Demolding mechanism and heat dissipation type mold for manufacturing circuit board

Abstract

The utility model relates to the technical field of circuit board manufacturing, in particular to a demolding mechanism and a heat dissipation type mold for circuit board manufacturing. A spring is arranged on the mounting frame; the device has the beneficial effects that the punch on the upper die presses a circuit board until the punch on the upper die is clamped into the avoiding hole, generated disintegrating slag falls into the avoiding hole and falls into the waste chip groove through the through groove, only the disintegrating slag in the waste chip groove needs to be cleaned, the safety of a worker when the device is used is improved, and if a top plate or a spring is damaged, the device is not damaged. The bolts on the mounting frame are screwed, the top plate and the mounting frame are taken out from the base, the bolts on the connecting plate are screwed to remove locking between the mounting frame and the top plate, the mounting frame and the top plate are separated, and a worker can replace the springs in the mounting frame or maintain the top plate according to actual conditions; later maintenance work of workers is facilitated, and the using effect of the device is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board manufacturing, in particular to a demoulding mechanism and a heat dissipation mold for circuit board manufacturing. Background Art

[0002] The circuit board is composed of integrated circuits, quartz oscillators, fine-tuning capacitors and printed circuit boards. The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. In electronic equipment, they are mainly used to connect various electronic components and play the role of structural support.

[0003] In the prior art, a mold is usually used to produce the appearance of the circuit board during the production process of the circuit board, so a demoulding structure is used to demould the mold.

[0004] However, the traditional demoulding structure is usually fixed as one with the overall structure, and it is difficult for the staff to maintain the demoulding structure. The demoulding structure is easily damaged after long-term use, which leads to poor demoulding effect. Therefore, the utility model proposes a demoulding mechanism and a heat dissipation mold for circuit board manufacturing to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a demoulding mechanism and a heat dissipation mold for manufacturing a circuit board, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the utility model provides the following technical solutions: a demoulding mechanism, the demoulding mechanism comprising: a base, a waste chip groove is provided on the side of the base, and a plurality of installation grooves are provided on the side of the inner wall of the base;

[0007] The mounting frame has a limiting groove on its inner side and a spring on the mounting frame.

[0008] Preferably, the mounting groove is a "convex" groove structure, the mounting frame can be inserted into the mounting groove and the mounting frame can be fixed to the base using bolts, and the base is fixedly connected to the bracket.

[0009] Preferably, the limiting groove is a "convex" groove structure, the limiting block is slidably connected to the limiting groove, the limiting block can slide up and down along the limiting groove, and the side of the limiting block is fixedly connected to the movable plate.

[0010] Preferably, the spring is fixedly connected to the mounting frame, and the other end of the spring is fixedly connected to the movable plate. The movable plate is in a "cross"-shaped plate structure, and a connecting plate is fixedly connected to the upper surface of the movable plate.

[0011] Preferably, the bracket is fixedly connected to the hydraulic rod, the telescopic end of the hydraulic rod is fixedly connected to the upper mold, and the punch arranged on the lower surface of the upper mold can just fit into the avoidance hole arranged on the top plate.

[0012] Preferably, the connecting plate is a square plate structure, the connecting plate and the top plate are fixed together by bolts, the top plate is a square plate structure, a number of handles are fixedly connected to the side of the top plate, the handles can just fit into the slots when the top plate moves downward, and a number of avoidance holes are opened on the top plate.

[0013] Preferably, the avoidance hole has a circular groove-like structure, the inner diameter of the avoidance hole is equal to the diameter of the punch set on the lower surface of the upper mold, and the avoidance hole corresponds one-to-one to the through groove opened on the base, the through groove has a circular groove-like structure, the through groove passes through the base and communicates with the waste chip groove, and the waste chip groove has a square groove-like structure.

[0014] A heat dissipation mold for manufacturing a circuit board comprises the demoulding mechanism.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model provides a demoulding mechanism and a heat dissipation mold for manufacturing a circuit board. The punch on the upper mold presses the circuit board until the punch on the mold is inserted into the avoidance hole, and the top plate moves downward and is inserted into the base. At this time, the handle is just inserted into the slot, and the avoidance hole is just connected to the through slot. The debris generated when the circuit board is pressed follows and falls into the avoidance hole and then falls into the waste chip slot through the through slot. The staff only needs to clean the debris in the waste chip slot, which greatly reduces the burden on the staff, improves the safety of the staff when using the device, and improves the production efficiency. If the top plate or the spring is damaged, the staff can screw the bolts on the mounting frame, remove the top plate and the mounting frame from the base along the mounting slot, screw the bolts on the connecting plate to release the lock between the mounting frame and the top plate, separate the mounting frame from the top plate, and the staff can replace the spring in the mounting frame or repair the top plate according to the actual situation, and then assemble the mounting frame, the top plate and the base. The demoulding device adopts a modular structure, which is convenient for the staff to maintain in the later stage and improves the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a partial structural schematic diagram of the utility model;

[0019] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0020] Figure 4 It is a schematic diagram of the local structure of the utility model.

