Heat dissipation assembly, semiconductor dehumidification assembly and dehumidification device

Abstract

The utility model relates to the technical field of air dehumidification, in particular to a heat dissipation assembly, a semiconductor dehumidification assembly and a dehumidification device. The heat dissipation assembly comprises a shell, the shell comprises a first heat conduction end and a plurality of second heat conduction ends, the first heat conduction end is used for conducting heat with a heat source, and each second heat conduction end is provided with a connecting end connected with the first heat conduction end and an extending end extending in the direction away from the first heat conduction end from the connecting end. The first heat conduction end is provided with a first heat dissipation area close to a heat source and a second heat dissipation area away from the heat source, and the wall thickness of the first heat dissipation area is larger than that of the second heat dissipation area. According to the heat dissipation assembly, the first heat dissipation area and the second heat dissipation area are arranged, the first heat dissipation area with the large wall thickness can absorb more heat, the second heat dissipation area with the small wall thickness can accelerate heat transfer and dissipation, heat accumulation of the first heat conduction end is reduced, and the heat dissipation efficiency of the heat dissipation assembly is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air dehumidification, in particular to a heat dissipation component, a semiconductor dehumidification component and a dehumidification device. Background Art

[0002] Semiconductor refrigeration technology, also known as thermoelectric refrigeration or temperature difference electric refrigeration, is a technology that uses the electrical properties of semiconductor materials to achieve refrigeration. Its principle is to use the external voltage to make the electrons in the semiconductor material jump, thereby absorbing heat and cooling the surface of the material. Semiconductor refrigeration technology has the characteristics of small size, compact structure, no vibration, environmental protection, quietness, precise temperature control, and easy installation.

[0003] Dehumidifiers can be divided into semiconductor refrigeration dehumidification and compressor refrigeration dehumidification according to the refrigeration working mode. Compared with compressor refrigeration dehumidifiers, semiconductor refrigeration dehumidifiers have the advantages of small size, light weight and low noise. They are easy to carry and can be used in multiple application scenarios such as living rooms and bedrooms. The semiconductor refrigeration dehumidification method is that the external air enters the dehumidifier from the air inlet, and the air first flows through the semiconductor refrigeration end, and the water molecules in the air condense into water droplets, that is, the air is dehumidified; the dehumidified air then flows through the heating end of the semiconductor, absorbs heat, and is discharged from the air outlet.

[0004] The heat dissipation component absorbs the heat from the semiconductor heating end through its receiving end, and then transfers the heat through the conducting end of the heat dissipation component. The existing heat dissipation component has a regular structure, and it cannot guarantee that every position of the heat dissipation component can absorb heat when the semiconductor contacts the heat dissipation component. Once the heat at the receiving end of the heat dissipation component is too concentrated and cannot be quickly dissipated, it is easy to cause heat accumulation and cause the semiconductor heating end to overheat, resulting in poor semiconductor cooling effect and affecting the actual user experience. Therefore, it is necessary to improve the heat dissipation component to further improve the heat dissipation efficiency to meet the user's usage needs. Utility Model Content

[0005] In view of the above-mentioned technical problem that the structure of the existing heat dissipation assembly is regular, it cannot be guaranteed that every position of the heat dissipation assembly can absorb heat when the semiconductor contacts the heat dissipation assembly. Once the heat at the receiving end of the heat dissipation assembly is too concentrated and cannot be quickly dissipated, it is easy to cause heat accumulation and overheating of the semiconductor heating end, resulting in poor semiconductor refrigeration effect. The technical solution adopted by the utility model to solve the technical problem is:

[0006] The heat dissipation component includes a housing, the housing includes a first heat conduction end for conducting heat with a heat source, and a second heat conduction end. There are multiple second heat conduction ends. The second heat conduction end is provided with a connection end connected to the first heat conduction end, and an extension end extending away from the first heat conduction end in a direction away from the first heat conduction end. The first heat conduction end is provided with a first heat dissipation area close to the heat source and a second heat dissipation area away from the heat source. The wall thickness of the first heat dissipation area is greater than the wall thickness of the second heat dissipation area.

[0007] Furthermore, in some embodiments of the present invention, the housing is made of a metal material. The lengths of the first heat conduction end and each second heat conduction end are equal. The length of the second heat conduction end located in the second heat dissipation area is greater than the length of the second heat conduction end located in the first heat dissipation area. The difference between the end thickness of the connection end and the end thickness of the extension end is between 0.15 - 0.25 mm, and the end thickness of the connection end is greater than the end thickness of the extension end.

[0008] Furthermore, in some embodiments of the present invention, multiple second heat conduction ends are arranged in parallel. The second heat conduction end is perpendicular to the first heat conduction end. An arc-shaped groove is provided between adjacent two second heat conduction ends. The housing is integrally formed and is made of aluminum material.

[0009] Furthermore, in some embodiments of the present invention, the difference between the wall thickness of the first heat dissipation area and the wall thickness of the second heat dissipation area is between 0.8 mm - 2 mm.

[0010] Furthermore, in some embodiments of the present invention, the second heat conduction end is provided with an upper heat conduction fin and a lower heat conduction fin. The first heat conduction end is further provided with a first installation area formed by enclosing the upper heat conduction fin, the lower heat conduction fin, and the inner wall of the first heat conduction end. A first installation hole is provided in the first installation area. The first heat conduction end is further provided with a second installation area close to the second heat dissipation area, and a second installation hole is provided in the second installation area.

[0011] Furthermore, in some embodiments of the present invention, the distance between the upper heat conduction fin and the lower heat conduction fin is between 4.5 - 6.5 mm, and the cross-section of the first installation area is U-shaped.

[0012] Furthermore, in some embodiments of the present invention, the second heat conduction end is provided with multiple heat conduction fins away from the upper heat conduction fin or the lower heat conduction fin. The distance between adjacent heat conduction fins is between 2.5 - 4 mm, and the distance between the two heat conduction fins located at both ends of the second heat conduction end is between 90 - 110 mm.

[0013] Furthermore, in some embodiments of the present invention, the thickness of the shell is between 25-40 mm, the height of the shell is between 105-125 mm, and the height of the first heat dissipation area is between 27-55 mm.

[0014] Furthermore, in some embodiments of the present invention, a semiconductor dehumidification component includes a shell component, the shell component is provided with a accommodating cavity, and also includes a heat dissipation component as described above connected to the accommodating cavity, a condensation component located outside the accommodating cavity and used for contacting the air, a semiconductor component connected between the heat dissipation component and the condensation component, a negative pressure component connected to the accommodating cavity, and a condensation cavity for accommodating the condensation component.

[0015] Furthermore, in some embodiments of the utility model, the dehumidification device includes the semiconductor dehumidification component as described above, an air inlet connected to the condensation chamber, and an air outlet connected to the accommodating chamber, and the distance between the condensation element and the air inlet is between 5-20 mm.

[0016] The beneficial effects of the utility model are as follows:

[0017] The utility model sets the first heat dissipation area and the second heat dissipation area, so that the first heat dissipation area with a larger wall thickness can absorb more heat, and the second heat dissipation area with a smaller wall thickness can accelerate the transfer and dissipation of heat, reduce heat accumulation at the first heat conduction end, and improve the heat dissipation efficiency of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a side view of the heat dissipation assembly of the present utility model.

[0019] Figure 2 It is a front view of the heat dissipation component of the utility model.

