Substrate table cooling device of diamond growth equipment

Abstract

The utility model relates to a substrate table cooling device of diamond growth equipment, which comprises a bottom plate for providing a mounting plane, a first sealing half shell is arranged on the bottom plate, and a detachable growth substrate table capable of limiting a molybdenum support placing space is arranged on the inner bottom surface of the first sealing half shell. The growth substrate table comprises an inner inserting core column and a table base body, the inner inserting core column bearing a molybdenum support is movably arranged in a lifting channel formed in the table base body in a centering mode in a penetrating mode, and a first cooling assembly and a second cooling assembly are arranged in the inner inserting core column and the table base body respectively. According to the utility model, the substrate table can be subjected to partitioned temperature control cooling, so that the growth uniformity and the comprehensive deposition quality of diamonds borne by the substrate table are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diamond growth platforms, in particular to a substrate platform cooling device for diamond growth equipment. Background Art

[0002] At present, the commonly used diamond growth equipment is usually a microwave plasma chemical vapor deposition device. The device deposits plasma-generated reaction gas on the surface of the seed crystal on the tray to form a diamond film. In order to achieve mass production, substrates (such as diamond single crystals) are placed in an array on the substrate table. In order to achieve uniform deposition of diamonds on the surfaces of each substrate, the upper surface temperature of each substrate is required to be kept as consistent as possible during the entire growth process. Therefore, during production, it is necessary to set up a structure that can cool the substrate table and the diamond seed crystals placed on the table in order to promote the growth of the diamond film. A common cooling structure is to set a heat exchange structure at the bottom of the substrate table to transfer heat within the substrate table to reduce its temperature.

[0003] However, during the diamond deposition process when the MPCVD device prepares diamond films, the plasma light in the central area is closer to the substrate, so that the distribution of the plasma energy in the plasma chamber on the substrate stage is strong in the middle and weak at the edge, which will cause the middle temperature above the substrate stage to be high and the edge temperature to be low, making the temperature of the substrate at the center of the substrate stage higher than the temperature of the surrounding substrates. At present, the commonly used cooling structure can usually only perform indiscriminate cooling of the entire substrate stage, and cannot independently control the temperature change of a certain area of ​​the substrate stage, and cannot effectively adapt to the temperature difference control requirements of different areas of the substrate stage. In particular, when process parameters such as cavity air pressure and microwave power change, the temperature field distribution on the substrate stage will also change. The existing cooling components cannot adaptively make zoned temperature reduction adjustments, resulting in the substrate stage still having the defect of uneven temperature in the radial direction, resulting in different growth thicknesses of the diamond film, resulting in large deviations in the quality of the same batch of products, affecting the quality of diamond products and failing to meet the needs of industrial production. Utility Model Content

[0004] The utility model aims to provide a substrate stage cooling device for diamond growth equipment, which can perform zoned temperature control and cooling on a substrate stage to improve the growth uniformity and comprehensive deposition quality of the diamond carried by the substrate stage, so as to solve the problem that the temperature field in the growth area of ​​the existing diamond growth equipment is unevenly distributed and the uniform growth of diamond cannot be guaranteed. Excessively high growth temperature will hinder the high-quality deposition of diamond. In particular, the existing cooling equipment cannot perform zoned temperature control on the substrate stage with a limited diamond growth area, and the overall cooling adjustment achieved by the cooling equipment cannot effectively adapt to the temperature difference control requirements of different areas of the substrate stage, resulting in the defect of radial temperature unevenness on the substrate stage, causing the growth thickness of the diamond film to be different, resulting in a large deviation in the quality of the same batch of products.

[0005] The technical solution adopted by the utility model is: a substrate stage cooling device for diamond growth equipment, including a bottom plate providing a mounting plane, a first sealing half shell is arranged on the bottom plate, a detachable growth substrate stage capable of limiting a molybdenum holder placement space is installed on the inner bottom surface of the first sealing half shell, the growth substrate stage includes an inserted core column and a pedestal body, wherein the inserted core column carrying the molybdenum holder is movably arranged in a lifting channel centrally opened inside the pedestal body, and a first cooling component and a second cooling component are respectively arranged in the inserted core column and the pedestal body.

