Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device, belonging to the technical field of chemical mechanical polishing, the wafer cleaning device comprises a carrier roller set, a megasonic washing assembly and a cleaning brush assembly, the carrier roller set is used for driving a wafer to rotate; the megasonic flushing assembly comprises a first driving mechanism, a spraying pipe connected to the first driving mechanism and a megasonic generator connected with the spraying pipe, and the first driving mechanism is used for driving the spraying pipe to rotate; the cleaning brush assembly comprises a horizontal driving mechanism, a support connected to the horizontal driving mechanism and a rolling brush rotationally connected to the support, and the horizontal driving mechanism is used for driving the support to move in the radial direction of the wafer. According to the wafer cleaning device provided by the utility model, the wafer is cleaned in a manner of combining spraying and the cleaning brush, and the sprayed cleaning liquid carries vibration energy under the action of the megasonic generator, so that relatively firm particles attached to the surface of the wafer are loosened, and the cleaning quality is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chemical mechanical polishing, and in particular relates to a wafer cleaning device. Background Art

[0002] Chemical mechanical polishing is mainly used in wafer manufacturing. It combines the advantages of chemical polishing and mechanical polishing. It can obtain a more perfect surface while ensuring material removal efficiency. The flatness is 1-2 orders of magnitude higher than that of chemical polishing or mechanical polishing alone, and can achieve surface roughness from nanometer to atomic level.

[0003] After chemical mechanical polishing, the processed surface of the wafer needs to be cleaned. The existing cleaning process mainly uses a cleaning brush for cleaning. The cleaning brush relies on friction and adsorption force to remove residues on the surface of the wafer during cleaning, but cannot remove tightly attached particles, resulting in poor cleaning effect. Utility Model Content

[0004] The embodiment of the utility model provides a wafer cleaning device, aiming to solve the technical problem that the existing wafer cleaning adopts a cleaning brush, which cannot remove the fastened particles and has a poor cleaning effect.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a wafer cleaning device, comprising:

[0006] A roller group is used to drive the wafer to rotate;

[0007] A megasonic washing assembly, comprising a first driving mechanism, a nozzle connected to the first driving mechanism, and a megasonic generator connected to the nozzle, wherein the first driving mechanism is used to drive the nozzle to rotate so that a liquid outlet of the nozzle is located directly above the wafer;

[0008] The cleaning brush assembly includes a horizontal driving mechanism, a bracket connected to the horizontal driving mechanism, and a roller brush rotatably connected to the bracket. The horizontal driving mechanism is used to drive the bracket to move along the radial direction of the wafer so that the roller brush contacts the processing surface of the wafer.

[0009] In one possible implementation, the roller group includes a plurality of rollers evenly distributed along the circumference of the wafer, each of the rollers includes an upper and lower roller body, the diameter of the upper roller body is smaller than the diameter of the lower roller body, the top surface of the lower roller body is used to contact the lower surface of the wafer, and the outer peripheral surface of the upper roller body abuts against the outer peripheral surface of the wafer.

[0010] In a possible implementation, the roller assembly further includes at least one driving motor;

[0011] When the driving motor is provided with one, the driving motor is drivingly connected to all the rollers;

[0012] When there are multiple drive motors, the number of the drive motors is less than or equal to the number of the rollers, and each of the drive motors is drivingly connected to at least one of the rollers.

[0013] In a possible implementation, the first driving mechanism is a first motor, and an output shaft of the first motor is arranged in the up-down direction;

[0014] The megasonic flushing assembly further comprises a supporting member fixed to the output shaft of the first motor, the megasonic generator is fixedly connected to the supporting member, and one end of the nozzle is fixedly connected to the megasonic generator.

[0015] In a possible implementation, the liquid outlet end of the nozzle is bent downward to form a liquid outlet portion, and the center of the liquid outlet portion is used to coincide with the axis of the wafer.

[0016] In a possible implementation, the cleaning brush assembly further includes a vertical driving mechanism, the horizontal driving mechanism is used to drive the vertical driving mechanism to move radially of the wafer, and the vertical driving mechanism is used to drive the bracket and the roller brush to move up and down.

