Nozzle device and wet spraying device

Abstract

The utility model relates to a nozzle device and a wet spraying device, and the nozzle device comprises a nozzle frame which is used for being suspended above a wafer; the supporting frame comprises a moving mechanism, and the moving mechanism is used for driving the nozzle frame to move in the first direction; the plurality of nozzles are distributed on the nozzle frame at intervals along a second direction and are used for spraying air and / or liquid to the wafer; the first direction and the second direction are parallel to the maximum diameter extension direction of the wafer and are perpendicular to each other. By adopting the nozzle equipment and the wet spraying equipment, the nozzles which are distributed on the nozzle frame at intervals along the extension direction of the maximum diameter of the wafer can enable the spraying to be more uniform.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a nozzle device and a wet spraying device. Background Art

[0002] The cavity nozzles (Nozzle) of existing single-chip equipment generally adopt a single nozzle swing arm design, which shows a certain swing arm movement on the spin wafer. This type of nozzle has obvious advantages in mature processes, but when the process evolves to a higher level, its shortcomings are gradually exposed, such as large solution consumption, pattern collapse, damage, and challenges to cleaning or etching uniformity. Utility Model Content

[0003] Based on this, it is necessary to provide a nozzle device and a wet spraying device that sprays more evenly.

[0004] In a first aspect, the present application provides a nozzle device, the nozzle device comprising:

[0005] A nozzle holder, used to be suspended above the wafer;

[0006] A support frame, comprising a moving mechanism, wherein the moving mechanism is used to drive the nozzle frame to move along a first direction;

[0007] A plurality of nozzles are distributed on the nozzle rack at intervals along a second direction for spraying air and / or liquid onto the wafer; the first direction and the second direction are both parallel to the maximum diameter extension direction of the wafer and perpendicular to each other.

[0008] In one embodiment, the nozzles are evenly spaced and distributed on the nozzle rack.

[0009] In one embodiment, the support frame includes a first sub-support frame and a second sub-support frame, and the first sub-support frame, the wafer, and the second sub-support frame are arranged in sequence along the second direction;

[0010] Each of the nozzles is divided into a first nozzle group and a second nozzle group with the center point of the wafer as the boundary. The spray direction of each nozzle in the first nozzle group is at a 45-degree angle to the third direction of the counterclockwise rotation surface of the wafer, and the spray direction of each nozzle in the second nozzle group is at a 45-degree angle to the fourth direction of the counterclockwise rotation surface of the wafer.

[0011] In one embodiment, the moving mechanism comprises:

[0012] A guide rail, disposed on the support frame, for limiting the movement of the nozzle frame along the first direction;

[0013] The moving part is used to drive the nozzle rack to move on the guide rail.

[0014] In one embodiment, the guide rail includes a first guide rail and a second guide rail, two ends of the nozzle rack are respectively located on the first guide rail and the second guide rail, and a distance between the first guide rail and the second guide rail is greater than or equal to the maximum diameter of the wafer.

[0015] In one embodiment, at least two nozzle racks are arranged at intervals on the guide rail.

[0016] In one embodiment, the moving part comprises:

[0017] The servo motor is used to move along the first direction and drive the nozzle rack to move on the guide rail.

[0018] In one embodiment, it also includes:

[0019] The wafer stage is used to drive the wafer to rotate.

[0020] In one embodiment, the diameter of each nozzle is 3 mm to 5 mm.

[0021] In a second aspect, the present application also provides a wet spraying device, which includes the above-mentioned nozzle device.

[0022] The above-mentioned nozzle equipment and wet spraying equipment, the nozzle equipment includes a nozzle rack, a support rack and a plurality of nozzles, wherein the moving mechanism on the support rack is used to drive the nozzle rack to move along the first direction, and the plurality of nozzles are distributed on the nozzle rack at intervals along the second direction, and are used to spray air and / or liquid onto the wafer, the first direction and the second direction are both parallel to the maximum diameter extension direction of the wafer and perpendicular to each other, so that the nozzles distributed on the nozzle rack at intervals along the maximum diameter extension direction of the wafer can make the spraying more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic diagram of a spray group device in the conventional technology;

[0025] Figure 2 It is a schematic diagram of a nozzle device according to an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 100 nozzle rack, 210 guide rail, 211 first guide rail, 212 second guide rail, 220 first sub-support rack, 230 second sub-support rack, 300 nozzle, 310 first nozzle group, 320 second nozzle group, 400 wafer, 500 first direction, 600 second direction, 700 wafer carrier. DETAILED DESCRIPTION

[0028] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0031] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0032] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0033] Combination Figure 1 As shown, Figure 1 This is a schematic diagram of a nozzle device in traditional technology, in which a cavity nozzle (Nozzle) generally adopts a single nozzle swing arm design, which exhibits a certain swing arm motion on the spin wafer, but such a single nozzle device sprays unevenly.