[0006] According to a preferred embodiment, the first cooling component includes an outer insert tube, an inner insert tube, a sealing column, an active heat dissipation ring plate, a first connecting pipe and a first circulating cooling unit, wherein the outer insert tube is coaxially inserted in the inner insert core column, and the axial lower end of the outer insert tube away from the inner insert core column is connected to the sealing column for sealing its lower port, and the inner insert tube extending into the outer insert tube is coaxially inserted in the sealing column; the active heat dissipation ring plate is laid on the axial upper end surface of the tube cavity of the outer insert tube; the ends of the outer insert tube and the inner insert tube away from the inner insert core column are respectively connected to the inlet and outlet of the first circulating cooling unit through the first connecting pipe.

[0007] According to a preferred embodiment, the portion of the inner tube placed inside the outer tube can separate the tube cavity of the outer tube into an outer reflux annular cavity and an inner inlet cavity defined by the tube body of the inner tube, and the inner inlet cavity is located at the axial upper end of the inner tube and is connected to the outer reflux annular cavity by a heat exchange guide cavity defined by the upper tube cavity of the outer tube.

[0008] According to a preferred embodiment, the chamber top of the heat exchange guide chamber is arranged as an arched dome structure, and a central heat dissipation circular plate located at the center of the curved surface and a plurality of outer heat dissipation ring plates with different radius sizes and sequentially arranged on the outer side of the central heat dissipation circular plate are arranged on the arched dome-shaped cavity wall defined by the heat exchange guide cavity, so that the central heat dissipation circular plate and the outer heat dissipation ring plates cooperate to cover the curved cavity wall.

[0009] According to a preferred embodiment, the second cooling component includes a cooling coil, a plug-in tube and a second circulating cooling unit, wherein the cooling coil is inserted into the pedestal body; the cooling coil also constructs a circulating cooling loop with the second circulating cooling unit by inserting the plug-in tube into the pedestal body.

[0010] According to a preferred embodiment, the cooling coil is constructed by embedding a second active heat sink on the tube wall of a flat tube facing the lifting channel; the plug-in tube extends to the tube body outside the pedestal body and passes through the first sealed half shell and the bottom plate to be connected to the second circulating cooling unit installed on the bottom plate.

[0011] According to a preferred embodiment, the inserted core column passes through the lifting channel, the first sealing half shell and the bottom plate in sequence and is connected to the lifting drive mechanism on the lower side of the bottom plate; a sealing gasket is also provided on the side wall of the column where the inserted core column is wrapped by the first sealing half shell and the bottom plate.

[0012] According to a preferred embodiment, the base plate suspends the second sealing half shell above the first sealing half shell by supporting a lifting support frame on its plate surface, so that the second sealing half shell can be raised and lowered under the control of the lifting support frame to form an adjustable sealing shell cavity with the first sealing half shell.

[0013] According to a preferred embodiment, the first circulating cooling unit is detachably mounted on the lower surface of the base plate.

[0014] According to a preferred embodiment, the lifting drive mechanism includes connecting rods circumferentially connected to the bottom end of the inserted core column, a telescopic drive unit at the lower end of the connecting rod, and a lower plate for mounting the telescopic drive unit.

[0015] The beneficial effects of the utility model are:

[0016] The growth substrate stage provided in the present application can limit the range of microwave reflection while carrying the molybdenum support, so that the diamond can effectively complete the deposition growth within a certain range, and the growth substrate stage can also adjust the relative height difference between the inserted core column and the base body, so as to ensure that the diamond surface on the inserted core column always maintains a relatively stable spacing distance from the plasma light, so as to ensure the quality of deposition and improve the comprehensive performance of diamond. The first cooling component and the second cooling component are respectively used for cooling and temperature control in the present application to ensure that the surface of the inserted core column has a uniform temperature, and at the same time effectively adjust the inner wall temperature of the base body to ensure that the diamond can be effectively deposited and grown in a temperature field with a uniform temperature value. The first cooling component provided in the present application mainly arranges a number of active heat dissipation ring sheets capable of active heat transfer radially within a circular surface, so as to effectively adapt to the actual temperature field distribution in which the temperature in the central area is high and the temperature in the outer ring decreases step by step during the deposition process, so as to perform zone heating according to the actual distribution of the temperature field, so that the temperature of the plane in the entire growth range can maintain a roughly equal parameter state, so as to ensure that the growth thickness of the entire diamond film is roughly equal, thereby improving the growth uniformity and comprehensive deposition quality of the diamond. The present application can also achieve temperature change uniformity of the entire diamond through synchronous cooling and temperature control of the first cooling component and the second cooling component, thereby avoiding the breakage of the diamond wafer due to temperature difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a preferred substrate stage cooling device for diamond growth equipment proposed by the utility model;