[0021] In the figure: 1, base; 2, mounting frame; 3, card slot; 4, mounting slot; 5, through slot; 6, waste chip slot;

[0022] 7. Connecting plate; 8. Limiting groove; 9. Limiting block; 10. Moving plate; 11. Spring; 12. Top plate;

[0023] 13. Handle; 14. Avoidance hole; 15. Bracket; 16. Hydraulic rod; 17. Upper mold. DETAILED DESCRIPTION

[0024] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1

[0026] See also Figure 1-Figure 4 The utility model provides a technical solution: a demoulding mechanism, the demoulding mechanism comprises: a base 1, a waste chip groove 6 is provided on the side of the base 1, and a plurality of mounting grooves 4 are provided on the inner wall side of the base 1; a mounting frame 2, a limiting groove 8 is provided on the inner side of the mounting frame 2, and a spring 11 is provided on the mounting frame 2, a heat dissipation mold for circuit board manufacturing, comprising the demoulding mechanism;

[0027] When in use, the mounting frame 2 is fixed to the top plate 12 by threading the threaded holes provided on the connecting plate 7 through bolts and threading them with the threaded holes on the side of the top plate 12. The staff aligns the mounting frame 2 with the mounting groove 4 on the base 1 and inserts it, and then uses bolts to penetrate the threaded holes on the mounting frame 2 and threading them with the corresponding threaded holes on the base 1 to fix the mounting frame 2 and the top plate 12 on the base 1. At this time, the avoidance holes 14 provided on the top plate 12 just correspond to the through grooves 5 provided on the base 1, and the line The board is fixed on the top plate 12, and the hydraulic rod 16 is started to move the upper mold 17 downward. The punch on the upper mold 17 presses the circuit board until the punch on the upper mold 17 is stuck in the avoidance hole 14. The top plate 12 moves downward and is stuck in the base 1. At this time, the handle 13 is just stuck in the card slot 3, and the avoidance hole 14 is just connected to the through slot 5. The debris generated when pressing the circuit board follows and falls into the avoidance hole 14, passes through the through slot 5 and falls into the waste chip slot 6. The staff cleans the debris in the waste chip slot 6.

[0028] Embodiment 2

[0029] On the basis of the first embodiment, in order to facilitate the staff to perform later maintenance of the device, a mounting groove 4 is provided, and the mounting groove 4 is a "convex" groove-shaped structure. The mounting frame 2 can be inserted into the mounting groove 4 and the mounting frame 2 can be fixed to the base 1 with bolts. The base 1 is fixedly connected to the bracket 15, and a spring 11 is fixedly connected to the mounting groove 4. The limiting groove 8 is a "convex" groove-shaped structure. The limiting block 9 is slidably connected to the limiting groove 8. The limiting block 9 can slide up and down along the limiting groove 8. The side of the limiting block 9 is fixedly connected to the movable plate 10. The upper mold 17 moves upward, and the spring 11 is relaxed to push the limiting block 9 and the movable plate 10 to move upward, so that the connecting plate 7 and the top plate 12 move upward, so that the circuit board can be demoulded, without manual demoulding, thereby improving production efficiency. The spring 11 is fixedly connected to the mounting frame 2, and the other end of the spring 11 is fixedly connected to the movable plate 10. The movable plate 10 is a "cross"-shaped plate-shaped structure, and the upper surface of the movable plate 10 is fixedly connected with a connecting The bolts on the connecting plate 7 can separate the mounting frame 2 from the top plate 12, and the staff can replace the new top plate 12 or the spring 11, thereby improving the actual use effect of the device, facilitating the later maintenance work of the staff, and having high practicality.