[0020] Figure 3 It is a schematic diagram of the heat dissipation component of the present utility model.

[0021] Figure 4 It is a schematic diagram of a semiconductor dehumidification component of the utility model.

[0022] Figure 5 It is a schematic diagram of a semiconductor dehumidification component of the utility model.

[0023] Figure 6 It is a side view of a semiconductor dehumidification component of the utility model.

[0024] Figure 7 This is an exploded view of a semiconductor dehumidification component of the utility model.

[0025] Figure 8 This is an exploded view of a semiconductor dehumidification component of the utility model. DETAILED DESCRIPTION

[0026] The implementation modes of the present utility model are described in detail below in conjunction with the accompanying drawings.

[0027] like Figures 1 to 8 The heat dissipation component shown includes a shell 3, which includes a first heat-conducting end 301 for conducting heat with a heat source, and a second heat-conducting end 302, wherein the second heat-conducting end 302 is provided with a plurality of ends, the second heat-conducting end 302 is provided with a connecting end 3021 connected to the first heat-conducting end 301, and an extending end 3022 extending from the connecting end 3021 in a direction away from the first heat-conducting end 301, the first heat-conducting end 301 is provided with a first heat dissipation area 3011 close to the heat source, and a second heat dissipation area 3012 away from the heat source, and the wall thickness of the first heat dissipation area 3011 is greater than the wall thickness of the second heat dissipation area 3012.

[0028] The utility model sets the first heat dissipation area and the second heat dissipation area, so that the first heat dissipation area with a larger wall thickness can absorb more heat, and the second heat dissipation area with a smaller wall thickness can accelerate the transfer and dissipation of heat, reduce heat accumulation at the first heat conduction end, and improve the heat dissipation efficiency of the heat dissipation component.

[0029] Specifically, by designing multiple second heat-conducting ends and extending them from the connection end in a direction away from the first heat-conducting end, the second heat-conducting ends can effectively disperse the heat conducted from the heat source. Multiple extension ends increase the heat dissipation area, making the heat distribution on the heat dissipation component more uniform, avoiding the overheating problem caused by the heat concentration in the first heat dissipation area, helping to extend the service life of the semiconductor, and reducing the failure rate and maintenance cost caused by high temperature. At the same time, the stable operation state also improves the overall performance and user experience of the dehumidification device.

[0030] The utility model optimizes the heat flow path by setting the wall thickness difference, and improves the overall heat dissipation efficiency of the heat dissipation component. Specifically, the first heat dissipation area with a larger wall thickness helps to better absorb the heat conducted from the heat source, and the second heat dissipation area with a smaller wall thickness is conducive to the rapid transfer and dissipation of heat. The heat is quickly dispersed to the entire heat dissipation component and quickly dissipated to the environment through the second heat conduction end with a larger heat dissipation area, thereby effectively preventing the accumulation of heat, reducing the risk of overheating of the semiconductor heating end, and avoiding the decline in the cooling effect caused by overheating. Such a setting not only improves the stability and reliability of the semiconductor refrigeration system, but also ensures the continuity and efficiency of its cooling effect.

[0031] like Figures 1 to 3In the heat dissipation assembly shown, the shell 3 is made of metal material, the length of the first heat-conducting end 301 is equal to that of each of the second heat-conducting ends 302, the length of the second heat-conducting end 302 located in the second heat dissipation area 3012 is greater than the length of the second heat-conducting end 302 located in the first heat dissipation area 3011, the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is between 0.15-0.25 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. Further, as a preferred embodiment of the present utility model but not a limitation, the length of the first heat-conducting end is equal to that of each of the second heat-conducting ends, and such a setting can ensure that the heat is evenly distributed between each of the first heat-conducting ends and the second heat-conducting ends, thereby avoiding the problem of local overheating or overcooling, and helping to improve the overall heat dissipation efficiency and stability of the semiconductor refrigeration system.

[0032] Specifically, the shell made of metal material has excellent thermal conductivity, which can quickly transfer the heat generated by the semiconductor heating end to the heat dissipation component. The efficient thermal conductivity can improve the heat dissipation efficiency, thereby ensuring that the heat can be quickly transferred from the heat source to each part of the heat dissipation component. In addition, the firmness and good mechanical properties of the metal material make the heat dissipation component have higher structural strength and durability. Even in high-intensity or overly humid and high-temperature working environments, it can maintain stable heat dissipation performance and extend the service life of the equipment. In addition, the design of the heat dissipation component is relatively simple, easy to manufacture and process, and its compact structure and modular design facilitate subsequent replacement and cleaning.

[0033] Furthermore, the second heat-conducting end located in the second heat dissipation zone is longer, which can provide more heat dissipation area in the area far away from the heat source, thereby reducing the risk of heat accumulation.

[0034] Specifically, there is a difference in thickness between the connecting end and the end of the extension end. On the one hand, the heat can be gradually released during the transfer process. The thicker connecting end helps to better absorb the heat, while the thinner extension end is conducive to the rapid dissipation of heat. The gradient thickness design improves the heat transfer efficiency and heat dissipation effect. On the other hand, when the heat dissipation component is formed, this thickness difference makes it easier to demold the second heat-conducting end, reducing product defects caused by the process. Specifically, the difference in thickness between the connecting end and the end of the extension end is controlled between 0.15-0.25mm. This precise thickness control helps to ensure the stability and controllability of heat during the transfer process, avoiding the problem of deformation of the second heat-conducting end due to insufficient structural strength caused by excessive thickness difference, or the problem of unclear improvement in heat dissipation performance due to too small thickness.

[0035] like Figures 1 to 3In the heat dissipation assembly shown, a plurality of the second heat-conducting ends 302 are arranged in parallel, the second heat-conducting ends 302 are arranged vertically with the first heat-conducting ends 301, an arc groove is arranged between two adjacent second heat-conducting ends 302, and the shell 3 is integrally formed, and the shell 3 is made of aluminum. Further, as a preferred embodiment of the utility model but not limited thereto, the aluminum material has excellent thermal conductivity, and can quickly transfer heat from the first heat-conducting end in contact with the heat source to the second heat-conducting end, and ensure that the heat can be quickly dispersed through efficient heat conduction capacity, reducing the accumulation of heat at the first heat-conducting end. The integrally formed aluminum shell has excellent structural strength and stability, can withstand large thermal stress and mechanical stress, and ensures the reliability and durability of the heat dissipation assembly in a long-term, high-intensity working environment. The vertical arrangement of the second heat-conducting end and the first heat-conducting end makes the overall structure of the heat dissipation assembly more compact and stable, and is not easy to deform or damage. The vertical arrangement allows the heat to form a natural convection effect during the transfer process, which helps to further improve the heat dissipation efficiency. The parallel arrangement of the second heat-conducting ends increases the heat dissipation area, so that the heat can be more widely dissipated into the environment.

[0036] In addition, the arc-shaped groove between two adjacent second heat-conducting ends not only increases the aesthetics of the heat dissipation component, but also helps to guide the air flow to form a more effective heat dissipation channel. The arc-shaped groove plays a spoiler role, increasing the turbulence of the air flow, thereby making the heat distribution on the heat dissipation component more even, thereby improving the heat dissipation efficiency and reducing the risk of local overheating.

[0037] In addition, the arc-shaped groove can also reduce the wear during the demoulding process, thereby reducing the wear between the mold and the heat dissipation component while ensuring the structural strength of the heat dissipation component, thereby increasing the service life of the manufacturing equipment.