[0018] Figure 2 This is a partial enlarged structural schematic diagram of the A region of a substrate stage cooling device of a preferred diamond growth equipment proposed by the utility model;

[0019] Figure 3 It is a partial enlarged structural schematic diagram of the B portion of a substrate stage cooling device of a preferred diamond growth equipment proposed by the utility model;

[0020] Figure 4 It is a plan view of an active heat dissipation ring sheet of a substrate stage cooling device of a preferred diamond growth equipment proposed by the utility model.

[0021] Reference numerals list

[0022] 1: bottom plate; 2: first sealing half shell; 3: second sealing half shell; 4: lifting support frame; 5: growth substrate platform; 6: lifting drive mechanism; 7: first cooling component; 8: second cooling component; 51: inner plug core column; 52: platform body; 511: sealing gasket; 521: lifting channel; 61: connecting support rod; 62: telescopic drive unit; 63: lower plate; 71: outer plug tube; 72: inner plug tube; 73: blocking column; 74: active heat dissipation ring plate; 75: first connecting pipe; 76: first circulating cooling unit; 711: inner layer inlet cavity; 712: outer layer return ring cavity; 713: heat exchange guide cavity; 741: central heat dissipation disc; 742: outer ring heat dissipation ring plate; 81: cooling coil; 82: plug-in tube; 83: second circulating cooling unit; 811: flat tube; 812: second active heat dissipation fin. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the utility model will be briefly introduced below in combination with the drawings and the descriptions of the embodiments or the prior art. Obviously, the following descriptions of the structures of the drawings are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] The technical solution provided by the present invention will be described in detail below by way of embodiments with reference to the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In some examples, some implementation methods are not described or are not described in detail because they belong to existing or conventional technologies.

[0025] In addition, the technical features recorded in this article or the steps of all methods or processes disclosed, except for mutually exclusive features and / or steps, can also be combined in any suitable manner in one or more embodiments. For those skilled in the art, the steps or operation sequence of the methods related to the embodiments provided herein can also be changed. Any order in the drawings and embodiments is only for illustrative purposes and does not imply a requirement to follow a certain order unless it is explicitly stated that a certain order is required.

[0026] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, under reasonable circumstances (not constituting a self-contradiction), include direct and indirect connections (couplings).

[0027] The following is a detailed description with reference to the accompanying drawings.

[0028] Example 1

[0029] The present application provides a substrate stage cooling device for diamond growth equipment, which includes a base plate 1, a first sealing half shell 2, a second sealing half shell 3, a lifting support frame 4, a growth substrate stage 5, a lifting drive mechanism 6, a first cooling component 7 and a second cooling component 8.

