Sample stage suitable for SALD equipment

By adopting the combination of anti-slip structure and thimble on the sample table of the SALD equipment, the incompatibility problem of substrates of different materials when moving on the sample table is solved, and the stable fixation of the substrate and the uniformity of ALD reaction are achieved.

CN222878082UActive Publication Date: 2025-05-16KUNSHAN GCL OPTOELECTRONIC MATERIAL CO LTD
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Patent Information

Application Number
CN202421499020.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-05-16
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

When the sample table of the existing SALD equipment processes substrates of different materials, the substrates undergo relative movement in the sample tank due to different thermal expansion coefficients, resulting in uneven ALD reaction and damage to the substrate; while the use of a limiting device will affect the air flow above the substrate, resulting in uneven film layer.

Method used

A sample table suitable for SALD equipment is designed, using an anti-slip structure and a combination of thimble. The limit fixation and loading and unloading of the substrate through the through hole and driving mechanism is achieved, avoiding the influence of the limiting device on the air flow, and is compatible with substrates of different sizes and materials.

Benefits of technology

Compatibility with substrates of different materials is achieved, relative movement and airflow of substrates are avoided, and uniformity of ALD reaction and stability of substrates are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a sample stage suitable for SALD equipment, which comprises a sample stage, a driving mechanism and a plurality of thimbles, the sample stage is provided with a first surface and a second surface which are arranged back to back along a first direction, the first surface is used for bearing a sample and is provided with a plurality of through holes, and the thimbles are arranged in the through holes. The through hole penetrates through the sample table along the first direction and is communicated with the second surface; each ejector pin corresponds to one through hole, the ejector pins are in transmission connection with the driving mechanism, and the ejector pins can be driven by the driving mechanism to move in the through holes in the first direction. The sample stage suitable for the SALD equipment provided by the utility model can be compatible with substrates of different sizes and substrates of different materials, and has strong applicability.
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Description

Technical Field

[0001] The utility model belongs to the technical field of atomic layer deposition equipment, and in particular relates to a sample table suitable for SALD equipment. Background Art

[0002] In atomic layer deposition (ALD), precursors are sequentially deposited onto the substrate via short pulses while being physically separated by an intermediate purge step. Spatial atomic layer deposition (SALD) is a variant of ALD, where film growth is achieved by exposing the substrate to locations containing different precursors via the movement of the sample stage. Typically, the movement direction of the SALD sample stage is perpendicular to the injection direction of the precursors, which requires a faster movement speed of the sample stage to prevent the reciprocating movement of the sample stage from entraining the precursor molecules from the injected area to the area where another precursor is injected. The substrate is fixed on the sample stage and reciprocates with the sample stage.

[0003] There are two existing methods for fixing the substrate. One is to place the substrate into a sample slot on a sample stage, and the other is to limit the movement of the substrate with a limiting device.

[0004] The disadvantage of method 1 is that the thermal expansion coefficients of substrates of different materials are different. For a single material substrate (such as aluminum alloy, the thermal expansion coefficient is 22.3-23.9*10 -6 / ℃) is not compatible with other materials with large differences in thermal expansion coefficients (such as nickel-chromium steel, 14*10 -6 / ℃). Assuming that the sample stage size is determined based on the thermal expansion coefficient of aluminum alloy, when the substrate is replaced with glass with a smaller thermal expansion coefficient, the sample will move relative to the groove and continue to hit both sides, causing uneven ALD reaction and substrate breakage. If it is replaced with a material with a larger thermal expansion coefficient (such as aluminum alloy, the thermal expansion coefficient is 22.3-23.9*10 -6 / ℃), the sample cannot fall into the groove.

[0005] Although the second method can reduce the influence of thermal expansion by fine-tuning the limiting device, the existence of the limiting device will inevitably affect the airflow above the substrate, which may easily lead to uneven film layer on the substrate. Utility Model Content

[0006] In view of the deficiencies of the prior art, the purpose of the utility model is to provide an anti-slip device and a sample stage which are compatible with the size of a substrate and do not require a limiter.

[0007] In order to achieve the above-mentioned utility model purpose, the technical solution adopted by the utility model includes:

[0008] A sample stage suitable for SALD equipment comprises a sample stage, a through hole, an anti-slip structure, a driving mechanism and an ejector pin.