[0038] In addition, the one-piece design simplifies the manufacturing process and reduces production costs. At the same time, since there are no complicated connecting parts or assembly processes, it also reduces errors and failure rates in the manufacturing process. The one-piece heat dissipation component is easier to clean and maintain. Due to the compact structure and no gaps, it is not easy to accumulate dust or blockage, thereby extending the service life.

[0039] like Figures 1 to 3In the heat dissipation assembly shown, the difference between the wall thickness of the first heat dissipation zone 3011 and the wall thickness of the second heat dissipation zone 3012 is between 0.8mm and 2mm. The difference in wall thickness design allows heat to form a gradient transfer effect inside the heat dissipation assembly. Further, as a preferred embodiment of the utility model but not a limitation, the thicker first heat dissipation zone acts as a heat buffer zone, which can slow down the speed of heat flow and make the heat more uniform during the transfer process. The thinner second heat dissipation zone accelerates the release rate of heat and improves the overall heat dissipation efficiency. While maintaining the overall structure compact, the thicker first heat dissipation zone can provide better structural support and reduce the damage to the heat dissipation assembly caused by thermal stress caused by temperature changes, while the thinner second heat dissipation zone can adapt to changes in heat and maintain overall stability.

[0040] Specifically, when the difference between the wall thickness of the first heat dissipation zone and the wall thickness of the second heat dissipation zone is between 0.8mm and 2mm, the thicker wall thickness of the first heat dissipation zone helps to store more heat in the early stage of heat transfer, thereby slowing down the impact of heat on the semiconductor, making heat transfer smoother and heat distribution more stable. As heat gradually accumulates, the thicker wall can provide a larger thermal capacity, which helps to form a stable heat dissipation performance when the heat generation of the semiconductor heating end reaches a peak. The thinner wall thickness of the second heat dissipation zone is conducive to the rapid release of heat. When heat is transferred from the first heat dissipation zone to the second heat dissipation zone, the thinner wall can dissipate heat to the environment faster to avoid heat accumulation.

[0041] like Figures 1 to 3 In the heat dissipation assembly shown, the second heat-conducting end 302 is provided with an upper heat-conducting fin 3023 and a lower heat-conducting fin 3024, the first heat-conducting end 301 is also provided with a first mounting area 303 formed by the upper heat-conducting fin 3023, the lower heat-conducting fin 3024, and the inner wall of the first heat-conducting end 301, the first mounting area 303 is provided with a first mounting hole 3031, the first heat-conducting end 301 is also provided with a second mounting area 304 close to the second heat dissipation area 3012, and the second mounting area 304 is provided with a second mounting hole 3041. Specifically, the first mounting area is located in the middle of the first heat-conducting end, and the second mounting area is located on both sides of the first heat-conducting end, and such an arrangement can form a firm structure and a position that is easy to install.

[0042] In the prior art, the heat dissipation assembly is only designed with the second installation area but not the first installation area. Therefore, during the installation process, the connection near the first heat dissipation area is not firm enough. The setting of the first installation area and the second installation area provides a variety of installation options. By setting the first installation hole and the second installation hole on the first installation area and the second installation area respectively, it can be conveniently connected and fixed with other components (such as semiconductors, condensers, etc.), thereby improving the versatility and maintainability of the heat dissipation assembly.

[0043] As Figures 1 to 3 shown by the heat dissipation component, the distance between the upper heat conduction fins 3023 and the lower heat conduction fins 3024 is between 4.5 - 6.5 mm, and the cross-section of the first installation area 303 is U-shaped. Further, as a preferred implementation manner rather than a limitation of the present utility model, the arrangement of the upper heat conduction fins and the lower heat conduction fins significantly increases the heat dissipation area of the first installation area, enabling the first installation area to accommodate other components while allowing heat to be dissipated more quickly from the second heat conduction end to the surrounding environment. The upper heat conduction fins and the lower heat conduction fins improve the heat exchange efficiency between the air and the heat dissipation component, and by guiding the flow direction of the heat, make the distribution of heat on the heat dissipation component more uniform. This reduces the risk of local overheating, thereby enhancing the overall heat dissipation effect.

[0044] Specifically, the distance between the upper heat conduction fins and the lower heat conduction fins is set within the range of 4.5 - 6.5 mm. On the one hand, this makes the first installation area more compact. When the size of the heat dissipation component is fixed, a smaller distance between the upper heat conduction fins and the lower heat conduction fins can be used to increase the number of heat conduction fins in the vertical direction to improve the heat dissipation efficiency. On the other hand, it also helps to form an effective air flow channel, allowing air to flow smoothly between the upper heat conduction fins and the lower heat conduction fins, taking away more heat, thereby improving the heat dissipation efficiency. At the same time, the distance of 4.5 - 6.5 mm also avoids the problem of blocked air flow caused by too close fins and insufficient heat dissipation area caused by too far fins.

[0045] Moreover, the U-shaped cross-section of the first installation area not only provides additional heat dissipation area but also makes the heat transfer between the upper heat conduction fins and the lower heat conduction fins more uniform, helping to reduce heat accumulation and improve the heat dissipation efficiency. In addition, the U-shaped structure also helps to guide the direction of air flow, enabling heat to be dissipated more effectively into the environment.

[0046] As Figures 1 to 3In the heat dissipation assembly shown, the second heat-conducting end 302 is provided with a plurality of heat-conducting fins 3025 away from the upper heat-conducting fins 3023 or the lower heat-conducting fins 3024, the distance between adjacent heat-conducting fins 3025 is between 2.5-4 mm, and the distance between the two heat-conducting fins 3025 located at both ends of the second heat-conducting end 302 is between 90-110 mm. Further, as a preferred embodiment of the utility model but not a limitation, a plurality of independent heat-conducting fins not only enhance the heat dissipation effect, but also improve the structural strength of the heat dissipation assembly to a certain extent. The heat-conducting fins provide additional support points for the heat dissipation assembly, which helps to reduce deformation or damage caused by temperature changes or mechanical vibrations. The design of multiple independent heat-conducting fins is not only practical, but also aesthetically pleasing. The heat-conducting fins add a sense of hierarchy and three-dimensionality to the heat dissipation assembly, making the entire heat dissipation assembly look more refined and high-end.

[0047] Furthermore, by adding multiple independent heat-conducting fins to the second heat-conducting end, the heat dissipation area can be significantly increased, so that heat can be transferred from the heat source to the environment more quickly, thereby improving the heat exchange efficiency of the heat dissipation component and further enhancing the heat dissipation effect. The distance between adjacent heat-conducting fins is set between 2.5mm and 4mm, which helps to ensure that air flows smoothly between the heat-conducting fins, avoids air flow obstruction caused by too dense heat-conducting fins, and also prevents insufficient heat dissipation area caused by too sparse heat-conducting fins, so that the heat is distributed more evenly on the heat dissipation component, reducing the risk of local overheating.

[0048] Furthermore, the distance between the upper thermal fin and the adjacent thermal fin is between 2.5-4mm, the distance between the lower thermal fin and the adjacent thermal fin is between 2.5-4mm, and the distance between the upper thermal fin and the adjacent thermal fin is equal to the distance between the lower thermal fin and the adjacent thermal fin.