[0030] according to Figure 1-4 In a specific embodiment shown, the base plate 1 can be detachably mounted on a working wall or an engineering support to provide an installation plane. A first sealing half shell 2 is arranged on the base plate 1. The base plate 1 suspends the second sealing half shell 3 above the first sealing half shell 2 by supporting the lifting support frame 4 on its plate surface, so that the second sealing half shell 3 can be lifted and lowered under the control of the lifting support frame 4 to form an adjustable sealed shell cavity with the first sealing half shell 2. A detachable growth substrate stage 5 capable of defining a space for placing a molybdenum tray is installed on the inner bottom surface of the first sealing half shell 2. A first cooling component 7 and a second cooling component 8 are respectively arranged in the inserted core column 51 and the base body 52 of the growth substrate stage 5. The first cooling component 7 is provided with a plurality of groups of active heat dissipation ring sheets 74 on the top cavity wall of the heat exchange cavity defined by it close to the upper end surface of the inserted core column 51 in a manner that can perform graded active heat transfer on multiple coaxial annular surfaces. The growth substrate stage 5 provided in the present application can limit the range of microwave reflection while carrying the molybdenum support, so that the diamond can effectively complete the deposition growth within a certain range, and the growth substrate stage 5 can also adjust the relative height difference between the inserted core column 51 and the base body 52, so as to ensure that the diamond surface on the inserted core column 51 always maintains a relatively stable spacing distance from the plasma light, so as to ensure the quality of deposition and improve the comprehensive performance of diamond. The first cooling component 7 and the second cooling component 8 provided in the present application are used for cooling and temperature control respectively to ensure that the surface of the inserted core column 51 has a uniform temperature, and at the same time effectively adjust the inner wall temperature of the base body 52 to ensure that the diamond can be effectively deposited and grown in a temperature field with a uniform temperature value. The first cooling component 7 provided in the present application is mainly to arrange a number of active heat dissipation ring sheets 74 capable of active heat transfer radially within the circular surface, so as to effectively adapt to the actual temperature field distribution in which the temperature in the central area is high and the temperature in the outer ring decreases step by step during the deposition process, so as to perform zone heating according to the actual distribution of the temperature field, so that the temperature of the plane corresponding to the entire growth range can maintain a roughly equal parameter state, so as to ensure that the growth thickness of the entire diamond film is roughly equal, so that the quality of the same batch of products is roughly equal, so as to improve the quality and quality of diamond growth. The present application can also achieve temperature change uniformity of the entire diamond through synchronous cooling and temperature control of the first cooling component 7 and the second cooling component 8, so as to avoid the temperature difference causing the diamond wafer to break.

[0031] Preferably, a transparent observation window can be provided on the second sealing half shell 3, so as to judge the temperature difference according to the color change of the diamond film grown by the seed crystal, so as to adjust the heat dissipation efficiency of different areas, so that the diamond deposited on the entire growth substrate stage 5 can maintain a roughly uniform deposition efficiency.

[0032] Preferably, the growth substrate stage 5 includes an inserted core column 51 and a pedestal body 52. ​​Further preferably, the inserted core column 51 carrying the molybdenum support is movably arranged in a lifting channel 521 centrally opened inside the pedestal body 52. ​​Specifically, the inserted core column 51 passes through the lifting channel 521, the first sealing half shell 2 and the bottom plate 1 in sequence and is connected to the lifting drive mechanism 6 located on the lower side of the bottom plate 1. Specifically, a sealing gasket 511 is also sleeved on the side wall of the column body of the inserted core column 51 wrapped by the first sealing half shell 2 and the bottom plate 1. Preferably, the inserted core column 51 is made of a metal material with strong thermal conductivity, such as copper, aluminum, etc. Preferably, a temperature monitoring element is penetrated in the inserted core column 51 along its radial direction, so as to adjust the power of the active heat dissipation ring sheet 74 corresponding to different areas according to the temperature rise of different areas of the inserted core column 51. The temperature monitoring element can be an infrared detection device radially arranged on the bearing circular surface defined by the inserted core column 51, so as to detect the temperature distribution in the radial direction, so as to effectively measure the temperature uniformity of multiple continuous intervals in the radial direction. The pedestal body 52 provided in the present application can build a shielding fence higher than the inserted core column 51, so as to avoid discharging the seed crystal carried by the molybdenum support on the inserted core column 51 during the reaction process, so as to ensure the stability and continuous effectiveness of the deposition. The inserted core column 51 and the pedestal body 52 provided in the present application can be cooled independently of each other, so as to effectively reduce the temperature of the seed crystal placement space and the diamond growth space defined by the two and the temperature difference between different regions, so that the diamond can achieve uniform and high-quality effective deposition growth within a certain range. The inserted core column 51 is always lower than the pedestal body 52, so that the end face edge defined by it is the boundary of microwave reflection, so as to effectively limit the growth range of diamond. The structure of the growth platform is simplified, and the manufacturing difficulty and production cost of the growth substrate platform 5 are reduced.

