Magnetron sputtering target gun with high sputtering rate

Abstract

The utility model relates to the technical field of magnetron sputtering, and particularly discloses a high-sputtering-rate magnetron sputtering target gun which comprises a target seat, an anode cover body arranged on the outer side of the target seat, a target material body mounted in a mounting groove, a copper back plate arranged on the upper side of the bottom end of the target seat, and a target material gland arranged on the outer side of the bottom end of the target seat, a magnetic ring is further arranged between the first cooling copper table and the second cooling copper table, a magnetic yoke is installed at the upper end of the second cooling copper table, a connecting aluminum table is installed at the upper end of the magnetic yoke, and an insulator is arranged on the outer side of the connecting aluminum table. According to the utility model, the spatial position of the permanent magnet magnetic steel and the structure of the target gun are optimized, so that the magnetic intensity penetrating through the surface of a target material is guaranteed, the magnetic field intensity of a magnetic control plasma area is high, the magnetic control effect is more obvious, the sputtering rate of magnetron sputtering is greatly improved, the production efficiency of magnetron sputtering is also improved, and the production cost is reduced. And for a magnetic material which cannot be sputtered by common magnetron sputtering, sputtering deposition can also be carried out, so that the application range of magnetron sputtering is wider.

Description

Technical Field

[0001] The utility model belongs to the technical field of magnetron sputtering, and in particular relates to a high sputtering rate magnetron sputtering target gun. Background Art

[0002] Magnetron sputtering technology is a physical vapor deposition technology. Due to its advantages such as fast deposition speed, low substrate temperature rise, dense and uniform thin film, easy operation and environmental protection, it is widely used in many fields from basic research to industrial application.

[0003] Magnetron sputtering technology is a process in which argon gas is generally introduced under vacuum conditions. During the process in which electrons are accelerated to fly toward the substrate under the action of an electric field, they collide with argon atoms and ionize a large number of argon ions and electrons. The argon ions are accelerated to bombard the target material under the action of the electric field, sputtering out target atoms or ions, which are deposited on the substrate to form a continuous film. In this process, electrons and secondary electrons are constrained by the magnetic field and bound to the cathode surface to perform three-dimensional spiral motion, which greatly increases the probability of electron ionization of argon atoms, forms a very dense plasma, and greatly improves the sputtering deposition rate. Since the magnetic strength of the permanent magnet steel is limited and the spatial distance has a huge impact on the weakening of the magnetic field strength, the existing magnetron sputtering target gun has limitations in terms of structural size. The cathode target surface is already far away from the steel, and the magnetic field strength that can penetrate the target surface is limited. Especially for magnetic targets, the magnetic field is almost completely shielded, resulting in an extremely low sputtering rate, which affects use. Utility Model Content

[0004] The utility model aims to provide a high sputtering rate magnetron sputtering target gun to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A high sputtering rate magnetron sputtering target gun, comprising:

[0007] A target seat, an anode cover is arranged on the outside of the target seat, and its function is to prevent the sputtering of non-target parts by utilizing the principle of the dark area of ​​the sputtering cathode, so as to improve the purity of the film. Furthermore, the anode cover can adjust the gap between it and the target body, and cannot be completely fitted with the target body. A mounting groove is arranged at the bottom end of the target seat, and the target body is installed inside the mounting groove. A copper back plate is arranged on the upper side of the bottom end of the target seat. The overall thickness of the copper back plate is relatively thin while ensuring the structural strength, so that the target gun has higher magnetic field penetration and higher sputtering rate. The copper back plate is located at the upper end of the target body, and a target pressure cover is arranged on the outside of the bottom end of the target seat. A cooling copper platform 2 is arranged in the middle of the upper end of the copper back plate. A magnetic column is arranged inside the cooling copper platform 2, a cooling copper platform 1 is arranged outside the cooling copper platform 2, a magnetic ring is arranged between the cooling copper platform 1 and the cooling copper platform 2, a magnetic yoke is installed on the upper end of the cooling copper platform 2, the magnetic yoke plays the role of magnetic conduction and strengthening the magnetic field, thereby increasing the magnetic field penetration of the target gun, a connecting aluminum platform is installed on the upper end of the magnetic yoke, the connecting aluminum platform needs to be connected to the sputtering power supply to transmit high voltage, so an insulator is arranged on its outer side, a sealing pressure plate is arranged on the upper end of the connecting aluminum platform, and the sealing performance is achieved by squeezing the rubber ring below by tightening the sealing pressure plate with screws, an insulator is arranged on the outer side of the connecting aluminum platform, which plays an insulating role, and a water channel interface is also connected to the inside of the cooling copper platform 2.