[0049] Furthermore, the distance between the two thermal fins located at both ends of the second heat-conducting end is set between 90 mm and 110 mm. The longer distance is suitable for scenarios that require a larger heat dissipation area, while the shorter distance is suitable for scenarios with limited space or low heat dissipation requirements. This design makes the heat dissipation component more flexible and adaptable to different application environments.

[0050] like Figures 1 to 3In the heat dissipation assembly shown, the thickness of the shell 3 is between 25-40 mm, the height of the shell 3 is between 105-125 mm, and the height of the first heat dissipation area 3011 is between 27-55 mm. Further, as a preferred embodiment of the utility model but not a limitation, the thickness of the shell is set between 25 mm and 40 mm. This range ensures that the shell has sufficient structural strength to withstand the thermal stress and mechanical stress generated during the heat dissipation process. A thicker shell can provide better support and protection to prevent deformation or damage caused by external forces or temperature changes.

[0051] Further, as a preferred embodiment of the present invention but not a limitation, the height of the housing is set between 105 mm and 125 mm. This height range helps to form an effective heat dissipation channel, so that heat can be smoothly transferred from the inside of the heat dissipation component to the external environment. At the same time, this height has good compatibility with other components, ensuring that the heat dissipation component can be easily installed and integrated into a larger dehumidification component system.

[0052] Further, as a preferred embodiment of the present invention but not a limitation, the height of the first heat dissipation zone is set between 27 mm and 55 mm. This range ensures that heat can be fully accumulated and transferred in the first heat dissipation zone. As the starting point of heat transfer, the height setting of the first heat dissipation zone directly affects the effect of the subsequent heat dissipation process. This height range is neither too high to cause the heat to be difficult to transfer quickly, nor too low to cause excessive heat accumulation in the first heat dissipation zone.

[0053] The utility model can maximize the use of the space occupied by the heat dissipation component by reasonably setting the thickness, height of the shell and the height of the first heat dissipation zone. This compact design not only reduces the volume and weight of the heat dissipation component, but also improves its heat dissipation efficiency in a limited space.

[0054] like Figures 1 to 8 As shown, the semiconductor dehumidification component includes a shell component 1, the shell component 1 is provided with a accommodating chamber 2, and also includes the heat dissipation component as described above connected to the accommodating chamber 2, a condensation component 4 located outside the accommodating chamber 2 and used for contacting the air, a semiconductor component 5 connected between the heat dissipation component and the condensation component 4, a negative pressure component 6 communicated with the accommodating chamber 2, and a condensation chamber 9 for accommodating the condensation component 4.

[0055] Specifically, the semiconductor component is connected between the heat dissipation component and the condensation component, and a cooling effect is generated by the action of electric current. The heat dissipation component is used to dissipate the heat generated by the semiconductor component when it is working, and maintain the stable operation of the semiconductor dehumidification component. The condensation component is in direct contact with the air, and is used to condense the moisture in the air into water droplets to achieve the dehumidification function.

[0056] Optionally, in some embodiments, the negative pressure component is a fan or a pump.

[0057] Optionally, in some embodiments, the negative pressure assembly and the condensation element are relatively arranged on the left and right sides of the shell assembly.

[0058] Optionally, in some embodiments, the negative pressure assembly is located at the lower side of the condensing member, and the shell assembly is provided with a shell assembly opening connecting the negative pressure assembly and the accommodating chamber, and the negative pressure assembly is installed toward the shell assembly opening.

[0059] The dehumidification device includes the semiconductor dehumidification component as described above, an air inlet connected to the condensation chamber 9, and an air outlet connected to the accommodating chamber 2, and the distance between the condensation element 4 and the air inlet is between 5-20 mm.

[0060] Optionally, in some embodiments, the air inlet is located on the side or top of the dehumidification device and is connected to the condensation chamber. After the negative pressure component is started, a negative pressure area will be formed at the air inlet to attract indoor moisture to enter.

[0061] Optionally, in some embodiments, the air outlet is connected to the accommodating cavity for discharging the dehumidified air. The air outlet is located on a side away from the air inlet, which can prevent dry air from the air outlet from entering the air inlet while ensuring smooth air flow.

[0062] Specifically, humid air enters from the air inlet and flows through the surface of the condensation element. The moisture in the air condenses when it gets cold, and the air is preliminarily dehumidified. The dehumidified air continues to move, and the air enters the accommodating cavity and passes through the heat dissipation component connected to the hot end of the semiconductor component again to absorb heat to avoid overcooling of the air. Finally, dry air with a suitable temperature is discharged from the air outlet, completing the entire dehumidification cycle.

[0063] The utility model uses semiconductor components to achieve precise temperature control and improve dehumidification efficiency. The semiconductor dehumidification component saves space through integration and is suitable for equipment installation and use in various environments. The utility model does not have the vibration and noise of traditional compressors, and can create a quiet user experience. Compared with traditional dehumidification methods, the semiconductor dehumidification component has low power consumption and is more environmentally friendly.

[0064] Specifically, the distance between the condensation element and the air inlet is between 5-20 mm. The distance limit between the end of the condensation element and the air inlet helps to ensure that the air can quickly contact the condensation element after entering the condensation chamber, thereby improving the dehumidification efficiency. If the distance between the condensation element and the air inlet is too close, the negative pressure of the air inlet will be insufficient to draw enough air into the accommodating chamber. If the distance between the condensation element and the air inlet is too far, the air drawn by the air inlet will move directly toward the negative pressure component after entering the accommodating chamber, resulting in the air not being able to contact the condensation element well, affecting the dehumidification efficiency.

[0065] It also includes a guide member connected to the shell assembly 1 and located on the lower side of the condensation member 4, the guide member 8 is provided with a guide end 81, a guide surface 82 inclined from top to bottom and toward the guide end 81, and the guide member 8 is arranged in a Y shape. Further, as a preferred embodiment of the utility model but not a limitation, the design of the guide surface from top to bottom and inclined toward the guide end allows the condensed water generated on the condensation member to flow quickly and smoothly along the guide surface to the guide end, and the guide end gathers the water droplets into the water storage device, reducing the accumulation and splashing of the condensed water on the guide member, thereby improving the collection efficiency of the condensed water, reducing the condensed water being carried away by the airflow, and thus improving the dehumidification effect. The Y-shaped guide member design further enhances the guiding property of the condensed water flow and improves the dehumidification efficiency.

[0066] like Figures 4 to 8 A semiconductor dehumidification component is shown, wherein the housing component is provided with a limiting groove 71 for limiting the conductive wire of the semiconductor component 5, and the limiting groove 71 is arranged on a side away from the moving direction of the condensed water. Furthermore, as a preferred embodiment of the utility model but not a limitation, the limiting groove fixes the conductive wire of the semiconductor component by limiting it to prevent it from loosening or shifting due to vibration or external force during the operation of the dehumidifier, thereby protecting the integrity and stability of the conductive wire and avoiding circuit failure or performance degradation caused by damage to the conductive wire. Setting the limiting groove on a side away from the moving direction of the condensed water can significantly reduce the risk of condensed water directly contacting and corroding the conductive wire. During the movement, the condensed water will be guided to the predetermined drainage area by the guide member, and the conductive wire will be safely fixed in the limiting groove away from the drainage area, thereby ensuring its dryness and cleanliness.