[0033] Preferably, the lifting drive mechanism 6 includes a connecting rod 61 connected to the bottom end of the inserted core column 51 at an annular interval, a telescopic drive unit 62 at the lower end of the connecting rod 61, and a lower plate 63 on which the telescopic drive unit 62 is installed. Preferably, the lower plate 63 can be directly set on the working ground or connected to the bottom plate 1. Preferably, the telescopic drive unit 62 used in the present application is a high-precision and small-unit translation drive mechanism, such as a high-precision screw drive, a guide rail drive, etc. Specifically, when driven by a high-precision screw sleeve, it can be used in a state where the inner cross-section of the tube body is circular and fits with the screw, and the outer cross-section of the tube body is polygonal and is movably penetrated in the lower plate 63, and its movement direction is limited by the lower plate 63. The lifting drive mechanism 6 provided in the present application can make the height of the diamond deposited on the inserted core column 51 lower than the top surface height of the pedestal body 52, so as to ensure the stability of the deposition work.

[0034] Preferably, the first cooling assembly 7 comprises an outer insert tube 71, an inner insert tube 72, a blocking column 73, an active heat dissipation ring sheet 74, a first connecting pipe 75 and a first circulating cooling unit 76. Preferably, the outer insert tube 71 is coaxially inserted in the inner insert column 51. Further preferably, the axial lower end of the outer insert tube 71 away from the inner insert column 51 is connected with a blocking column 73 for blocking its lower port. Preferably, an inner insert tube 72 extending into the outer insert tube 71 is coaxially inserted in the blocking column 73. Preferably, an active heat dissipation ring sheet 74 is laid on the axial upper end surface of the tube cavity of the outer insert tube 71. Preferably, the ends of the outer insert tube 71 and the inner insert tube 72 away from the inner insert column 51 are respectively connected to the inlet and outlet of the first circulating cooling unit 76 through the first connecting pipe 75, so that the first circulating cooling unit 76 can form a closed-loop circulating cooling circuit with the heat exchange cavity formed by the inner and outer layer channels of the outer insert tube 71 separated by the inner insert tube 72. The active heat dissipation ring sheet 74 provided in the present application is composed of several semiconductor heat exchanger sheets spliced ​​together, so as to facilitate independent active heat transfer of different strengths and efficiencies, so as to effectively adapt to the state where the temperature distribution of different end surface areas of the inserted core column 51 is different, so as to effectively perform zoned temperature control heat transfer, so that the temperature field of the end surface of the inserted core column 51 is in a uniform numerical state, so that the diamond can be uniformly deposited and grown on the end surface, and the quality and quality of the diamond growth can be guaranteed. The circulating cooling circuit for heat dissipation constructed by the cooperation of the external insert tube 71, the internal insert tube 72, the first connecting tube 75 and the first circulating cooling unit 76 in the present application can continuously and efficiently absorb the temperature transferred by the active heat dissipation ring sheet 74 to ensure the heat transfer efficiency of the active heat dissipation ring sheet 74, so as to efficiently and zone-controlledly complete the cooling of the inserted core column 51.