[0017] In a possible implementation, the horizontal drive mechanism and the vertical drive mechanism both include:

[0018] Second motor;

[0019] a lead screw, parallel to and connected to an output shaft of the second motor;

[0020] A slider, matched with the lead screw;

[0021] Among them, the output shaft of the second motor in the horizontal drive mechanism is arranged horizontally, and the slider in the horizontal drive mechanism is connected to the vertical drive mechanism; the output shaft of the second motor in the vertical drive mechanism is arranged vertically, and the slider in the vertical drive mechanism is connected to the bracket.

[0022] In a possible implementation, the horizontal drive mechanism and the vertical drive mechanism further include:

[0023] Fixed seat;

[0024] A guide rail is provided on the fixing seat, the guide rail is located on one side of the lead screw and is parallel to the lead screw;

[0025] Wherein, the fixing seat is used to install the second motor and the lead screw, the guide rail in the horizontal driving mechanism is slidably matched with the vertical driving mechanism, and the guide rail in the vertical driving mechanism is slidably matched with the bracket.

[0026] In a possible implementation, the horizontal drive mechanism and the vertical drive mechanism both include:

[0027] cylinder;

[0028] a slide rail extending parallel to the piston rod of the cylinder;

[0029] Wherein, the piston rod of the cylinder in the horizontal driving mechanism is arranged horizontally and fixedly connected to the vertical driving mechanism; the piston rod of the cylinder in the vertical driving mechanism is arranged vertically and fixedly connected to the bracket.

[0030] In a possible implementation, the support includes:

[0031] A top plate connected to the vertical drive mechanism;

[0032] Two fixing blocks are fixedly connected to the bottom of the top plate at intervals;

[0033] A rotating shaft, rotatably connected between the two fixed blocks, wherein the axial direction of the rotating shaft is parallel to the radial direction of the wafer and is perpendicular to the moving path of the horizontal driving mechanism;

[0034] Wherein, the roller brush is fixedly connected to the rotating shaft.

[0035] The scheme shown in the embodiment of the present application is compared with the prior art. After the wafer is ground, it is placed in the roller group and the surface to be cleaned is kept facing upward. The roller group drives the wafer to rotate. The megasonic flushing assembly is first used to clean the wafer. The first driving mechanism is started to drive the nozzle to rotate, and the megasonic generator is turned on at the same time. During the rotation of the wafer, the liquid outlet of the nozzle sprays the cleaning liquid and gradually moves from the edge of the wafer to the center of the wafer, and then moves from the center of the wafer to the edge of the wafer. Then the megasonic flushing assembly is closed, the cleaning brush assembly is turned on, and the horizontal driving mechanism drives the roller brush to pass through the surface to be tilted of the wafer to complete the cleaning process of the wafer. The utility model wafer cleaning device cleans the wafer by combining spraying and cleaning brushes, wherein the sprayed cleaning liquid carries vibration energy under the action of the megasonic generator, which can loosen the particles that are tightly attached to the surface of the wafer, thereby facilitating the subsequent roller brush to brush off the particles and improving the cleaning quality; and the nozzle is used to spray the cleaning liquid, which can reduce the loss of energy, so that the liquid is transferred to a single unit closer to the wafer, and the energy acts on the surface of the wafer more concentratedly and evenly. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1A schematic diagram of the top view of the wafer cleaning device provided by an embodiment of the utility model;

[0037] Figure 2 This is a schematic diagram of the main structure of the roller group used in the embodiment of the utility model;

[0038] Figure 3 This is a schematic diagram of the main structure of the megasonic flushing assembly used in the embodiment of the utility model;

[0039] Figure 4 This is a schematic diagram of the three-dimensional structure of the cleaning brush assembly used in the embodiment of the utility model.