[0008] Preferably, an internal thread is provided on the inner side of the target cover, and an external thread connected to the target cover is provided on the outer side of the bottom end of the target seat. The target cover is threadedly connected to the target seat to facilitate its installation, and a through hole is provided in the middle of the bottom end of the target cover.

[0009] Preferably, the magnetic rings are arranged in multiple groups, and the multiple groups of magnetic rings are evenly distributed on the outer side of the cooling copper platform 2 and the inner side of the cooling copper platform 1. The magnetic rings are arranged in a cylindrical structure, and the cooling copper platform 1 and the cooling copper platform 2 are fitted together by tightly embedded magnetic rings.

[0010] Preferably, the upper and lower ends of the cooling copper platform 1 and the cooling copper platform 2 are both provided with rubber ring installation grooves, and rubber rings are installed inside the rubber ring installation grooves, which can play the role of vacuum sealing and water channel sealing, thereby improving the sealing.

[0011] Preferably, a through hole is provided inside the second cooling copper platform, and the upper end of the magnetic column passes through the through hole and is connected to the magnetic yoke, and the magnetic yoke and the magnetic column are adsorbed together by mutual magnetism.

[0012] Preferably, an annular groove is provided inside the upper end of the target seat, a retaining ring is provided inside the annular groove, and the retaining ring is located at the upper end of the sealing pressure plate.

[0013] Preferably, the insulator includes an insulating sleeve and a sealed insulating platform. The insulating sleeve is provided on the outer side of the connecting aluminum platform and is located at the outer end of the target seat. The sealed insulating platform is installed on the upper end of the connecting aluminum platform and is located at the upper end of the insulating sleeve to play an insulating role. The anode cover is sleeved on the outer side of the sealed insulating platform.

[0014] Preferably, a bottom connecting flange is installed on the upper end of the sealing insulating platform and connected by bolts. The bottom connecting flange is located inside the upper end of the anode cover body to play a sealing role. A through hole is also provided inside the bottom connecting flange. A rubber ring mounting groove 1 is provided on the upper end of the sealing insulating platform. A rubber ring 1 is installed inside the rubber ring mounting groove 1. The rubber ring 1 is located between the bottom connecting flange and the sealing insulating platform to play a sealing role.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The design of the utility model optimizes the spatial position of the permanent magnet magnetic steel and the structure of the target gun, so that the magnetic strength penetrating the target surface is guaranteed, the magnetic field strength in the magnetron plasma region is high, the magnetron effect is more significant, the sputtering rate of magnetron sputtering is greatly improved, and the production efficiency of magnetron sputtering is also improved. For magnetic materials that cannot be sputtered by general magnetron sputtering, sputtering deposition can also be performed, which makes the application range of magnetron sputtering wider. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0019] Figure 3 It is another perspective schematic diagram of the utility model;

[0020] In the figure: 1. anode cover; 2. copper back plate; 3. target material pressure cover; 4. target seat; 5. sealing pressure plate; 6. insulating sleeve; 7. sealing insulating platform; 8. bottom connecting flange; 9. rubber ring 1; 10. retaining ring; 11. connecting aluminum platform; 12. magnetic yoke; 13. cooling copper platform 1; 14. cooling copper platform 2; 15. target material body; 16. water channel interface; 17. magnetic column; 18. magnetic ring. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example:

[0023] See also Figure 1-Figure 3 As shown, a high sputtering rate magnetron sputtering target gun comprises:

[0024] A target seat 4 is provided with an anode cover 1 on the outside of the target seat 4, and its function is to prevent sputtering of non-target parts by utilizing the principle of sputtering cathode dark area, so as to improve the purity of the film. Furthermore, the anode cover 1 can adjust the gap between it and the target body 15, and cannot be completely fitted with the target body 15. A mounting groove is provided at the bottom end of the target seat 4, and the target body 15 is installed inside the mounting groove. A copper back plate 2 is provided on the upper side of the bottom end of the target seat 4. The copper back plate 2 is thinner overall while ensuring the structural strength, so that the target gun has higher magnetic field penetration and higher sputtering rate. The copper back plate 2 is located at the upper end of the target body 15, and a target pressure cover 3 is provided on the outside of the bottom end of the target seat 4. A cooling copper platform 14 is provided in the middle of the upper end of the copper back plate 2. The cooling copper platform 14 A magnetic column 17 is arranged inside, a cooling copper platform 13 is arranged outside the cooling copper platform 2 14, a magnetic ring 18 is arranged between the cooling copper platform 13 and the cooling copper platform 2 14, a magnetic yoke 12 is installed on the upper end of the cooling copper platform 2 14, the magnetic yoke 12 plays the role of magnetic conduction and strengthening the magnetic field, thereby increasing the magnetic field penetration of the target gun, an aluminum platform 11 is installed on the upper end of the yoke 12, and the aluminum platform 11 needs to be connected to the sputtering power supply to transmit high voltage, so an insulator is arranged on its outer side, a sealing pressure plate 5 is arranged on the upper end of the aluminum platform 11, and the sealing performance is achieved by squeezing the rubber ring below by tightening the sealing pressure plate 5 with screws, an insulator is arranged on the outer side of the aluminum platform 11, and plays an insulating role, and the interior of the cooling copper platform 2 14 is also connected to a water channel interface 16.