[0035] Preferably, the part of the inner tube 72 placed in the outer tube 71 can separate the tube cavity of the outer tube 71 into an outer layer return annular cavity 712 and an inner layer inlet cavity 711 defined by the tube body of the inner tube 72. Preferably, the inner layer inlet cavity 711 is located at the axial upper end of the inner tube 72 and the heat exchange guide cavity 713 defined by the upper tube cavity of the outer tube 71 is connected to the outer layer return annular cavity 712. Specifically, the chamber top of the heat exchange guide cavity 713 is set as an arched dome structure. Further preferably, a central heat dissipation disc 741 located at the center of the curved surface defined by the top cavity wall and a plurality of outer heat dissipation ring sheets 742 with different radius sizes and sequentially sleeved on the outside of the central heat dissipation disc 741 are arranged on the arched dome-shaped cavity wall defined by the heat exchange guide cavity 713, so that the central heat dissipation disc 741 and the outer heat dissipation ring sheets 742 cover the curved cavity wall in coordination, thereby realizing the intensity-adjustable partitioned active heat transfer, so as to facilitate the partitioned active heat transfer with gradually increasing temperature according to the condition that the middle temperature of the upper end face of the inserted core column 51 is higher than the edge temperature, so that the inserted core column 51 and the molybdenum support arranged at its upper end can be in a relatively uniform plane temperature state, ensuring the uniformity of diamond growth. The arched dome structure provided in the present application enables the heat transfer fluid input into the heat exchange guide cavity 713 to preferentially and efficiently transfer heat to the central area with higher temperature. In particular, the arched dome structure can also effectively reduce the thickness of the column in the central area, so that the central heat dissipation disc 741 can more quickly and efficiently transfer more heat in the highest temperature range of the central area of ​​the end face of the inserted core column 51, so as to quickly reduce the temperature of this area, thereby achieving temperature uniformity and consistency of the temperature field of the entire end face. The central heat dissipation disc 741 and the outer ring heat dissipation ring sheet 742 set in the present application can efficiently adapt to the temperature field distribution of the inserted core column 51 with a high center temperature and gradually decreasing along its end face radially, so as to more effectively and independently and effectively regulate the temperature of different end face areas of the inserted core column 51, thereby improving the uniformity of temperature parameters, thereby improving deposition uniformity, ensuring that the growth thickness of the diamond film remains roughly consistent, and improving the quality of diamond.

[0036] Preferably, the second cooling assembly 8 includes a cooling coil 81, a plug-in tube 82 and a second circulating cooling unit 83. Preferably, the cooling coil 81 is inserted into the pedestal body 52 to cool down the fence side formed by the pedestal body 52. ​​Preferably, the cooling coil 81 also constructs a circulating cooling loop with the second circulating cooling unit 83 by inserting the plug-in tube 82 into the pedestal body 52. ​​Preferably, the cooling coil 81 is constructed by embedding a second active heat sink 812 on the tube wall of a flat tube 811 facing the lifting channel 521. Specifically, the plug-in tube 82 extends to the outside of the pedestal body 52 and passes through the first sealed half shell 2 and the bottom plate 1 to communicate with the second circulating cooling unit 83 installed on the bottom plate 1. Preferably. A driving pump capable of driving the heat transfer fluid to flow in a directional manner in the circulation loop is provided in both the first circulating cooling unit 76 and the second circulating cooling unit 83. The cooling coil 81 provided in the present application can effectively cool down the high-temperature edge area defined by the microwave reflection boundary defined by the inner side surface of the pedestal body 52, thereby effectively eliminating the high heat due to the accumulation of marginal microwave energy. The cooling coil 81 provided in the present application can also controllably realize the temperature control and cooling requirements at different stages, so as to facilitate the cooling and disassembly after production.

[0037] The present utility model is not limited to the above optional implementation modes. Anyone can derive other various forms of products under the inspiration of the present utility model. However, no matter what changes are made in the shape or structure, all technical solutions that fall within the scope of the claims of the present utility model fall within the protection scope of the present utility model. Those skilled in the art should understand that the present utility model specification and its drawings are illustrative and do not constitute limitations on the claims. The protection scope of the present utility model is defined by the claims and their equivalents. Throughout the text, the features guided by "preferably" are only an optional method and should not be understood as having to be set. Therefore, the applicant reserves the right to abandon or delete the relevant preferred features at any time.

Claims

1. A substrate stage cooling device for a diamond growth device, comprising a base plate (1) providing a mounting plane, a first sealing half shell (2) being arranged on the base plate (1), characterized in that: A detachable growth substrate stage (5) capable of defining a space for placing a molybdenum tray is mounted on the inner bottom surface of the first sealing half shell (2), the growth substrate stage (5) comprising an inner plug-in core column (51) and a base body (52), wherein the inner plug-in core column (51) carrying the molybdenum tray is movably arranged in a lifting channel (521) centrally opened inside the base body (52), A first cooling component (7) and a second cooling component (8) are respectively arranged in the inner insert core column (51) and the pedestal body (52).