[0067] like Figure 7 and Figure 8 A semiconductor dehumidification component is shown, the shell component 1 is provided with a mounting groove 13 which is connected to the condensation chamber 9 and into which the semiconductor component 5 is inserted, the semiconductor component 5 is provided with a cold end 501 for conducting temperature with the condensation element 4, and a hot end 502 for conducting temperature with the heat dissipation component, the thickness of the semiconductor component 5 is greater than the depth of the mounting groove 13, the condensation element 4 is provided with a condensation element connection end 401, the heat dissipation component is provided with a first mounting hole 3031, and the fastener 14 extends into or passes through the shell component 1 and is connected to the condensation element connection end 401 and the first mounting hole 3031 to fix the condensation element 4 and the heat dissipation component. Further, as a preferred embodiment of the utility model but not a limitation, the setting of the mounting groove enables the semiconductor component to be stably connected between the accommodating chamber and the condensation chamber, and the overall structure is more compact. At the same time, the cold end of the semiconductor component is directly connected to the condensation element, and the hot end is connected to the heat dissipation component, which is conducive to the rapid transfer and dissipation of heat.

[0068] Specifically, the thickness of the semiconductor component is greater than the depth of the mounting groove, so that the semiconductor component can be more fully in contact with the condensation component and the heat dissipation component, thereby improving the heat conduction efficiency. The cold end can more effectively condense the air in the condensation chamber into water droplets through the condensation component and discharge it, while the hot end can dissipate heat to the heat dissipation component more quickly, thereby extending the service life of the semiconductor component and improving the stability of the semiconductor component. The fasteners are extended into or out of the housing component and connected to the condensation component connection end and the heat dissipation component connection end, thereby achieving stable fixation of the condensation component and the heat dissipation component, which not only ensures close contact between the components, but also effectively prevents loosening or falling off due to vibration or external force, thereby ensuring the long-term stable operation of the dehumidifier.

[0069] Specifically, the fastener may be a screw or a bolt, and the fastener may be connected by passing through a mounting groove or through other connecting holes of the housing assembly.

[0070] Specifically, the condensing component connection end and the heat dissipation component connection end are both connection holes that cooperate with the fasteners.

[0071] like Figure 7 and Figure 8 A semiconductor dehumidification component is shown, the semiconductor component 5 includes at least a first semiconductor 51 and a second semiconductor 52, the condensation member 4 includes a first condensation member 41 abutting against the first semiconductor 51, and a second condensation member 42 abutting against the second semiconductor 52, the first condensation member 41 is provided with a first condensation center fin 411 extending away from the first semiconductor 51, and a first condensation outer fin 412, the first condensation center fin 411 is provided with multiple fins and close to the center of the first condensation member 41, the first condensation outer fin 412 is provided with at least two and located on both sides of the first condensation member 4, and the condensation member connection end 401 is located on a side close to the first condensation outer fin 412. Further, as a preferred embodiment of the utility model but not a limitation, the first condensation member and the second condensation member are respectively abutted against the first semiconductor and the second semiconductor, so that the heat generated by each semiconductor can be quickly conducted to the corresponding condensation member, making full use of the thermoelectric effect of the semiconductor material and improving the condensation efficiency. The first condensation center fin and the first condensation outer fin extend from top to bottom, which not only increases the heat exchange area, but also guides the airflow to be more evenly distributed on the surface of the condensation element, avoids the airflow from being concentrated in certain areas, and improves the utilization efficiency of the airflow. The condensation element guides the condensed water downward, reduces the splashing of water droplets, and thus allows the guide element to better collect it.

[0072] Specifically, the arrangement of multiple first condensation center fins and first condensation outer fins further increases the condensation area, allowing the condensation element to absorb and dissipate heat more quickly, thereby improving the dehumidification efficiency of the entire dehumidification assembly. In addition, multiple first condensation center fins are close to the center of the first condensation element, which helps to quickly disperse and conduct the heat in the central area to a wider area, thereby avoiding local overheating or uneven temperature. The first condensation outer fins are located on both sides of the first condensation element, which helps to dissipate heat from the edge of the condensation element, further optimizing the temperature distribution on the condensation element. At the same time, the gas close to the extension part can contact the first condensation outer fins when moving downward, thereby increasing the contact area between the gas in the condensation chamber and the condensation element. At the same time, the first condensation outer fin not only increases the condensation area, but also plays a role in strengthening the structure of the condensation piece. Specifically, the first condensation center fin can cover the cold end of the first semiconductor, so that the first semiconductor can completely transfer the temperature to the first condensation center fin. The connection end of the condensation piece is located between the outermost first condensation outer fin and the outermost first condensation center fin. The position of the condensation piece connection end will not affect the condensation effect of the first condensation center fin. The connection close to the outside of the condensation piece can provide a more stable support for the entire condensation piece, reducing the risk of deformation or damage due to vibration or external force.

[0073] Optionally, in some embodiments, the first semiconductor 51 and the second semiconductor 52 are connected in parallel.

[0074] Optionally, in some embodiments, the first semiconductor 51 and the second semiconductor 52 are connected in series.

[0075] like Figure 7 and Figure 8A semiconductor dehumidification assembly is shown, the housing assembly 1 includes a first housing 11 enclosing the accommodating chamber 2 and respectively close to the negative pressure assembly 6, and a second housing 12 close to the condensing element 4, the first housing 11 is provided with a first connecting end 111, the second housing 12 is provided with a second connecting end 121, the mounting groove 13 is located on the second housing 12, the second housing 12 is also provided with a second mating end 122, the heat dissipation assembly 3 is provided with a second mounting hole 3041, the fastener 14 passes through the second mating end 122 and the second mounting hole 3041, so that the heat dissipation assembly is fixed on the second housing 12, the heat dissipation assembly is provided with a plurality of second heat-conducting ends 302 extending in the horizontal direction or in the vertical direction, a heat dissipation channel 32 is formed between two adjacent second heat-conducting ends 302, and the accommodating chamber 2 is provided with an accommodating chamber opening 20 for air to move from the heat dissipation channel 32 to the outside. Further, as a preferred embodiment of the utility model but not a limitation, the first housing and the second housing enable the entire housing assembly to be tightly enclosed into an accommodating chamber, providing a stable operating environment for the heat dissipation assembly. At the same time, through the cooperation of the first connection end and the second connection end, and the use of fasteners, the structural stability of the housing assembly is enhanced, and the risk of deformation or damage caused by vibration or external force is reduced. By setting the mounting groove on the second housing, the semiconductor assembly can be quickly and accurately positioned, making the assembly process simpler and more efficient.

[0076] Optionally, in some embodiments, the first connection end and the second connection end are snap-fitted.

[0077] Optionally, in some embodiments, the first connecting end and the second connecting end are matched by a fastener.

[0078] Specifically, the plurality of second heat-conducting ends extending in the horizontal direction or the vertical direction provided on the heat-dissipating component greatly increases the heat-dissipating area, so that the heat can be dissipated to the surrounding environment more quickly. The heat-dissipating channel formed between two adjacent second heat-conducting ends facilitates air circulation, further improves the heat-dissipating efficiency, ensures that the heat generated by the semiconductor component during operation can be dissipated in time, and avoids the performance degradation or damage caused by overheating. The setting of the opening of the accommodating cavity enables the air to move smoothly from the heat-dissipating channel to the outside world.

[0079] Additionally, the fastener passes through the second mating end and the mating end of the heat dissipation assembly, and the heat dissipation assembly can be connected to the second shell, making the installation and removal of the heat dissipation assembly simple and quick, facilitating regular cleaning and maintenance, and reducing maintenance costs.

