides an integrated heat dissipation power module to solve the problems of poor heat dissipation, large size and large space occupied by existing power modules.
[0005] The utility model provides an integrated heat dissipation power module, comprising a heat sink and a capacitor component, a power component and an electrical connection component respectively arranged on each side of the heat sink; wherein:
[0006] The power assembly comprises a first power component and a second power component, wherein the first power component and the second power component are arranged on a first set of opposite surfaces of the heat sink opposite to each other;
[0007] The capacitor assembly is disposed on one of the second set of opposite surfaces of the heat sink;
[0008] The electrical connection assembly includes an input copper bar and an output copper bar, wherein the input copper bar and the output copper bar are arranged on a second set of opposite surfaces of the heat sink, and the input copper bar and the capacitor assembly are located on the same side of the heat sink;
[0009] The input copper busbar is electrically connected to the capacitor component and the power component, and the output copper busbar is electrically connected to the first power component and the second power component.
[0010] In one embodiment, the heat sink is in the shape of a cuboid having three groups of opposing faces, wherein the first group of opposing faces has the largest area, and the second group of opposing faces has a middle area.
[0011] In one embodiment, the first group of opposite surfaces are the left and right sides of the radiator, and the first power component and the second power component are arranged on the left and right sides of the radiator relatively;
[0012] The second group of opposite surfaces are the top surface and the bottom surface of the radiator, the output copper bar and the input copper bar are arranged on the top surface and the bottom surface of the radiator relatively, and the capacitor component is arranged on the bottom surface of the radiator.
[0013] In one embodiment, the input copper bar includes a first connecting copper bar and a second connecting copper bar, the first connecting copper bar connects the positive electrode of the capacitor assembly and the first power component, and the second connecting copper bar connects the negative electrode of the capacitor assembly and the second power component.
[0014] In one embodiment, the first connecting copper bar and the second connecting copper bar are arranged on the left and right sides of the heat sink opposite to each other.
[0015] In one embodiment, the first connecting copper bar is disposed in contact with the top surface of the capacitor assembly and the bottom surface of the heat sink.
[0016] In one of the embodiments, a heat conducting layer is provided between the capacitor component and / or the power component and / or the electrical connection component and the surface of the heat sink.
[0017] In one of the embodiments, an insulating layer is provided between the capacitor component and / or the power component and / or the electrical connection component and the surface of the heat sink.
[0018] In one embodiment, the radiator is a liquid-cooled radiator.
[0019] In one embodiment, the radiator includes a cooling water channel arranged inside and a water inlet and a water outlet arranged on a third group of opposing surfaces of the radiator, the water inlet and the water outlet are both connected to the cooling water channel, and the third group of opposing surfaces is a group of opposing surfaces with the smallest area of the radiator.
[0020] Compared with the prior art, the utility model has at least the following beneficial effects: the integrated heat dissipation power module arranges the power components, capacitor components and electrical connection components on the opposite surfaces of different groups of the heat sink, so that the heat-generating components are arranged around the heat sink, so that a single heat-generating component can dissipate heat for all the heat-generating components, and the heat dissipation effect is good. Moreover, the heat-generating components are dispersed, which can not only achieve uniform heat dissipation of each component and improve the heat dissipation effect of each component, but also reduce the volume of the entire power module and improve the power density. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a schematic structural diagram of an integrated heat dissipation power module in one embodiment;
[0022] Figure 2 An exploded schematic diagram of an integrated heat dissipation power module in one embodiment;
[0023] Figure 3 It is a schematic diagram of the cooperation between the capacitor core, the heat sink and the copper busbar of an integrated heat dissipation power module in one embodiment.
[0024] The figure marks in the drawings of the specification include: heat sink 1, capacitor component 2, capacitor core 201, power component 3, first power component 301, second power component 302, electrical connection component 4, input copper bus 401, first connecting copper bus 4011, second connecting copper bus 4012, output copper bus 402. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0026] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention.
[0027] The structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology, and are not used to limit the conditions under which the present invention can be implemented. Any structural modification, change in proportion or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.