2. The substrate stage cooling device of the diamond growth equipment according to claim 1, characterized in that: The first cooling assembly (7) comprises an outer insert tube (71), an inner insert tube (72), a blocking column (73), an active heat dissipation ring sheet (74), a first connecting tube (75) and a first circulating cooling unit (76), wherein: The outer insert tube (71) is coaxially inserted into the inner insert column (51), and the axial lower end of the outer insert tube (71) away from the inner insert column (51) is connected to the blocking column (73) for blocking the lower port thereof. An inner insert tube (72) is coaxially inserted into the blocking column (73) and extends into the outer insert tube (71); The active heat dissipation ring sheet (74) is laid on the axial upper end surface of the tube cavity of the outer insert tube (71); One end of the outer insert tube (71) and the inner insert tube (72) away from the inner insert core column (51) is respectively connected to the inlet and outlet of the first circulating cooling unit (76) through the first connecting pipe (75).

3. The substrate stage cooling device of the diamond growth equipment according to claim 2, characterized in that: The portion of the inner tube (72) disposed inside the outer tube (71) is capable of dividing the lumen of the outer tube (71) into an outer layer reflux annular cavity (712) and an inner layer inflow cavity (711) defined by the tube body of the inner tube (72). The inner layer inlet cavity (711) is located at the axial upper end of the inner insert tube (72), and the heat exchange guide cavity (713) defined by the upper tube cavity of the outer insert tube (71) is connected to the outer layer return annular cavity (712).

4. The substrate stage cooling device of the diamond growth equipment according to claim 3, characterized in that: The chamber top of the heat exchange guide cavity (713) is arranged as an arched dome structure, and a central heat dissipation circular plate (741) located at the center of the curved surface and a plurality of outer heat dissipation ring plates (742) with different radius sizes and sequentially sleeved on the outer side of the central heat dissipation circular plate (741) are arranged on the arched dome-shaped cavity wall defined by the heat exchange guide cavity (713), so that the central heat dissipation circular plate (741) and the outer heat dissipation ring plates (742) cooperate to cover the curved cavity wall.

5. The substrate stage cooling device of the diamond growth equipment according to claim 4, characterized in that: The second cooling assembly (8) comprises a cooling coil (81), a plug-in pipe (82) and a second circulating cooling unit (83), wherein: The cooling coil (81) is disposed inside the pedestal body (52); The cooling coil (81) also forms a circulating cooling loop with the second circulating cooling unit (83) by inserting the plug-in tube (82) into the pedestal body (52).

6. The substrate stage cooling device of the diamond growth equipment according to claim 5, characterized in that: The cooling coil (81) is constructed by embedding a second active heat sink (812) on the wall of a flat tube (811) facing the lifting channel (521); The plug-in tube (82) extends to the outside of the pedestal body (52), passes through the first sealed half shell (2) and the bottom plate (1), and is connected to the second circulating cooling unit (83) installed on the bottom plate (1).

7. The substrate stage cooling device of the diamond growth equipment according to claim 6, characterized in that: The inserted core column (51) sequentially passes through the lifting channel (521), the first sealing half shell (2) and The base plate (1) is connected to a lifting drive mechanism (6) located at the bottom side of the base plate (1); A sealing gasket (511) is also sleeved on the column side wall of the inserted core column (51) which is wrapped by the first sealing half shell (2) and the bottom plate (1).

8. The substrate stage cooling device of the diamond growth equipment according to claim 7, characterized in that: The bottom plate (1) suspends the second sealing half shell (3) above the first sealing half shell (2) by means of a lifting support frame (4) supported on the bottom plate (1), so that the second sealing half shell (3) can be lifted or lowered under the control of the lifting support frame (4) to form an adjustable sealing shell cavity with the first sealing half shell (2).

9. The substrate stage cooling device of the diamond growth equipment according to claim 8, characterized in that: The first circulating cooling unit (76) is detachably mounted on the lower surface of the base plate (1).

10. The substrate stage cooling device of the diamond growth equipment according to claim 9, characterized in that: The lifting drive mechanism (6) comprises a connecting rod (61) connected to the bottom end of the inserted core column (51) at an annular interval, a telescopic drive unit (62) located at the lower end of the connecting rod (61), and a lower plate (63) for mounting the telescopic drive unit (62).

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