[0009] The sample stage has a first surface and a second surface arranged back to back along a first direction, the first surface is used to carry the sample, and the first surface is provided with a plurality of through holes, the through holes penetrate the sample stage along the first direction and are connected to the second surface, an anti-slip structure is also provided in the through hole, and the top of the anti-slip structure protrudes above the first surface.

[0010] Each of the ejector pins corresponds to a through hole, and the ejector pin is in transmission connection with the driving mechanism. The ejector pin can move along the first direction in the through hole under the drive of the driving mechanism. The top of the ejector pin can extend above the first surface. The top surfaces of the plurality of ejector pins can form a bearing structure for bearing samples, and the plurality of ejector pins can also be enclosed on the first surface to form a limiting structure that limits the movement of the sample.

[0011] Furthermore, the anti-slip structure includes a first part and a second part, the first part is arranged in the through hole, and the second part is protruded from the first surface.

[0012] Furthermore, the through hole includes a first hole segment and a second hole segment arranged in sequence along its own axial direction, the first hole segment is directly connected to the first surface, the second hole segment is directly connected to the second surface, and a part of the anti-slip structure is arranged in the first hole segment.

[0013] Furthermore, the diameter of the first hole section is greater than the diameter of the second hole section.

[0014] Furthermore, the anti-slip structure is an annular structure, and the inner diameter of the anti-slip structure is equal to the diameter of the second hole section.

[0015] Furthermore, the ejector pin in the through hole is clearance-matched with the hole wall and the anti-slip structure of the through hole.

[0016] Furthermore, the anti-slip structure includes a heat-resistant rubber ring.

[0017] Furthermore, the ejector pin comprises an ejector rod and a head structure protruding from the top of the ejector rod, and the head structure is a smooth curved surface structure.

[0018] Furthermore, the head structure includes an anti-slip rubber head.

[0019] Furthermore, a sample groove is arranged on the first surface of the sample stage, and a plurality of through holes are arranged on the bottom surface of the sample groove.

[0020] Furthermore, the plurality of through holes are distributed in an array.

[0021] Compared with the prior art, the advantages of the utility model include:

[0022] 1) The sample stage suitable for SALD equipment provided by the utility model has an anti-slip structure and an ejector pin to achieve position limiting and fixing of the substrate, which is compatible with substrates of different sizes and can be applied to substrates of different materials, and has strong applicability.

[0023] 2) The sample stage suitable for SALD equipment provided by the utility model can have a pin that can move up and down along the through hole to lift and lower the substrate, that is, to load and unload the substrate.

[0024] 3) The sample stage suitable for SALD equipment provided by the utility model can enclose a limiting structure on the first surface to limit the movement of the sample when one top pin corresponds to one driving mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a front view of a first embodiment of a sample stage suitable for a SALD device provided by the utility model;

[0026] Figure 2 This is a bottom view of a first embodiment of a sample stage suitable for a SALD device provided by the utility model;

[0027] Figure 3 This is a top view of a first embodiment of a sample stage suitable for a SALD device provided by the utility model;

[0028] Figure 4 It is a cross-sectional view of AA;

[0029] Figure 5 yes Figure 4 A partial enlarged view of

[0030] Figure 6 This is a front view of a second embodiment of a sample stage suitable for a SALD device provided by the utility model;

[0031] Figure 7 This is a top view of a second embodiment of a sample stage suitable for a SALD device provided by the utility model;

[0032] Figure 8 It is a cross-sectional view of BB;

[0033] Fig. 9 yes Figure 8 A partial enlarged view of

[0034] Explanation of the reference numerals: 2. Anti-slip structure; 3. Through hole; 4. Ejector pin; 5. Sample stage; 6. Bump; 7. Ejector rod; 8. Head structure. DETAILED DESCRIPTION

[0035] In view of the deficiencies in the prior art, the inventor of the present invention has proposed the technical solution of the present invention after long-term research and extensive practice. The technical solution, its implementation process and principle will be further explained as follows.

[0036] An embodiment of the utility model provides a sample stage suitable for a SALD device, comprising a sample stage, a through hole, an anti-slip structure, a driving mechanism and an ejector pin.