[0040] Description of reference numerals:

[0041] 10- roller group; 11- roller body; 12- driving motor;

[0042] 20-megasonic flushing assembly; 21-first driving mechanism; 22-nozzle; 221-liquid outlet; 23-megasonic generator; 24-supporting member;

[0043] 30-cleaning brush assembly; 31-horizontal drive mechanism; 32-bracket; 321-top plate; 322-fixed block; 323-rotating shaft; 33-rolling brush; 34-vertical drive mechanism; 35-second motor; 36-screw; 37-slider; 38-cylinder; 39-slide rail; 310-fixed seat; 311-guide rail. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0045] In the claims, specification and the above drawings of the present utility model, unless otherwise clearly defined, the terms "first", "second" or "third" are used to distinguish different objects, rather than to describe a specific order. In the claims, specification and the above drawings of the present utility model, the terms "upper", "lower", "top" and "bottom" are the same as the up and down directions when the wafer is cleaned; the other directional words, unless otherwise clearly defined, such as the terms "front", "back", "inside", "outside", "center", "lateral", "longitudinal", "horizontal", "vertical", "left", "right", "clockwise", "counterclockwise", "high", "low" and the like indicate the orientation or position relationship based on the orientation and position relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as limiting the specific protection scope of the present utility model.

[0046] In the claims, specification and the above drawings of the utility model, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is to say, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements.

[0047] In the claims, specification and drawings of the present utility model, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0048] Please also read Figures 1 to 4 The wafer cleaning device provided by the utility model is now described. The wafer cleaning device comprises a roller group 10, a megasonic washing assembly 20 and a cleaning brush assembly 30. The roller group 10 is used to drive the wafer to rotate; the megasonic washing assembly 20 comprises a first driving mechanism 21, a nozzle 22 connected to the first driving mechanism 21, and a megasonic generator 23 connected to the nozzle 22. The first driving mechanism 21 is used to drive the nozzle 22 to rotate so that the liquid outlet of the nozzle 22 is located directly above the wafer; the cleaning brush assembly 30 comprises a horizontal driving mechanism 31, a bracket 32 ​​connected to the horizontal driving mechanism 31, and a rolling brush 33 rotatably connected to the bracket 32. The horizontal driving mechanism 31 is used to drive the bracket 32 ​​to move along the radial direction of the wafer so that the rolling brush 33 contacts the processing surface of the wafer.

[0049] Compared with the prior art, the wafer cleaning device provided in the present embodiment is that after the wafer is ground, it is placed in the roller group 10 and the surface to be cleaned is kept facing upward. The roller group 10 drives the wafer to rotate, and the wafer is first cleaned using the megasonic flushing assembly 20. The first driving mechanism 21 is started to drive the nozzle 22 to rotate, and the megasonic generator 23 is turned on at the same time. During the rotation of the wafer, the liquid outlet end of the nozzle 22 sprays cleaning liquid and gradually moves from the edge of the wafer to the center of the wafer, and then moves from the center of the wafer to the edge of the wafer. Then, the megasonic flushing assembly 20 is closed, and the cleaning brush assembly 30 is turned on. The horizontal driving mechanism 31 drives the roller brush 33 to pass over the surface to be tilted of the wafer to complete the cleaning process of the wafer. The wafer cleaning device of the utility model cleans the wafer by combining spraying and a cleaning brush, wherein the sprayed cleaning liquid carries vibration energy under the action of the megasonic generator 23, which can loosen particles that are tightly attached to the surface of the wafer, thereby facilitating the subsequent rolling brush 33 to brush off the particles and improving the cleaning quality; and the use of the nozzle 22 to spray the cleaning liquid can reduce energy loss, so that the liquid is transmitted to a portion closer to the wafer, and the energy acts on the surface of the wafer in a more concentrated and uniform manner.

[0050] In some embodiments, a specific implementation of the above roller group 10 can be as follows: Figure 1 to Figure 2 See the structure shown. Figure 1 to Figure 2 The roller group 10 includes a plurality of rollers evenly distributed along the circumference of the wafer, and each roller includes two roller bodies 11, one above and one below. The diameter of the roller body 11 located at the top is smaller than the diameter of the roller body 11 located at the bottom. The top surface of the roller body 11 located at the bottom is used to contact the bottom surface of the wafer, and the outer peripheral surface of the roller body 11 located at the top abuts against the outer peripheral surface of the wafer. The roller body 11 located at the bottom of each roller supports the wafer, and when the roller rotates, the friction between the lower roller body 11 and the bottom surface of the wafer, and the friction between the upper roller body 11 and the outer peripheral surface of the wafer drive the wafer to rotate, thereby improving the stability of the wafer during rotation and preventing the wafer from being misplaced and falling.