[0034] To solve the above problems, please combine Figure 2 As shown, the present application provides a nozzle device, which includes a nozzle rack 100 , a support rack, and a plurality of nozzles 300 .

[0035] The nozzle rack 100 is suspended above the wafer 400; the support frame includes a moving mechanism, which is used to drive the nozzle rack 100 to move along the first direction 500; multiple nozzles 300 are distributed on the nozzle rack 100 at intervals along the second direction 600, and the multiple nozzles 300 are used to spray air and / or liquid onto the wafer 400; the first direction 500 and the second direction 600 are both parallel to the maximum diameter extension direction of the wafer 400 and perpendicular to each other.

[0036] Optionally, the diameter of each nozzle 300 is 3 mm to 5 mm. Optionally, the diameter of the nozzle 300 is 3 mm, 4 mm or 5 mm.

[0037] Specifically, the axial direction of the nozzle rack 100 is the second direction 600, and the nozzle rack 100 is provided with a plurality of nozzles 300, for example, at least two nozzles 300. In other embodiments, the number of nozzles 300 on the nozzle rack 100 may also be other values, which are not specifically limited herein. The length of the nozzle rack 100 may be greater than or equal to the maximum diameter of the wafer 400. Optionally, the length of the nozzle rack 100 is equal to the maximum diameter of the wafer 400. The plurality of nozzles 300 are arranged at intervals on the nozzle rack 100, so that the plurality of nozzles 300 are arranged at intervals along the extension direction of the maximum diameter of the wafer 400.

[0038] The support frame is used to support the nozzle frame 100 so that the nozzle frame 100 is suspended above the wafer 400. Optionally, the nozzle frame 100 can be fixed at a specific position of the support frame, such as one end or the center, or at any other position. In other embodiments, the moving mechanism can drive the nozzle frame 100 to move along the first direction 500.

[0039] Among them, combined Figure 2 As shown, the first direction 500 and the second direction 600 are both parallel to the maximum diameter extension direction of the wafer 400 and perpendicular to each other.

[0040] Each nozzle 300 can spray air and / or liquid toward the wafer 400. Optionally, the nozzles 300 on the same nozzle rack 100 spray the same content. For example, each nozzle 300 on one nozzle rack 100 sprays air toward the wafer 400, and each nozzle 300 on another nozzle rack 100 sprays liquid toward the wafer 400. Optionally, the contents sprayed by each nozzle rack 100 on the support rack may be the same or different, which is not specifically limited here.

[0041] In some optional embodiments, in order to reduce the usage of cleaning solution / gas and reduce costs, the solution or gas sprayed from each nozzle 300 is mixed with high-pressure nitrogen (N2). The atomization function of high-pressure nitrogen N2 can also effectively reduce the usage of cleaning solution / gas and reduce costs, and the atomization function of high-pressure nitrogen N2 can improve the protection of the wafer 400 pattern.

[0042] Optionally, the nozzle device further includes a wafer carrier 700 for driving the wafer 400 to rotate.

[0043] Optionally, the nozzle device in the present application is suitable for semiconductors, especially semiconductor manufacturing processes, and can be suitable for 8-inch, 12-inch and 18-inch wafer 400 manufacturing.

[0044] In the above embodiment, the nozzle device includes a nozzle rack 100, a support rack and a plurality of nozzles 300, wherein a moving mechanism on the support rack is used to drive the nozzle rack 100 to move along a first direction 500, and a plurality of nozzles 300 are distributed on the nozzle rack 100 at intervals along a second direction 600, for spraying air and / or liquid onto the wafer 400, and the first direction 500 and the second direction 600 are both parallel to the maximum diameter extension direction of the wafer 400 and perpendicular to each other, so that the nozzles 300 distributed on the nozzle rack 100 at intervals along the maximum diameter extension direction of the wafer 400 can make the spraying more uniform.