[0028] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "middle", "longitudinal", "lateral", "horizontal", "inner", "outer", "radial", "circumferential" and the like in this specification are based on the directions or positional relationships shown in the drawings and are only for the convenience of simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0029] The embodiment of the utility model provides an integrated heat dissipation power module, which includes a heat sink 1 and a capacitor component 2, a power component 3 and an electrical connection component 4 respectively arranged on each side of the heat sink 1; wherein,
[0030] The power assembly 3 includes a first power component 301 and a second power component 302, and the first power component 301 and the second power component 302 are arranged on a first set of opposite surfaces of the heat sink 1 opposite to each other;
[0031] The capacitor assembly 2 is disposed on one of the side surfaces of the second set of opposite surfaces of the heat sink 1;
[0032] The electrical connection component 4 includes an input copper bar 401 and an output copper bar 402, the input copper bar 401 and the output copper bar 402 are arranged on the second set of opposite surfaces of the heat sink 1, and the input copper bar 401 and the capacitor component 2 are located on the same side of the heat sink 1;
[0033] The input copper busbar 401 is electrically connected to the capacitor component 2 and the power component 3 , and the output copper busbar 402 is electrically connected to the first power component 301 and the second power component 302 .
[0034] The integrated heat dissipation power module provided by the embodiment of the utility model is arranged on opposite surfaces of different groups of the heat sink 1 by arranging the power components 3, the capacitor components 2 and the electrical connection components 4, so that the heat-generating components are arranged around the heat sink 1, so that a single heat-generating component can dissipate heat for all the heat-generating components, and the heat dissipation effect is good. Moreover, the heat-generating components are dispersedly distributed, which can not only achieve uniform heat dissipation of each component and improve the heat dissipation effect of each component, but also reduce the volume of the entire power module and improve the power density.
[0035] The integrated heat dissipation power module provided by the embodiment of the utility model is described in detail below with reference to the accompanying drawings.
[0036] Figure 1 This is a schematic diagram of the structure of an integrated heat dissipation power module provided by at least one embodiment of the present utility model. Figure 1 The integrated heat dissipation power module includes a heat sink 1 and a capacitor component 2, a power component 3 and an electrical connection component 4 respectively arranged on each side of the heat sink 1.
[0037] See also Figure 1 and Figure 2 In this embodiment, the heat sink 1 is in the shape of a cuboid, and each side surface and the upper and lower surfaces thereof are heat sinks, wherein the left and right heat sinks of the heat sink 1 have the largest areas, the upper and lower heat sinks have the middle areas, and the front and rear heat sinks have the smallest areas. Figure 2 In the direction shown, the left and right sides of the radiator 1 can be understood as the two sides of the radiator 1 along the width direction, and the front and rear sides can be understood as the two sides of the heat dissipation length direction.
[0038] Of course, in other embodiments, the radiator 1 can also be a cube or other regular or irregular shapes, etc., as long as the surface of the radiator 1 is convenient for the installation and heat dissipation of the capacitor component 2, the power component 3 and the electrical connection component 4. For example, the surface of the radiator 1 is flat.
[0039] In this embodiment, the radiator 1 can be selected as a liquid cooling radiator, such as a water cooling radiator. Specifically, a cooling water channel is provided in the radiator 1, and the cooling water channel can be arranged along the length direction of the radiator 1, and the specific form of the cooling water channel can be not limited. For example, it can be arranged to include an integration of multiple water channels, or to be arranged in different shapes, including but not limited to forming a curved water channel or a bent water channel, etc., to increase the cooling water flow path and time, and the water channel depth can also be set to gradually increase, etc., to increase the cooling water flow speed, etc.
[0040] See also Figure 1 A water inlet and a water outlet connected to the cooling water channel are provided on the front and rear sides of the radiator 1. By providing the water inlet and the water outlet on the side with the smallest heat dissipation area of the radiator 1, the heat dissipation area of the radiator 1 is occupied less, and the heat dissipation utilization rate of the radiator 1 is not reduced. Of course, in other embodiments, the water inlet and the water outlet can also be provided on the same side of the radiator 1, for example, both are provided on the front side or the rear side of the radiator 1.
[0041] See also Figure 2 In this embodiment, the power assembly 3 includes a first power component 301 and a second power component 302, and the first power component 301 and the second power component 302 are arranged on a first set of opposite surfaces of the heat sink 1. In this way, the first power component 301 and the second power component 302 are dispersedly arranged on two opposite heat dissipation surfaces of the heat sink 1. Compared with the stacked arrangement, each power component can be evenly directly contacted with the heat sink 1, which increases the overall heat dissipation effect of the power assembly 3, and can make the structure more compact, the overall size is small, and the space utilization rate is high.