[0025] The magnetron sputtering gun works on the principle of the combined action of magnetic field and electric field. Under the action of the electric field, the space electrons are accelerated to fly to the substrate and collide with the sputtering gas atoms. If the electrons have enough energy, they will ionize sputtering ions and generate electrons. When the electrons fly to the substrate, the sputtering ions are accelerated to fly to the target body 15 under the action of the electric field and bombard the surface of the target body 15 with high energy, causing the target body 15 to sputter.

[0026] The design of the present application optimizes the spatial position of the permanent magnet magnetic steel and the structure of the target gun, so that the magnetic field can penetrate the target material in large quantities, making the magnetron effect more significant and greatly improving the sputtering rate of magnetron sputtering. The utility model is a high sputtering rate magnetron sputtering target gun, which is the core component of the magnetron sputtering equipment. It overcomes the shortcomings of the original sputtering technology that it is difficult to sputter and deposit magnetic materials, and further improves the sputtering rate of non-magnetic materials, making its application range in integrated circuits, semiconductors and other fields more extensive.

[0027] refer to Figure 1-Figure 3 As shown, the inner side of the target cover 3 is provided with an internal thread, and the outer side of the bottom end of the target seat 4 is provided with an external thread connected to the target cover 3. The target cover 3 is threadedly connected to the target seat 4, which is convenient for installation. A through hole is opened in the middle of the bottom end of the target cover 3.

[0028] refer to Figure 1-Figure 3 As shown, the magnetic rings 18 are arranged in multiple groups, and the multiple groups of magnetic rings 18 are evenly distributed on the outer side of the cooling copper platform 2 14 and the inner side of the cooling copper platform 1 13. The magnetic rings 18 are arranged in a cylindrical structure, and the cooling copper platform 1 13 and the cooling copper platform 2 14 are fitted together by the tightly embedded magnetic rings 18.

[0029] refer to Figure 1-Figure 3 As shown, the upper and lower ends of the cooling copper platform 1 13 and the cooling copper platform 2 14 are provided with rubber ring installation grooves, and rubber rings are installed inside the rubber ring installation grooves, which can play the role of vacuum sealing and water channel sealing, thereby improving the sealing.

[0030] refer to Figure 1-Figure 3 As shown, a through hole is provided inside the second cooling copper platform 14, and the upper end of the magnetic column 17 passes through the through hole and is connected to the magnetic yoke 12, and the magnetic yoke 12 and the magnetic column 17 are attracted together by mutual magnetism.

[0031] refer to Figure 1-Figure 3 As shown, an annular groove is provided inside the upper end of the target base 4 , and a retaining ring 10 is provided inside the annular groove. The retaining ring 10 is located at the upper end of the sealing pressure plate 5 .

[0032] refer to Figure 1-Figure 3 As shown, the insulator includes an insulating sleeve 6 and a sealed insulating platform 7. The insulating sleeve 6 is arranged on the outer side of the connecting aluminum platform 11, and the insulating sleeve 6 is located at the outer end of the target seat 4. The sealed insulating platform 7 is installed on the upper end of the connecting aluminum platform 11, and the sealed insulating platform 7 is located at the upper end of the insulating sleeve 6, which can play an insulating role. The anode cover body 1 is sleeved on the outer side of the sealed insulating platform 7.

[0033] refer to Figure 1-Figure 3As shown, a bottom connecting flange 8 is installed at the upper end of the sealing insulating platform 7, which is connected by bolts. The bottom connecting flange 8 is located inside the upper end of the anode cover 1 to play a sealing role. A through hole is also provided inside the bottom connecting flange 8. A rubber ring mounting groove 1 is provided at the upper end of the sealing insulating platform 7. A rubber ring 9 is installed inside the rubber ring mounting groove 1. The rubber ring 9 is located between the bottom connecting flange 8 and the sealing insulating platform 7 to play a sealing role.