[0051] In some embodiments, a specific implementation of the above roller group 10 can be as follows: Figure 2 See the structure shown. Figure 2 The roller group 10 also includes at least one driving motor 12; when there is one driving motor 12, the driving motor 12 is connected to all the rollers in a transmission manner; when there are multiple driving motors 12, the number of driving motors 12 is less than or equal to the number of rollers, and each driving motor 12 is connected to at least one roller in a transmission manner. It is easy to think of setting a transmission shaft at the bottom of each roller, setting a synchronous wheel on each transmission shaft, and driving multiple synchronous wheels to rotate through a synchronous belt, and the synchronous belt is connected to the output shaft of the driving motor 12 in a transmission manner, so that one driving motor 12 drives multiple rollers to rotate, and the corresponding number of driving motors 12 is selected according to the needs, and the synchronization between multiple rollers can be adjusted.

[0052] In some embodiments, a specific implementation of the first driving mechanism 21 can be as follows: Figure 3 See the structure shown. Figure 3 The first driving mechanism 21 is a first motor, and the output shaft of the first motor is arranged in the up-down direction; the megasonic washing assembly 20 also includes a supporting member 24 fixed to the output shaft of the first motor, the megasonic generator 23 is fixedly connected to the supporting member 24, and one end of the nozzle 22 is fixedly connected to the megasonic generator 23. By starting the first motor, the output shaft of the first motor rotates to drive the supporting member 24 to rotate and then drives the nozzle 22 to rotate, so that the liquid outlet pipe of the nozzle 22 switches position on the surface to be cleaned of the wafer, thereby achieving comprehensive washing of the wafer.

[0053] As an alternative embodiment, the first driving mechanism 21 can also be a hydraulic cylinder that drives the rack to move, and a gear that cooperates with the rack is set at the bottom of the supporting member 24. Then, during the extension and retraction of the piston rod of the hydraulic cylinder, the gear can be driven to rotate forward or reverse, thereby realizing the rotation of the nozzle 22.

[0054] In some embodiments, an improved embodiment of the nozzle 22 can be adopted as follows Figure 3 See the structure shown. Figure 3 , the liquid outlet end of the nozzle 22 is bent downward to form a liquid outlet portion 221, and the center of the liquid outlet portion 221 is used to coincide with the axis of the wafer. Since most of the nozzle 22 is parallel to the surface of the wafer to be cleaned, if the liquid is sprayed directly, the sprayed liquid will be sprayed in a parabolic path, and the parabola presented will also be different depending on the flow rate of the cleaning liquid, which will affect the cleaning effect of the wafer; by bending the liquid outlet end of the nozzle 22 so that the direction of the liquid outlet is perpendicular to the surface of the wafer to be cleaned, it can be ensured that the liquid outlet is located where the liquid outlet portion 221 is facing, and the distance to the wafer is closer, and the cleaning effect is better.

[0055] In some embodiments, an improved embodiment of the cleaning brush assembly 30 may be as follows: Figure 1 and Figure 4 See the structure shown. Figure 1 and Figure 4 The cleaning brush assembly 30 further includes a vertical driving mechanism 34. The horizontal driving mechanism 31 is used to drive the vertical driving mechanism 34 to move along the radial direction of the wafer. The vertical driving mechanism 34 is used to drive the bracket 32 ​​and the roller brush 33 to move up and down. After the megasonic washing assembly 20 is finished working, the cleaning brush assembly 30 starts working. Before working, the distance between the roller brush 33 and the surface of the wafer can be adjusted by the vertical driving mechanism 34, thereby adjusting the force applied to the wafer when the roller brush 33 passes through the wafer, which is more flexible to use.