[0037] The sample stage has a first surface and a second surface arranged in opposite directions along a first direction, the first surface is used to carry the sample, and the first surface is provided with a plurality of through holes, the through holes penetrate the sample stage along the first direction and are connected to the second surface, the through holes include a first hole segment and a second hole segment arranged in sequence along the axial direction thereof, the first hole segment is directly connected to the first surface, and the second hole segment is directly connected to the second surface. The diameter of the first hole segment is greater than the diameter of the second hole segment. Preferably, the plurality of through holes are distributed in an array.

[0038] The through hole is also provided with an anti-slip structure, and the anti-slip structure includes a first part and a second part, the first part is provided in the first hole segment, and the second part is exposed on the first surface. Specifically, the shape of the anti-slip structure is set according to the shape of the first hole segment, and the anti-slip structure can be an annular structure, a square structure or an anisotropic structure, preferably an annular structure, and the inner diameter of the anti-slip structure is equal to the diameter of the second hole segment. When fixing the substrate, the substrate is placed on the top of the anti-slip structure, and the anti-slip friction force generated between the substrate and the anti-slip structure is used to fix the substrate. The anti-slip structure can be an anti-slip body with a concave-convex structure or a rubber ring. Preferably, the anti-slip structure is a rubber ring because, after the substrate is placed on the rubber ring, the rubber ring will be pressed downward and deformed due to the weight of the substrate itself, thereby increasing the contact area between the substrate and the rubber ring, thereby increasing the friction between the substrate and the rubber ring, so that the effect of fixing the substrate is better. More specifically, the anti-slip structure includes a heat-resistant rubber ring because the ALD equipment usually needs to be heated at a temperature of 100-180°C. The sample stage is in the chamber and is in a heated state for a long time, so the anti-slip structure must be able to withstand long-term heat. The anti-slip structure is preferably silicone (such as methyl vinyl silicone rubber (MVQ)), or methyl vinyl silicone rubber (MVQ), fluororubber, hydrogenated nitrile rubber (HNBR), etc.

[0039] Each of the ejector pins corresponds to a through hole, and the ejector pins are in transmission connection with the driving mechanism. The ejector pins can move in the through hole along the first direction under the drive of the driving mechanism, and the top of the ejector pins can extend above the first surface. The top surfaces of the plurality of ejector pins can form a bearing structure for bearing samples, and the plurality of ejector pins can also enclose the first surface to form a limiting structure for limiting the movement of samples. At the same time, the driving mechanism drives the ejector pins to move up and down to achieve lifting and lowering of the substrate (i.e., loading and unloading of the substrate). After the ejector pin 4 lifts the substrate, the substrate does not contact the anti-slip structure 2, and unloading is achieved; when the substrate needs to be limited and fixed, the ejector pin 4 descends until its upper end surface is on the same plane as the upper end surface of the anti-slip structure 2, and the ejector pin 4 cooperates with the anti-slip structure 2 to fix the substrate, and the substrate is loaded.

[0040] The ejector pin in the through hole is in clearance fit with the hole wall and the anti-slip structure of the through hole.

[0041] Specifically, the driving end of the driving mechanism is provided with a connecting plate, and one ejector pin may correspond to one connecting plate, or multiple ejectors may be fixed on one connecting plate. The driving mechanism may be a cylinder or a motor driving a lead screw.

[0042] Specifically, the ejector pin includes an ejector pin and a head structure protruding from the top of the ejector pin, wherein the head structure is a smooth curved surface structure, and more specifically, the head structure 8 is an anti-slip rubber head, which can increase the friction between the ejector pin and the substrate under the gravity of the substrate, thereby fixing the substrate.

[0043] In some embodiments, a sample slot is disposed on the first surface of the sample stage, and a plurality of through holes are disposed on the bottom surface of the sample slot.

[0044] Embodiment 1:

[0045] like Figure 1-5 As shown, a sample stage 5 suitable for a SALD device comprises a sample stage 5, wherein the sample stage 5 has a first surface and a second surface arranged back to back along a first direction, the first surface is provided with 16 circular through holes 3, the through holes 3 penetrate the sample stage 5 along the first direction and are connected to the second surface, the through holes 3 comprise a first hole segment and a second hole segment sequentially arranged along the axial direction thereof, the first hole segment is directly connected to the first surface, the second hole segment is directly connected to the second surface, a heat-resistant and anti-slip rubber ring is arranged in the through hole 3, the heat-resistant and anti-slip rubber ring comprises a first part and a second part, the first part is arranged in the first hole segment, and the second part is protruded from the first surface.