[0042] Further, in this embodiment, the first group of opposite surfaces of the radiator 1 is a group of opposite surfaces with a larger heat dissipation area of the radiator 1, for example, Figure 1 For example, the first set of opposite surfaces of the heat sink 1 is the left and right sides of the heat sink 1, and correspondingly, the first power component 301 and the second power component 302 are arranged on the left and right opposite sides of the heat sink 1. In this arrangement, the area of the power component is usually large, and the first power component 301 and the second power component 302 are arranged on the left and right sides of the heat sink 1 with relatively large areas, which can increase the heat dissipation area of the power component, improve the heat transfer efficiency, increase the heat dissipation uniformity of the power component, and improve the heat dissipation effect.
[0043] For further information, see Figure 1 The first power component 301 and the second power component 302 are fixed on the left and right opposite sides of the radiator 1 in a tightly fitted manner to ensure close contact between the first power component 301 and the second power component 302 and the radiator 1, thereby improving the heat transfer effect between the power components and the radiator 1.
[0044] For further information, see Figure 1 The same bridge arms of the first power component 301 and the second power component 302 are arranged opposite to each other on the left and right sides. Such arrangement makes it easier to install and arrange the electrical connection component 4 and reduces the difficulty of wiring.
[0045] It is understandable that, in this embodiment, the power component 3 may include various types of modules known to those skilled in the art, such as but not limited to one or more of a single tube (MOS tube, etc.), a half-bridge module, a Boost module, a Buck module, etc. The specific connection method between the power component and the heat sink 1 may be various types known to those skilled in the art, including but not limited to screw fixing, welding fixing, etc.
[0046] In this embodiment, the capacitor component 2 and the electrical connection component 4 are arranged on the second group of opposite surfaces of the radiator 1. In this way, by arranging the power component 3, the capacitor component 2 and the electrical connection component 4 on different groups of opposite surfaces of the radiator 1, the heating components are arranged around the radiator 1, so that a single radiator 1 can dissipate heat for all the heating components, and the heat dissipation effect is good. Moreover, the dispersed distribution of the heating components can not only achieve uniform heat dissipation of each component and improve the heat dissipation effect of each component, but also reduce the volume of the entire power module and improve the power density.
[0047] Specifically, in this embodiment, the capacitor assembly 2 is disposed on one of the second set of opposite surfaces of the heat sink 1, for example, see Figure 1 The second set of opposite surfaces of the radiator 1 is the top surface and the bottom surface of the radiator 1. Correspondingly, the capacitor component 2 is arranged on the top surface or the bottom surface of the radiator 1. Figure 1 The embodiment in which the capacitor assembly 2 is arranged on the bottom surface of the heat sink 1 is exemplarily shown.
[0048] It is understandable that, in this embodiment, the capacitor assembly 2 may include various types of modules known to those skilled in the art, including but not limited to one or more of busbar capacitors, X capacitors, and Y capacitors, and its structure may also be various. In this embodiment, the capacitor assembly 2 includes a housing and a capacitor core 201 disposed in the housing. The specific connection method between the capacitor assembly 2 and the radiator 1 may be various known to those skilled in the art, including but not limited to screw fixing, welding fixing, etc. During installation, the capacitor core 201 is offset against the heat dissipation surface at the bottom of the radiator 1, and the heat dissipation surface at the bottom of the radiator 1 is used to dissipate heat for the capacitor assembly 2.
[0049] See also Figure 2 In this embodiment, the electrical connection component 4 includes an input copper bar 401 and an output copper bar 402, and the input copper bar 401 and the output copper bar 402 are arranged on the second set of opposite surfaces of the radiator 1. In this way, by arranging the output copper bar 402 and the input copper bar 401 at the top and bottom of the radiator 1 respectively, the input and output copper bars are arranged separately and staggered, which is convenient for connecting the copper bars with the capacitor and the power component 3, and the spatial arrangement is more orderly, which reduces the difficulty of wiring, and fully utilizes each surface of the radiator 1 to dissipate heat for the heat generating component, thereby improving the heat dissipation capacity of the input and output copper bars 402.
[0050] Further, in this embodiment, in order to facilitate the electrical connection between the input copper bar 401 and the capacitor assembly 2, the setting surface of the input copper bar 401 is the surface where the capacitor assembly 2 is located, that is, the input copper bar 401 and the capacitor assembly 2 are arranged on the same side of the heat sink 1, for example, see Figure 1 The input copper busbar 401 and the capacitor assembly 2 are both arranged at the bottom of the radiator 1 , and correspondingly, the output copper busbar 402 is arranged at the top of the radiator 1 .