[0056] In some embodiments, a specific implementation of the horizontal drive mechanism 31 and the vertical drive mechanism 34 can be as follows: Figure 1 and Figure 4 See the structure shown. Figure 1 and Figure 4 The horizontal driving mechanism 31 and the vertical driving mechanism 34 both include a second motor 35, a lead screw 36 and a slider 37. The lead screw 36 is parallel to and connected to the output shaft of the second motor 35; the slider 37 is matched with the lead screw 36;

[0057] Among them, the output shaft of the second motor 35 in the horizontal driving mechanism 31 is arranged horizontally, and the slider 37 in the horizontal driving mechanism 31 is connected to the vertical driving mechanism 34; the output shaft of the second motor 35 in the vertical driving mechanism 34 is arranged vertically, and the slider 37 in the vertical driving mechanism 34 is connected to the bracket 32.

[0058] The output shaft of the second motor 35 rotates to drive the lead screw 36 to rotate, thereby driving the slider 37 to move axially along the lead screw 36, so that the horizontal drive mechanism 31 drives the vertical drive mechanism 34 to move radially along the wafer, or the vertical drive mechanism 34 drives the bracket 32 ​​to move up and down.

[0059] Specifically, the horizontal drive mechanism 31 and the vertical drive mechanism 34 further include a fixed seat 310 and a guide rail 311. The guide rail 311 is arranged on the fixed seat 310. The guide rail 311 is located on one side of the lead screw 36 and is parallel to the lead screw 36. The fixed seat 310 is used to install the second motor 35 and the lead screw 36. The guide rail 311 in the horizontal drive mechanism 31 is slidably matched with the vertical drive mechanism 34. The guide rail 311 in the vertical drive mechanism 34 is slidably matched with the bracket 32. When the vertical drive mechanism 34 moves on the lead screw 36 of the horizontal drive mechanism 31, and the bracket 32 ​​moves on the lead screw 36 of the vertical drive mechanism 34, further guidance can be achieved through the guide rail 311, so that the moving process is more stable, ensuring the contact area between the roller brush 33 and the wafer, thereby improving the cleaning quality.

[0060] In some embodiments, a modified implementation of the horizontal drive mechanism 31 and the vertical drive mechanism 34 can be as follows: Figure 1 and Figure 4 See the structure shown. Figure 1 and Figure 4 , the horizontal drive mechanism 31 and the vertical drive mechanism 34 both include a cylinder 38 and a slide rail 39, and the slide rail 39 extends parallel to the piston rod of the cylinder 38;

[0061] The piston rod of the cylinder 38 in the horizontal driving mechanism 31 is arranged horizontally and fixedly connected to the vertical driving mechanism 34 ; the piston rod of the cylinder 38 in the vertical driving mechanism 34 is arranged vertically and fixedly connected to the bracket 32 ​​.

[0062] The piston rod of the cylinder 38 is extended and retracted to directly drive the vertical drive mechanism 34 to move along the radial direction of the wafer, or to drive the bracket 32 ​​to move up and down, and at the same time, the slide rail 39 also provides further guidance for the movement process to improve stability.

[0063] In some embodiments, a specific implementation of the bracket 32 ​​can be as follows: Figure 4 See the structure shown. Figure 4 The bracket 32 ​​includes a top plate 321, two fixed blocks 322 and a rotating shaft 323. The top plate 321 is connected to the vertical driving mechanism 34. The two fixed blocks 322 are fixedly connected to the bottom of the top plate 321 at intervals. The rotating shaft 323 is rotatably connected between the two fixed blocks 322. The axial direction of the rotating shaft 323 is parallel to the radial direction of the wafer and is perpendicular to the moving path of the horizontal driving mechanism 31.

[0064] The roller brush 33 is fixed to the rotating shaft 323 .

[0065] The rotating shaft 323 is installed between the two fixing blocks 322 , which can prevent one end of the rotating shaft 323 from being suspended in the air, ensure the horizontality of the rotating shaft 323 , and provide an installation space for the roller brush 33 .

[0066] It is easy to imagine that in order to reduce the friction between the rotating shaft 323 and the fixing block 322 , a bearing may be provided between the rotating shaft 323 and the fixing block 322 .

[0067] Specifically, in order to facilitate the replacement of the roller brush 33 , a detachable structure may be provided between the rotating shaft 323 and the fixing block 322 .