[0045] In one optional embodiment, the nozzles 300 are evenly spaced and distributed on the nozzle holder 100 .

[0046] The nozzles 300 on each nozzle rack 100 can be evenly distributed, or the corresponding distribution intervals can be designed based on design requirements. In this embodiment, the nozzles 300 are evenly distributed on the nozzle rack 100, so that a more balanced spraying device can be obtained, thereby improving the balance of cleaning and etching.

[0047] In one of the optional embodiments, the support frame includes a first sub-support frame 220 and a second sub-support frame 230, and the first sub-support frame 220, the wafer 400, and the second sub-support frame 230 are arranged in sequence along the second direction 600; each nozzle 300 is divided into a first nozzle group 310 and a second nozzle group 320 with the center point of the wafer 400 as the boundary, and the spraying direction of each nozzle 300 in the first nozzle group 310 is at a 45-degree angle to the third direction of the counterclockwise rotation surface of the wafer, and the spraying direction of each nozzle 300 in the second nozzle group 320 is at a 45-degree angle to the second direction of the counterclockwise rotation surface of the wafer.

[0048] Combination Figure 2As shown, the support frame includes a first sub-support frame 220 and a second sub-support frame 230. The first sub-support frame 220 and the second sub-support frame 230 are placed on both sides of the wafer 400 along the second direction 600, wherein each nozzle 300 on each nozzle frame 100 is divided into a first nozzle group 310 and a second nozzle group 320 with the center point of the wafer 400 as the boundary.

[0049] The spray direction of each nozzle 300 in the first nozzle group 310 is at a 45-degree angle to the third direction of the counterclockwise rotation plane of the wafer. The spray direction of each nozzle 300 in the second nozzle group 320 is at a 45-degree angle to the fourth direction of the counterclockwise rotation plane of the wafer. The angle of 45 degrees defined here is an optional real-time method. In other embodiments, it can also be other angles, which are not specifically limited here.

[0050] The third direction and the fourth direction are opposite directions. For specific illustrations of the third direction and the fourth direction, please refer to Figure 2 In some optional embodiments, the third direction is the same as the first direction mentioned above.

[0051] In the above embodiment, the different spraying directions on both sides of the wafer 400 can improve the friction between the solution / gas and the surface of the wafer 400 to protect the pattern of the wafer 400.

[0052] In one optional embodiment, the moving mechanism includes a guide rail 210 and a moving part, wherein the guide rail 210 is disposed on the support frame, and the guide rail 210 is used to limit the movement of the nozzle rack 100 along the first direction 500; the moving part is used to drive the nozzle rack 100 to move on the guide rail 210.

[0053] The axial direction of the guide rail 210 is parallel to the first direction 500 .

[0054] In one optional embodiment, the guide rail 210 includes a first guide rail 211 and a second guide rail 212 , and both ends of the nozzle rack 100 are respectively located on the first guide rail 211 and the second guide rail 212 , and the distance between the first guide rail 211 and the second guide rail 212 is greater than or equal to the maximum diameter of the wafer 400 .

[0055] Among them, the first guide rail 211 is fixed to the first sub-support frame 220, and the second guide rail 212 is fixed to the second sub-support frame 230, so that the first guide rail 211 and the second guide rail 212 are located on both sides of the wafer 400 along the second direction 600, that is, the first guide rail 211 and the second guide rail 212 are parallel to the first direction 500 and perpendicular to the second direction 600, and the spacing between the first guide rail 211 and the second guide rail 212 is greater than or equal to the maximum diameter of the wafer 400.

[0056] In order to enable the nozzle rack 100 to move on the guide rail 210, the two ends of the nozzle rack 100 are respectively located on the first guide rail 211 and the second guide rail 212, so that when the two ends of the nozzle rack 100 move on the first guide rail 211 and the second guide rail 212, the movement of the nozzle rack 100 can be achieved. Optionally, the two ends of the nozzle rack 100 move in the same direction and speed on the first guide rail 211 and the second guide rail 212.