[0051] In this embodiment, the input copper busbar 401 is a DC input copper busbar, which is connected between the capacitor component 2 and the power component 3 to achieve electrical connection between the capacitor component 2 and the power component 3. Figure 2 The input copper bar 401 includes a first connecting copper bar 4011 and a second connecting copper bar 4012, wherein the first connecting copper bar 4011 connects the positive electrode of the capacitor assembly 2 and the first power component 301, and the second connecting copper bar 4012 connects the negative electrode of the capacitor assembly 2 and the second power component 302. Specifically, in this embodiment, the top of the capacitor core 201 is the positive electrode and the bottom is the negative electrode. Correspondingly, see Figure 3 The lower end of the first connecting copper bar 4011 is connected to the top of the capacitor core 201, and the upper end is connected to the lower end of the first power component 301. The lower end of the second connecting copper bar 4012 is connected to the bottom of the capacitor core 201, and the upper end is connected to the lower end of the second power component 302.
[0052] In this embodiment, the specific structural forms of the first connecting copper bar 4011 and the second connecting copper bar 4012 can be various. Figure 2 The specific connection method between the first connecting copper bar 4011 and the second connecting copper bar 4012 and the capacitor component 2 and the power component 3 can also be a variety of methods known to those skilled in the art, including but not limited to welding.
[0053] For further information, see Figure 2In this embodiment, the first connecting copper bar 4011 is arranged to fit with the bottom surface of the heat sink 1, that is, the first connecting copper bar 4011 is fixed on the capacitor core 201, and when the heat sink 1 is installed on the capacitor assembly 2, the heat sink 1 just fits with the horizontal part of the first connecting copper bar 4011. In this way, the first connecting copper bar 4011 is in close contact with the capacitor assembly 2 and the heat sink 1. Based on the good thermal conductivity of the copper bar, the heat of the capacitor assembly 2 can be quickly transferred to the heat sink 1 through the first connecting copper bar 4011, which can significantly improve the heat dissipation capacity of the capacitor assembly 2 and increase the working life of the capacitor.
[0054] See also Figure 1 In this embodiment, the area of the first connecting copper bus 4011 that is in contact with the bottom surface of the heat sink 1 is smaller than the area of the bottom surface of the heat sink 1, so that the remaining part of the bottom surface of the heat sink 1 is opposite to the capacitor core 201, and the heat sink 1 directly dissipates the heat for the capacitor component 2, thereby enhancing the heat dissipation effect.
[0055] For further information, see Figure 2 and Figure 3 In this embodiment, the first copper bar 4011 and the second copper bar 4012 are arranged on both sides of the heat sink 1, that is, the first copper bar 4011 is arranged on the left side of the heat sink 1, and the second copper bar 4012 is arranged on the right side of the heat sink 1. Such arrangement makes the first copper bar 4011 and the second copper bar 4012 dispersed, which can effectively avoid the bridge between the first copper bar 4011 and the second copper bar 4012, so that the operation stability of the power module is better, and it is also convenient for the first copper bar 4011 and the second copper bar 4012 to be connected with the first power component 301 and the second power component 302 arranged on both sides of the heat sink 1, reducing the volume of the copper bar and reducing the overall space occupancy rate of the module.
[0056] In this embodiment, the output copper bus 402 is an AC output copper bus, which is electrically connected between the first power component 301 and the second power component 302. Figure 2 The output copper bar 402 has three connecting copper bars, which are respectively connected to the three corresponding bridge arms of the first power component 301 and the second power component 302, and the three connecting copper bars are all located at the top of the radiator 1. In this way, the output copper bar 402 is at the top of the radiator 1, which can effectively reduce the temperature of the output copper bar 402, and the copper bar thickness can be made smaller under the same current, saving material costs.
[0057] It can be understood that, in this embodiment, the specific structural form of the output copper busbar 402 can be various, and the following is used herein: Figure 2The specific connection method between the input copper bar 401 and the output copper bar 402 and the power component can be various known to those skilled in the art, including but not limited to welding.
[0058] In some embodiments, a heat-conducting layer is provided between the capacitor component 2 and / or the power component 3 and / or the electrical connection component 4 and the surface of the radiator 1, that is, a heat-conducting layer is provided between any one component, any two components or three components of the capacitor component 2, the power component 3, the electrical connection component 4 and the surface of the radiator 1. In this embodiment, preferably, a heat-conducting layer is provided between the parts of each component that are in contact with the radiator 1 or the parts with smaller gaps and the radiator 1. For example, a heat-conducting layer is provided between the power component and the side of the radiator 1, and a heat-conducting layer is provided between the radiator 1 and the capacitor core 201. Specifically, the heat-conducting layer can be thermal grease, a thermal pad, etc. Such a configuration can improve the heat conduction efficiency between each component and the radiator 1, thereby improving the heat dissipation effect of each component.