[0030] Embodiment 3

[0031] On the basis of the second embodiment, in order to reduce the burden on the staff, a bracket 15 is provided, the bracket 15 is fixedly connected to the hydraulic rod 16, the telescopic end of the hydraulic rod 16 is fixedly connected to the upper mold 17, the punch provided on the lower surface of the upper mold 17 can just be inserted into the avoidance hole 14 provided on the top plate 12, the hydraulic rod 16 is started to move the upper mold 17 downward, the punch on the upper mold 17 presses the circuit board, until the punch on the upper mold 17 is inserted into the avoidance hole 14, the debris generated when pressing the circuit board follows and falls into the avoidance hole 14, avoiding the debris from adhering to the top plate 12, and no manual cleaning is required. The slag is handled, which reduces the workload of the staff. The avoidance hole 14 is a circular groove structure. The inner diameter of the avoidance hole 14 is equal to the punch diameter set on the lower surface of the upper mold 17, and the avoidance hole 14 corresponds to the through groove 5 opened on the base 1 one by one. The through groove 5 is a circular groove structure. The through groove 5 passes through the base 1 and is connected with the waste chip groove 6. The waste chip groove 6 is a square groove structure. The debris generated when pressing the circuit board follows and falls into the avoidance hole 14, passes through the through groove 5 and falls into the waste chip groove 6. The staff only needs to clean the debris in the waste chip groove 6, which greatly reduces the burden on the staff and improves the processing efficiency of the device.

[0032] In actual use, the punch on the upper mold 17 presses the circuit board until the punch on the mold 17 is stuck in the avoidance hole 14, and the top plate 12 moves downward and is stuck in the base 1. At this time, the handle 13 is just stuck in the card slot 3, and the avoidance hole 14 is just connected to the through slot 5. The debris generated when pressing the circuit board follows and falls into the avoidance hole 14, passes through the through slot 5 and falls into the waste chip slot 6. The staff only needs to clean the debris in the waste chip slot 6, which greatly reduces the burden on the staff, improves the safety of the staff when using the device, and improves the production efficiency. If the plate 12 or the spring 11 is damaged, the staff can unscrew the bolts on the mounting frame 2, remove the top plate 12 and the mounting frame 2 from the base 1 along the mounting groove 4, and unscrew the bolts on the connecting plate 7 to release the lock between the mounting frame 2 and the top plate 12, and separate the mounting frame 2 from the top plate 12. The staff can replace the spring 11 in the mounting frame 2 or repair the top plate 12 according to the actual situation, and then assemble the mounting frame 2, the top plate 12 and the base 1. The demoulding device adopts a modular structure, which is convenient for the staff's later maintenance work and improves the use effect of the device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A demoulding mechanism, characterized in that: The demoulding mechanism comprises: a base (1), a waste chip groove (6) is provided on the side of the base (1), and a plurality of mounting grooves (4) are provided on the inner wall side of the base (1); A mounting frame (2), wherein a limiting groove (8) is provided on the inner side of the mounting frame (2), and a spring (11) is provided on the mounting frame (2); A connecting plate (7), wherein the connecting plate (7) is in a square plate-like structure, the connecting plate (7) and the top plate (12) are fixed as a whole by bolts, the top plate (12) is in a square plate-like structure, a plurality of handles (13) are fixedly connected to the side of the top plate (12), and when the top plate (12) moves downward, the handles (13) can just be inserted into the slots (3), and a plurality of avoidance holes (14) are provided on the top plate (12); The avoidance hole (14) is in a circular groove-like structure, the inner diameter of the avoidance hole (14) is equal to the diameter of the punch arranged on the lower surface of the upper die (17), and the avoidance hole (14) corresponds one-to-one with the through groove (5) provided on the base (1), the through groove (5) is in a circular groove-like structure, the through groove (5) passes through the base (1) and communicates with the waste chip groove (6), and the waste chip groove (6) is in a square groove-like structure.

2. A demoulding mechanism according to claim 1, characterized in that: The installation groove (4) is a "convex" groove structure, the installation frame (2) can be inserted into the installation groove (4) and the installation frame (2) can be fixed to the base (1) using bolts, and the base (1) is fixedly connected to the bracket (15).

3. A demoulding mechanism according to claim 1, characterized in that: The limiting groove (8) is in a convex groove structure, the limiting block (9) is slidably connected to the limiting groove (8), the limiting block (9) can slide up and down along the limiting groove (8), and the side surface of the limiting block (9) is fixedly connected to the movable plate (10).

4. A demoulding mechanism according to claim 1, characterized in that: The spring (11) is fixedly connected to the mounting frame (2), and the other end of the spring (11) is fixedly connected to the moving plate (10). The moving plate (10) is a "cross"-shaped plate structure, and a connecting plate (7) is fixedly connected to the upper surface of the moving plate (10).

5. A demoulding mechanism according to claim 2, characterized in that: The bracket (15) is fixedly connected to the hydraulic rod (16), the telescopic end of the hydraulic rod (16) is fixedly connected to the upper mold (17), and the punch arranged on the lower surface of the upper mold (17) can just be inserted into the avoidance hole (14) arranged on the top plate (12).

6. A heat dissipation mold for circuit board manufacturing, characterized in that: It comprises the demoulding mechanism described in any one of claims 1 to 5.

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