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that: include: A roller group is used to drive the wafer to rotate; A megasonic washing assembly, comprising a first driving mechanism, a nozzle connected to the first driving mechanism, and a megasonic generator connected to the nozzle, wherein the first driving mechanism is used to drive the nozzle to rotate so that a liquid outlet of the nozzle is located directly above the wafer; The cleaning brush assembly includes a horizontal driving mechanism, a bracket connected to the horizontal driving mechanism, and a roller brush rotatably connected to the bracket. The horizontal driving mechanism is used to drive the bracket to move along the radial direction of the wafer so that the roller brush contacts the processing surface of the wafer.

2. The wafer cleaning device according to claim 1, characterized in that: The roller group includes a plurality of rollers evenly distributed along the circumference of the wafer, each of the rollers includes an upper and a lower roller body, the diameter of the upper roller body is smaller than the diameter of the lower roller body, the top surface of the lower roller body is used to contact the lower surface of the wafer, and the outer peripheral surface of the upper roller body abuts against the outer peripheral surface of the wafer.

3. The wafer cleaning device according to claim 2, characterized in that: The roller assembly further includes at least one driving motor; When the driving motor is provided with one, the driving motor is drivingly connected to all the rollers; When a plurality of driving motors are provided, the number of the driving motors is less than or equal to the number of the rollers, and each of the driving motors is drivingly connected to at least one of the rollers.

4. The wafer cleaning device according to claim 1, characterized in that: The first driving mechanism is a first motor, and the output shaft of the first motor is arranged in the up-down direction; The megasonic flushing assembly further comprises a supporting member fixed to the output shaft of the first motor, the megasonic generator is fixedly connected to the supporting member, and one end of the nozzle is fixedly connected to the megasonic generator.

5. The wafer cleaning device according to claim 1, characterized in that: The liquid outlet end of the nozzle is bent downward to form a liquid outlet portion, and the center of the liquid outlet portion is used to coincide with the axis of the wafer.

6. The wafer cleaning device according to claim 1, characterized in that: The cleaning brush assembly also includes a vertical driving mechanism, the horizontal driving mechanism is used to drive the vertical driving mechanism to move along the radial direction of the wafer, and the vertical driving mechanism is used to drive the bracket and the roller brush to move up and down.

7. The wafer cleaning device according to claim 6, characterized in that: The horizontal driving mechanism and the vertical driving mechanism both include: Second motor; a lead screw, parallel to and connected to an output shaft of the second motor; A slider, matched with the lead screw; Among them, the output shaft of the second motor in the horizontal drive mechanism is arranged horizontally, and the slider in the horizontal drive mechanism is connected to the vertical drive mechanism; the output shaft of the second motor in the vertical drive mechanism is arranged vertically, and the slider in the vertical drive mechanism is connected to the bracket.

8. The wafer cleaning device according to claim 7, characterized in that: The horizontal driving mechanism and the vertical driving mechanism further include: Fixed seat; A guide rail is provided on the fixing seat, the guide rail is located on one side of the lead screw and is parallel to the lead screw; Wherein, the fixing seat is used to install the second motor and the lead screw, the guide rail in the horizontal driving mechanism is slidably matched with the vertical driving mechanism, and the guide rail in the vertical driving mechanism is slidably matched with the bracket.

9. The wafer cleaning device according to claim 6, characterized in that: The horizontal driving mechanism and the vertical driving mechanism both include: cylinder; a slide rail extending parallel to the piston rod of the cylinder; Wherein, the piston rod of the cylinder in the horizontal driving mechanism is arranged horizontally and fixedly connected to the vertical driving mechanism; the piston rod of the cylinder in the vertical driving mechanism is arranged vertically and fixedly connected to the bracket.

10. The wafer cleaning device according to any one of claims 6 to 9, characterized in that: The support comprises: A top plate connected to the vertical drive mechanism; Two fixing blocks are fixedly connected to the bottom of the top plate at intervals; A rotating shaft, rotatably connected between the two fixed blocks, wherein the axial direction of the rotating shaft is parallel to the radial direction of the wafer and is perpendicular to the moving path of the horizontal driving mechanism; Wherein, the roller brush is fixedly connected to the rotating shaft.

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