[0080] like Figure 7 and Figure 8A semiconductor dehumidification component is shown, wherein the first shell 11 is provided with a first shell opening 112 connecting the negative pressure component 6 and the accommodating chamber 2, and a limiting portion 113 for limiting the negative pressure component 6, wherein the limiting portion 113 includes a first limiting connection portion 1131 and a second limiting connection portion 1132, wherein the negative pressure component 6 is provided with a negative pressure component connection portion 61 for the first limiting connection portion 1131 to pass through, and the second limiting connection portion 1132 is provided with a plurality of and is engaged with the negative pressure component 6. Optionally, the outer diameter of the first shell opening is smaller than the outer diameter of the negative pressure component, so that the airflow can move completely and smoothly from the condensing chamber to the outside of the negative pressure component, and then the gas is moved from the first shell opening to the accommodating chamber through the negative pressure component, and the double limiting design of the first limiting connection portion and the second limiting connection portion ensures a stable connection between the negative pressure component and the first shell, avoids loosening due to equipment vibration or improper operation, and improves the stability of the entire structure. The first limiting connection portion passes through the negative pressure component connection portion, providing a fixed base point for the negative pressure component; and the second limiting connection portion is tightly abutted against the negative pressure component through multiple snap-fit ​​points, further enhancing the stability of the connection.

[0081] Optionally, in some embodiments, the first limiting connection portion is a connecting column, and after the first limiting connection portion passes through one of the negative pressure component connection portions close to the first shell opening, the fastener first passes through one of the negative pressure component connection portions away from the first shell opening, and then connects to the connecting hole on the first limiting connection portion.

[0082] Optionally, in some embodiments, the first position limiting connection part is a connection column, and after the first position limiting connection part passes through two negative pressure component connection parts in sequence, the fastener is connected to the connection hole on the first position limiting connection part.

[0083] Optionally, in some embodiments, the first shell 11 is further provided with a positioning end 114, which extends from the outside of the first shell in a direction away from the accommodating cavity. The positioning end is used for positioning and guiding when assembling the negative pressure component, and cooperates with the first limiting connection part and the second limiting connection part to limit the negative pressure component.

[0084] Specifically, the first connection end 111 located in the middle of the first shell 11 and the second connection end 121 located in the middle of the second shell 12 overlap with the side of the first installation area, and the diameter of the first connection end and the diameter of the second connection end are greater than or equal to the distance between the upper heat conducting fin and the lower heat conducting fin. Such a setting ensures the connection strength between the first shell and the second shell, and ensures that the first installation hole of the first installation area is set to enable different components to be connected to the heat dissipation assembly.

[0085] Specifically, the first connection end 111 located in the middle of the first shell 11 and the second connection end 121 located in the middle of the second shell 12 are both cylindrical, and their arc surfaces can guide the gas near the first installation area to move smoothly to avoid heat accumulation.

[0086] Example 1

[0087] like Figures 1 to 3 The heat dissipation component shown includes a shell 3, which includes a first heat-conducting end 301 for conducting heat with a heat source, and a second heat-conducting end 302, wherein the second heat-conducting end 302 is provided with a plurality of ends, the second heat-conducting end 302 is provided with a connecting end 3021 connected to the first heat-conducting end 301, and an extending end 3022 extending from the connecting end 3021 in a direction away from the first heat-conducting end 301, the first heat-conducting end 301 is provided with a first heat dissipation area 3011 close to the heat source, and a second heat dissipation area 3012 away from the heat source, and the wall thickness of the first heat dissipation area 3011 is greater than the wall thickness of the second heat dissipation area 3012.

[0088] The length of the first heat-conducting end 301 is equal to that of each of the second heat-conducting ends 302. The length of the second heat-conducting end 302 located in the second heat dissipation area 3012 is greater than the length of the second heat-conducting end 302 located in the first heat dissipation area 3011. The difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.15 mm. The end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022.

[0089] A plurality of the second heat conducting ends 302 are arranged in parallel, the second heat conducting ends 302 are arranged perpendicular to the first heat conducting ends 301 , an arc groove is arranged between two adjacent second heat conducting ends 302 , and the shell 3 is integrally formed and made of aluminum.

[0090] The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 0.8 mm.

[0091] The second heat-conducting end 302 is provided with an upper heat-conducting fin 3023 and a lower heat-conducting fin 3024. The first heat-conducting end 301 is also provided with a first mounting area 303 formed by the upper heat-conducting fin 3023, the lower heat-conducting fin 3024, and the inner wall of the first heat-conducting end 301. The first mounting area 303 is provided with a first mounting hole 3031. The first heat-conducting end 301 is also provided with a second mounting area 304 close to the second heat dissipation area 3012. The second mounting area 304 is provided with a second mounting hole 3041. The first mounting area 303 is located in the middle of the first heat-conducting end 301, and the second mounting area 304 is located on both sides of the first heat-conducting end 301.

[0092] The distance between the upper heat conducting fin 3023 and the lower heat conducting fin 3024 is 4.5 mm, and the cross section of the first mounting area 303 is in a U-shape.

[0093] The second heat-conducting end 302 is provided with a plurality of heat-conducting fins 3025 away from the upper heat-conducting fins 3023 or the lower heat-conducting fins 3024 , the distance between adjacent heat-conducting fins 3025 is 2.5 mm, and the distance between two heat-conducting fins 3025 located at both ends of the second heat-conducting end 302 is 90 mm.

[0094] The thickness of the shell 3 is 25 mm, the height of the shell 3 is 105 mm, and the height of the first heat dissipation area 3011 is 35 mm.

[0095] The utility model sets the first heat dissipation area 3011 and the second heat dissipation area 3012. The first heat dissipation area 3011 with a thicker wall can absorb more heat, and the second heat dissipation area 3012 with a thinner wall can accelerate the transfer and dissipation of heat, reduce the heat accumulation of the first heat conducting end 301, and improve the heat dissipation efficiency of the heat dissipation component.

[0096] Example 2

[0097] The difference between Example 2 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.25 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 2 mm, the distance between the upper heat conducting fin 3023 and the lower heat conducting fin 3024 is 6.5 mm, the distance between adjacent heat conducting fins 3025 is 4 mm, and the distance between the two heat conducting fins 3025 located at both ends of the second heat conducting end 302 is 110 mm. The thickness of the housing 3 is 40 mm, the height of the housing 3 is 125 mm, and the height of the first heat dissipation area 3011 is 55 mm.

[0098] Example 3

[0099] The difference between Example 3 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.20 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 1.2 mm, the distance between the upper heat conduction fin 3023 and the lower heat conduction fin 3024 is 5.8 mm, the distance between adjacent heat conduction fins 3025 is 3.4 mm, and the distance between the two heat conduction fins 3025 located at both ends of the second heat conduction end 302 is 101 mm. The thickness of the housing 3 is 33 mm, the height of the housing 3 is 115 mm, and the height of the first heat dissipation area 3011 is 47 mm.

[0100] Example 4

[0101] The difference between Example 4 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.18 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 1.5 mm, the distance between the upper heat conduction fin 3023 and the lower heat conduction fin 3024 is 4.8 mm, the distance between adjacent heat conduction fins 3025 is 2.9 mm, and the distance between the two heat conduction fins 3025 located at both ends of the second heat conduction end 302 is 95 mm. The thickness of the housing 3 is 38 mm, the height of the housing 3 is 110 mm, and the height of the first heat dissipation area 3011 is 40 mm.