[0034] The design of the utility model optimizes the spatial position of the permanent magnet magnetic steel and the structure of the target gun, so that the magnetic strength penetrating the target surface is guaranteed, the magnetic field strength in the magnetron plasma region is high, the magnetron effect is more significant, the sputtering rate of magnetron sputtering is greatly improved, and the production efficiency of magnetron sputtering is also improved. For magnetic materials that cannot be sputtered by general magnetron sputtering, sputtering deposition can also be performed, which makes the application range of magnetron sputtering wider.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high sputtering rate magnetron sputtering target gun, characterized in that: include: A target seat (4), wherein an anode cover (1) is arranged on the outer side of the target seat (4), a mounting groove is provided at the bottom end of the target seat (4), a target body (15) is installed inside the mounting groove, a copper back plate (2) is arranged on the upper side of the bottom end of the target seat (4), the copper back plate (2) is located at the upper end of the target body (15), a target pressure cover (3) is arranged on the outer side of the bottom end of the target seat (4), a cooling copper platform (14) is arranged in the middle of the upper end of the copper back plate (2), and a magnetic column (17) is arranged inside the cooling copper platform (14) A cooling copper platform (13) is arranged outside the cooling copper platform (14), a magnetic ring (18) is arranged between the cooling copper platform (13) and the cooling copper platform (14), a yoke (12) is installed at the upper end of the cooling copper platform (14), a connecting aluminum platform (11) is installed at the upper end of the yoke (12), a sealing pressure plate (5) is arranged at the upper end of the connecting aluminum platform (11), an insulator is arranged on the outer side of the connecting aluminum platform (11), and a water channel interface (16) is also connected to the inside of the cooling copper platform (14).

2. The high sputtering rate magnetron sputtering target gun according to claim 1, characterized in that: The target cover (3) is provided with an internal thread on the inner side, and the target seat (4) is provided with an external thread on the outer side of the bottom end thereof, the target cover (3) is threadedly connected to the target seat (4), and a through hole is provided in the middle of the bottom end thereof.

3. The high sputtering rate magnetron sputtering target gun according to claim 2, characterized in that: The magnetic rings (18) are arranged in a plurality of groups, and the plurality of groups of magnetic rings (18) are evenly distributed on the outer side of the second cooling copper platform (14) and the inner side of the first cooling copper platform (13).

4. The high sputtering rate magnetron sputtering target gun according to claim 3, characterized in that: The upper and lower ends of the cooling copper platform 1 (13) and the cooling copper platform 2 (14) are both provided with rubber ring installation grooves, and rubber rings are installed inside the rubber ring installation grooves.

5. The high sputtering rate magnetron sputtering target gun according to claim 4, characterized in that: A through hole is provided inside the second cooling copper platform (14), and the upper end of the magnetic column (17) passes through the through hole and is connected to the magnetic yoke (12).

6. The high sputtering rate magnetron sputtering target gun according to claim 5, characterized in that: An annular groove is provided inside the upper end of the target seat (4), a retaining ring (10) is provided inside the annular groove, and the retaining ring (10) is located at the upper end of the sealing pressure plate (5).

7. The high sputtering rate magnetron sputtering target gun according to claim 6, characterized in that: The insulator comprises an insulating sleeve (6) and a sealed insulating platform (7); the insulating sleeve (6) is arranged on the outer side of the connecting aluminum platform (11); the insulating sleeve (6) is located at the outer end of the target seat (4); the sealed insulating platform (7) is installed on the upper end of the connecting aluminum platform (11); the sealed insulating platform (7) is located at the upper end of the insulating sleeve (6); and the anode cover (1) is sleeved on the outer side of the sealed insulating platform (7).

8. The high sputtering rate magnetron sputtering target gun according to claim 7, characterized in that: A bottom connecting flange (8) is installed at the upper end of the sealing insulating platform (7), and the bottom connecting flange (8) is located inside the upper end of the anode cover (1). A through hole is also provided inside the bottom connecting flange (8). A rubber ring installation groove 1 is provided at the upper end of the sealing insulating platform (7), and a rubber ring 1 (9) is installed inside the rubber ring installation groove 1. The rubber ring 1 (9) is located between the bottom connecting flange (8) and the sealing insulating platform (7).

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