[0046] An ejector pin 4 is arranged in the second hole section. The ejector pin 4 includes an ejector rod 7 and a rubber head 8 protruding from the top of the ejector rod 7. One end of the ejector rod 7 away from the rubber head is transmission-connected to a motor. Driven by the motor, the ejector pin 4 moves up and down in the circular hole.

[0047] Embodiment 2:

[0048] like Figure 6-9 As shown, a sample stage 5 suitable for a SALD device comprises a sample stage 5, on which 25 square through holes 3 are arranged in an array at equal intervals, the square through holes 3 comprise a first square hole segment and a second square hole segment, a square rubber ring is arranged in the first square hole segment, the square rubber ring comprises a first part and a second part, the first part is arranged in the first hole segment, the second part is protruded from the first surface, a square ejector pin 4 is arranged in the second hole segment, the square ejector pin 4 comprises an ejector rod 7 and a lifting head arranged on the ejector rod 7, a protrusion 6 is arranged at one end of the lifting head away from the ejector rod 7.

[0049] Embodiment three:

[0050] A motor is arranged below the ejector pin 4 , a screw rod is connected to the driving end of the motor, a connecting plate is connected to the screw rod, and a plurality of ejector pins 4 are fixed on the connecting plate.

[0051] In this embodiment, a plurality of ejector pins 4 are driven to rise and fall synchronously by one motor.

[0052] Embodiment 4:

[0053] A motor is arranged below each ejector pin 4 , and a driving end of the motor is connected to a screw rod, which is connected to the ejector pin 4 .

[0054] In this embodiment, each motor drives a pin 4 to move up and down. This control mode can form a restriction structure for restricting the movement of the sample on the first surface by controlling the lifting and lowering of each pin 4.

[0055] It should be understood that the above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A sample stage suitable for a SALD device, characterized in that: include: A sample stage, the sample stage having a first surface and a second surface arranged in opposite directions along a first direction, the first surface being used to carry a sample, and the first surface being provided with a plurality of through holes, the through holes penetrating the sample stage along the first direction and being in conduction with the second surface, an anti-slip structure being further provided in the through holes, the top of the anti-slip structure protruding above the first surface; A driving mechanism and a plurality of ejector pins, each of the ejector pins corresponds to a through hole, the ejector pin is in transmission connection with the driving mechanism, the ejector pin can move along the first direction in the through hole under the drive of the driving mechanism, the top of the ejector pin can extend above the first surface, the top surfaces of the plurality of ejector pins can form a bearing structure for bearing samples, and the plurality of ejector pins can also enclose the first surface to form a limiting structure for limiting the movement of the sample.

2. A sample stage suitable for SALD equipment according to claim 1, characterized in that: The anti-slip structure includes a first part and a second part, the first part is arranged in the through hole, and the second part is protruded from the first surface.

3. A sample stage suitable for SALD equipment according to claim 1, characterized in that: The through hole comprises a first hole segment and a second hole segment sequentially arranged along its axial direction, the first hole segment is directly connected to the first surface, the second hole segment is directly connected to the second surface, and a part of the anti-slip structure is arranged in the first hole segment.

4. A sample stage suitable for SALD equipment according to claim 3, characterized in that: The diameter of the first hole section is greater than the diameter of the second hole section.

5. The sample stage suitable for SALD equipment according to claim 1, characterized in that: The anti-slip structure is an annular structure, and the inner diameter of the anti-slip structure is equal to the diameter of the second hole segment.

6. The sample stage suitable for SALD equipment according to claim 1, characterized in that: The ejector pin in the through hole is in clearance fit with the hole wall and the anti-slip structure of the through hole.

7. The sample stage suitable for SALD equipment according to claim 1, characterized in that: The anti-slip structure comprises a heat-resistant rubber ring.

8. The sample stage suitable for SALD equipment according to claim 1, characterized in that: The ejector pin comprises an ejector rod and a head structure protruding from the top of the ejector rod, and the head structure is a smooth curved surface structure.

9. The sample stage suitable for SALD equipment according to claim 8, characterized in that: The head structure includes an anti-slip rubber head.

10. The sample stage suitable for SALD equipment according to claim 1, characterized in that: A sample groove is provided on the first surface of the sample stage, and a plurality of through holes are provided on the bottom surface of the sample groove; And / or, the plurality of through holes are distributed in an array.