[0102] Example 5

[0103] The difference between Example 5 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.22 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 1.0 mm, the distance between the upper heat conduction fin 3023 and the lower heat conduction fin 3024 is 6.0 mm, the distance between adjacent heat conduction fins 3025 is 3.7 mm, and the distance between the two heat conduction fins 3025 located at both ends of the second heat conduction end 302 is 106 mm. The thickness of the housing 3 is 29 mm, the height of the housing 3 is 121 mm, and the height of the first heat dissipation area 3011 is 51 mm.

[0104] Example 6

[0105] The difference between Example 6 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.24 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 1.8 mm, the distance between the upper heat conduction fin 3023 and the lower heat conduction fin 3024 is 5.5 mm, the distance between adjacent heat conduction fins 3025 is 2.7 mm, and the distance between the two heat conduction fins 3025 located at both ends of the second heat conduction end 302 is 96 mm. The thickness of the housing 3 is 33 mm, the height of the housing 3 is 117 mm, and the height of the first heat dissipation area 3011 is 27 mm.

[0106] Example 7

[0107] The difference between Example 7 and Example 1 is that the difference between the end thickness of the connecting end 3021 and the end thickness of the extending end 3022 is 0.17 mm, and the end thickness of the connecting end 3021 is greater than the end thickness of the extending end 3022. The difference between the wall thickness of the first heat dissipation area 3011 and the wall thickness of the second heat dissipation area 3012 is 0.9 mm, the distance between the upper heat conduction fin 3023 and the lower heat conduction fin 3024 is 6.2 mm, the distance between adjacent heat conduction fins 3025 is 3.4 mm, and the distance between the two heat conduction fins 3025 located at both ends of the second heat conduction end 302 is 100 mm. The thickness of the housing 3 is 38 mm, the height of the housing 3 is 123 mm, and the height of the first heat dissipation area 3011 is 30 mm.

[0108] Example 8

[0109] Example 8 further has the following implementation methods based on Example 4:

[0110] like Figures 1 to 8 A semiconductor dehumidification component is shown, including a shell component 1, the shell component 1 is provided with a accommodating chamber 2, and also includes a heat dissipation component connected to the accommodating chamber 2, a condensation component 4 located outside the accommodating chamber 2 and used for contacting the air, a semiconductor component 5 connected between the heat dissipation component and the condensation component 4, a negative pressure component 6 communicated with the accommodating chamber 2, and a condensation chamber 9 for accommodating the condensation component 4.

[0111] The negative pressure component 6 is a fan, and the negative pressure component 6 and the condensing element 4 are arranged on the left and right sides of the shell component 1 relative to each other.

[0112] It also includes a guide member 8 connected to the shell assembly 1 and located at the lower side of the condensing member 4. The guide member 8 is provided with a guide end 81 and a guide surface 82 inclined from top to bottom and toward the guide end 81. The guide member 8 is arranged in a Y shape.

[0113] The guide member 8 is integrally formed on the outer side of the second shell 12 , and the horizontal extension length of the guide member 8 is greater than the horizontal extension width of the guide member 8 .

[0114] A limiting groove 71 for limiting the conductive wire of the semiconductor component 5 is disposed on the outer side of the second housing 12 . The limiting groove 71 is disposed on a side away from the moving direction of the condensed water.

[0115] The shell component 1 is provided with a mounting groove 13 which is connected with the condensation chamber 9 and for the semiconductor component 5 to extend into. The semiconductor component 5 is provided with a cold end 501 for conducting temperature with the condensation component 4, and a hot end 502 for conducting temperature with the heat dissipation component. The thickness of the semiconductor component 5 is greater than the depth of the mounting groove 13. The condensation component 4 is provided with a condensation component connecting end 401, and the heat dissipation component is provided with a first mounting hole 3031. The fastener 14 extends into or passes through the shell component 1 and is connected to the condensation component connecting end 401 and the first mounting hole 3031 to fix the condensation component 4 and the heat dissipation component.

[0116] The fastener 14 is a screw, and the fastener 14 passes through the mounting slot 13 for connection.

[0117] The condensing component connection end 401 and the heat dissipation component connection end 301 are both connection holes that cooperate with the fastener 14.

[0118] The semiconductor component 5 at least includes a first semiconductor 51 and a second semiconductor 52. The condensation member 4 includes a first condensation member 41 abutting against the first semiconductor 51 and a second condensation member 42 abutting against the second semiconductor 52. The first condensation member 41 is provided with a first condensation center fin 411 extending away from the first semiconductor 51 and a first condensation outer fin 412. The first condensation center fin 411 is provided with multiple pieces and is close to the center of the first condensation member 41. The first condensation outer fin 412 is provided with at least two pieces and is located on both sides of the first condensation member 4. The condensation member connection end 401 is located on a side close to the first condensation outer fin 412. The first condensation center fin 411 and the first condensation outer fin 412 are parallelogram-shaped. The first semiconductor 51 and the second semiconductor 52 are connected in series.

[0119] The shell assembly 1 includes a first shell 11 that encloses the accommodating chamber 2 and is respectively close to the negative pressure assembly 6, and a second shell 12 that is close to the condensing element 4. The first shell 11 is provided with a first connecting end 111, and the second shell 12 is provided with a second connecting end 121. The mounting groove 13 is located on the second shell 12, and the second shell 12 is also provided with a second mating end 122. The heat dissipation assembly is provided with a second mounting hole 3041, and the fastener 14 passes through the second mating end 122 and the second mounting hole 3041 so that the heat dissipation assembly is fixed on the second shell 12. The heat dissipation assembly is provided with a plurality of second heat-conducting ends 302 extending in a horizontal direction or a vertical direction, and a heat dissipation channel 32 is formed between two adjacent second heat-conducting ends 302. The accommodating chamber 2 is provided with an accommodating chamber opening 20 for air to move from the heat dissipation channel 32 to the outside.

[0120] The first connection end 111 and the second connection end 121 are connected by snap fit and fastener fit.

[0121] The first connection end 111 located in the middle of the first shell 11 and the second connection end 121 located in the middle of the second shell 12 are both cylindrical and coincide with the side of the first mounting area 303. The diameter of the first connection end 111 and the diameter of the second connection end 121 are greater than the distance between the upper thermal fin 3023 and the lower thermal fin 3024.

[0122] The first shell 11 is provided with a first shell opening 112 connecting the negative pressure assembly 6 and the accommodating chamber 2, and a limiting portion 113 for limiting the negative pressure assembly 6. The limiting portion 113 includes a first limiting connection portion 1131 and a second limiting connection portion 1132. The negative pressure assembly 6 is provided with a negative pressure assembly connection portion 61 for the first limiting connection portion 1131 to pass through. The second limiting connection portion 1132 is provided with a plurality of and is engaged with the negative pressure assembly 6. The first limiting connection portion 1131 is a connecting column. After the first limiting connection portion 1131 passes through one of the negative pressure assembly connection portions 61 close to the first shell opening 112, the fastener 14 first passes through one of the negative pressure assembly connection portions 61 away from the first shell opening 112, and then connects with the connecting hole on the first limiting connection portion 1131. The negative pressure assembly connection portion 61 is located around the negative pressure assembly 6, and the second limiting connection portions are evenly arranged on the circumference of the negative pressure assembly 6.