[0057] In one optional embodiment, at least two nozzle racks 100 are arranged at intervals on the guide rail 210. In order to meet the process requirements of different solutions and / or gases, at least two nozzle racks 100 are arranged at intervals on the guide rail 210, and each nozzle rack 100 sprays different contents.

[0058] For example, when different solutions need to be sprayed, a corresponding number of nozzle racks 100 may be arranged at intervals on the guide rail 210 based on the number of solution types, and each nozzle rack 100 sprays different solutions. For example, when different gases need to be sprayed, a corresponding number of nozzle racks 100 may be arranged at intervals on the guide rail 210 based on the number of gas types, and each nozzle rack 100 sprays different gases. For example, when different solutions and gases need to be sprayed, a corresponding number of nozzle racks 100 may be arranged at intervals on the guide rail 210 based on the total number of solution types and gas types, and each nozzle rack 100 sprays different solutions and gases, and one nozzle rack 100 can only spray one gas or solution.

[0059] In the above embodiment, different nozzle racks 100 are set up to meet the process requirements of different solutions / gases.

[0060] In one optional embodiment, the moving part includes: a servo motor, which is used to move along the first direction 500 and drive the nozzle rack 100 to move on the guide rail 210 .

[0061] The nozzle rack 100 can perform linear motion along the guide rail 210, and the linear motion can be driven by a servo motor. Optionally, the servo motor can be located at the first guide rail 211 and / or the second guide rail 212, for example, the servo motor is located at the first guide rail 211, or the servo motor is located at the second guide rail 212, or the servo motor is located at the first guide rail 211 and the second guide rail 212. The servo motor is connected to the corresponding nozzle rack 100, so that the nozzle rack 100 can be driven to move. Optionally, different nozzle racks 100 can be driven by different servo motors, or all nozzle racks 100 can be driven by the same servo motor, which is not specifically limited here.

[0062] In one of the optional embodiments, the present application further provides a wet spraying device, which includes the nozzle device in any one of the above embodiments. The specific definition of the nozzle device can be found above and will not be repeated here.

[0063] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A nozzle device, characterized in that: The nozzle device comprises: A nozzle holder, used to be suspended above the wafer; A support frame, comprising a moving mechanism, wherein the moving mechanism is used to drive the nozzle frame to move along a first direction; A plurality of nozzles are distributed on the nozzle rack at intervals along a second direction for spraying air and / or liquid onto the wafer; the first direction and the second direction are both parallel to the maximum diameter extension direction of the wafer and perpendicular to each other.

2. The nozzle device according to claim 1, characterized in that The nozzles are evenly distributed on the nozzle rack.

3. The nozzle device according to claim 1, characterized in that The support frame comprises a first sub-support frame and a second sub-support frame, and the first sub-support frame, the wafer, and the second sub-support frame are arranged in sequence along the second direction; Each of the nozzles is divided into a first nozzle group and a second nozzle group with the center point of the wafer as the boundary. The spray direction of each nozzle in the first nozzle group is at a 45-degree angle to the third direction of the counterclockwise rotation surface of the wafer, and the spray direction of each nozzle in the second nozzle group is at a 45-degree angle to the fourth direction of the counterclockwise rotation surface of the wafer.

4. The nozzle device according to claim 1, characterized in that The moving mechanism comprises: A guide rail, disposed on the support frame, for limiting the movement of the nozzle frame along the first direction; The moving part is used to drive the nozzle rack to move on the guide rail.

5. The nozzle device according to claim 4, characterized in that The guide rail comprises a first guide rail and a second guide rail, two ends of the nozzle rack are respectively located on the first guide rail and the second guide rail, and a distance between the first guide rail and the second guide rail is greater than or equal to the maximum diameter of the wafer.

6. The nozzle device according to claim 4, characterized in that At least two nozzle racks are arranged on the guide rail at intervals.

7. The nozzle device according to claim 4, characterized in that The mobile unit comprises: The servo motor is used to move along the first direction and drive the nozzle rack to move on the guide rail.

8. The nozzle device according to claim 7, characterized in that Also includes: The wafer stage is used to drive the wafer to rotate.

9. The nozzle device according to claim 1, characterized in that The diameter of each of the nozzles is 3 mm to 5 mm.

10. A wet spraying device, characterized in that: The wet spraying equipment comprises the nozzle equipment according to any one of claims 1 to 9.

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