[0059] In some embodiments, an insulating layer is provided between the capacitor component 2 and / or the power component 3 and / or the electrical connection component 4 and the surface of the radiator 1, that is, an insulating layer is provided between any one component, any two components or three components of the capacitor component 2, the power component 3, the electrical connection component 4 and the surface of the radiator 1. In this embodiment, an insulating layer is preferably provided between the part of each component that is in contact with the radiator 1 or the part with a smaller gap and the radiator 1. For example, an insulating layer is provided between the power component and the side of the radiator 1, and an insulating layer is provided between the radiator 1 and the capacitor core 201. Specifically, the insulating layer can be insulating paper, insulating glue, etc. With such a configuration, the insulating layer can play an insulating role between each component and the radiator 1 to prevent safety problems caused by excessive current causing burn-through, and the thickness of the insulating layer formed by the insulating paper, insulating glue, etc. is usually small and does not take up much space.
[0060] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0061] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. An integrated heat dissipation power module, characterized in that: It comprises a heat sink (1), and a capacitor component (2), a power component (3), and an electrical connection component (4) respectively arranged on each side of the heat sink (1); wherein: The power assembly (3) comprises a first power component (301) and a second power component (302), wherein the first power component (301) and the second power component (302) are arranged oppositely on a first group of opposite surfaces of the heat sink (1); The capacitor component (2) is arranged on one of the second group of opposite surfaces of the heat sink (1); The electrical connection component (4) comprises an input copper bar (401) and an output copper bar (402), wherein the input copper bar (401) and the output copper bar (402) are arranged on a second set of opposite surfaces of the heat sink (1) in a relative manner, and the input copper bar (401) and the capacitor component (2) are located on the same side of the heat sink (1); The input copper busbar (401) is electrically connected to the capacitor component (2) and the power component (3), and the output copper busbar (402) is electrically connected to the first power component (301) and the second power component (302).
2. The integrated heat dissipation power module according to claim 1, characterized in that: The radiator (1) is in the shape of a cuboid and has three groups of opposing faces, wherein the area of the first group of opposing faces is the largest and the area of the second group of opposing faces is in the middle.
3. The integrated heat dissipation power module according to claim 2, characterized in that: The first group of opposite surfaces are the left and right sides of the radiator (1), and the first power component (301) and the second power component (302) are arranged opposite to each other on the left and right sides of the radiator (1); The second group of opposing surfaces are the top surface and the bottom surface of the heat sink (1), the output copper busbar (402) and the input copper busbar (401) are arranged on the top surface and the bottom surface of the heat sink (1) relative to each other, and the capacitor component (2) is arranged on the bottom surface of the heat sink (1).
4. The integrated heat dissipation power module according to claim 3, characterized in that: The input copper busbar (401) comprises a first connecting copper busbar (4011) and a second connecting copper busbar (4012), wherein the first connecting copper busbar (4011) connects the positive electrode of the capacitor component (2) and the first power component (301), and the second connecting copper busbar (4012) connects the negative electrode of the capacitor component (2) and the second power component (302).
5. The integrated heat dissipation power module according to claim 4, characterized in that: The first connecting copper bar (4011) and the second connecting copper bar (4012) are arranged oppositely on the left and right sides of the heat sink (1).
6. The integrated heat dissipation power module according to claim 4, characterized in that: The first connecting copper bar (4011) is arranged in contact with the top surface of the capacitor assembly (2) and the bottom surface of the heat sink (1).
7. The integrated heat dissipation power module according to claim 1, characterized in that: A heat-conducting layer is provided between the capacitor component (2) and / or the power component (3) and / or the electrical connection component (4) and the surface of the heat sink (1).
8. The integrated heat dissipation power module according to claim 1, characterized in that: An insulating layer is provided between the capacitor component (2) and / or the power component (3) and / or the electrical connection component (4) and the surface of the heat sink (1).
9. The integrated heat dissipation power module according to claim 2, characterized in that: The radiator (1) is a liquid-cooled radiator.
10. The integrated heat dissipation power module according to claim 9, characterized in that: The radiator (1) comprises a cooling water channel arranged inside and a water inlet and a water outlet arranged on a third group of opposite surfaces of the radiator (1), the water inlet and the water outlet are both connected to the cooling water channel, and the third group of opposite surfaces is a group of opposite surfaces with the smallest area of the radiator (1).