[0123] Example 9

[0124] The difference between Example 9 and Example 8 is that the heat dissipation component is provided with multiple second heat-conducting ends 302 extending in the horizontal direction, a heat dissipation channel 32 is formed between two adjacent second heat-conducting ends 302 and is parallel to the horizontal plane, and two accommodating cavity openings 20 are provided and are respectively on the left and right sides of the shell component 1.

[0125] Example 10

[0126] The difference between Example 10 and Example 8 is that the heat dissipation component 3 has multiple second heat-conducting ends 302 extending in the vertical direction, a heat dissipation channel 32 is formed between two adjacent second heat-conducting ends 302 and is perpendicular to the horizontal plane, and the accommodating cavity opening 20 is arranged on the upper side of the shell component 1.

[0127] Embodiment 11

[0128] Embodiment 11, based on Embodiment 8, further has the following implementation mode: the dehumidification device comprises the semiconductor dehumidification assembly as described above, an air inlet connected to the condensation chamber 9, and an air outlet connected to the accommodating chamber 2. The distance between the condensation element 4 and the air inlet is 5 mm.

[0129] The air inlet is located on the side of the dehumidifier and is connected to the condensation chamber 9. After the negative pressure component 6 is started, a negative pressure area will be formed at the air inlet to attract indoor moisture to enter.

[0130] The air outlet is connected to the accommodating chamber 2 for discharging the dehumidified air. The air outlet is located on a side away from the air inlet, which can prevent the dry air from the air outlet from entering the air inlet while ensuring that the air can flow smoothly.

[0131] The humid air enters from the air inlet and flows through the surface of the condensation element 4. The moisture in the air condenses when it gets cold, and the air is preliminarily dehumidified. The dehumidified air continues to move and enters the accommodating chamber 2. It passes through the heat dissipation component 3 connected to the hot end 502 of the semiconductor component again to absorb heat to avoid overcooling of the air. Finally, dry air with a suitable temperature is discharged from the air outlet, completing the entire dehumidification cycle.

[0132] Example 12

[0133] The difference between Example 12 and Example 11 is that the distance between the condensation element 4 and the air inlet is 20 mm.

[0134] Embodiment 13

[0135] The difference between Example 13 and Example 11 is that the distance between the condensation element 4 and the air inlet is 15 mm.

[0136] Embodiment 14

[0137] The difference between Example 14 and Example 11 is that the distance between the condensation element 4 and the air inlet is 10 mm.

[0138] Embodiment 15

[0139] The difference between Example 15 and Example 11 is that the distance between the condensation element 4 and the air inlet is 8 mm.

[0140] Example 16

[0141] The difference between Example 16 and Example 11 is that the distance between the condensation element 4 and the air inlet is 12 mm.

[0142] Embodiment 17

[0143] The difference between Example 17 and Example 11 is that the distance between the condensation element 4 and the air inlet is 18 mm.

[0144] The above examples are only used to further illustrate the technical content of the utility model, so that readers can understand it more easily, but it does not mean that the implementation methods of the utility model are limited to this. Any technical extension or re-creation made based on the utility model is protected by the utility model. The protection scope of the utility model shall be based on the claims.

Claims

1. A heat dissipation assembly, comprising a housing (3), characterized in that: The housing (3) includes a first heat-conducting end (301) for conducting heat with a heat source, and a plurality of second heat-conducting ends (302). The second heat-conducting ends (302) are provided with a connection end (3021) connected to the first heat-conducting end (301), and an extension end (3022) extending away from the first heat-conducting end (301) in the direction of the connection end (3021). The first heat-conducting end (301) is provided with a first heat-dissipating area (3011) close to the heat source and a second heat-dissipating area (3012) away from the heat source. The wall thickness of the first heat-dissipating area (3011) is greater than the wall thickness of the second heat-dissipating area (3012).

2. The heat dissipation assembly according to claim 1, characterized in that: The housing (3) is made of a metal material. The lengths of the first heat-conducting end (301) and each of the second heat-conducting ends (302) are equal. The length of the second heat-conducting end (302) located in the second heat-dissipating area (3012) is greater than the length of the second heat-conducting end (302) located in the first heat-dissipating area (3011). The difference between the end thickness of the connection end (3021) and the end thickness of the extension end (3022) is between 0.15 - 0.25 mm, and the end thickness of the connection end (3021) is greater than the end thickness of the extension end (3022).

3. The heat dissipation assembly according to claim 1, characterized in that: The plurality of second heat-conducting ends (302) are arranged in parallel, the second heat-conducting ends (302) are arranged perpendicular to the first heat-conducting end (301), and an arc-shaped groove is provided between adjacent second heat-conducting ends (302). The housing (3) is integrally formed, and the housing (3) is made of aluminum material.

4. The heat dissipation assembly according to claim 1, characterized in that: The difference between the wall thickness of the first heat-dissipating area (3011) and the wall thickness of the second heat-dissipating area (3012) is between 0.8 mm - 2 mm.

5. The heat dissipation assembly according to claim 1, characterized in that: The second heat-conducting end (302) is provided with an upper heat-conducting fin (3023) and a lower heat-conducting fin (3024). The first heat-conducting end (301) is further provided with a first installation area (303) formed by enclosing the upper heat-conducting fin (3023), the lower heat-conducting fin (3024), and the inner wall of the first heat-conducting end (301). A first installation hole (3031) is provided in the first installation area (303). The first heat-conducting end (301) is further provided with a second installation area (304) close to the second heat-dissipating area (3012), and a second installation hole (3041) is provided in the second installation area (304).

6. The heat dissipation assembly according to claim 5, characterized in that: The distance between the upper heat-conducting fin (3023) and the lower heat-conducting fin (3024) is between 4.5 - 6.5 mm, and the cross-section of the first installation area (303) is in a U shape.

7. The heat dissipation assembly according to claim 5, characterized in that: The second heat-conducting end (302) is provided with a plurality of heat-conducting fins (3025) away from the upper heat-conducting fin (3023) or the lower heat-conducting fin (3024). The distance between adjacent heat-conducting fins (3025) is between 2.5 - 4 mm, and the distance between the two heat-conducting fins (3025) located at both ends of the second heat-conducting end (302) is between 90 - 110 mm.

8. The heat dissipation assembly according to claim 1, characterized in that: The thickness of the shell (3) is between 25 and 40 mm, the height of the shell (3) is between 105 and 125 mm, and the height of the first heat dissipation area (3011) is between 27 and 55 mm.

9. A semiconductor dehumidification component, comprising a housing component (1), wherein the housing component (1) is provided with a receiving cavity (2), characterized in that: The device further comprises a heat dissipation component as claimed in any one of claims 1 to 8 connected to the accommodating chamber (2), a condensation member (4) located outside the accommodating chamber (2) and used for contacting with air, a semiconductor component (5) connected between the heat dissipation component and the condensation member (4), a negative pressure component (6) communicated with the accommodating chamber (2), and a condensation chamber (9) used for accommodating the condensation member (4).

10. A dehumidification device, characterized in that: It comprises the semiconductor dehumidification component as claimed in claim 9, an air inlet connected to the condensation chamber (9), and an air outlet connected to the accommodating chamber (2), wherein the distance between the condensation element (4) and the air inlet is between 5-20 mm.

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